CN108811314A - One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board - Google Patents
One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board Download PDFInfo
- Publication number
- CN108811314A CN108811314A CN201810702841.5A CN201810702841A CN108811314A CN 108811314 A CN108811314 A CN 108811314A CN 201810702841 A CN201810702841 A CN 201810702841A CN 108811314 A CN108811314 A CN 108811314A
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- module
- master board
- signal
- detection module
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses one kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board, including master board and signal transmission module, the master board includes receiving chip and driving chip, the master board uses double-sided flex circuit plate, and it is additionally provided with poly- cruel resinous material in the outer surface of master board, there is high reliability and higher flexible printed circuit board to be a kind of made of base material to gather cruel resinous material, and hole there are four being bored in the upper right side of master board, and the output end of master board is connected with VRM Voltage Regulator Module and rectification module, and VRM Voltage Regulator Module is connected by receiving end signal detection module with pulse generation module；The signal transmission module is connected with signal detection module, and signal detection module is connected with DC-DC converter, this heat dissipation for circuit board is good, using diminution volume, lightweight, miniaturization, slimming are realized, to realize component arrangement and conducting wire connecting integration.
Description
The number of patent application that the present invention is applicant to be proposed on the 17th in August in 2016 is " 2016106868163 ", entitled
The divisional application of the Chinese invention patent application of " one kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board ",
Entire contents are incorporated among the application.
Technical field
The present invention relates to electronic circuit board technical fields, specially a kind of high based on high thickness to diameter ratio Deep hole electroplating technology high frequency
Fast electronic circuit board.
Background technology
With the development of electronic product production technology, people start to develop interlayer on the basis of double-sided PCB, in fact
It is exactly one piece of single sided board of superposition on the basis of dual platen, here it is multilayer circuit boards.Originally, the multi-purpose ground for making large area of interlayer
The wiring of line, power cord, surface layer are all used for signal routing.Later, it is desirable that the case where interlayer is for signal routing is more and more, this
It is required that the number of plies of circuit board will also increase.But interlayer cannot infinitely increase, and main cause is cost and thickness problem, general life
Production factory is intended to obtain performance as high as possible with alap cost, this is different from the original shape machine design done in laboratory,
Therefore, electronics designers will consider this contradictory synthesis of cost performance, and most realistic design method times is so
It is first choice to make signal wiring layer with surface layer, and the element of high-frequency circuit can not be arranged too close, and the otherwise radiation of element itself can be straight
It connects and interference is generated to other elements
Invention content
In view of the above problems, the present invention provides one kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit
Plate is provided with master board, and is equipped in master board and receives chip and driving chip, and being saved using integrated chip can connect up
Trouble so that placement-and-routing is simpler, and use Voltage stabilizing module burning voltage and electric current so that the design of circuit is more proper
When can effectively solve the problems in background technology.
To achieve the above object, the present invention provides the following technical solutions：One kind is high based on high thickness to diameter ratio Deep hole electroplating technology
Frequency high-velocity electrons wiring board, including master board and signal transmission module, the master board include receiving chip and driving core
Piece, the communication port for receiving chip are connected by control line with driving chip, and the master board uses double-faced flexible
Circuit board, and it is additionally provided with poly- cruel resinous material in the outer surface of master board, there are four the upper right side brills of master board
Hole, and the output end of master board is connected with VRM Voltage Regulator Module and rectification module, and VRM Voltage Regulator Module passes through reception
End signal detection module is connected with pulse generation module, and pulse generation module is connected by circuit for signal conditioning with filter circuit
It connects, filter circuit one end is connected with digital oscilloscope, and the other end is connected by trigger with voltage bias module, and voltage is inclined
It sets being connected with digital signal processor by signal acquisition module for module, digital signal processor passes through Voltage stabilizing module and electricity
Position device is connected；The signal transmission module is connected with signal detection module, and signal detection module is connected with DC-DC converter
It connects, and DC-DC converter is connected by waveform detection module with digital signal processor, the waveform detection module and voltage
Biasing module is connected.
As a kind of preferred technical solution of the present invention, the input terminal for receiving chip is connected with clock control bus.
As a kind of preferred technical solution of the present invention, the input terminal of the driving chip respectively with gating signal line sum number
It is connected according to signal wire, and gating signal line is connected by delay circuit with clock control bus.
As a kind of preferred technical solution of the present invention, the output end of the trigger is also connected with comparison amplifier.
Compared with prior art, the beneficial effects of the invention are as follows：It should be based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed
Electronic circuit board is provided with master board, and is equipped in master board and receives chip and driving chip, is saved using integrated chip
Go the trouble that can be connected up so that placement-and-routing is simpler, and uses Voltage stabilizing module burning voltage and electric current so that circuit is set
Meter is more appropriate, and has high reliability and higher flexible printing electricity to be a kind of made of base material to gather cruel resinous material
Road plate, this heat dissipation for circuit board is good, can not only be bent, and folded, wind, but also can arbitrarily be moved in three dimensions and flexible, can
Using volume is reduced, lightweight, miniaturization, slimming are realized, to realize component arrangement and conducting wire connecting integration, and it is entire
System structure is simple, and placement-and-routing's management is relatively preferable, the phenomenon that being not in crosstalk between each circuit, highly practical.
Description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is electrical block diagram of the present invention.
In figure：1- master boards；2- signal transmission modules；3- receives chip；4- driving chips；5- gathers cruel resinae material
Material；6- holes；7- VRM Voltage Regulator Modules；8- rectification modules；9- receiving end signal detection modules；10- pulse generation modules；11-
Circuit for signal conditioning；12- filter circuits；13- digital oscilloscopes；14- triggers；15- voltage bias modules；16- signal acquisitions
Module；17- Voltage stabilizing modules；18- digital signal processors；19- potentiometers；20- signal detection modules；21-DC-DC converters；
22- waveform detection modules；23- clock control buses；24- gating signal lines；25- data signal lines；26- comparison amplifiers；27-
Delay circuit.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment：
It please refers to Fig.1 and Fig. 2, the present invention provides a kind of technical solution：One kind is high based on high thickness to diameter ratio Deep hole electroplating technology
Frequency high-velocity electrons wiring board, including master board 1 and signal transmission module 2, the master board 1 include receiving chip 3 and driving
Dynamic chip 4, the communication port for receiving chip 3 is connected by control line with driving chip 4, and receives the input of chip 3
End is also connected with clock control bus 23, the input terminal of the driving chip 4 respectively with gating signal line 24 and data-signal
Line 25 is connected, and gating signal line 24 is connected by delay circuit 27 with clock control bus 23, and the master board 1 is adopted
With double-sided flex circuit plate, and it is additionally provided with poly- cruel resinous material 5 in the outer surface of master board 1, on the right side of master board 1
There are four holes 6 for upper end brill, and the output end of master board 1 is connected with VRM Voltage Regulator Module 7 and rectification module 8, and voltage
Adjustment module 7 is connected by receiving end signal detection module 9 with pulse generation module 10, and pulse generation module 10 passes through signal
It adjusts circuit 11 with filter circuit 12 to be connected, 12 one end of filter circuit is connected with digital oscilloscope 13, and the other end is by touching
Hair device 14 is connected with voltage bias module 15, and the output end of the trigger 14 is also connected with comparison amplifier 26, the voltage
Biasing module 15 is connected by signal acquisition module 16 with digital signal processor 18, and digital signal processor 18 is by steady
Die block 17 is connected with potentiometer 19；The signal transmission module 2 is connected with signal detection module 20, and signal detection module
20 are connected with DC-DC converter 21, and DC-DC converter 21 passes through waveform detection module 22 and 18 phase of digital signal processor
Connection, the waveform detection module 22 are connected with voltage bias module 15.
The operation principle of the present invention：It should be based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board, be provided with
Master board, and be equipped in master board and receive chip and driving chip, the trouble that can be connected up is saved using integrated chip, is made
It is simpler to obtain placement-and-routing, and uses Voltage stabilizing module burning voltage and electric current so that the design of circuit is more appropriate, and with poly-
Cruel resinous material is one kind made of base material, and there is high reliability and higher flexible printed circuit board, this circuit board to dissipate
Heat is good, can not only be bent, and folded, wind, but also can arbitrarily be moved in three dimensions and flexible, using volume is reduced, realizes
Lightweight, miniaturization, slimming, to realize component arrangement and conducting wire connecting integration, and whole system is simple in structure, layout
Cable management is relatively preferable, the phenomenon that being not in crosstalk between each circuit, highly practical.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (2)
1. one kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board, including master board (1) and signal pass
Defeated module (2), it is characterised in that：The master board (1) includes receiving chip (3) and driving chip (4), the reception chip
(3) communication port is connected by control line with driving chip (4), and the master board (1) uses double-sided flex circuit plate,
And it is additionally provided with poly- cruel resinous material (5) in the outer surface of master board (1), it is drilled with four in the upper right side of master board (1)
A hole (6), and the output end of master board (1) is connected with VRM Voltage Regulator Module (7) and rectification module (8), and voltage tune
Section module (7) is connected by receiving end signal detection module (9) with pulse generation module (10), and pulse generation module (10) is logical
It crosses circuit for signal conditioning (11) with filter circuit (12) to be connected, filter circuit (12) one end is connected with digital oscilloscope (13)
It connects, the other end is connected by trigger (14) with voltage bias module (15), and voltage bias module (15) are adopted by signal
Collection module (16) is connected with digital signal processor (18), and digital signal processor (18) passes through Voltage stabilizing module (17) and current potential
Device (19) is connected；The signal transmission module (2) is connected with signal detection module (20), and signal detection module (20) with
DC-DC converter (21) is connected, and DC-DC converter (21) passes through waveform detection module (22) and digital signal processor
(18) it is connected, the waveform detection module (22) is connected with voltage bias module (15)；The input for receiving chip (3)
End is connected with clock control bus (23)；The input terminal of the driving chip (4) respectively with gating signal line (24) and data
Signal wire (25) is connected, and gating signal line (24) is connected by delay circuit (27) with clock control bus (23).
2. it is according to claim 1 a kind of based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board, it is special
Sign is：The output end of the trigger (14) is also connected with comparison amplifier (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810702841.5A CN108811314B (en) | 2016-08-17 | 2016-08-17 | High-frequency high-speed electronic circuit board based on high-thickness-diameter ratio deep hole electroplating technology |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610686816.3A CN106255316B (en) | 2016-08-17 | 2016-08-17 | One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board |
| CN201810702841.5A CN108811314B (en) | 2016-08-17 | 2016-08-17 | High-frequency high-speed electronic circuit board based on high-thickness-diameter ratio deep hole electroplating technology |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610686816.3A Division CN106255316B (en) | 2016-08-17 | 2016-08-17 | One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811314A true CN108811314A (en) | 2018-11-13 |
| CN108811314B CN108811314B (en) | 2020-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610686816.3A Active CN106255316B (en) | 2016-08-17 | 2016-08-17 | One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board |
| CN201810702841.5A Active CN108811314B (en) | 2016-08-17 | 2016-08-17 | High-frequency high-speed electronic circuit board based on high-thickness-diameter ratio deep hole electroplating technology |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610686816.3A Active CN106255316B (en) | 2016-08-17 | 2016-08-17 | One kind being based on high thickness to diameter ratio Deep hole electroplating technology high-frequency high-speed electronic circuit board |
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| Country | Link |
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| CN (2) | CN106255316B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788222A (en) * | 2021-02-07 | 2021-05-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219229A (en) * | 2017-07-03 | 2019-01-15 | 东莞市品赫胜自动化科技有限公司 | A kind of panel driving board function testing circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100775066B1 (en) * | 2007-08-21 | 2007-11-08 | 에이피엘시스템(주) | Guidance light controller |
| CN203761073U (en) * | 2013-12-16 | 2014-08-06 | 国家电网公司 | Portable mobile power supply |
| CN204408213U (en) * | 2015-02-06 | 2015-06-17 | 中国人民解放军信息工程大学 | Pulsed high voltage generator |
| US9237609B2 (en) * | 2013-05-20 | 2016-01-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd | LED backlight driving circuit, backlight module, and LCD device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5861868B2 (en) * | 2011-11-04 | 2016-02-16 | ソニー株式会社 | Electronic circuit and method of manufacturing electronic circuit |
| CN202471757U (en) * | 2012-02-21 | 2012-10-03 | 温州满毅电气有限公司 | Hall detection circuit board |
| CN205450251U (en) * | 2016-03-24 | 2016-08-10 | 威胜集团有限公司 | Digital electric energy meter verifying device |
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2016
- 2016-08-17 CN CN201610686816.3A patent/CN106255316B/en active Active
- 2016-08-17 CN CN201810702841.5A patent/CN108811314B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100775066B1 (en) * | 2007-08-21 | 2007-11-08 | 에이피엘시스템(주) | Guidance light controller |
| US9237609B2 (en) * | 2013-05-20 | 2016-01-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd | LED backlight driving circuit, backlight module, and LCD device |
| CN203761073U (en) * | 2013-12-16 | 2014-08-06 | 国家电网公司 | Portable mobile power supply |
| CN204408213U (en) * | 2015-02-06 | 2015-06-17 | 中国人民解放军信息工程大学 | Pulsed high voltage generator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788222A (en) * | 2021-02-07 | 2021-05-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106255316B (en) | 2018-10-02 |
| CN108811314B (en) | 2020-10-13 |
| CN106255316A (en) | 2016-12-21 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200909 Address after: Building 6, GONGTING Wenyuan East District, No.5, Chengnan Avenue, Meilin Town, Ganxian District, Ganzhou City, Jiangxi Province Applicant after: GANZHOU XUANYI TECHNOLOGY Co.,Ltd. Address before: 543200 the Guangxi Zhuang Autonomous Region, Cenxi City, Canton Road, No. 96, the first floor of the first floor, No. Applicant before: CENXI DONGZHENG POWER SCIENCE & TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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Effective date of registration: 20220825 Address after: Room 401, Building 1, No. 34, Xiangfeng Road, Liaobu, Liaobu Town, Dongguan City, Guangdong 523000 Patentee after: Dongguan Guanrui Electronics Co.,Ltd. Address before: Building 6, East District, Gongting Wenyuan, No. 5 Chengnan Avenue, Meilin Town, Ganxian District, Ganzhou City, Jiangxi Province 341100 Patentee before: GANZHOU XUANYI TECHNOLOGY Co.,Ltd. |
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