CN115537753A - Open-close type shielding component and film deposition machine station with same - Google Patents
Open-close type shielding component and film deposition machine station with same Download PDFInfo
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- CN115537753A CN115537753A CN202110725819.4A CN202110725819A CN115537753A CN 115537753 A CN115537753 A CN 115537753A CN 202110725819 A CN202110725819 A CN 202110725819A CN 115537753 A CN115537753 A CN 115537753A
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- 230000008021 deposition Effects 0.000 title claims abstract description 20
- 238000000427 thin-film deposition Methods 0.000 claims abstract description 24
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 239000010408 film Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 17
- 238000013459 approach Methods 0.000 abstract description 9
- 238000005137 deposition process Methods 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 4
- 239000011553 magnetic fluid Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention provides a film deposition machine with an open-close type shielding component, which mainly comprises a reaction cavity, a bearing disc and an open-close type shielding component, wherein the middle part of the open-close type shielding component and the bearing disc are positioned in the reaction cavity. The open-close type shielding component comprises a first shielding plate, a second shielding plate and a driving device, wherein the driving device is connected with the first shielding plate and the second shielding plate and is used for driving the first shielding plate and the second shielding plate to swing towards opposite directions. When the deposition process is performed, the driving device drives the first and second shielding plates to move away from each other and switch to an open state. When the cleaning process is performed, the driving device drives the first and second shielding plates to approach each other and switches to a shielding state to shield the carrier plate, thereby preventing the carrier plate from being contaminated in the process of cleaning the thin film deposition machine.
Description
Technical Field
The invention relates to a film deposition machine with an open-close type shielding component, which mainly shields a bearing disc through the open-close type shielding component so as to avoid polluting the bearing disc in the process of cleaning a processing chamber.
Background
Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment and are commonly used in integrated circuit, light emitting diode, display and other processes.
The deposition apparatus mainly includes a chamber and a wafer tray, wherein the wafer tray is disposed in the chamber and is used for carrying at least one wafer. For example, in physical vapor deposition, a target is disposed in the chamber, wherein the target faces the wafer on the wafer carrier. During physical vapor deposition, inert gas and/or reaction gas can be conveyed into the cavity, bias voltage is respectively applied to the target material and the wafer bearing disc, and the borne wafer is heated through the wafer bearing disc.
The inert gas in the cavity forms ionized inert gas under the action of the high-voltage electric field, and the ionized inert gas is attracted by bias on the target material to bombard the target material. Target atoms or molecules sputtered from the target are attracted by the bias on the wafer carrier plate and deposit on the surface of the heated wafer to form a film on the surface of the wafer.
After a period of time, the inner surface of the chamber forms a deposition film, and thus the chamber needs to be periodically cleaned to prevent the deposition film from falling off during the process and further contaminating the wafer. Furthermore, oxides or other contaminants may also form on the surface of the target, and thus periodic cleaning of the target is also required. Generally, plasma ions are bombarded against the target in the chamber by a burn-in process to remove oxides or other contaminants from the surface of the target.
When the chamber and the target are cleaned, the wafer carrying tray and the wafer in the chamber need to be taken out, or the wafer carrying tray needs to be isolated, so that the wafer carrying tray and the wafer are prevented from being polluted in the cleaning process.
Disclosure of Invention
Generally, after a certain period of use, a thin film deposition tool typically needs to be cleaned to remove oxide or nitride from the thin film and the target deposited in the chamber. Particles generated during the cleaning process contaminate the carrier plate, thereby requiring isolation of the carrier plate from contaminants. The invention provides an open-close type shielding component and a film deposition machine station with the same. The shielding plate operating in the shielding state can be used for shielding the bearing plate so as to avoid the pollution of particles generated when the cavity or the target material is cleaned on the bearing plate.
The present invention provides a thin film deposition machine with an openable shielding member, which mainly comprises a reaction chamber, a carrying plate and an openable shielding member. The open-close type shielding component comprises a driving device and two shielding plates, wherein the driving device is connected with and drives the two shielding plates to respectively swing towards opposite directions, so that the two shielding plates are operated in an open state and a shielding state.
When the reaction cavity is cleaned, the driving device drives the two shielding plates to mutually approach in a swinging mode, so that the two shielding plates approach and shield the bearing plate in the accommodating space, and plasma or generated pollution used in the cleaning process is prevented from contacting the bearing plate and/or a substrate borne by the bearing plate. When the deposition process is carried out, the driving device drives the two shielding plates to move away from each other in a swinging mode, and the thin film deposition can be carried out on the substrate in the reaction cavity.
An objective of the present invention is to provide a film deposition machine with an openable shielding member, wherein two shielding plates form a complete shielding member, so as to reduce the space required for accommodating the shielding plates. In an embodiment of the present invention, the two shielding plates can swing in opposite directions in the accommodating space of the reaction chamber, wherein the two shielding plates can be operated in an open state or a shielding state in the accommodating space of the reaction chamber, so as to simplify the structure of the reaction chamber and reduce the volume of the reaction chamber.
An objective of the present invention is to provide a film deposition machine with an openable shielding member, wherein a driving device is connected to and supports two shielding plates through two connecting arms, respectively, so as to reduce the load of the connecting arms. In addition, a shielding plate with larger thickness can be further used to prevent the shielding plate from generating high-temperature deformation when the film deposition machine is cleaned, and the effect of shielding the bearing disc by the shielding plate is favorably improved.
In order to achieve the above object, the present invention provides a thin film deposition apparatus, comprising: a reaction cavity comprising a containing space; a bearing disc positioned in the containing space and used for bearing at least one substrate; and an openable shielding member comprising: a first shielding plate positioned in the accommodating space; the second shielding plate is positioned in the accommodating space; and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein the first shielding plate and the second shielding plate in the shielding state are used for shielding the bearing disc.
The invention provides an open-close type shielding component, which is suitable for a film deposition machine table, and comprises: a first shielding plate; a second shielding plate; and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein the first shielding plate in the shielding state is close to the second shielding plate, and a spacing space is formed between the first shielding plate in the opening state and the second shielding plate.
The driving device comprises a shaft seal device and at least one driving motor, and the driving motor is connected with the first shielding plate and the second shielding plate through the shaft seal device.
The film deposition machine platform comprises a film deposition machine platform body, a shaft sealing device and a driving motor, wherein the shaft sealing device comprises an outer pipe body and a shaft body, the outer pipe body comprises a space for accommodating the shaft body, the driving motor is connected with a first shielding plate through the outer pipe body, is connected with a second shielding plate through the shaft body, and synchronously drives the shaft body and the outer pipe body to rotate in opposite directions.
The film deposition machine platform and the opening-closing type shielding component comprise a first connecting arm and a second connecting arm, the outer tube body is connected with the first shielding plate through the first connecting arm, and the shaft body is connected with the second shielding plate through the second connecting arm.
The film deposition machine platform and the opening-closing type shielding component comprise a plurality of position sensing units arranged in the reaction cavity and used for sensing the positions of the first shielding plate and the second shielding plate.
The thin film deposition machine platform comprises a thin film deposition machine platform body, a first shielding plate and a second shielding plate, wherein the area of the first shielding plate is larger than that of the second shielding plate.
In the film deposition machine platform and the opening-closing type shielding component, the height of the first shielding plate is higher than that of the second shielding plate, and part of the first shielding plate and part of the second shielding plate which operate in a shielding state are overlapped.
The beneficial effects of the invention are: when the reaction cavity is cleaned, the driving device can drive the first shielding plate and the second shielding plate to be close to each other and switch the first shielding plate and the second shielding plate into a shielding state to shield the bearing plate, so that the bearing plate is prevented from being polluted in the process of cleaning a film deposition machine.
Drawings
FIG. 1 is a schematic side sectional view illustrating an embodiment of a thin film deposition apparatus with an openable and closable shielding member operating in a shielding state according to the present invention.
Fig. 2 is a schematic perspective view illustrating an open/close type shielding member of a thin film deposition machine according to an embodiment of the present invention in an open state.
Fig. 3 is a schematic perspective view illustrating an open/close type shielding member of a thin film deposition machine according to an embodiment of the present invention operating in a shielding state.
Fig. 4 is a schematic perspective cross-sectional view illustrating an embodiment of a driving device for an opening/closing type shielding member according to the present invention.
Fig. 5 is a schematic perspective view of an embodiment of a linking mechanism of an opening/closing type shielding member according to the present invention.
FIG. 6 is a top view of an embodiment of a thin film deposition apparatus with an openable shielding member according to the present invention in an open state.
FIG. 7 is a top view of an embodiment of a thin film deposition apparatus with an openable shielding member in a shielding state according to the present invention.
FIG. 8 is a top view of another embodiment of a thin film deposition apparatus with an openable shielding member according to the present invention, the apparatus being in an open state.
Description of reference numerals: 10-a thin film deposition device; 100-an opening and closing type shielding member; 11-a reaction chamber; a 111-stop; 112-an opening; 12-an accommodating space; 121-cleaning the space; 13-a carrier tray; 141-first connecting arm; 143-a second linking arm; 15-a shield; 151-first shield plate; 152-space; 153-a second shield plate; 161-target material; 163-substrate; 17-a drive means; 171-a drive motor; 173-a shaft seal device; 1731-outer body; 1732-space; 1733-a shaft body; 18-a linkage mechanism; 181-drive gear; 183-a first driven gear; 185-a second driven gear; 19-position sensing unit.
Detailed Description
Fig. 1 is a schematic side cross-sectional view illustrating an embodiment of a thin film deposition machine with an openable shielding member operating in a shielding state according to the present invention. As shown in the figure, the thin film deposition apparatus 10 mainly includes a reaction chamber 11, a carrying tray 13 and an opening/closing type shielding member 100, wherein the reaction chamber 11 includes an accommodating space 12 for accommodating the carrying tray 13 and a part of the opening/closing type shielding member 100.
The susceptor 13 is disposed in the accommodating space 12 of the reaction chamber 11 and is used for supporting at least one substrate 163. Taking the thin film deposition apparatus 10 as a physical vapor deposition chamber as an example, a target 161 is disposed in the reaction chamber 11, wherein the target 161 faces the substrate 163 and the susceptor 13. For example, the target 161 may be disposed on the upper surface of the reaction chamber 11 and face the susceptor 13 and/or the substrate 163 in the accommodating space 12.
Referring to fig. 2 and fig. 3, the opening/closing type shielding member 100 includes a first shielding plate 151, a second shielding plate 153 and a driving device 17, wherein the first shielding plate 151 and the second shielding plate 153 are located in the accommodating space 12. The driving device 17 is connected to the first shielding plate 151 and the second shielding plate 153, and drives the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, for example, the first shielding plate 151 and the second shielding plate 153 swing synchronously around the driving device 17.
In an embodiment of the invention, the driving device 17 is connected to a first connecting arm 141 and a second connecting arm 143, and is connected to the first shielding plate 151 and the second shielding plate 153 through the first connecting arm 141 and the second connecting arm 143, respectively, wherein the driving device 17 drives the first shielding plate 151 and the second shielding plate 153 to swing or rotate in opposite directions through the first connecting arm 141 and the second connecting arm 143, respectively.
The first shielding plate 151 and the second shielding plate 153 may be plate bodies, wherein the first shielding plate 151 and the second shielding plate 153 may have similar areas and shapes, for example, the first shielding plate 151 and the second shielding plate 153 may be semicircular plate bodies. When the driving device 17 drives the first shielding plate 151 and the second shielding plate 153 to close, the first shielding plate 151 and the second shielding plate 153 approach each other to form a disc-shaped shielding member 15, and the carrier tray 13 and/or the substrate 163 is shielded by the shielding member 15.
The first shielding plate 151 and the second shielding plate 153 according to the embodiment of the present invention operate in a shielding state or the first shielding plate 151 and the second shielding plate 153 are connected, which may be defined as the first shielding plate 151 and the second shielding plate 153 are close to each other until the distance between the two is smaller than a threshold, for example, smaller than 1mm. Specifically, the first shielding plate 151 and the second shielding plate 153 do not directly contact each other, so as to prevent particles generated by the first shielding plate 151 and the second shielding plate 153 during the contact process from contaminating the accommodating space 12 of the reaction chamber 11 and/or the susceptor 13.
In an embodiment of the invention, the first shielding plate 151 and the second shielding plate 153 may be disposed at different heights, for example, the first shielding plate 151 is higher than the second shielding plate 153, when the first shielding plate 151 and the second shielding plate 153 operate in the shielding state, a part of the first shielding plate 151 overlaps a part of the second shielding plate 153, so as to improve the shielding effect of the shielding member 15.
The first shielding plate 151 and the second shielding plate 153 have similar areas and shapes, and are semi-circular plates, which are only an embodiment of the present invention and are not intended to limit the scope of the present invention. In practical applications, the first shielding plate 151 and the second shielding plate 153 may be plates with different areas and shapes, or may be plates with square, oval or any geometric shapes, for example, the area of the first shielding plate 151 may be larger than that of the second shielding plate 153. It is within the scope of the present invention that the shielding member 15 is composed of a first shielding plate 151 and a second shielding plate 153, wherein the first shielding plate 151 and the second shielding plate 153 can shield the susceptor 13 and/or the substrate 163 when the first shielding plate 151 and the second shielding plate 153 are closed.
Taking the first shielding plate 151 and the second shielding plate 153 as semicircular plates, the first shielding plate 151 and the second shielding plate 153 have a straight side and a semicircular or arc side, respectively, wherein the straight sides of the first shielding plate 151 and the second shielding plate 153 face each other. When the driving device 17 drives the first shielding plate 151 and the second shielding plate 153 to approach each other, the straight sides of the first shielding plate 151 and the second shielding plate 153 approach each other to form the circular shielding member 15. The first shielding plate 151 and the second shielding plate 153 are connected by straight side edges, which is only an embodiment of the present invention and is not intended to limit the scope of the present invention. In practical applications, the straight side edges of the first shielding plate 151 and the second shielding plate 153 may also be corresponding curved or saw-toothed side edges, so long as the side edges of the first shielding plate 151 and the second shielding plate 153 connected to each other can be close to and combined with each other, the supporting plate 13 can be effectively shielded.
In an embodiment of the present invention, as shown in fig. 4, the driving device 17 includes at least one driving motor 171 and a shaft sealing device 173, wherein the driving motor 171 is connected to the first shielding plate 151 and the second shielding plate 153 by the shaft sealing device 173. The driving motor 171 is located outside the accommodating space 12 of the reaction chamber 11, and the shaft sealing device 173 passes through and is disposed in the reaction chamber 11, wherein a part of the shaft sealing device 173 is located in the accommodating space 12 of the reaction chamber 11.
The shaft seal 173 includes an outer body 1731 and a shaft 1733. The outer tube 1731 includes a space 1732 for accommodating the shaft 1733, wherein the outer tube 1731 and the shaft 1733 are coaxially disposed, and the outer tube 1731 and the shaft 1733 can rotate relatively. The outer tube 1731 is connected to the first connecting arms 141, and is connected to the first shielding plate 151 via the first connecting arms 141 to drive the first shielding plate 151 to swing. The shaft 1733 is connected to the second connecting arm 143, and is connected to and drives the second shielding plate 153 to swing via the second connecting arm 143.
The shaft seal 173 may be a common shaft seal, and is mainly used to isolate the accommodating space 12 of the reaction chamber 11 from the external space so as to maintain the vacuum of the accommodating space 12. In another embodiment of the present invention, the shaft sealing device 173 can be a magnetic fluid shaft seal and includes a plurality of bearings, at least one permanent magnet, at least one magnetic pole piece and at least one magnetic fluid. For example, the bearing may be disposed on the outer surface of the shaft 1733 and between the shaft 1733 and the outer tube 1731, such that the shaft 1733 and the outer tube 1731 may rotate relative to each other. Permanent magnets are disposed on the inner surface of the outer tube 1731 between the two bearings. Two pole pieces are disposed on the inner surface of the outer tube 1731 and between the permanent magnet and the two bearings, respectively. A gap is provided between the pole piece and the outer surface of the shaft 1733, and the magnetic fluid is disposed in the gap. The above-mentioned configuration of the magnetic fluid shaft seal is only an embodiment of the present invention, and is not a limitation to the scope of the present invention.
In an embodiment of the invention, as shown in fig. 4, the number of the driving motors 171 may be two, and the two driving motors 171 are respectively connected to the outer tube 1731 and the shaft 1733 of the sealing device 173 and respectively drive the outer tube 1731 and the shaft 1733 to synchronously rotate in opposite directions, so as to respectively drive the first shielding plate 151 and the second shielding plate 153 to swing in different directions through the outer tube 1731 and the shaft 1733.
In another embodiment of the present invention, as shown in fig. 5, the number of the driving motors 171 may be one, and the first shielding plate 151 and the second shielding plate 153 are connected and driven to synchronously swing in opposite directions by a linkage mechanism 18 via the first connecting arm 141 and the second connecting arm 143, respectively. Specifically, the linkage mechanism 18 includes a driving gear 181, a first driven gear 183, and a second driven gear 185, wherein the driving gear 181 engages with the first driven gear 183 and the second driven gear 185. The first driven gear 183 is connected to the first shielding plate 151 through the outer body 1731 and the first connecting arm 141, and the second driven gear 185 is connected to the second shielding plate 153 through the shaft 1733 and the second connecting arm 143. When the driving gear 181 rotates, the first driven gear 183 and the second driven gear 185 rotate in opposite directions, and drive the outer tube 1731 and the shaft 1733 to rotate in opposite directions, so as to drive the first shielding plate 151 and the second shielding plate 153 to synchronously swing in opposite directions.
The linkage mechanism 18 includes three gears only as an embodiment of the present invention, and in different embodiments, the linkage mechanism 18 may include a plurality of rotating wheels and a plurality of belts, wherein the driving motor 171 is connected to one of the rotating wheels and drives the outer tube 1731 and the shaft 1733 to rotate in opposite directions through the rotating wheel and the belts.
Specifically, the thin film deposition apparatus 10 and/or the open-close type shielding member 100 of the present invention can be operated in two states, i.e., an open-state shielding state. As shown in fig. 2 and 6, the driving device 17 can drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, so that the first shielding plate 151 and the second shielding plate 153 are separated from each other and operate in an open state. A space 152 is formed between the first shielding plate 151 and the second shielding plate 153 when the target 161 is operated in the open state, so that the first shielding plate 151 and the second shielding plate 153 are not present between the target 161 and the susceptor 13 and the substrate 163.
The susceptor 13 and the substrate 163 may then be driven toward the target 161, and the gas, such as inert gas, in the accommodating space 12 may impact the target 161 to deposit a thin film on the surface of the substrate 163.
In an embodiment of the invention, as shown in fig. 1, the accommodating space 12 of the reaction chamber 11 may be provided with a stopper 111, wherein one end of the stopper 111 is connected to the reaction chamber 11, and the other end of the stopper 111 forms an opening 112. When the carrier plate 13 approaches the target 161, it enters or contacts the opening 112 formed by the stopper 111. The reaction chamber 11, the carrier plate 13 and the stopper 111 separate a reaction space in the accommodating space 12, and deposit a thin film on the surface of the substrate 163 in the reaction space, thereby preventing the formation of a deposited thin film on the surfaces of the reaction chamber 11 and the carrier plate 13 outside the reaction space.
Further, as shown in fig. 3 and 7, the driving device 17 may drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, so that the first shielding plate 151 and the second shielding plate 153 approach each other and operate in a shielding state. The closed first shielding plate 151 and the closed second shielding plate 153 may form a shielding member 15, wherein the shielding member 15 is located between the target 161 and the carrier plate 13 and is used for shielding the carrier plate 13 to isolate the target 161 from the carrier plate 13.
The shielding member 15 can separate a cleaning space 121 in the accommodating space 12, wherein the cleaning space 121 is partially overlapped or close to the reaction space. A burn-in process may be performed in the cleaning space 121 to clean the target 161 and the reaction chamber 11 and/or the stopper 111 in the cleaning space 121, and remove oxide, nitride or other contaminants on the surface of the target 161 and the deposited film on the surface of the reaction chamber 11 and/or the stopper 111.
During the cleaning process of the thin film deposition apparatus 10, the susceptor 13 and/or the substrate 163 are shielded or isolated by the shielding member 15 to prevent the substances generated during the cleaning process from contaminating or depositing on the surface of the susceptor 13 and/or the substrate 163.
Specifically, the first shielding plate 151 and the second shielding plate 153 form the shielding member 15, and the first connecting arm 141 and the second connecting arm 143 respectively bear the weight of the first shielding plate 151 and the second shielding plate 153, so that the burden on the first connecting arm 141 and the second connecting arm 143 can be reduced.
By using two connecting arms 141/143 to carry the weight of part of the shielding plates 151/153, respectively, the thickness or weight of the first shielding plate 151 and the second shielding plate 153 can be further increased. The thicker first shielding plate 151 and the thicker second shielding plate 153 can prevent high temperature deformation during the cleaning process of the thin film deposition machine 10, and prevent plasma or contamination from contacting the lower susceptor 13 or the substrate 163 through the deformed first shielding plate 151 and the deformed second shielding plate 153 during the cleaning process.
In addition, the shielding member 15 is divided into two first shielding plates 151 and second shielding plates 153 which can be connected and separated from each other, which is more favorable for reducing the receiving space required by the first shielding plates 151 and the second shielding plates 153 in the open state, and can simplify or adjust the structure of the reaction chamber 11.
In an embodiment of the invention, as shown in fig. 6 and 7, the first shielding plate 151 and the second shielding plate 153 can be operated in the open state and the shielding state in the accommodating space 12 of the reaction chamber 11 without additionally providing one or more storage chambers for storing the shielding plates in the open state. For example, the volume of the reaction chamber 11 and/or the accommodating space 12 may be slightly larger than the original volume, so that the first shielding plate 151 and the second shielding plate 153 can be opened or closed in the accommodating space 12 of the reaction chamber 11.
In an embodiment of the invention, a plurality of position sensing units 19 may be further disposed on the reaction chamber 11, wherein the position sensing units 19 face the accommodating space 12 and are configured to sense positions of the first shielding plate 151 and the second shielding plate 153 to determine whether the first shielding plate 151 and the second shielding plate 153 are in an open state. The position sensing unit 19 may be a light sensing unit, for example.
If the first shielding plate 151 and the second shielding plate 153 are not completely opened, the carrier 13 is displaced toward the target 161, which may cause the carrier 13 to collide with the first shielding plate 151 and the second shielding plate 153, thereby damaging the carrier 13, the first shielding plate 151 and/or the second shielding plate 153. In practical applications, the position of the position sensing unit 19 can be adjusted, wherein the first shielding plate 151 and the second shielding plate 153 are opened to a specific angle and then sensed by the position sensing unit 19. Then, the susceptor 13 can approach the target 161 to avoid collision of the susceptor 13 with the first shielding plate 151 and the second shielding plate 153.
In practical applications, the position of the retractable shielding member 100 in the reaction chamber 11 can be adjusted according to the configuration of other mechanisms or moving lines on the thin film deposition apparatus 10. Taking the accommodating space 12 of the reaction chamber 11 as a square, as shown in fig. 6 and 7, the driving device 17 of the retractable shielding member 100 may be disposed at or near the side of the reaction chamber 11 and/or the accommodating space 12. As shown in fig. 8, the driving device 17 of the retractable shielding member 100 may also be disposed at a corner or a top corner of the reaction chamber 11 and/or the accommodating space 12, so as to facilitate disposing mechanisms such as a substrate feeding port and an exhaust line at a side of the reaction chamber 11.
The invention has the advantages that:
when the reaction cavity is cleaned, the driving device can drive the first shielding plate and the second shielding plate to be close to each other and switch the first shielding plate and the second shielding plate into a shielding state to shield the bearing plate, so that the bearing plate is prevented from being polluted in the process of cleaning a film deposition machine.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, i.e., all equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention described in the claims should be included in the scope of the present invention.
Claims (10)
1. A thin film deposition machine, comprising:
a reaction cavity body, including a containing space;
a bearing disc positioned in the containing space and used for bearing at least one substrate; and
an openable shade member comprising:
a first shielding plate located in the accommodating space;
a second shielding plate located in the accommodating space;
and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so as to switch the first shielding plate and the second shielding plate between an opening state and a shielding state, wherein the first shielding plate and the second shielding plate in the shielding state are close to each other and are used for shielding the bearing disc.
2. The apparatus of claim 1, wherein the driving device comprises a shaft seal device and at least one driving motor, and the driving motor is connected to the first shielding plate and the second shielding plate via the shaft seal device.
3. The thin film deposition apparatus as claimed in claim 2, wherein the shaft sealing device includes an outer tube and a shaft, the outer tube includes a space for receiving the shaft, the driving motor is connected to the first shielding plate through the outer tube, and is connected to the second shielding plate through the shaft, and synchronously drives the shaft and the outer tube to rotate in opposite directions.
4. The apparatus of claim 3, comprising a first connecting arm and a second connecting arm, wherein the outer tube is connected to the first shielding plate through the first connecting arm, and the outer tube is connected to the second shielding plate through the second connecting arm.
5. The apparatus of claim 1, comprising a plurality of position sensing units disposed in the reaction chamber for sensing positions of the first shielding plate and the second shielding plate.
6. The apparatus of claim 1, wherein the first shielding plate is higher than the second shielding plate, and a portion of the first shielding plate and a portion of the second shielding plate overlap when the first shielding plate and the second shielding plate are in the shielding state.
7. An opening and closing type shielding component is suitable for a film deposition machine station, and is characterized by comprising:
a first shielding plate;
a second shielding plate; and
and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so as to switch the first shielding plate and the second shielding plate between an opening state and a shielding state, wherein the first shielding plate in the shielding state is close to the second shielding plate, and a spacing space is formed between the first shielding plate in the opening state and the second shielding plate.
8. The opening-closing shielding member of claim 7, wherein the driving device comprises a shaft sealing device and at least one driving motor, and the driving motor is connected to the first shielding plate and the second shielding plate via the shaft sealing device.
9. The opening-closing type shielding member of claim 8, wherein the shaft sealing device comprises an outer tube and a shaft, the outer tube comprises a space for accommodating the shaft, the driving motor is connected to the first shielding plate through the outer tube, is connected to the second shielding plate through the shaft, and synchronously drives the shaft and the outer tube to rotate in opposite directions.
10. The shutter according to claim 7, wherein the first shield plate has an area larger than that of the second shield plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110725819.4A CN115537753A (en) | 2021-06-29 | 2021-06-29 | Open-close type shielding component and film deposition machine station with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110725819.4A CN115537753A (en) | 2021-06-29 | 2021-06-29 | Open-close type shielding component and film deposition machine station with same |
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| Publication Number | Publication Date |
|---|---|
| CN115537753A true CN115537753A (en) | 2022-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110725819.4A Pending CN115537753A (en) | 2021-06-29 | 2021-06-29 | Open-close type shielding component and film deposition machine station with same |
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| JP2006070330A (en) * | 2004-09-02 | 2006-03-16 | Nippon Shinku Kogaku Kk | Thin film vapor deposition system |
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| WO2015087505A1 (en) * | 2013-12-12 | 2015-06-18 | 株式会社アルバック | Film deposition preparation method for inline type film deposition device, inline type film deposition device, and carrier |
| US20190341237A1 (en) * | 2016-12-14 | 2019-11-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Shutter mechanism for target, and film-forming device provided with same |
| CN112813384A (en) * | 2021-01-06 | 2021-05-18 | 鑫天虹(厦门)科技有限公司 | Thin film deposition apparatus |
| CN216237258U (en) * | 2021-06-29 | 2022-04-08 | 鑫天虹(厦门)科技有限公司 | Open-close type shielding component and film deposition device with same |
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2021
- 2021-06-29 CN CN202110725819.4A patent/CN115537753A/en active Pending
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| JP2006070330A (en) * | 2004-09-02 | 2006-03-16 | Nippon Shinku Kogaku Kk | Thin film vapor deposition system |
| JP2007131883A (en) * | 2005-11-09 | 2007-05-31 | Ulvac Japan Ltd | Film deposition apparatus |
| WO2015087505A1 (en) * | 2013-12-12 | 2015-06-18 | 株式会社アルバック | Film deposition preparation method for inline type film deposition device, inline type film deposition device, and carrier |
| US20190341237A1 (en) * | 2016-12-14 | 2019-11-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Shutter mechanism for target, and film-forming device provided with same |
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