CN115608626A - High-speed multi-head chip sorting device - Google Patents
High-speed multi-head chip sorting device Download PDFInfo
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- CN115608626A CN115608626A CN202211351586.7A CN202211351586A CN115608626A CN 115608626 A CN115608626 A CN 115608626A CN 202211351586 A CN202211351586 A CN 202211351586A CN 115608626 A CN115608626 A CN 115608626A
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- 230000007246 mechanism Effects 0.000 claims abstract description 134
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 239000013078 crystal Substances 0.000 claims description 165
- 238000003825 pressing Methods 0.000 claims description 21
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 abstract description 10
- 230000003749 cleanliness Effects 0.000 abstract description 6
- 230000003028 elevating effect Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 11
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 239000000428 dust Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 239000003595 mist Substances 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000000779 smoke Substances 0.000 description 4
- 244000309464 bull Species 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 230000001105 regulatory effect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application discloses a high-speed multi-head chip sorting device, including solenoid valve subassembly, the vacuum pressure gauge, camera locating component, stroke adjustment subassembly, rotatory crystalline substance of getting puts brilliant unit and protective housing, rotatory crystalline substance of getting puts brilliant unit including directly driving the motor, chip pickup mechanism and drive assembly, rotatory getting is provided with 18 chip pickup mechanism on the brilliant unit of putting, the position of setting for two stations is respectively for getting brilliant position and putting brilliant position, when carrying out chip sorting work, stroke adjustment subassembly sets up above getting brilliant position, drive the chip pickup mechanism who gets brilliant position and push down, drive assembly drives chip pickup mechanism and does the elevating movement, solenoid valve subassembly control carries out picking up and placing of chip, utilize the vacuum gauge outfit to carry out the passback of signal, camera locating component chip fixes a position and shoots, be convenient for next time pick up brilliant and put the brilliant smooth going on of action, the chip sorting efficiency of this application is high, cleanliness factor is high, get brilliant platform and put brilliant platform and can go up the lower floor setting, and occupation space is little.
Description
Technical Field
The invention relates to the technical field of chip production equipment, in particular to a high-speed multi-head chip sorting device.
Background
Along with the development of science and technology, chips are widely applied in a plurality of fields, so that the quality of the chips needs to be detected, the yield of the chips is ensured, in the actual production, the size of the chips is small, so that the manual detection is difficult and the time consumption is long, a chip detection device needs to be used for detecting the quality, the chips are picked up by a sorting device and are carried on a test workbench, the traditional sorting device drives a chip picking mechanism to rotate by using a motor to pick up the crystals, but the number of the chip picking mechanisms is small; the size of the sorting device directly influences the linear distance between the crystal taking position and the crystal placing position, the larger the distance between the crystal taking position and the crystal placing position is, the more easily the material falling phenomenon is generated, the longer the time consumed by the crystal taking and the crystal placing is, and the problem of lower chip picking efficiency exists. The crystal taking position and the crystal placing position of the traditional chip sorting device are arranged in a mode that the occupied space of the device is large, the required size of a direct-drive motor is large, and the traditional sorting device has the problem that chips are polluted due to the fact that no external protection exists, so that the problem that the crystal taking efficiency can be improved, the occupied space is small, and the high cleanliness of the device for sorting the chips is urgently solved.
Disclosure of Invention
The invention provides a high-speed multi-head chip sorting device, which aims to solve the problems in the background technology and provides the following scheme for achieving the purpose:
the high-speed multi-head chip sorting device comprises a rotary crystal taking and placing unit, a stroke adjusting assembly and a protective outer cover, wherein the stroke adjusting assembly is fixedly arranged on the outer side of the rotary crystal taking and placing unit, the rotary crystal taking and placing unit comprises a direct drive motor, a plurality of chip picking mechanisms and a plurality of driving assemblies, the plurality of chip picking mechanisms are arranged at the bottom of the rotary crystal taking and placing unit, one station on a crystal taking platform is designated as a crystal taking position, one station on a crystal placing platform is designated as a crystal placing position, the direct drive motor drives the plurality of chip picking mechanisms to rotate on the circumference, when the driving assemblies above the crystal taking position and the crystal placing position work, the chip picking mechanisms reaching the crystal taking position and the crystal placing position are respectively driven to move up and down in the vertical direction, and the stroke adjusting assembly drives the chip picking mechanisms above the crystal taking position to press down, so that a height difference is formed between the crystal taking position and the crystal placing position.
The direct drive motor drives a chip picking mechanism fixedly arranged at the bottom of the rotary crystal taking and placing unit to rotate in a circular motion period, when the chip picking mechanism reaches a crystal taking position, the chip picking mechanism is pressed down for a certain distance in the vertical direction under the action of a stroke adjusting assembly, and a driving assembly on the crystal taking position drives the chip picking mechanism which is driven by the direct drive motor to rotate to reach the crystal taking position to do lifting motion in the vertical direction, so that the chip picking requirement is met, and chips are picked and collected from a crystal taking platform; further, when the chip picking mechanism with the chip reaches the chip placing position, the driving component above the chip placing position drives the chip picking mechanism to lift in the vertical direction, so that the picked chip is placed on the chip placing platform;
the chip picking mechanism and the chip picking mechanism reach the chip picking position to pick chips, and the chip picking mechanism reach the chip placing position to place chips, due to the height difference, the chip placing platform and the chip taking platform can be arranged in an upper layer mode and a lower layer mode, the space occupied by the device is saved, the rotary chip picking and placing unit is provided with the chip picking mechanisms, multiple chip picking and placing can be achieved through one rotation of the direct-drive motor every time, the chips can be picked and placed synchronously, the chip sorting efficiency is greatly improved, the whole device is in a semi-closed state due to the arrangement of the protective outer cover, further, oil mist and dust can be sucked through the inner part, the lower products are prevented from being polluted by the oil mist and the dust, and the chip sorting work has the characteristic of high cleanliness.
In a specific embodiment, 18 chip picking mechanisms are arranged on the rotary crystal taking and crystal placing unit at equal intervals.
The crystal taking and placing unit is provided with 18 chip picking mechanisms, the distance between each chip picking mechanism and the adjacent chip picking mechanism is fixed and the same, the direct-drive motor only needs to rotate 20 degrees at each time, the chip picking mechanisms can reach the positions of the adjacent chip picking mechanisms, the corresponding used time is 1/18 of the time spent by the direct-drive motor in one rotation, the next crystal taking and placing actions can be quickly realized, the chip sorting work for many times can be realized in the period of one rotation of the direct-drive motor, and the work efficiency of chip sorting is greatly improved.
In a specific embodiment, the high-speed multi-head chip sorting device further comprises a crystal taking and positioning camera assembly and a crystal placing and positioning camera assembly, wherein the crystal taking and positioning camera assembly is fixedly arranged right above the crystal taking position, and the crystal placing and positioning camera assembly is fixedly arranged right above the crystal placing position.
The crystal taking positioning camera component is used for positioning and detecting the chip on the crystal taking platform, so that the chip picking mechanism reaching the crystal taking position can accurately pick up the chip, the direct drive motor continues to rotate after the chip picking mechanism finishes the picking action, and the crystal taking positioning camera component continues to shoot and position the chip on the crystal taking platform after the chip picking mechanism leaves the crystal taking position, so that accurate information is provided for the next picking work; the crystal-placing positioning camera component is used for positioning and detecting the chip on the crystal-placing platform, so that the chip can be accurately placed when the chip picking mechanism with the chip reaches the crystal-placing position.
In a further embodiment, the stroke adjusting assembly is fixedly connected with the driving assembly above the crystal taking position.
The stroke adjustment assembly is fixedly connected with the driving assembly above the crystal taking position, when the stroke adjustment assembly drives the chip picking mechanism reaching the upper part of the crystal taking position to press down, the driving assembly on the stroke adjustment assembly descends along with the stroke adjustment assembly synchronously, so that when the subsequent driving assembly drives the chip picking mechanism reaching the crystal taking position to do lifting motion, the height adjustment is not needed additionally, and further, the driving assembly above the crystal taking position drives the chip picking mechanism reaching the crystal taking position to do lifting motion in the vertical direction to realize the picking of the chip.
In a specific embodiment, the stroke adjustment assembly comprises a servo link assembly, a cam and a lifting assembly, the servo link assembly is arranged on one side of the lifting assembly, the cam is fixedly arranged below the lifting assembly, and the servo link assembly drives the lifting assembly to move up and down so as to drive the cam to do lifting movement in the vertical direction.
In a further embodiment, the driving component above the crystal taking position is fixedly arranged on the cam, and when the stroke adjusting component works, the cam moves up and down to drive the driving component to lift in the vertical direction, and further, when the driving component above the crystal taking position works, the driving component below the driving component drives the chip picking mechanism to lift or press in the vertical direction.
In specific embodiment, the lifting unit includes the fixed plate, the connecting plate, linear slide rail and extension spring, linear slide rail is fixed to be set up on the fixed plate, the fixed slider that sets up on linear slide rail of connecting plate, extension spring one end is fixed to be set up on the fixed plate, extension spring's other end is fixed to be set up on the connecting plate, connecting plate and servo link mechanism fixed connection, servo link mechanism includes servo motor, crank and connecting rod, the one end and the articulate border of connecting rod are rotated and are connected, the other end rotates with the connecting plate to be connected, servo motor drive crank is rotatory, drive connecting plate up-and-down motion through the connecting rod, and then drive cam up-and-down motion.
Servo link assembly during operation, drive the connecting plate on the lifting unit at the vertical direction up-and-down motion, and then drive cam up-and-down motion, linear slide rail leads to the lifting motion of connecting plate on the vertical direction this moment, furthermore, lead to the lifting motion of the cam that sets up below the connecting plate, extension spring's pulling force makes and guarantees under the outage state that the cam does not drop, chip pick-up mechanism accomplishes the work of picking up of chip and leaves when getting the crystalline site, connecting plate and the cam of connecting plate below get back to original high level under extension spring's pulling force, extension spring's setting also makes the cam to chip pick-up mechanism's pushing down the dynamics adjustable, thereby avoid pressure too big and produce the impact to the chip and make the chip produce the damage.
In a specific embodiment, the cam is an arc structure with a high middle part at the bottom and two low ends, and when the rotary crystal taking and placing unit works, the chip picking mechanism which rotates to reach the crystal taking position reaches the middle part of the cam along the arc structure.
The cam is the arc structure that high both ends are low in the middle of the bottom, the intermediate position of bottom with get the crystal position corresponding, the intermediate position setting of cam bottom is getting the crystal position directly over promptly, it picks up the mechanism under curved direction to be about to reach the chip of getting the crystal position, gradually by pushing down to the low level, and under the drive assembly's of getting the crystal position top drive assembly, it carries out picking up of chip to getting the crystal position to push down, the cam sets up with the mode of arc structure, make the chip that is close to getting the crystal position pick up the mechanism and progressively realize in the lift of vertical direction, avoid chip to pick up the mechanism abrupt rising and falling and produce too big impact force to getting the chip on the brilliant platform, thereby make the chip damage, influence the efficiency that the chip was selected separately.
In a further embodiment, the extension spring is a hook-and-loop extension spring, a hook ring at the upper end of the hook-and-loop extension spring is connected with a hook-and-loop fixing seat on the fixing plate, and a hook ring at the lower end of the hook-and-loop extension spring is connected with a hook-and-loop fixing seat on the connecting plate.
The shackle extension spring is connected with the shackle fixing seat on the fixed plate and the connecting plate, so that the movement speed of the cam below the connecting plate and the connecting plate is reduced, and after the picking work is completed, the connecting plate and the cam can return to the original high position by virtue of the tension of the extension spring, so that the next chip picking work can be matched smoothly.
In a further embodiment, the stroke adjustment assembly further comprises an outer cover, and the outer cover is used for protecting the movement of the servo connecting rod assembly from being influenced by impurities such as smoke, dust and the like, preventing the chip from being polluted and improving the yield.
In a specific embodiment, the chip picking mechanism comprises a suction nozzle unit, an elastic unit and a supporting arm support, wherein the elastic unit is arranged below the pressure head unit, the elastic unit is fixedly connected with the supporting arm support, and the suction nozzle unit is fixedly arranged at the front end of the supporting arm support.
The pressure of the chip picking mechanism is regulated and controlled by the elastic unit, so that the integral downward pressing and rising speed and force of the chip picking mechanism are controlled, the phenomenon that the chip is damaged due to overlarge impact force is avoided, the suction nozzle unit extends out of the direct stress range of the downward pressing of the driving assembly through the supporting arm support, and the suction nozzle unit can perform crystal taking and crystal placing actions in the photographing range of the crystal taking positioning camera assembly and the crystal placing positioning camera assembly.
In a further embodiment, the suction nozzle unit comprises a suction nozzle, a suction nozzle rod and an air pipe, the air pipe is fixedly connected with the suction nozzle rod, and the suction nozzle rod is detachably connected with the suction nozzle.
The suction force is generated by vacuumizing the air pipe, the chip is adsorbed on the suction nozzle, and the suction nozzle rod and the suction nozzle can be detached independently, so that the model is easy to change.
In a further embodiment, the chip picking mechanism comprises a precision ball sliding group, the suction nozzle unit is fixedly connected with the precision ball sliding group, and the precision ball sliding group plays a role in guiding the up-and-down movement of the suction nozzle unit.
In a further embodiment, the resilient unit comprises a spring and an oil-free linear slide.
The oil-free linear sliding rail is used for guiding, so that the whole chip picking mechanism can move in the vertical direction, and the spring plays a role in buffering and is used for adjusting the lower pressure degree.
In a further embodiment, the elastic unit is externally provided with an outer cover, and the outer cover is used for protecting the lifting movement of the elastic unit from being influenced by impurities such as smoke, dust and the like, so that the chip is prevented from being polluted, and the yield is improved.
In specific embodiment, drive assembly includes servo motor, cam unit and pressure head unit, servo motor, cam unit and pressure head unit from top to bottom ground fixed connection, servo motor drives the motion of cam unit and drive the pressure head unit and do elevating movement in the vertical direction.
Servo motor, cam unit and pressure head unit are fixed through the fixing base, and the speed and the stability of pushing down can effectively be improved in servo motor and cam unit's combination, and the pressure head unit is used for promoting chip and picks up the mechanism and descend or rise in the vertical direction to drive chip and pick up the mechanism and move from top to bottom in the vertical direction, make chip pick up work and go on smoothly.
In a further embodiment, the cam unit includes a cam connected to a rotation shaft of the servo motor and a cam follower contacting a lower surface of the cam, the lower surface of the cam having different height dimensions.
When the servo motor moves, the cams with different height sizes on the lower surface are driven to rotate, so that the cam followers below the cams are driven to ascend or descend in the vertical direction, and the pressure head units below the cam units are further driven to ascend and descend.
In a further embodiment, the pressure head unit comprises a pressure rod, a pressure head and a compression spring, the compression spring is fixedly arranged between the cam unit and the fixed seat, the pressure rod is arranged inside the compression spring, and the pressure head is fixedly connected with the pressure rod.
Thereby servo motor and cam unit cooperation drive pressure head unit when rising or descending, the compression spring that sets up in pressure head unit has played the effect that compresses tightly the buffering, can control pressure head unit ascending and descending motion in the vertical direction, and cam follower ascending and descending motion in the vertical direction has also been accomplished in the cooperation to compression spring's setting.
In a specific embodiment, the crystal taking camera positioning assembly and the crystal placing camera positioning assembly comprise a CCD, a light source, a lens and an XYZ manual adjustment mechanism, and the CCD, the XYZ manual adjustment mechanism, the lens and the light source are sequentially connected from top to bottom.
CCD has higher sensitivity, high detection precision and high-speed detection efficiency and convenient output and is not easy to be interfered by the outside, a light source and a lens are necessary components which can not be lacked for chip positioning detection, and an XYZ manual adjusting mechanism enables a crystal taking positioning camera component and a crystal placing positioning camera component to have the adjustability in the direction, thereby further meeting the requirements of photographing, positioning and detecting the chip in the crystal taking and crystal placing work.
In a specific embodiment, the vacuum pump further comprises a solenoid valve assembly and a vacuum pressure gauge.
The electromagnetic valve assembly comprises a vacuum electromagnetic valve and a vacuum breaking electromagnetic valve, when the chip picking mechanism reaches a chip picking position, the chip picking driving assembly presses the chip picking mechanism downwards, the vacuum electromagnetic valve acts to suck the chip, the chip picking driving assembly ascends after the vacuum gauge head returns a signal, when the chip picking mechanism with the chip reaches a chip placing position, the chip placing driving assembly presses downwards, and the vacuum breaking electromagnetic valve acts to place the chip.
The utility model provides a high-speed bull chip sorting unit, including rotatory crystalline substance of getting put brilliant unit and stroke adjustment subassembly, it includes stroke adjustment subassembly to get brilliant unit and stroke adjustment subassembly to rotate to get brilliant, it is provided with 18 chip pickup mechanism to get brilliant unit to rotate to get brilliant unit, a station on the appointed brilliant platform of getting is for getting brilliant position, the position of a station on the appointed brilliant platform of putting is for putting brilliant position, direct drive motor rotates 20 every time, when getting brilliant position, stroke adjustment subassembly pushes down, make the chip pickup mechanism on the brilliant position of getting below the drive subassembly and put brilliant position chip pickup machine stroke difference on the brilliant position, be convenient for get brilliant platform and put brilliant platform and set up in the layering, the occupation space is saved, when getting brilliant and putting brilliant work, the drive subassembly motion makes chip pickup mechanism go on the elevating movement in the vertical direction, thereby accomplish the picking up and placing of chip, the action of picking up and placing of chip pickup mechanism is controlled by electromagnetism valve module and vacuum pressure gauge, it still is provided with location camera subassembly to put brilliant platform and put on the brilliant platform, be convenient for getting below, chip is fixed a position and put brilliant platform and put, chip location detection efficiency is improved chip, the high-speed bull chip sorting unit is provided with the protection dustcoat, the high-speed detection and sorting efficiency of the product is not reduced, the dust pollution of the product is also, the sorting unit below is improved. The utility model provides a high-speed bull chip sorting unit can realize that high speed, high accuracy, high efficiency get the brilliant, and whole group dustcoat protects, and inside is bled, guarantees that oil mist and dust do not pollute the below product and has realized high cleanliness factor, gets brilliant platform and puts the setting of brilliant platform can the lower floor, and it is little to take up an area of the space, reduce cost.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1a is a perspective view of a high speed multi-head chip sorting apparatus according to the present invention;
FIG. 1b is a top view of a high-speed multi-head chip sorting apparatus according to the present invention
FIG. 1c is a schematic view of the internal structure of a high-speed multi-head chip sorting apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a rotary crystal-taking and crystal-placing unit of the high-speed multi-head chip sorting device according to the technical solution of the present invention;
FIGS. 3a-b are schematic structural views of a stroke adjustment assembly of a high-speed multi-head chip sorting device according to the present invention;
FIG. 4 is a schematic structural diagram of a driving assembly of a high-speed multi-head chip sorting apparatus according to the present invention;
FIG. 5 is a schematic structural view of a chip picking mechanism of a high-speed multi-head chip sorting apparatus according to the present invention;
fig. 6 is a schematic structural diagram of a crystal-taking positioning camera assembly of the high-speed multi-head chip sorting device according to the technical solution of the present invention.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as "top," "bottom," "left," "right," "up," "down," etc., is used with reference to the orientation of the figures being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and logical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Fig. 1a shows a perspective view of a high-speed multi-head chip sorting device according to the technical solution of the present invention, fig. 1b shows a bottom view of a high-speed multi-head chip sorting device according to the technical solution of the present invention, fig. 1c shows an internal structure schematic diagram of a high-speed multi-head chip sorting device according to the technical solution of the present invention, as shown in fig. 1a-c, a high-speed multi-head chip sorting device comprises a rotary crystal-taking and crystal-placing unit 1, a stroke adjusting assembly 3 and a protective outer cover 2, the stroke adjusting assembly 3 is fixedly arranged at the outer side of the rotary crystal-taking and crystal-placing unit 1, the rotary crystal-taking and crystal-placing unit 1 comprises a direct drive motor 11, a plurality of chip picking mechanisms 13 and a plurality of driving assemblies 12, the bottom of the rotary crystal-taking and crystal-placing unit 1 is provided with a plurality of chip picking mechanisms 13, A station on the designated crystal taking platform is a crystal taking position, a station on the designated crystal placing platform is a crystal placing position (the crystal taking platform and the crystal placing platform are not shown in the attached drawings and can be arranged according to actual requirements), a direct drive motor 11 drives a plurality of chip picking mechanisms 13 to rotate on the circumference, two driving assemblies 12 in the plurality of chip picking mechanisms are respectively arranged above the crystal taking position and the crystal placing position, when the driving assemblies 12 above the crystal taking position and the crystal placing position work, the chip picking mechanisms 13 reaching the crystal taking position and the crystal placing position are respectively driven to do lifting motion in the vertical direction, and the stroke adjusting assembly 3 drives the chip picking mechanisms 13 reaching the crystal taking position to press down, so that the crystal taking position and the crystal placing position form a height difference.
The direct drive motor 11 drives the chip picking mechanism 13 fixedly arranged at the bottom of the rotary crystal taking and placing unit 1 to rotate in a circular motion period, when the chip picking mechanism 13 reaches a crystal taking position, the chip picking mechanism 13 is pressed down for a certain distance in the vertical direction under the action of the stroke adjusting assembly 3, and the driving assembly 12 on the crystal taking position drives the chip picking mechanism 13 which is driven by the direct drive motor 11 to rotate to reach the crystal taking position to perform lifting motion in the vertical direction, so that the chip picking requirement is met, and chips are picked and collected from the crystal taking platform; further, when the chip picking mechanism 13 with the chip reaches the chip placing position, the driving component 12 above the chip placing position drives the chip picking mechanism 13 to lift in the vertical direction, so that the picked chip is placed on the chip placing platform;
the arrangement of the stroke adjusting assembly 3 enables the chip picking mechanism 13 to reach a crystal taking position for picking a chip, and enables the chip picking mechanism 13 to reach a crystal placing position for placing the chip, the height difference exists on the original height, due to the height difference, the crystal placing platform and the crystal taking platform can be arranged according to the upper layer mode and the lower layer mode, the space occupied by the device is saved, the rotary crystal taking and placing unit 1 is provided with a plurality of chip picking mechanisms 13, the direct drive motor 11 can pick and place the chip for a plurality of times every time the direct drive motor rotates for one circle, and can synchronously pick and place the chip, the chip sorting efficiency is greatly improved, the whole device is in a semi-closed state due to the arrangement of the protective outer cover 2, further, the oil mist and dust can be guaranteed to not pollute products below through internal air suction, and the chip sorting work has the characteristic of high cleanliness.
In a further embodiment, the system further comprises a crystal taking and positioning camera assembly 41 and a crystal placing and positioning camera assembly 42, wherein the crystal taking and positioning camera assembly 41 is fixedly arranged right above the crystal taking position, and the crystal placing and positioning camera assembly 42 is fixedly arranged right above the crystal placing position.
The crystal taking positioning camera component 41 is used for positioning and detecting the chip on the crystal taking platform, so that the chip picking mechanism 13 reaching the crystal taking position can accurately pick up the chip, the direct drive motor 11 continues to rotate after the chip picking mechanism 13 finishes the picking action, and the crystal taking positioning camera component continues to photograph and position the chip on the crystal taking platform after the chip picking mechanism 13 leaves the crystal taking position, so as to provide accurate information for the next picking work; the crystal-placing positioning camera assembly 12 is used for positioning and detecting the chip on the crystal-placing platform, so that the chip can be accurately placed when the chip picking mechanism 13 with the chip reaches the crystal-placing position.
In a further embodiment, a solenoid valve assembly 5 and a vacuum pressure gauge 6 are included.
The electromagnetic valve assembly 5 comprises a vacuum electromagnetic valve 51 and a vacuum breaking electromagnetic valve 52 (the vacuum electromagnetic valve 51 and the vacuum breaking electromagnetic valve 52 are not marked in the figure), when the chip picking mechanism 13 reaches a chip picking position, the driving assembly 12 on the chip picking position presses down the chip picking mechanism 13, the vacuum electromagnetic valve 51 acts to suck a chip, the vacuum gauge head 6 returns a signal and then the driving assembly 12 rises, when the chip picking mechanism 12 with the chip reaches a chip placing position, the driving assembly 12 on the chip placing position presses down, and the vacuum breaking electromagnetic valve 52 acts to place the chip.
In a further embodiment, the stroke adjustment assembly 3 is fixedly connected to the driving assembly 12 above the seed removal station.
The stroke adjusting component 3 is fixedly connected with the driving component 12 above the crystal taking position, when the stroke adjusting component 3 drives the chip picking mechanism 13 reaching the upper part of the crystal taking position to press down, the driving component 12 on the stroke adjusting component 3 descends synchronously along with the stroke adjusting component 3, so that in subsequent work, when the driving component 12 drives the chip picking mechanism 13 reaching the crystal taking position to do lifting motion, additional height adjustment is not needed, and further, the driving component 12 above the crystal taking position drives the chip picking mechanism 13 reaching the crystal taking position to do lifting motion in the vertical direction to realize chip picking.
Fig. 2 shows a schematic structural diagram of a rotary crystal taking and placing unit of a high-speed multi-head chip sorting device according to the technical solution of the present invention, and as shown in fig. 2, 18 chip picking mechanisms are arranged on the rotary crystal taking and placing unit 1 at equal intervals.
The crystal taking and placing unit 1 is provided with 18 chip picking mechanisms 13, the distance between each chip picking mechanism 13 and the adjacent chip picking mechanism 13 is fixed and the same, the direct drive motor 11 only needs to rotate 20 degrees at each time, the chip picking mechanisms 13 can reach the positions of the adjacent chip picking mechanisms 13, the corresponding time is 1/18 of the time taken by the direct drive motor 11 to rotate for one circle, the next crystal taking and placing actions can be quickly realized, therefore, the chip sorting work for many times can be realized in the period of one circle of rotation of the direct drive motor 11, and the work efficiency of chip sorting is greatly improved.
Fig. 3a-b show a schematic structural diagram of a stroke adjustment assembly of a high-speed multi-head chip sorting apparatus according to the technical solution of the present invention, as shown in fig. 3a-b, the stroke adjustment assembly 3 includes a servo link assembly 31, a cam 33 and a lifting assembly 32, the servo link assembly 31 is disposed on one side of the lifting assembly 32, the cam 33 is fixedly disposed below the lifting assembly 32, and the servo link assembly 31 drives the lifting assembly 32 to move up and down so as to drive the cam 33 to move up and down in a vertical direction.
In a further embodiment, the driving assembly 12 above the picking position is fixedly disposed on the cam 33, and when the stroke adjusting assembly 12 works, the cam 33 moves up and down to drive the driving assembly 12 to move up and down in the vertical direction, and further, when the driving assembly 12 above the picking position works, the driving assembly 12 below the picking position drives the chip picking mechanism 13 to move up and down in the vertical direction.
In a specific embodiment, the lifting assembly 32 includes a fixed plate 321, a connecting plate 325, a linear slide rail 322, a slider 323 and an extension spring 324, the linear slide rail 322 is fixedly disposed on the fixed plate 321, the connecting plate 325 is fixedly disposed on the slider 323 on the linear slide rail 322, one end of the extension spring 324 is fixedly disposed on the fixed plate 321, the other end of the extension spring 324 is fixedly disposed on the connecting plate 325, the connecting plate 325 is fixedly connected with the servo link mechanism 31, the servo link mechanism 31 includes a servo motor 311, a crank 313 and a connecting rod 312, one end of the connecting rod 312 is rotatably connected with an edge of the crank 313, the other end of the connecting rod is rotatably connected with the connecting plate 325, the servo motor 311 drives the crank 313 to rotate, the connecting plate 325 is driven by the connecting rod 312 to move up and down, and the cam 33 is driven to move up and down.
When the servo link assembly 31 works, the connecting plate 325 on the lifting assembly 32 is driven to move up and down in the vertical direction, and further the cam 33 is driven to move up and down, at this time, the linear slide rail 322 guides the lifting movement of the connecting plate 325 in the vertical direction, further, the lifting movement of the cam 33 arranged below the connecting plate 325 is guided, the tension of the tension spring 324 ensures that the cam 33 does not drop under the power-off state, when the chip picking mechanism 13 finishes the chip picking work and leaves the chip picking position, the connecting plate 325 and the cam 33 arranged below the connecting plate 325 return to the original high position under the tension of the tension spring 324, the arrangement of the tension spring 324 also enables the cam 33 to push down the chip picking mechanism 13 with adjustable force, and the phenomenon that the chip is damaged due to impact caused by too large pressure is avoided.
In a specific embodiment, the cam 33 is an arc structure with a high bottom in the middle and two low ends, and when the crystal taking and placing unit 1 is operated, the chip picking mechanism 13 which is about to rotate to reach the crystal taking position reaches the middle of the cam 33 along the arc structure.
The cam 33 is the arc structure that the high both ends are low in the middle of the bottom, the intermediate position of bottom with get brilliant position corresponding, the intermediate position setting of cam 33 bottom is getting brilliant position immediately, it picks up mechanism 13 under curved direction to reach the chip that gets brilliant position soon, be pushed down to the low level gradually, and under the drive of getting the drive assembly 12 of brilliant position top, it carries out picking up of chip to getting brilliant position to push down, the cam 33 sets up with the mode of arc structure, make the chip that is close to getting brilliant position to pick up mechanism 13 lift on the vertical direction and progressively realize, avoid chip to pick up mechanism 13 shock mount and fall and produce too big impact force to getting the chip on the brilliant platform, thereby make the chip damage, influence the efficiency that the chip was selected separately.
In a further embodiment, the tension spring 324 is a hook-and-loop tension spring, the upper hook of the hook-and-loop tension spring 324 is connected to the hook-and-loop holder of the fixing plate 321, and the lower hook of the hook-and-loop tension spring 324 is connected to the hook-and-loop holder of the connecting plate 325.
The hook-and-loop extension spring 324 is connected with the fixing plate 321 and the hook-and-loop fixing seat on the connecting plate 325, so that the moving speed of the connecting plate 325 and the cam 33 below the connecting plate 325 is reduced, and after the picking operation is completed, the connecting plate 325 and the cam 33 can return to the original high position by virtue of the tension of the extension spring 324, so as to be matched with the successful picking operation of the next chip.
In a further embodiment, the stroke adjustment assembly 3 further includes an outer cover 34, and the outer cover 34 is used for protecting the movement of the servo link assembly 31 from the influence of impurities such as smoke, dust, etc., preventing the chips from being polluted, and improving the yield.
Fig. 4 shows a schematic structural diagram of a driving assembly of the high-speed multi-head chip sorting apparatus according to the technical solution of the present invention, as shown in fig. 4, the driving assembly 12 includes a servo motor 121, a cam unit 122, and a pressing head unit 123, the servo motor 121, the cam unit 122, and the pressing head unit 123 are fixedly connected from top to bottom, and the servo motor 121 drives the cam unit 122 to move and drives the pressing head unit 123 to move up and down in a vertical direction. The servo motor 121, the cam unit 122 and the pressing head unit 123 are fixed by the fixing seat 124, the combination of the servo motor 121 and the cam unit 122 can effectively improve the pressing speed and stability, and the pressing head unit 123 is used for pushing the chip picking mechanism 13 to descend or ascend in the vertical direction, so as to drive the chip picking mechanism 13 to move up and down in the vertical direction, so that the chip picking work can be smoothly carried out.
In a further embodiment, the cam unit 122 includes a cam 1221 and a cam follower 1222, the cam 1221 is connected to a rotation shaft of the servo motor 121, the cam follower 1222 is in contact with a lower surface of the cam 1221, and the lower surface of the cam 1221 has a different height dimension.
When the servo motor 121 moves, the cam 1221 with a lower surface having a different height dimension is driven to rotate, so that the cam follower 1222 below the cam 1221 is driven to move up or down in the vertical direction, and the pressing head unit 123 below the cam unit 122 is further driven to move up and down.
In a further embodiment, the pressing head unit 123 includes a pressing rod 1231, a pressing head 1232 and a compression spring 1233, the compression spring 1233 is fixedly disposed between the cam unit 122 and the fixing seat 124, the pressing rod 1231 is disposed inside the compression spring 1233, and the pressing head 1232 is fixedly connected to the pressing rod 1231.
When the servo motor 121 cooperates with the cam unit 122 to drive the ram unit 123 to move up or down, the compression spring 1233 disposed in the ram unit 123 plays a role of compressing and buffering, so as to control the ram unit 123 to move up and down in the vertical direction, and the compression spring 1233 also cooperates with the cam follower 1222 to move up and down in the vertical direction.
As shown in fig. 5, the chip picking mechanism 13 includes a suction nozzle unit 131, an elastic unit 132 and a bracket arm support 133, the elastic unit 132 is disposed below the pressing head unit 123, the elastic unit 132 is fixedly connected to the bracket arm support 133, and the suction nozzle unit 131 is fixedly disposed at the front end of the bracket arm support 133. The pressure of the chip picking mechanism 13 is regulated and controlled by the elastic unit 132, so that the overall pressing and rising speed and force of the chip picking mechanism 13 are controlled, the chip damage caused by the overlarge impact force is avoided, the bracket arm support 133 enables the suction nozzle unit 131 to stretch out of the direct stress range of the driving assembly 12 to be pressed, and the suction nozzle unit 131 can perform the crystal taking and crystal placing actions in the photographing ranges of the crystal taking positioning camera assembly 41 and the crystal placing positioning camera assembly 42.
In a further embodiment, the suction nozzle unit 131 includes suction nozzles 1311, suction nozzle bars 1312, and air pipes 1313, the air pipes 1313 being fixedly connected to the suction nozzle bars 1312, and the suction nozzle bars 1312 being detachably connected to the suction nozzles 1311.
The chip is sucked on the suction nozzle 1311 by generating suction force through the air pipe 1313, and the suction nozzle rod 1312 and the suction nozzle 1311 can be detached independently, so that the model can be changed easily.
In a further embodiment, the chip picking mechanism 13 includes a precision ball slide set 113134, the nozzle unit 131 is fixedly connected by the precision ball slide set 134, and the precision ball slide set 134 guides the up and down movement of the nozzle unit 131.
In a further embodiment, the elastic unit 132 includes a spring 1321 and an oil-free linear slide 1322.
The oil-free linear guide 1322 is used for guiding so that the entire chip pickup mechanism 13 can move in the vertical direction, and the spring 1321 has a buffering effect for adjusting the degree of pressing force.
In a further embodiment, an outer cover 135 is disposed outside the elastic unit 132, and the outer cover 135 is used to protect the lifting movement of the elastic unit 132 from the influence of impurities such as smoke, dust, etc., so as to prevent the chip from being contaminated and improve the yield.
As shown in FIG. 6, the crystal phase taking machine positioning assembly 41 comprises a CCD411, a light source 414, a lens 413 and an XYZ manual adjusting mechanism 412, wherein the CCD411, the XYZ manual adjusting mechanism 412, the lens 413 and the light source 414 are sequentially connected from top to bottom.
In a further embodiment, the crystal placement positioning assembly 42 has the same structure as the crystal removal positioning assembly.
The CCD has higher sensitivity, high detection precision and high-speed detection efficiency, the output is convenient and is not easy to be interfered by the outside, the light source and the lens are necessary components which can not be lacked for chip positioning detection, and the XYZ manual adjusting mechanism 412 ensures that the crystal taking positioning camera component 41 and the crystal placing positioning camera component 42 have the adjustability in the direction, thereby further meeting the requirements of the chip photographing positioning and detection in the crystal taking and crystal placing work.
The technical scheme of the invention has the following working procedures: the crystal taking positioning camera component is used for photographing and positioning a chip on the crystal taking platform, after a signal is received, the direct drive motor rotates, one chip picking mechanism reaches a crystal taking position, the stroke adjusting component presses the chip picking mechanism downwards to a certain height, the driving component drives the chip picking mechanism to do lifting motion in the vertical direction, at the moment, under the cooperation of the electromagnetic valve component and the vacuum pressure gauge, the chip picking mechanism performs picking work, after the picking work is finished, the crystal taking positioning camera performs a new round of photographing and positioning on the chip on the crystal taking platform, the direct drive motor continues to rotate, and the adjacent chip picking mechanism performs the next round of chip picking work; when the chip picking mechanism with the chip reaches the chip picking position, the driving assembly on the chip picking position drives the chip picking mechanism to move up and down in the vertical direction, at the moment, under the cooperation of the electromagnetic valve assembly and the vacuum pressure gauge, the chip picking mechanism carries out placing work, the chip is placed on the crystal placing platform, the crystal placing camera carries out photographing and positioning on the chip picking platform, the direct-drive motor continues to rotate, and the adjacent chip picking mechanism with the chip carries out next round of chip placing work.
According to the technical scheme, the high-speed multi-head chip sorting device is provided with the rotary crystal taking and placing unit, the stroke adjusting assembly and the protective outer cover, 18 chip picking mechanisms are arranged on the rotary crystal taking and placing unit, a direct drive motor can perform chip sorting work for multiple times within one rotation period, high-speed, high-precision and high-efficiency crystal taking is achieved, the whole set of outer cover is protected, internal air suction is performed, it is guaranteed that oil mist and dust do not pollute a product below, high cleanliness is achieved, the height difference exists when the chip picking mechanisms perform crystal taking and crystal placing due to the arrangement of the stroke adjusting assembly, the crystal taking platform and the crystal placing platform can be arranged on the upper layer and the lower layer, the occupied space is small, and the cost is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. In this way, it is intended that the present invention also cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (10)
1. The high-speed multi-head chip sorting device is characterized by comprising a rotary crystal taking and placing unit, a stroke adjusting assembly and a protective outer cover, wherein the stroke adjusting assembly is arranged on the outer side of the rotary crystal taking and placing unit in a liftable manner, the rotary crystal taking and placing unit comprises a direct drive motor, a plurality of chip picking mechanisms and a plurality of driving assemblies, the bottom of the rotary crystal taking and placing unit is provided with the plurality of chip picking mechanisms, one station on a specified crystal taking platform is a crystal taking position, one station on the specified crystal placing platform is a crystal placing position, the direct drive motor drives the plurality of chip picking mechanisms to rotate on the circumference, the crystal taking position and the driving assemblies above the crystal placing position can respectively drive the chip picking mechanisms reaching the crystal taking position and the crystal placing position to do lifting motion in the vertical direction, and the stroke adjusting assembly drives the chip picking mechanisms above the crystal taking position to press down, so that the crystal taking position and the crystal placing position form a height difference.
2. The high-speed multi-head chip sorting device according to claim 1, wherein 18 chip picking mechanisms are arranged on the rotary crystal taking and placing unit at equal intervals.
3. The high-speed multi-head chip sorting device according to claim 1, further comprising a wafer taking and positioning camera assembly and a wafer placing and positioning camera assembly, wherein the wafer taking and positioning camera assembly is fixedly arranged right above the wafer taking position, and the wafer placing and positioning camera assembly is fixedly arranged right above the wafer placing position.
4. The high-speed multi-head chip sorting device according to claim 1, wherein the stroke adjusting assembly comprises a servo link assembly, a cam and a lifting assembly, the servo link assembly is arranged on one side of the lifting assembly, the cam is fixedly arranged below the lifting assembly, and the servo link assembly drives the lifting assembly to move up and down so as to drive the cam to move up and down in a vertical direction.
5. The high-speed multi-head chip sorting device according to claim 5, wherein the lifting assembly comprises a fixed plate, a connecting plate, a linear slide rail and an extension spring, the linear slide rail is fixedly arranged on the fixed plate, the connecting plate is fixedly arranged on a slide block on the linear slide rail, one end of the extension spring is fixedly arranged on the fixed plate, the other end of the extension spring is fixedly arranged on the connecting plate, the connecting plate is fixedly connected with the servo link mechanism, the servo link mechanism comprises a servo motor, a crank and a connecting rod, one end of the connecting rod is rotatably connected with the edge of the crank, the other end of the connecting rod is rotatably connected with the connecting plate, the servo motor drives the crank to rotate, the connecting rod drives the connecting plate to move up and down, and then the cam is driven to move up and down.
6. The high-speed multi-head chip sorting device according to claim 5, wherein the cam is an arc structure with a high bottom in the middle and two low ends, and when the rotary crystal taking and placing unit is operated, the chip picking mechanism which rotates to reach the crystal taking position reaches the middle part of the cam along the arc structure.
7. The high-speed multi-head chip sorting device according to claim 1, wherein the chip picking mechanism comprises a suction nozzle unit, an elastic unit and a supporting arm support, the elastic unit is arranged below the pressure head unit, the elastic unit is fixedly connected with the supporting arm support, and the suction nozzle unit is fixedly arranged at the front end of the supporting arm support.
8. The high-speed multi-head chip sorting device according to claim 1, wherein the driving assembly comprises a servo motor, a cam unit and a pressing head unit, the servo motor, the cam unit and the pressing head unit are fixedly connected from top to bottom, and the servo motor drives the cam unit to move and drives the pressing head unit to move up and down in the vertical direction.
9. The high-speed multi-head chip sorting device according to claim 3, wherein the crystal taking camera positioning assembly and the crystal placing camera positioning assembly comprise a CCD, a light source, a lens and an XYZ manual adjusting mechanism, and the CCD, the XYZ manual adjusting mechanism, the lens and the light source are sequentially connected from top to bottom.
10. The high-speed multi-head chip sorting apparatus according to claim 1, further comprising a solenoid valve assembly and a vacuum gauge.
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| CN115608626B (en) | 2023-04-28 |
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Address after: Unit 1, 1st Floor, No. 670 Hong'an Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Address before: 361103 unit 1, floor 1, No. 670, Honglong Road, torch high tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee before: COER AUTOMATION EQUIPMENT CO.,LTD. |
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Denomination of invention: A high-speed multi head chip sorting device Granted publication date: 20230428 Pledgee: Agricultural Bank of China Limited by Share Ltd. Xiamen Xiangan branch Pledgor: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Registration number: Y2024980005972 |