CN211150594U - Solid crystal picking and packaging device - Google Patents

Abstract

A solid crystal picking and packaging device belongs to the technical field of chip packaging devices. The method is characterized in that: the die separation device is characterized by comprising a die adjusting device (57), a chip separation device (4) and a chip conveying device (5), wherein the chip separation device (4) is arranged on the lower side of the die adjusting device (57), the chip conveying device (5) is arranged on the upper side of the die adjusting device (57), a die frame for clamping a die (13) is arranged on the die adjusting device (57), and a detection device is further arranged on the upper side of the die adjusting device (57). This encapsulation device is picked up to solid crystal's mould adjusting device can drive the mould and rotate to adjust the gesture of chip, guarantee that the chip is adjusted well with the corresponding position of lead frame, what make chip conveyor can be accurate carries the chip to the corresponding position of lead frame, guarantee that the chip is placed the accuracy good, improved the stability of chip solid crystal encapsulation, the qualification rate of product is high.

Description

Solid crystal picking and packaging device

Technical Field

A solid crystal picking and packaging device belongs to the technical field of chip packaging devices.

Background

The method is characterized in that a chip is firstly separated from a blue film and transferred to a lead frame before L ED packaging, so that the chip is packaged, the posture of the chip is required to be determined when the chip is packaged to ensure the accuracy of chip packaging, and the posture of the chip is difficult to adjust due to the fact that a die for clamping the blue film is annular, so that the posture of the chip is difficult to adjust, the adjustment of the posture of the chip is difficult, and the accuracy of chip packaging is influenced.

Disclosure of Invention

The to-be-solved technical problem of the utility model is: the solid crystal picking and packaging device overcomes the defects of the prior art, can adjust the posture of a chip, ensures that the corresponding positions of the chip and a lead frame are aligned, and automatically completes the solid crystal process.

The utility model provides a technical scheme that its technical problem adopted is: the die bonding pick-up and packaging device is characterized in that: the die comprises a die adjusting device, a chip separating device and a chip conveying device, wherein the chip separating device is arranged on the lower side of the die adjusting device, the chip conveying device is arranged on the upper side of the die adjusting device, a die frame for clamping a die is arranged on the die adjusting device, and a detecting device is further arranged on the upper side of the die adjusting device.

Preferably, the mold frame comprises a clamping ring and a mold pressing device, wherein a plurality of clamping pins are arranged on one side of the clamping ring at intervals, and the mold pressing device is arranged on the other side of the clamping ring and surrounds a clamping part together with the clamping pins.

Preferably, the mold adjusting device comprises a mold adjusting motor, and an output shaft of the mold adjusting motor is connected with the mold frame through a mold adjusting synchronous belt and drives the mold frame to rotate synchronously.

Preferably, the chip separating device comprises a puncture needle and a separating power device, the puncture needle is arranged at the lower side of the die frame, and the separating power device is connected with the puncture needle and drives the puncture needle to synchronously lift.

Preferably, the separation power device comprises a chip separation motor, a connecting rod, a chip separation shaft and a chip separation guide sleeve, the chip separation guide sleeve is slidably sleeved outside the chip separation shaft, the chip separation motor is arranged on the lower side of the chip separation shaft, one end of the connecting rod is rotatably connected with the lower end of the chip separation shaft, the other end of the connecting rod is fixedly connected with an output shaft of the chip separation motor and synchronously rotates along with the output shaft, and the puncture needle is arranged at the upper end of the chip separation shaft.

Preferably, the chip conveying device comprises a moving device and a chip sucker, the chip sucker is arranged on the moving device and moves along with the moving device, and a buffer mechanism is arranged between the chip sucker and the moving device.

Preferably, the buffer mechanism comprises a buffer spring and a chip buffer sleeve, the chip buffer sleeve is slidably mounted on the moving device, the chip suction head is mounted on the chip buffer sleeve and synchronously ascends and descends along with the chip buffer sleeve, and the buffer spring is connected with the chip buffer sleeve to push the chip buffer sleeve to reset.

Preferably, the chip conveying device further comprises a chip adjusting mechanism, the chip sucker is mounted on the chip adjusting mechanism through a buffer mechanism, and the chip adjusting mechanism is mounted on the moving device.

Preferably, the chip adjusting mechanism comprises a chip adjusting motor, the chip adjusting motor is mounted on the moving device, and the buffer mechanism is connected with an output shaft of the chip adjusting motor and drives the chip adjusting motor to synchronously rotate.

Preferably, the mould storage device is arranged on one side of the mould adjusting device, and the mould conveying device is arranged between the mould storage device and the mould adjusting device.

Compared with the prior art, the utility model discloses the beneficial effect who has is:

1. this encapsulation device is picked up to solid crystal's mould adjusting device can drive the mould and rotate to adjust the gesture of chip, guarantee that the chip is adjusted well with the corresponding position of lead frame, what make chip conveyor can be accurate carries the chip to the corresponding position of lead frame, guarantee that the chip is placed the accuracy good, improved the stability of chip solid crystal encapsulation, the qualification rate of product is high.

2. The clamping pin is matched with the pressing device to clamp the die, so that the die can synchronously rotate with the clamping ring, the die is convenient to take and place, and the posture of the chip is convenient to adjust.

3. The die adjusting motor is connected with the die frame through the die adjusting synchronous belt, so that the rotating angle of the die frame can be accurately adjusted, the posture of the chip can be accurately adjusted, and the die adjusting motor is convenient to adjust.

4. The separation power device pushes the puncture needle to lift, the puncture needle penetrates through the blue membrane and pushes the chip on the blue membrane to be separated from the blue membrane, and the chip is conveniently transferred to the lead frame by the chip conveying device.

5. The chip separation motor drives the puncture needle to reciprocate in the vertical direction through the connecting rod, so that the stroke of the reciprocating motion of the puncture needle is stable, the reciprocating lifting speed of the puncture needle is conveniently controlled, and the adjustment is convenient.

6. A buffer mechanism is arranged between the chip suction head and the moving device, so that when the chip suction head and the chip are sucked, the pressing force between the chip suction head and the chip can be ensured, the reliable attachment between the chip suction head and the chip can be ensured, the chip suction head can be further ensured to firmly suck the chip, and the damage to the chip caused by the overlarge pressing force of the chip suction head on the chip can be avoided.

7. The buffer spring pushes the chip buffer sleeve to compress the chip, and plays a role in buffering after the chip suction head is contacted with the chip, so that the excessive pressing force between the chip suction head and the chip is avoided, and the chip is prevented from being damaged.

8. The chip adjusting mechanism can adjust the posture of the chip, ensure that the chip is aligned with the corresponding position of the lead frame, and ensure that the chip is packaged accurately.

9. The chip adjusting motor drives the chip suction head to rotate through the buffer mechanism, the adjustment is convenient, the rotation angle of the chip suction head is conveniently adjusted, and the chip is guaranteed to be aligned with the corresponding position of the lead frame.

10. The die storage device can store a new die and receive an empty die, the chip storage device can convey a new lead frame to the die frame, and can transfer the empty die on the die frame back to the die storage device, so that automatic feeding and discharging are realized, and the automation degree is high.

Drawings

Fig. 1 is a schematic top view of a die attach pick-up package.

Fig. 2 is a perspective view of the mold storage device.

Fig. 3 is a partially enlarged view of a portion a in fig. 2.

Fig. 4 is a front view of the mold storage device.

Fig. 5 is a partially enlarged view of B in fig. 4.

Fig. 6 is a perspective view of the bin holding mechanism.

Fig. 7 is a perspective view of the mold conveying apparatus.

Fig. 8 is a partial enlarged view at C in fig. 7.

Fig. 9 is a front view schematically showing the mold conveying apparatus.

Fig. 10 is a perspective view of the mold positioning device.

Fig. 11 is a partial enlarged view of fig. 10 at D.

FIG. 12 is a front view of the chip separation apparatus.

Fig. 13 is a perspective view of the chip conveying device.

Fig. 14 is a front view of the chip transfer device.

Fig. 15 is a partial enlarged view at E in fig. 14.

Fig. 16 is a perspective view of the lead frame conveying apparatus.

In the figure: 1. the die storage device 2, the die conveying device 3, the die positioning device 4, the die separating device 5, the die conveying device 6, the lead frame input device 7, the lead frame conveying device 8, the lead frame output device 9, the feeding bottom plate 10, the feeding upright post 11, the bin supporting mechanism 12, the bin pressing device 13, the die 14, the bin pressing cylinder 15, the bin pressing block 1501, the pressing table 16, the bin supporting plate 1601, the bin supporting part 17, the supporting guide rail 18, the supporting slider 1801, the discharging operation part 19, the supporting mounting plate 20, the supporting spring 21, the material taking frame 22, the material taking upright post 23, the material taking guide rod 24, the material taking base 25, the die pushing frame 26, the material discharging guide plate 27, the material discharging adjusting cylinder 28, the die discharging bottom plate 29, the material discharging upright post 30, the die separating device, Discharging positioning rod 31, discharging cylinder 32, toggle roller 33, discharging baffle 34, discharging deflector 35, mold conveying frame 36, mold conveying motor 37, mold lifting cylinder 38, pushing frame 39, mold positioning disk 40, clamping jaw mounting disk 41, telescopic cylinder 42, mold clamping plate 43, mounting shaft 44, deflector 45, clamping jaw lifting guide rail 46, lifting mounting block 47, clamping jaw rotating frame 48, clamping jaw lifting frame 49, clamping jaw guide rod 50, clamping jaw lifting ring 51, clamping jaw shifting frame 5101, clamping jaw shifting groove 52, mold supporting bracket 5201, mold supporting ring 53, clamping ring 54, clamping pin 55, positioning wheel 56, mold pressing device 57, mold adjusting device 58, mold positioning translation frame 59, mold positioning frame 60, mold adjusting synchronous belt 61, pressing rod 6101, pressing rod pressing part 6102, The device comprises a pressing rod manipulation part 62, a supporting block 63, a pressing spring 64, a positioning pressing cylinder 65, a pressing wheel 66, a mold adjusting motor 67, a chip separation lifting cylinder 68, a chip separation lifting frame 69, a chip separation motor 70, a connecting rod 71, a chip separation lifting plate 72, a chip separation shaft 73, a puncture needle 74, a chip separation guide sleeve 75, a suction head translation frame 76, a suction head translation guide rail 77, a suction head lifting frame 78, a suction head lifting guide rail 79, a chip adjusting motor 80, a main shaft 81, a chip buffer sleeve 82, a chip suction head 83, a buffer spring 84, a chip conveying synchronous belt 85, a lead frame conveying frame 86, a guide shaft 87, a lead frame translation frame 88, a lifting frame 89, a suction disc mounting frame 90 and a lead frame suction disc.

Detailed Description

Fig. 1 to 16 are preferred embodiments of the present invention, and the present invention will be further explained with reference to fig. 1 to 16.

A die bonding picking and packaging device comprises a die adjusting device 57, a chip separating device 4 and a chip conveying device 5, wherein the chip separating device 4 is arranged on the lower side of the die adjusting device 57, the chip conveying device 5 is arranged on the upper side of the die adjusting device 57, a die frame for clamping a die 13 is arranged on the die adjusting device 57, and a detecting device is further arranged on the upper side of the die adjusting device 57. This encapsulation device is picked up to solid crystal's mould adjusting device 57 can drive mould 13 and rotate to adjust the gesture of chip, guarantee that the chip is adjusted well with the corresponding position of lead frame, make chip conveyor 5 can be accurate carry the chip to the corresponding position of lead frame, guarantee that the accuracy that the chip was placed is good, improved the stability of the solid crystal encapsulation of chip, the qualification rate of product is high.

The present invention is further described with reference to specific embodiments, however, it will be understood by those skilled in the art that the detailed description given herein with respect to the drawings is for better explanation and that the present invention is necessarily to be construed as limited to those embodiments, and equivalents or common means thereof will not be described in detail but will fall within the scope of the present application.

Specifically, the method comprises the following steps: as shown in fig. 1: this solid brilliant packaging hardware that picks up still includes the frame and installs mould storage device 1 in the frame, mould conveyor 2, mould positioner 3, chip conveyor 5, lead frame input device 6, lead frame conveyor 7 and lead frame output device 8, mould positioner 3 sets up in mould storage device 1 one side, mould conveyor 2 sets up between mould storage device 1 and mould positioner 3, chip separator 4 sets up the downside at mould positioner 3, chip conveyor 5 sets up 4 upsides at chip separator, lead frame conveyor 7 and mould positioner 3 set up side by side, chip conveyor 5 is used for shifting the chip on mould 13 on mould positioner 3 to the middle part of lead frame conveyor 7. The lead frame input device 6 is arranged at the input end of the lead frame conveying device 7, the lead frame output device 8 is arranged at the output end of the lead frame conveying device 7, the lead frame input device 6 conveys the lead frames to the lead frame conveying device 7, the chip conveying device 5 conveys the chips to the lead frames of the lead frame input device 6, and then the lead frames on the lead frame conveying device 7 are sent out through the lead frame output device 8.

As shown in FIGS. 2-5: mould storage device 1 includes the feeding storehouse and sets up the extracting device in feeding storehouse downside, and the discharge gate setting in feeding storehouse is in the bottom, and the downside in feeding storehouse is provided with feed bin supporting mechanism 11, is provided with the promotion portion that promotes feed bin supporting mechanism 11 and open on the extracting device. Feeding storehouse of mould storage device 1 is used for stacking mould 13, extracting device promotes feed bin supporting mechanism 11 through the promotion portion and opens, thereby make extracting device remove the bearing to mould 13 in the feeding storehouse, mould 13 falls to extracting device on, extracting device drives mould 13 whereabouts, in-process that falls down, promotion portion breaks away from with feed bin supporting mechanism 11, make feed bin supporting mechanism 11 accomplish the bearing to mould 13 again, thereby guarantee to only get a mould 13 at every turn, the automatic continuous material of getting of mould 13 has been realized, it is fast to get the material, and it is efficient to get the material.

The die storage device 1 further comprises a discharging bin and a discharging mechanism, the discharging mechanism is arranged on the lower side of the discharging mechanism, the discharging bin is arranged on one side of the discharging end of the discharging mechanism, and a die guide mechanism is arranged at the top of the discharging mechanism. The feeding bin, the material taking device, the discharging mechanism and the discharging bin are all installed on the material taking base 24.

The bin supporting mechanism 11 is provided with two at least, and the middle part upside of bin supporting mechanism 11 is provided with and is used for holding 13 feeding storehouses of mould, is provided with the ejection of compact control part 1801 that promotes it to open on the bin supporting mechanism 11. The feeding storehouse is used for stacking a plurality of moulds 13 that accompany blue membrane, and two at least feed bin supporting mechanism 11 cooperate and carry out the bearing to a plurality of moulds 13, promote the ejection of compact and control portion 1801 and make feed bin supporting mechanism 11 open, can follow the mould 13 of taking in the bottom in feeding storehouse, can realize continuous mould 13 of taking in addition, realized the continuous automatic feeding of blue membrane, improved solid brilliant efficiency. The feeding bin also comprises a feeding bottom plate 9, a bin pressing device 12 and a feeding upright post 10.

The feeding bottom plate 9 level sets up, and the middle part of feeding bottom plate 9 is provided with the through-hole that supplies mould 13 to pass through, forms the discharge gate, the upside of the feeding bottom plate 9 of the vertical setting of feeding stand 10, the lower extreme and the feeding bottom plate 9 fixed connection of feeding stand 10. The discharge gate interval equipartition that feeding column 10 encircles feeding bottom plate 9 has at least three to form the feeding storehouse at the upside of feeding bottom plate 9, in this embodiment, feeding column 10 interval equipartition has four. The feeding upright column 10 can guide the die 13, so that the die 13 can be neatly stacked in the feeding bin.

The upper end of the feeding upright post 10 is in a conical shape with the diameter gradually increasing from top to bottom, so that the die 13 can be conveniently placed in a feeding bin to be stacked.

Feed bin bearing mechanism 11 encircles feeding bottom plate 9's discharge gate interval equipartition has at least two, and in this embodiment, feed bin bearing mechanism 11 has the symmetry to set up two in the discharge gate both sides, and in two feed bin bearing portion 1601 of feed bin bearing mechanism 11 stretched into the discharge gate, two feed bin bearing mechanism 11 cooperateed and carry out the bearing to mould 13.

Feed bin closing device 12 sets up the upside at feeding bottom plate 9, and feed bin closing device 12 sets up the upside at feed bin supporting mechanism 11 to can press from both sides tightly the mould 13 of upside, and then conveniently take the mould 13 of downside.

Feed bin closing device 12 includes feed bin compress tightly cylinder 14 and feed bin compact heap 15, feed bin compress tightly 14 horizontal installation of cylinder on feeding bottom plate 9, the radial setting of feed bin compress tightly the piston rod of cylinder 14 along feeding bottom plate 9's discharge gate, the piston rod that the feed bin compressed tightly cylinder 14 sets up towards the feeding storehouse, feed bin compact heap 15 is the cuboid, feed bin compact heap 15 sets up at the feed bin and compresses tightly between cylinder 14 and the feeding storehouse, the piston rod that the feed bin compressed tightly cylinder 14 links to each other with feed bin compact heap 15, and promote its direction reciprocating motion along being close to or keeping away from the feeding storehouse. The pressing device can also be realized by an electric push rod.

Feed bin compact heap 15 is evagination towards the lower part of one side of accommodation space, forms to compress tightly platform 1501, compresses tightly the arc that is the middle part indent of platform 1501 to increased with mould 13's area of contact, can enough guarantee to compress tightly mould 13, can avoid making mould 13 warp again, and lead to mould 13 to damage.

The material taking device comprises a material taking frame 21 and a material taking cylinder, wherein the material taking frame 21 is horizontally arranged on the upper side of a material taking base 24 and is positioned under a feeding bottom plate 9, the material taking cylinder is arranged on one side of the material taking base 24, and a piston rod of the material taking cylinder is connected with the material taking frame 21 and drives the material taking frame to vertically lift. The material taking base 24 is provided with a vertical material taking guide rail, and the material taking frame 21 is slidably mounted on the material taking guide rail.

The upside of getting the work or material rest 21 is provided with three piece at least and gets material guide bar 23, get the vertical setting of material guide bar 23, in this embodiment, it is provided with three to get material guide bar 23, three are got material guide bar 23 and surround into the portion of getting with the discharge gate is coaxial, thereby lead to the mould 13 that takes off, guarantee that the mould 13 position of taking off is accurate, make things convenient for follow-up getting to mould 13 to put, it is preferred, the upper end of getting material guide bar 23 is the toper that the diameter is crescent from top to bottom, thereby make things convenient for mould 13 to enter into in the portion of getting.

The upside of material taking frame 21 still is provided with gets material stand 22, get the vertical setting of material stand 22, it is provided with two at least to get material stand 22, in this embodiment, it has three to get material stand 22, three are got material stand 22 and surround into the annular coaxial with the discharge gate, and it is less than the distance of getting material guide bar 23 to the discharge gate center to get the distance at material stand 22 to the discharge gate center, it is less than the top setting of getting material guide bar 23 to get the top of material stand 22, thereby can support the mould 13 of taking off, make mould 13 and material taking frame 21 interval set up, make things convenient for the transfer of follow-up mould 13. The feeding bottom plate 9 is provided with a material taking guide hole matched with the material taking guide rod 23.

The lateral part of getting work or material rest 21 is provided with promotion portion to with the cooperation of feed bin supporting mechanism 11, in this embodiment, feed bin supporting mechanism 11 has the symmetry to set up two in the feed bin both sides, promotion portion and 11 one-to-ones of feed bin supporting mechanism, and set up the downside at the feed bin supporting mechanism 11 that corresponds.

The lower part of the two sides of the material taking frame 21 is provided with a material taking shift lever 34, the upper end of the material taking shift lever 34 is detachably connected with the material taking frame 21, the lower end of the material taking shift lever 34 extends to the outer side of the material taking frame 21, and the lower end of the material taking shift lever 34 is rotatably provided with a shift roller 32, so that a pushing part for pushing the material taking control part 1801 is formed.

Go out the feed bin setting and in the one side of getting material base 24, go out the feed bin including mould ejection of compact bottom plate 28, ejection of compact stand 29 and ejection of compact baffle 33, mould ejection of compact bottom plate 28 is less than and gets material base 24 level setting, and mould ejection of compact bottom plate 28 sets up in the one side of getting material base 24. The vertical setting of ejection of compact stand 29 is at the upside of mould ejection of compact bottom plate 28, ejection of compact stand 29 has two of symmetry setting in mould ejection of compact bottom plate 28 both sides, ejection of compact baffle 33 sets up the upside at mould ejection of compact bottom plate 28 to the setting is kept away from one side of getting material base 24 at mould ejection of compact bottom plate 28, ejection of compact baffle 33 and the ejection of compact stand 29 of both sides surround into the open feed bin of right side and upside, discharge mechanism promotes the mould 13 of taking off the chip and piles up in the feed bin. The bottom of the mold discharge bottom plate 28 can be hinged to the mold discharge bottom plate 28 so as to facilitate the taking out of the mold 13 in the discharge bin.

Discharge mechanism includes that the mould pushes away frame 25 and ejection of compact cylinder 31, gets the middle part of material base 24 and is provided with the slot hole, gets the downside of material base 24 and installs ejection of compact guide rail, ejection of compact guide rail level sets up, and the mould pushes away the lower part slidable mounting of frame 25 on ejection of compact guide rail, and slot hole and upwards stretching out are passed on upper portion to promote mould 13 to go out in the feed bin. The discharging cylinder 31 is horizontally arranged on the material taking base 24, and a piston rod of the discharging cylinder 31 is connected with the mold pushing frame 25 and pushes the mold pushing frame to horizontally move, so that the mold 13 is pushed.

The discharging and positioning rods 30 are arranged on the upper side of the middle of the material taking base 24, the discharging and positioning rods 30 are symmetrically arranged on two sides of the mold pushing frame 25, two discharging and positioning rods 30 are arranged on each side of the mold pushing frame 25 at intervals, so that a discharging and positioning part for positioning the mold 13 is formed, and the mold 13 to be sent out is directly sent into the discharging and positioning part. The upper side of the material taking frame 21 is provided with a material taking frame guide hole matched with the discharging and positioning rod 30, the discharging and positioning rod 30 can also guide the material taking frame 21, and the linear lifting of the material taking frame 21 is guaranteed.

Get the upside of material base 24 and still be provided with ejection of compact deflector 26, ejection of compact deflector 26 has the symmetry to set up two in mould pushing away frame 25 both sides, ejection of compact deflector 26 sets up between ejection of compact locating lever 30 and ejection of compact storehouse, the vertical setting of ejection of compact deflector 26, and form discharging channel between two ejection of compact deflectors 26, the one end that discharging deflector 26 is close to ejection of compact locating lever 30 is the slope form, the width that makes discharging channel's feed end widens gradually along the direction that is close to ejection of compact locating lever 30, conveniently make mould 13 enter into in the discharging channel.

Get the downside of material base 24 and still be provided with ejection of compact adjustment mechanism, ejection of compact adjustment mechanism is used for adjusting the height of the mould 13 of seeing off, ejection of compact adjustment mechanism includes ejection of compact adjustment cylinder 27 and ejection of compact regulation pole, the vertical setting of ejection of compact adjustment cylinder 27 is getting the downside of material base 24, be provided with ejection of compact carriage between ejection of compact adjustment cylinder 27 and the material base 24 of getting, ejection of compact adjustment cylinder 27 links to each other with the ejection of compact carriage, and promote its sharp lift, the ejection of compact regulation pole has three, three ejection of compact regulation pole surrounds into the annular coaxial with the discharge gate, the lower extreme of ejection of compact regulation pole links to each other with the ejection of compact carriage, and go up and down with its synchronization, the upper end is passed and is got material base 24, ejection of compact.

As shown in fig. 6: feed bin bearing mechanism 11 includes bearing slider 18, feed bin bearing board 16 and bearing spring 20, the bilateral symmetry of feeding bottom plate 9 is provided with along the radial slot hole of discharge gate, feed bin bearing board 16 sets up the upside at feeding bottom plate 9, bearing slider 18 sets up the downside at feeding bottom plate 9, and bearing slider 18 is opening cell type up, bearing slider 18's both sides all pass behind the slot hole that feeding bottom plate 9 corresponds the side with correspond the feed bin bearing board 16 of side and link to each other, and drive feed bin bearing board 16 synchronous motion. The radial bearing guide rail 17 of edge discharge gate is installed to the bottom of feeding bottom plate 9, and bearing guide rail 17 sets up in the middle part of bearing slider 18, and bearing slider 18 and bearing guide rail 17 sliding connection to lead to bearing slider 18, guarantee bearing slider 18 rectilinear movement. The bearing spring 20 is arranged on one side of the bearing sliding block 18 far away from the discharge hole, and the bearing spring 20 is connected with the bearing sliding block 18 and pushes the bearing sliding block to move in the direction close to the discharge hole.

Bearing spring 20 has the symmetry to set up two in bearing slider 18 both sides, feed bin bearing mechanism 11 still includes bearing mounting panel 19, bearing mounting panel 19 is connected with feeding baseplate 9's lateral part detachable, bearing spring 20 one end links to each other with bearing slider 18's the side that corresponds, the other end links to each other with bearing mounting panel 19, bearing spring 20 is in compression state, thereby guarantee the impetus balance of bearing slider 18 both sides, guaranteed that bearing slider 18's removal is more smooth, feeding baseplate 9 go up can carry on spacingly to bearing slider 18.

The bottom of bearing slider 18 is for following the downward slope form gradually of the direction of keeping away from accommodation space, forms the ejection of compact and controls portion 1801, controls portion 1801 through the ejection of compact and makes bearing slider 18 to the direction of keeping away from accommodation space remove, and then makes feed bin bearing board 16 remove along the direction of keeping away from accommodation space to relieve the bearing to mould 13.

One side that feed bin bearing plate 16 is close to accommodation space is curved feed bin bearing portion 1601 of middle part indent to can enough guarantee to be reliable to the mould 13 bearing, can avoid again causing the hindrance to the mould when moving down to the mould 13 of taking.

The bin supporting mechanism 11 can also be realized by a horizontally arranged supporting cylinder or an electric push rod.

The working process of the feeding device of the chip packaging device is as follows: when needs feeding, material taking frame 21 rebound to promote feed bin supporting mechanism 11 through stirring gyro wheel 32 and open, feed bin closing device 12 compresses tightly the mould 13 of upside this moment, makes the mould 13 of downside fall on material taking frame 21, then material taking frame 21 descends, removes the restriction to feed bin supporting mechanism 11, makes feed bin supporting mechanism 11 support the mould 13 of upside once more, accomplishes and gets the material.

When the material taking frame 21 ascends to take materials, the empty die 13 enters between the four discharging positioning rods 30, the discharging adjusting cylinder 27 adjusts the height of the empty die 13, and the discharging mechanism pushes the empty die 13 to move into the discharging bin to finish discharging of the empty die 13.

As shown in FIGS. 7 to 9: the die clamping jaw is arranged on the side of the rotary power device and synchronously rotates along with the rotary power device. The mold conveying device 2 of the mold conveying device 2 drives the mold clamping jaw to rotate, so that the mold 13 is moved in and out, compared with the mold clamping jaw in linear motion, the mold conveying device greatly improves the moving speed of the mold 13, is high in working efficiency, ensures the speed of chip separation, and further ensures the efficiency of die bonding.

The mould conveying device 2 further comprises a mould conveying lifting mechanism, the mould conveying lifting mechanism is connected with the rotary power device, the mould conveying lifting mechanism is vertically arranged and drives the rotary power device to vertically lift, the rotating shaft of the rotary power device is vertically arranged, the mould clamping jaws are installed at the top of the rotary power device and are arranged side by side, in the practical force, the mould clamping jaws are provided with two clamping jaws arranged side by side, and the two mould clamping jaws are synchronously rotated along with the rotary power device.

The mold conveying device 2 further comprises a mold conveying frame 35, the mold conveying frame 35 is vertically arranged, the rotary power device is installed on the mold conveying frame 35, and the mold conveying lifting mechanism is installed at the upper end of the mold conveying frame 35.

The rotary power device comprises a die conveying motor 36 and a clamping jaw mounting disc 40, the die conveying motor 36 is vertically arranged at the lower end of the die conveying frame 35, an output shaft of the die conveying motor 36 is arranged upwards, and the die conveying lifting mechanism is detachably connected with the die conveying frame 35. The clamping jaw mounting discs 40 are arranged on the upper side of the die conveying frame 35 at intervals, and the clamping jaw mounting discs 40 are horizontally arranged.

A clamping jaw rotating frame 47 and a mounting shaft 43 are sequentially arranged between the die conveying motor 36 and the clamping jaw mounting disc 40 from bottom to top, the clamping jaw rotating frame 47 is of a groove type with an upward opening, and an output shaft of the die conveying motor 36 is connected with the bottom of the clamping jaw rotating frame 47 and drives the clamping jaw rotating frame 47 to synchronously rotate. The vertical setting of installation axle 43, in the lower extreme of installation axle 43 stretched into clamping jaw swivel mount 47, upper end and clamping jaw mounting disc 40 coaxial coupling to make mould conveying motor 36 drive clamping jaw mounting disc 40 and rotate.

The two sides of the inner wall of the clamping jaw rotating frame 47 are both provided with lifting installation blocks 46, the middle parts of the lifting installation blocks 46 are provided with guide grooves, the lower end of the installation shaft 43 extends into the space between the two lifting installation blocks 46, and the two sides of the lower end of the installation shaft 43 are both provided with clamping jaw lifting guide rails 45 which are in sliding connection with the guide grooves on the corresponding sides. The lifting mounting block 46 is matched with the clamping jaw lifting guide rail 45 on the mounting shaft 43, so that the lifting of the mounting shaft 43 can be guided, the mounting shaft 43 can synchronously rotate along with the clamping jaw rotating frame 47, the lifting and rotating actions of the clamping jaw mounting disc 40 are realized, and the mutual interference between the clamping jaw lifting guide rail and the clamping jaw rotating frame is avoided.

Elevating system is carried to mould includes mould lift cylinder 37, driving lever 44 and clamping jaw crane 48, mould lift cylinder 37 level sets up the one side at installation axle 43, and mould lift cylinder 37's piston rod sets up towards installation axle 43 level, driving lever 44 sets up between mould lift cylinder 37 and installation axle 43, driving lever 44 is for following the downward slope form of direction gradually of being close to mould lift cylinder 37, driving lever 44's one end is rotated with installation axle 43 and is connected, the other end is rotated with mould lift cylinder 37's piston rod and is connected, thereby the lift of installation axle 43 has been realized, make the lift of installation axle 43 more stable.

A pushing frame 38 is arranged between a piston rod of the mold lifting cylinder 37 and the shift rod 44, the pushing frame 38 is arranged between the shift rod 44 and the mold lifting cylinder 37, the piston rod of the mold lifting cylinder 37 is connected with the pushing frame 38 and pushes the mold lifting cylinder to move in a direction close to or far away from the mounting shaft 43, the two shift rods 44 are symmetrically arranged on two sides of the pushing frame 38, and the two shift rods 44 are respectively arranged on two sides of the mounting shaft 43. One end of the shift lever 44 is rotatably connected to the corresponding side of the pushing frame 38, and the other end is rotatably connected to the corresponding side of the mounting shaft 43.

The middle part of installation axle 43 is coaxial to be equipped with clamping jaw lift ring 50, and clamping jaw lift ring 50 goes up and down with installation axle 43 synchronous. Clamping jaw shifting frames 51 are arranged between each shifting rod 44 and the clamping jaw lifting ring 50, each clamping jaw shifting frame 51 is a cuboid, each clamping jaw shifting frame 51 is arranged between the corresponding shifting rod 44 and the corresponding clamping jaw lifting ring 50, and each clamping jaw shifting frame 51 is rotatably connected with the shifting rod 44 on the corresponding side. One side of the clamping jaw poking frame 51 close to the clamping jaw lifting ring 50 is provided with a clamping jaw poking groove 5101, and two sides of the clamping jaw lifting ring 50 are arranged in the clamping jaw poking groove 5101 on the corresponding side in a sliding manner, so that the clamping jaw lifting ring 50 can be used for poking the mounting shaft 43 to lift, and the interference on the rotation of the mounting shaft 43 can be avoided.

A clamping jaw lifting frame 48 is arranged between the die conveying frame 35 and the clamping jaw mounting disc 40, the mounting shaft 43 is rotationally connected with the clamping jaw lifting frame 48, and the clamping jaw lifting frame 48 is lifted synchronously along with the mounting shaft 43.

The clamping jaw lifting frame 48 is provided with a vertical clamping jaw guide rod 49, the mould conveying frame 35 is provided with a clamping jaw guide hole matched with the clamping jaw guide rod 49, the upper end of the clamping jaw guide rod 49 is connected with the clamping jaw lifting frame 48 and synchronously lifted along with the clamping jaw guide rod, and the lower end of the clamping jaw guide rod slides and extends into the corresponding clamping jaw guide hole. In this embodiment, the clamping jaw guide bar 49 surrounds the installation axle 43 and is evenly distributed with four at intervals, and the clamping guide hole and the clamping jaw guide bar 49 are in one-to-one correspondence, so that the installation axle 43 is guided, the straight lifting of the installation axle 43 is ensured, and the taking and placing of the mold 13 are ensured to be more accurate.

The mould clamping jaw includes die clamping cylinder and mould splint 42, and the upside at clamping jaw mounting disc 40 is installed to the clamping jaw cylinder, presss from both sides the cylinder along the radial setting of clamping jaw mounting disc 40, and mould splint 42 sets up and is keeping away from one side of clamping jaw mounting disc 40 axis at the clamp cylinder, and mould splint 42 appears in pairs, and the clamping jaw cylinder links to each other with two mould splint 42 simultaneously to drive it and open and shut, thereby realizes the clamp of mould 13 and unclamp. The lower mold clamping plate 42 can be fixedly arranged, and the upper mold clamping plate 42 is connected with the clamping jaw air cylinder, so that the opening and closing of the two mold clamping plates 42 are realized, and the clamping and loosening of the mold 13 are realized.

The clamping cylinder is connected with telescopic cylinder 41, and telescopic cylinder 41 installs on clamping jaw mounting disc 40, and telescopic cylinder 41 links to each other with clamping jaw cylinder along the radial setting of clamping jaw mounting disc 40, and telescopic cylinder 41's piston rod to promote to carry the cylinder along the radial movement of clamping jaw mounting disc 40, thereby conveniently get and put mould 13.

This mould transfer device, mould lift cylinder 37 promote the installation axle 43 and go up and down, and then realized the altitude mixture control of mould clamping jaw, and mould conveying motor 36 drives clamping jaw mounting disc 40 and rotates, and then realized the displacement of mould clamping jaw to the transfer of mould 13 has been realized. The die clamping jaws are two, when an empty die 13 is replaced, one die clamping jaw firstly clamps a new die 13, the other die clamping jaw clamps the empty die 13, and then the rotating mechanism drives the die clamping jaws to rotate, so that the new die 13 is placed on an appointed station, and the replacement efficiency of the die 13 is improved.

As shown in FIGS. 10 to 11: the mold positioning device 3 comprises a mold adjusting device 57, a mold frame is arranged on the mold adjusting device 57, a clamping portion is arranged on the mold frame, the mold adjusting device 57 is connected with the mold frame and drives the mold frame to rotate, and the detection device is arranged on one side of the clamping portion. The clamping part of the mold positioning device 3 clamps the mold 13, the detection device can detect the chip on the blue film and collect the image of the chip, and the mold adjusting device 57 drives the mold frame to rotate, so that the posture of the chip is adjusted, the posture accuracy of the chip is ensured, the packaging accuracy of the chip after the chip is taken is ensured, the equipment works stably, and the product qualification rate is high.

The mold positioning device 3 further comprises a mold support bracket 52, a mold traverse device and a mold longitudinal moving device, wherein the mold support bracket 52 is installed on the mold traverse device, the mold traverse device is installed on the mold longitudinal moving device, the moving directions of the mold traverse device and the mold longitudinal moving device are both horizontal, and the moving directions of the mold traverse device and the mold longitudinal moving device are mutually vertical.

The mold support bracket 52 is horizontally arranged, one end of the mold support bracket 52 is arranged on the mold transverse moving device, the other end is provided with an annular mold support ring 5201, and the mold frame is rotatably arranged on the upper side of the mold support ring 5201. The die adjusting device 57 is mounted on the die support bracket 52, and the die adjusting device 57 is connected with the die frame and drives the die frame to rotate synchronously, so that the posture of the chip is adjusted. The upper side of the die frame is provided with a clamping part, the detection devices are arranged on the upper side of the die frame at intervals, and the detection devices are aligned with the middle part of the clamping part. The detection device is a CCD camera, and the CCD can also be a photoelectric sensor.

The mold longitudinal moving device is installed on a mold positioning frame 59 and comprises a mold longitudinal translation linear module and a mold positioning translation frame 58, the mold positioning translation frame 58 is arranged on the upper side of the mold positioning frame 59, horizontal mold longitudinal translation guide rails are symmetrically arranged on two sides of the mold positioning frame 59, two sides of the mold positioning translation frame 58 are respectively in sliding connection with the mold longitudinal translation guide rails on the corresponding sides, the mold longitudinal translation linear module is installed on the mold positioning translation frame 58, and the mold longitudinal translation linear module is connected with the mold positioning translation frame 58 and drives the mold longitudinal translation linear module to move horizontally.

The mold transverse moving device comprises a mold transverse moving linear module, a mold bearing bracket 52 is arranged on the upper side of a mold positioning and translating frame 58, a horizontal mold transverse moving guide rail is arranged on the upper side of the mold positioning and translating frame 58, the mold transverse moving guide rail is perpendicular to a mold longitudinal moving guide rail, and the mold bearing bracket 52 is slidably mounted on the mold transverse moving guide rail. The mold lateral translation linear modules are mounted on the mold positioning translation stage 58 and are connected to and advance translation of the mold support bracket 52.

The mold frame comprises a clamping ring 53 and a mold pressing device 56, the clamping ring 53 is annular, the clamping ring 53 is arranged on the upper side of the mold support bracket 52, the clamping ring 53 and the mold support bracket 5201 are coaxially arranged, at least three positioning wheels 55 are arranged at intervals around the side part of the clamping ring 53, in the embodiment, the three positioning wheels 55 are uniformly distributed at intervals around the clamping ring 53, the positioning wheels 55 are rotatably arranged on the mold support bracket 52 and are used for positioning the clamping ring 53, and the clamping ring 53 is ensured to be coaxial with the mold support bracket 5201 all the time in the rotating process. One side of the clamping ring 53 is provided with a vertical clamping pin 54, the mold pressing device 56 is arranged on the other side of the clamping ring 53, and the mold pressing device 56 is matched with the clamping pin 54, so that the clamping and the unclamping of the mold 13 are realized, and the operation is convenient. The clamping ring 53 has a higher height at the side where the clamping pin 54 is provided than at the side where the die holding-down device 56 is provided, thereby avoiding interference with the operation of the die holding-down device 56.

The mold pressing device 56 comprises a pressing rod 61 and a pressing power device, the pressing rod 61 is arranged between the clamping ring 53 and the pressing power device, the middle of the pressing rod 61 is rotatably installed on the mold bearing bracket 52 to form a lever mechanism, one end, close to the pressing power device, of the pressing rod 61 is provided with a pressing rod control part 6102, the other end of the pressing rod is provided with a pressing rod pressing part 6101, and the pressing rod pressing part 6101 is in the shape of a circular arc with the middle part protruding outwards, so that the mold 13 is prevented from being damaged. The pressing power device is connected to the pressing lever operating portion 6102 and pushes it to swing, and further, the pressing of the mold 13 is realized by the pressing lever pressing portion 6101. The pressing rod 61 is symmetrically arranged on two sides of the pressing power device, and the pressing rod control portion 6102 of the pressing rod 61 is arranged close to the pressing power device, so that clamping of the die 13 can be guaranteed to be more reliable, and the die 13 can be prevented from being damaged by pressing.

The pressing power device comprises a pressing spring 63 and a positioning pressing cylinder 64, a supporting block 62 is arranged on the die supporting bracket 52 between the pressing rod operating part 6102 and the clamping ring 53, the pressing spring 63 is in one-to-one correspondence with the pressing rod 61, the pressing spring 63 is arranged between the supporting block 62 and the corresponding pressing rod operating part 6102, one end of the pressing spring 63 is connected with the supporting block 62, the other end is connected with the corresponding pressing rod operating part 6102, and the pressing spring 63 is in a compression state. The positioning and pressing cylinder 64 is arranged on one side, away from the clamping ring 53, of the pressing rod 61, the positioning and pressing cylinder 64 is arranged along the radial direction of the clamping ring 53, a pressing wheel 65 is rotatably mounted on a piston rod of the positioning and pressing cylinder 64, the positioning and pressing cylinder 64 pushes the two pressing rod control portions 6102 to swing through the pressing wheel 65, and then the pressing rod 61 is enabled to release the pressing of the die 13.

The mold adjusting device 57 comprises a mold adjusting motor 66, the mold adjusting motor 66 is installed on the mold supporting bracket 52, an output shaft of the mold adjusting motor 66 is vertically arranged, and the output shaft of the mold adjusting motor 66 is connected with the clamping ring 53 through a mold adjusting synchronous belt 60, so that the clamping ring 53 is driven to synchronously rotate, and the rotating angle of the clamping ring 53 can be accurately adjusted. A synchronous pulley is mounted on an output shaft of the mold adjusting motor 66, side teeth meshed with the mold adjusting synchronous belt 60 are arranged on the side portion of the clamping ring 53, one end of the mold adjusting synchronous belt 60 is meshed with the synchronous pulley, and the other end of the mold adjusting synchronous belt 60 is meshed with the side teeth of the clamping ring 53.

When the die positioning device is used, the positioning pressing cylinder 64 firstly pushes the pressing rod 61 to be opened, when the die 13 enters the upper side of the clamping ring 53, the positioning pressing cylinder 64 resets, and the pressing spring 63 pushes the pressing rod 61 to swing and press the die 13. At this time, the chip on the die 13 is detected by the detection device, and the die adjustment motor 66 drives the clamping ring 53 to rotate, so that the posture of the chip is adjusted, and the chip is accurately packaged.

As shown in fig. 12: the chip separation device 4 comprises a plurality of puncture needles 73 and a separation power device, the puncture needles 73 are arranged side by side, the puncture needles 73 are vertically arranged, the puncture needles 73 are arranged on the upper side of the separation power device and ascend and descend along with the separation power device, and the puncture needles 73 penetrate through the blue membrane and separate the chip from the blue membrane, so that the separation of the chip from the blue membrane is realized.

The separating power device comprises a chip separating motor 69, a connecting rod 70, a chip separating shaft 72 and a chip separating guide sleeve 74, the chip separating motor 69 is installed on the chip separating lifting frame 68, the chip separating guide sleeve 74 is vertically fixed on the upper side of the chip separating lifting frame 68, the chip separating guide sleeve 74 is a cylinder with the upper end sealed, the upper end of the chip separating shaft 72 slidably extends into the chip separating guide sleeve 74, and a through hole for the puncture needle 73 to pass through is formed in the upper end of the chip separating guide sleeve 74. The lower end of the chip separating shaft 72 is fixed with a chip separating lifting plate 71, and the chip separating lifting plate 71 drives the chip separating shaft 72 to synchronously lift. The chip separation motor 69 is disposed at a lower side of the chip separation elevating plate 71, an output shaft of the chip separation motor 69 is connected to the chip separation elevating plate 71 through a connecting rod 70, one end of the connecting rod 70 is connected to the output shaft of the chip separation motor 69 and rotates synchronously therewith, and the other end of the connecting rod 70 is rotatably connected to a lower end of a chip separation shaft 72, thereby achieving elevation of the puncture needle 73.

The downside of chip separation crane 68 is provided with chip separation lift cylinder 67, and the vertical setting of chip separation lift cylinder 67, the output shaft of chip separation lift cylinder 67 and chip separation crane 68 link to each other to promote its lift, with the separation of the blue membrane chip of adaptation not co-altitude. The chip separation lifting frame 68 is provided with a chip separation guide shaft at the side part for guiding the chip separation lifting frame 68, so that the chip separation lifting frame 68 is ensured to be lifted linearly, and the chip separation is ensured to be accurate.

As shown in FIGS. 13 to 15: the chip conveying device 5 comprises a moving device and a chip sucker 82, wherein the chip sucker 82 is installed on the moving device and moves along with the moving device, and a buffer mechanism is arranged between the chip sucker 82 and the moving device. A buffer mechanism is arranged between the chip suction head 82 of the chip conveying device 5 and the moving device, so that pressing force between the chip suction head 82 and a chip can be guaranteed when the chip suction head 82 and the chip suck, reliable attaching between the chip suction head 82 and the chip can be guaranteed, the chip suction head 82 can suck the chip firmly, and damage to the chip caused by overlarge pressing force of the chip suction head 82 on the chip can be avoided.

The moving device comprises a suction head translation device and a suction head lifting device, the suction head lifting device is installed on the suction head translation device, and the chip suction head 82 is installed on the suction head lifting device through a buffer mechanism. The chip conveying device 5 further comprises a chip adjusting mechanism, the chip adjusting mechanism is installed on the chip lifting device, and the chip sucker 82 is installed on the chip lifting device through a buffer mechanism.

The suction head translation device comprises a suction head translation frame 75, a suction head translation guide rail 76 and a suction head translation linear module, the suction head translation guide rail 76 is horizontally arranged, the suction head translation guide rail 76 is provided with two suction head translation guide rails which are arranged in parallel and at intervals, the upper side and the lower side of the suction head translation frame 75 are respectively installed on the suction head translation guide rails 76 on the corresponding sides in a sliding mode, and the suction head translation frame 75 is guaranteed to move linearly. The tip translation linear module is connected to the tip translation frame 75, and pushes the tip translation frame 75 to move horizontally.

The suction head lifting device comprises a suction head lifting frame 77 and a suction head lifting linear module, the bilateral symmetry of the suction head translation frame 75 is provided with vertical suction head lifting guide rails 78, the two sides of the suction head lifting frame 77 are respectively slidably mounted on the suction head lifting guide rails 78 on the corresponding sides, the suction head lifting linear module is mounted on the suction head translation frame 75, and the suction head lifting linear module is connected with the suction head lifting frame 77 and pushes the suction head lifting frame 77 to linearly lift.

The chip adjusting mechanism comprises a chip adjusting motor 79 and a spindle 80, the chip adjusting motor 79 is installed on the suction head lifting frame 77, the spindle 80 is rotatably installed on the suction head lifting frame 77, the spindle 80 is vertically arranged, and the chip adjusting motor 79 is arranged between the spindle 80 and the suction head translation frame 75. The output shaft of the chip adjusting motor 79 is connected with the main shaft 80 and drives the main shaft 80 to rotate synchronously, and the chip adjusting mechanism is installed at the lower end of the main shaft 80.

The output shaft of the chip adjusting motor 79 is connected with the main shaft 80 through the chip conveying synchronous belt 84, the output shaft of the chip adjusting motor 79 is provided with a driving synchronous belt pulley, the main shaft 80 is provided with a driven synchronous belt pulley, one end of the chip conveying synchronous belt 84 is meshed with the driving synchronous belt pulley, the other end of the chip conveying synchronous belt 84 is meshed with the driven synchronous belt pulley, the rotating angle of the main shaft 80 is conveniently controlled, and then the posture of the chip is adjusted. The bottom of the suction head lifting frame 77 can be provided with a CCD camera or a photoelectric sensor, thereby realizing the detection of the posture of the chip and the position of the lead frame.

Buffer gear includes buffer spring 83 and chip cushion collar 81, and the internal diameter of the lower extreme of chip cushion collar 81 is less than the internal diameter of upper end, and in the lower extreme of main shaft 80 slided to stretch into the upper end of chip cushion collar 81, through key-type connection or splined connection between main shaft 80 and the chip cushion collar 81 to make main shaft 80 and chip cushion collar 81 rotate in step, and then realized the regulation to the chip angle. The buffer spring 83 is sleeved on the main shaft 80, the upper end of the buffer spring 83 is supported on the suction head lifting frame 77, the lower end of the buffer spring 83 is supported on the chip buffer sleeve 81, and the buffer spring 83 is in a compressed state.

The chip suction head 82 is a chip suction pen point, the upper end of the chip suction head 82 extends into the lower end of the chip buffer sleeve 81, the chip suction head 82 synchronously ascends and descends along with the chip buffer sleeve 81, and the chip suction head 82 synchronously rotates along with the chip buffer sleeve 81, so that the angle of a chip is adjusted. The main shaft 80 is cylindrical, the lower end of the main shaft 80 is communicated with a chip suction head 82 through a chip buffer sleeve 81, and a rotary joint is arranged at the upper end of the main shaft, so that a negative pressure air pipe can be conveniently connected.

The main shaft 80 is coaxially provided with a detection disc, one side of the detection disc protrudes outwards to form a detection part, and the suction head lifting frame 77 is provided with a photoelectric sensor matched with the detection disc, so that the rotation angle of the main shaft 80 is detected, and the rotation angle of the main shaft is conveniently controlled.

When the chip transfer device is used, the suction head translation device and the suction head lifting device drive the chip suction head 82 to move, so that the position of the chip suction head 82 is adjusted, and the adjustment is convenient. The chip adjusting mechanism drives the chip sucker 82 to rotate, so that the angle of the chip is adjusted, and the chip is aligned with the corresponding position of the lead frame. After the chip suction head 82 is attached to the chip, the suction head lifting device continues to descend, so that the chip suction head 82 is reliably attached to the chip through the elastic force of the buffer spring 83, and the chip suction head 82 is further ensured to firmly suck the chip. When the tip elevating device descends, the chip tip 82 cannot be stopped immediately due to inertia, and the buffer spring 83 can also eliminate damage to the chip due to the inertia of the tip elevating device.

As shown in fig. 16: the lead frame conveying device 7 comprises a lead frame conveying frame and a lead frame conveying linear module, a horizontal lead frame guide rail is arranged on the rack, the lead frame conveying frame is slidably mounted on the lead frame guide rail, the lead frame linear module is mounted on the rack, and the lead frame linear module is connected with the lead frame conveying frame and pushes the lead frame conveying frame to move horizontally.

The lead frame input device 6 and the lead frame output device 8 have the same structure and respectively comprise a lead frame conveying frame 85, a lead frame translation frame 87, a lead frame lifting frame 88 and a lead frame sucker 90, wherein a guide shaft 86 is arranged on the lead frame conveying frame 85, the guide shaft 86 is horizontally arranged, the lead frame translation frame 87 is slidably arranged on the guide shaft 86, a lead frame conveying linear module is arranged on the lead frame conveying frame 85, the lead frame conveying linear module is connected with the lead frame translation frame 87 and pushes the lead frame translation frame 87 to translate, a lead frame lifting guide rail is arranged on the lead frame translation frame 87 and is vertically arranged, the lead frame lifting frame 88 is slidably arranged on the lead frame lifting guide rail, a lead frame lifting cylinder is arranged on the lead frame translation frame 87, a piston rod of the lead frame lifting cylinder is connected, and drive the vertical lift of lead frame crane 88, install sucking disc mounting bracket 89 on the lead frame crane 88, lead frame sucking disc 90 is installed on lead frame mounting bracket 89, installs a plurality of lead frame sucking discs 90 on the lead frame mounting bracket 89 to guarantee the lead frame level of absorption, avoid the chip to drop.

The die conveying device 2 of the die-bonding pick-up packaging device transfers dies 13 on a die storage device 1 to a die positioning device 3, the die positioning device 3 positions the dies 13, a chip separation device 4 separates chips on a blue film from the blue film, a chip conveying device 5 transfers the separated chips to lead frames on a lead frame conveying device 7, a lead frame input device 6 is used for conveying empty lead frames to the lead frame conveying device 7, and a lead frame output device 8 is used for sending out the lead frames on which the chips are arranged.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims (10)

1. A die attach pick-up package device, comprising: the die separation device is characterized by comprising a die adjusting device (57), a chip separation device (4) and a chip conveying device (5), wherein the chip separation device (4) is arranged on the lower side of the die adjusting device (57), the chip conveying device (5) is arranged on the upper side of the die adjusting device (57), a die frame for clamping a die (13) is arranged on the die adjusting device (57), and a detection device is further arranged on the upper side of the die adjusting device (57).

2. The die attach pick-up package assembly of claim 1, wherein: the die frame comprises a clamping ring (53) and a die pressing device (56), wherein a plurality of clamping pins (54) are arranged on one side of the clamping ring (53) at intervals, and the die pressing device (56) is arranged on the other side of the clamping ring (53) and surrounds the clamping pins (54) to form a clamping part.

3. The die attach pick-up package assembly of claim 1, wherein: the die adjusting device (57) comprises a die adjusting motor (66), and an output shaft of the die adjusting motor (66) is connected with the die frame through a die adjusting synchronous belt (60) and drives the die frame to synchronously rotate.

4. The die attach pick-up package assembly of claim 1, wherein: the chip separating device (4) comprises a puncture needle (73) and a separating power device, the puncture needle (73) is arranged at the lower side of the die frame, and the separating power device is connected with the puncture needle (73) and drives the puncture needle to synchronously lift.

5. The die attach pick-up and package assembly of claim 4, wherein: the separation power device comprises a chip separation motor (69), a connecting rod (70), a chip separation shaft (72) and a chip separation guide sleeve (74), wherein the chip separation guide sleeve (74) is slidably sleeved outside the chip separation shaft (72), the chip separation motor (69) is arranged on the lower side of the chip separation shaft (72), one end of the connecting rod (70) is rotatably connected with the lower end of the chip separation shaft (72), the other end of the connecting rod is fixedly connected with an output shaft of the chip separation motor (69) and synchronously rotates along with the output shaft, and a puncture needle (73) is arranged at the upper end of the chip separation shaft (72).

6. The die attach pick-up package assembly of claim 1, wherein: the chip conveying device (5) comprises a moving device and a chip suction head (82), the chip suction head (82) is installed on the moving device and moves along with the moving device, and a buffer mechanism is arranged between the chip suction head (82) and the moving device.

7. The die attach pick-up and package assembly of claim 6, wherein: buffer gear include buffer spring (83) and chip cushion collar (81), chip cushion collar (81) slidable mounting is on mobile device, chip suction head (82) are installed on chip cushion collar (81) to along with chip cushion collar (81) synchronous lift, buffer spring (83) link to each other with chip cushion collar (81), promote it to reset.

8. The die attach pick-up and package assembly of claim 6, wherein: the chip conveying device (5) further comprises a chip adjusting mechanism, the chip suction head (82) is installed on the chip adjusting mechanism through a buffer mechanism, and the chip adjusting mechanism is installed on the moving device.

9. The die attach pick-up package assembly of claim 8, wherein: the chip adjusting mechanism comprises a chip adjusting motor (79), the chip adjusting motor (79) is installed on the moving device, and the buffer mechanism is connected with an output shaft of the chip adjusting motor (79) and drives the chip adjusting motor to synchronously rotate.

10. The die attach pick-up package assembly of claim 1, wherein: the die storage device (1) is arranged on one side of the die adjusting device (57), and the die conveying device (2) is arranged between the die storage device (1) and the die adjusting device (57).

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