CN115304982A - Shielding coating for satellite-borne integrated circuit packaging and preparation method thereof - Google Patents

Shielding coating for satellite-borne integrated circuit packaging and preparation method thereof Download PDF

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CN115304982A
CN115304982A CN202210962526.2A CN202210962526A CN115304982A CN 115304982 A CN115304982 A CN 115304982A CN 202210962526 A CN202210962526 A CN 202210962526A CN 115304982 A CN115304982 A CN 115304982A
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lead
coating
halogen perovskite
perovskite powder
shielding coating
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CN115304982B (en
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李杨
崔凯
吴晓宏
洪杨
卢松涛
秦伟
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Harbin Institute of Technology
Chongqing Research Institute of Harbin Institute of Technology
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Harbin Institute of Technology
Chongqing Research Institute of Harbin Institute of Technology
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04Homopolymers or copolymers of ethene
    • C09D123/06Polyethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21FPROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00Shielding characterised by the composition of the materials
    • G21F1/02Selection of uniform shielding materials
    • G21F1/023Liquids
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21FPROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00Shielding characterised by the composition of the materials
    • G21F1/02Selection of uniform shielding materials
    • G21F1/10Organic substances; Dispersions in organic carriers
    • G21F1/103Dispersions in organic carriers

Abstract

The invention discloses a shielding coating for packaging a satellite-borne integrated circuit and a preparation method thereof, belongs to the technical field of preparation of functional materials, and particularly relates to the technical field of special functional coatings. The invention solves the defects of high cost, high density, poor mechanical property and the like of the traditional radiation-resistant shielding material. According to the invention, the lead-halogen perovskite powder is compounded with the resin material, the advantages of each component material are combined, a plurality of composite coatings with excellent performance are constructed, and meanwhile, the shielding of various high-energy rays is realized and the generation of secondary particles is inhibited by utilizing the synergistic mode of the lead-halogen perovskite powder multi-component material. And the composite coating has a large number of interfaces of lead-halogen perovskite and resin, so that a structure with alternately arranged high-Z materials and low-Z materials is constructed, and the bremsstrahlung radiation generated by the action of high-energy electrons and the high-Z materials is further inhibited.

Description

Shielding coating for satellite-borne integrated circuit packaging and preparation method thereof
Technical Field
The invention relates to a shielding coating for packaging a satellite-borne integrated circuit and a preparation method thereof, belongs to the technical field of preparation of functional materials, and particularly relates to the technical field of special functional coatings.
Background
With the comprehensive development of the Mars detection task, deep space detection enters a new era, and higher requirements are put forward on the service life of a satellite-borne integrated circuit. The satellite-borne integrated circuit is in a severe space radiation environment all the time, wherein high-energy rays such as high-energy electrons and gamma rays can generate radiation effects such as a total dose effect, a single event effect, a displacement effect and the like in the satellite-borne integrated circuit, the working stability of the satellite-borne integrated circuit is seriously influenced, even the satellite-borne integrated circuit is damaged, and the service life of the satellite-borne integrated circuit is shortened. Therefore, it is crucial to develop and design a shield coating for a satellite-borne integrated circuit package with excellent radiation shielding performance.
The existing shielding material is mainly selected by considering a material with high atomic number and high density, and lead metal is used as a traditional radiation shielding material and is widely applied to the fields of nuclear industry, nuclear medicine and the like, but the traditional radiation shielding material is toxic and serious in environmental pollution, has a weak absorption region for X rays, is poor in neutron shielding performance, large in mass and poor in mechanical performance, and is not suitable for being used as a packaging shielding coating of a satellite-borne integrated circuit. Therefore, it is necessary to provide a light-weight composite coating with excellent radiation shielding performance and good mechanical performance for the packaging shielding coating of the satellite-borne integrated circuit.
Disclosure of Invention
The invention provides a composite coating with light weight, excellent radiation shielding performance and good mechanical performance for a satellite-borne integrated circuit packaging shielding coating and a preparation method thereof, aiming at solving the defects of high cost, high density, poor mechanical performance and the like of the traditional radiation-resistant shielding material.
The technical scheme of the invention is as follows:
one of the objects of the present invention is to provide a method for preparing a radiation shielding coating, comprising the steps of:
s1, preparing lead halide perovskite powder;
lead salt, halogen acid and methylamine are used as raw materials, and lead halogen perovskite powder is prepared by a solvothermal method;
s2, preparing a composite coating;
mixing lead-halogen perovskite powder with resin, grinding to obtain slurry, coating the slurry on the surface of an object to be protected, and curing to form the radiation shielding coating.
Further limiting, the lead salt in S1 is lead acetate and/or lead iodide.
Further, the hydrohalic acid in S1 is hydrochloric acid, hydrobromic acid or hydroiodic acid.
Further limiting, the specific operation of S1 is: adding lead salt into a hydrohalic acid solution, stirring until the lead salt is completely dissolved, adding an isopropanol solvent, uniformly stirring, adding a methylamine solution, transferring the mixed solution into a reaction kettle, heating for reaction, and sequentially performing centrifugation, washing and drying treatment after the reaction is finished to obtain lead-halogen perovskite powder.
Further limiting, the heating reaction temperature is 60-180 ℃, and the time is 0.5-4 h.
Further, the mass ratio of the lead halogen perovskite powder to the resin in S2 is (1-3) to (7-9).
Further, the resin in S2 is epoxy resin, polyethylene, polyurethane or cyanate ester.
And further selecting, wherein a three-roll grinder is adopted for grinding in the step S2, and the grinding time is 5-20 min.
Further defined, slurry application means include, but are not limited to, knife coating, brush coating, spray coating, or spin coating.
Further defined, the thickness of the slurry coated on the surface of the object to be protected is 100-500 μm.
Further limiting, the curing treatment temperature is 60-150 ℃, and the time is 2-8 h.
One of the objects of the present invention is to provide a radiation shielding coating prepared by the above method, which is used for packaging shielding coating of satellite-borne integrated circuit.
According to the invention, the lead-halogen perovskite powder is compounded with the resin material, the advantages of each component material are combined, a plurality of composite coatings with excellent performance are constructed, and meanwhile, the shielding of various high-energy rays is realized and the generation of secondary particles is inhibited by utilizing the synergistic mode of the lead-halogen perovskite powder multi-component material. Compared with the prior art, the application also has the following beneficial effects:
(1) According to the invention, the lead-halogen perovskite powder is embedded into the resin material, so that the density of the composite coating is effectively controlled, the light composite coating is prepared, and the defects of high density, high toxicity and the like of the traditional material lead metal are effectively overcome.
(2) The lead-halogen perovskite powder prepared by the invention constructs a blocking channel in the resin matrix, enhances the collision probability between gamma rays and materials, and effectively attenuates the intensity of incident gamma rays. In addition, methylamine ions in the lead halide perovskite crystal lattice can block further transmission of secondary electrons, the penetration depth of the secondary electrons is shortened, high-energy electrons are well protected, and meanwhile, a resin material can be used as a moderator to decelerate neutrons.
(3) In addition, the composite coating prepared by the invention has a large number of interfaces of lead-halogen perovskite and resin, a structure with alternately arranged high-Z materials and low-Z materials is constructed, and the bremsstrahlung radiation generated by the action of high-energy electrons and the high-Z materials is inhibited to a certain extent.
(4) The lead halogen perovskite powder prepared by the invention can also play a role in enhancing the mechanical property of the resin matrix.
(5) The preparation process of the composite coating provided by the invention is simple and is suitable for large-scale production.
Drawings
FIG. 1 shows lead-halogen perovskite powder (MAPbBr) prepared in example 1 3 ) SEM photograph of (a);
FIG. 2 is a composite coating (MAPbBr) prepared in example 1 3 + epoxy resin);
FIG. 3 shows the lead-halogen perovskite powder (MAPbBr) prepared in example 1 3 ) And composite coatings (MAPbBr) 3 + epoxy resin) XRD spectrum;
FIG. 4 is a simulated depth of penetration of electrons in epoxy;
FIG. 5 shows electron-in-composite coating (MAPbBr) 3 + epoxy) penetration depth simulation plot;
FIG. 6 shows electron-in-composite coating (PbBr) 2 + epoxy) penetration depth simulation plot;
FIG. 7 shows lead-halo perovskite powder (MAPbI) prepared in example 2 3 ) SEM photograph of (a);
FIG. 8 is a composite coating (MAPbI) prepared in example 2 3 + epoxy) SEM photograph.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The experimental procedures used in the following examples are conventional unless otherwise specified. The materials, reagents, methods and apparatus used, unless otherwise specified, are conventional in the art and are commercially available to those skilled in the art.
Example 1:
this example prepares a composite coating (MAPbBr) 3 + epoxy resin) is carried out according to the following steps:
step 1, preparing lead-halogen perovskite powder (MAPbBr) 3 ):
Firstly, 120mg of white powder of lead acetate trihydrate is accurately weighedIn a beaker, 2mL of a 50wt% hydrobromic acid solution was added to the beaker, and stirred until the powder was completely dissolved in the hydrobromic acid solution, 60mL of an isopropyl alcohol solvent was added to the beaker, and stirred uniformly, 600 μ L of a 30wt% methylamine solution was added thereto using a pipette, and stirring was continued for 30min. Pouring the prepared mixed precursor into a 100mL polytetrafluoroethylene reaction kettle liner, putting the mixture into a reaction kettle, putting the reaction kettle into a drying oven, preserving heat for 4 hours at 140 ℃, taking out the reaction kettle, cooling the reaction kettle to room temperature, centrifuging a reaction product, continuously washing the reaction product for 3 times by using an isopropanol solution, and drying the reaction product to obtain lead-halogen perovskite powder (MAPbBr) 3 )。
For the obtained lead halogen perovskite powder (MAPbBr) 3 ) The microscopic morphology was characterized, and the results are shown in FIG. 1, from which it can be seen that MAPbBr was produced 3 The powder is cubic and has complete crystal structure.
For obtaining lead halogen perovskite powder (MAPbBr) 3 ) XRD test was performed with the results as MAPbBr in FIG. 3 3 As shown in the graph, the diffraction peaks of the prepared powder XRD at 14.9 °, 21.2 °, 30.2 °, 33.8 °, 37.2 °, 43.2 °, 45.9 °, 48.6 °, 53.6 °, 55.9 °, and 58.2 ° respectively correspond to the (100), (110), (200), (210), (211), (220), (300), (310), (222), (320), and (321) crystal planes, which indicates that MAPBR is successfully prepared 3 And (3) powder. .
Step 2, preparing a composite coating (MAPbBr) 3 + epoxy resin):
mixing the obtained lead halogen perovskite powder (MAPbBr) 3 ) Mixing with epoxy resin (K-9761A agent and B agent are mixed according to the mass ratio of 2: 1), wherein the lead halogen perovskite powder (MAPbBr 3 ) The mass ratio of the epoxy resin to the epoxy resin is 1:9. fully grinding the mixture by a three-roller grinder for 10min, coating the obtained slurry on the surface of the satellite-borne integrated circuit by adopting a blade coating mode after grinding to form a coating with the thickness of 500 mu m, placing the coating in a vacuum drying oven, and curing for 6h at 60 ℃ to obtain a composite coating (MAPbBr) 3 + epoxy resin).
For the obtained composite coating (MAPbBr) 3 + epoxy resin) to perform microscopic morphology characterization,as a result, as shown in FIG. 2, MAPbBr was observed 3 The powder is uniformly dispersed in the epoxy resin.
For the obtained composite coating (MAPbBr) 3 + epoxy resin) were XRD tested, the results are shown as MAPbBr in figure 3 3 As shown in the graph, the XRD diffraction peak of the composite coating corresponds to MAPbBr 3 Shows successful MAPbBr combination 3 Mixed into the epoxy resin.
For the obtained composite coating (MAPbBr) 3 + epoxy) the radiation shielding performance was tested by irradiating the composite coating with a 241-Am source (59.5 keV) for 10s, with the results shown in table 1 below:
TABLE 1
Figure BDA0003793324280000041
As can be seen from Table 1, the density of the obtained composite coating was 1.287g/cm 3 Linear attenuation coefficient of 0.698cm -1 The composite coating with the thickness of only 0.992cm can attenuate the initial gamma ray by 50 percent, and the radiation shielding performance is excellent.
For the obtained composite coating (MAPbBr) 3 + epoxy) and the results are shown in fig. 5, from fig. 5, it can be seen that 59.5keV has a penetration depth of 50 μm in the composite coating, and compared with the penetration depth of fig. 4 electrons in the epoxy, MAPbBr 3 The addition of the powder effectively blocks the penetration behavior of electrons in the composite coating.
For the obtained composite coating (MAPbBr) 3 + epoxy resin) and epoxy resin, 3 test specimens were tested, and the results of the mechanical property tests are shown in tables 2 and 3 below:
table 2:
modulus of elasticity/GPa 1 2 3 Mean value of
EP 2.3 1.4 2.6 2.1
Composite coating 3.7 3.8 3.7 3.7
As can be seen from Table 2, MAPbBr 3 The addition of the powder improves the elastic modulus of the composite coating.
Table 3:
Figure BDA0003793324280000042
Figure BDA0003793324280000051
as can be seen from Table 3, MAPbBr 3 The addition of the powder improves the hardness of the composite coating.
Comparative example 1:
the comparative example differs from the examples in that: in step 1, no methylamine solution was added, and the rest of the operation and parameter settings were the same as in example 1.
The electron penetration depth simulation was performed on the obtained coating, and the results are shown in fig. 6:
the composite coating formed without methylamine solution is PbBr 2 + epoxy, 59.5keV penetration depth in the composite coating 52 μm, and MAPbBr in the composite coating with the electrons of FIG. 5 (MAPbBr) 3 + epoxy) shows that the presence of methylamine ions can block further transport of electrons.
Example 2:
this example prepares a composite coating (MAPbI) 3 + epoxy resin) is carried out according to the following steps:
step 1, preparing lead-halogen perovskite powder (MAPbI) 3 ):
Firstly, 120mg of white powder of lead acetate trihydrate is accurately weighed in a clean beaker, 2mL of hydriodic acid solution with the concentration of 50wt% is added into the beaker, the mixture is stirred until the powder is completely dissolved in the hydriodic acid solution, 60mL of isopropanol solvent is added into the beaker, the mixture is stirred uniformly, 600 mu L of methylamine solution with the concentration of 30wt% is added into the beaker by using a liquid transfer gun, and the stirring is continued for 30min. Pouring the prepared mixed precursor into a 100mL polytetrafluoroethylene reaction kettle liner, putting the mixed precursor into a reaction kettle, putting the reaction kettle into a drying oven, preserving heat for 4 hours at 140 ℃, taking out the reaction kettle, cooling the reaction kettle to room temperature, centrifuging a reaction product, continuously washing the reaction product for 3 times by using an isopropanol solution, and drying the reaction product to obtain lead-halogen perovskite powder (MAPbI) 3 )。
For the obtained lead halogen perovskite powder (MAPbI) 3 ) The microscopic morphology was characterized, and the results are shown in FIG. 7, from which it can be seen that the MAPbI was prepared 3 The powder is in a cuboid shape, and the crystal structure is complete.
Step 2, preparing the composite coating (MAPbI) 3 + epoxy resin):
lead-halogen perovskite powder (MAPbI) obtained by the method 3 ) And epoxy resin (K-9761A agent and B agent are mixed according to the mass ratio of 2: 1), wherein the lead-halogen perovskite powder (MAPbI 3 ) The mass ratio of the epoxy resin to the epoxy resin is 2:8. fully grinding the mixture of the two by a three-roller grinder for 10min, and scraping after grindingCoating the slurry on the surface of a satellite-borne integrated circuit to form a coating with the thickness of 500 mu m, placing the coating in a vacuum drying oven, and curing at 60 ℃ for 6h to obtain a composite coating (MAPbI) 3 + epoxy resin).
For the obtained composite coating (MAPbI) 3 + epoxy resin) and the results are shown in fig. 8, from which it can be seen that MAPbI 3 The powder is uniformly dispersed in the epoxy resin.
For the obtained composite coating (MAPbI) 3 + epoxy) the composite coating was irradiated with a 241-Am source (59.5 keV) for 10 seconds with the following test results in table 3:
table 3:
Figure BDA0003793324280000061
as can be seen from Table 3, the density of the obtained composite coating was 1.390g/cm 3 Linear attenuation coefficient of 1.640cm -1 And the composite coating with the thickness of only 0.423cm can attenuate the initial gamma ray by 50 percent, and the radiation shielding performance is excellent.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A preparation method of a radiation shielding coating is characterized by comprising the following steps:
s1, preparing lead-halogen perovskite powder;
lead salt, halogen acid and methylamine are used as raw materials, and lead halogen perovskite powder is prepared by a solvothermal method;
s2, preparing a composite coating;
mixing lead-halogen perovskite powder with resin, grinding to obtain slurry, coating the slurry on the surface of an object to be protected, and curing to form the radiation shielding coating.
2. The method of claim 1, wherein the lead salt is lead acetate and/or lead iodide.
3. The method of claim 1, wherein the hydrohalic acid is hydrochloric acid, hydrobromic acid, or hydroiodic acid.
4. The method of claim 1, wherein S1 is specifically operative to: adding lead salt into a hydrohalic acid solution, stirring until the lead salt is completely dissolved, adding an isopropanol solvent, uniformly stirring, adding a methylamine solution, transferring the mixed solution into a reaction kettle, heating for reaction, and sequentially performing centrifugation, washing and drying treatment after the reaction is finished to obtain lead-halogen perovskite powder.
5. The method of claim 4, wherein the heating reaction temperature is 60 ℃ to 180 ℃ and the time is 0.5h to 4h.
6. The method for preparing a radiation shielding coating according to claim 1, wherein the mass ratio of the lead-halogen perovskite powder to the resin is (1-3) to (7-9), and the resin is epoxy resin, polyethylene, polyurethane or cyanate ester.
7. The method of claim 1, wherein the grinding is performed with a three-roll mill for 5-20 min.
8. The method of claim 1, wherein the curing temperature is 60 ℃ to 150 ℃ and the curing time is 2h to 8h.
9. A radiation shielding coating prepared by the method of claim 1.
10. A radiation shielding coating of claim 9 applied to a package shielding coating of a satellite-borne integrated circuit.
CN202210962526.2A 2022-08-11 2022-08-11 Packaging shielding coating for spaceborne integrated circuit and preparation method thereof Active CN115304982B (en)

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