CN115268225A - Supporting device for automatic exposure machine of printed circuit board - Google Patents
Supporting device for automatic exposure machine of printed circuit board Download PDFInfo
- Publication number
- CN115268225A CN115268225A CN202210862201.7A CN202210862201A CN115268225A CN 115268225 A CN115268225 A CN 115268225A CN 202210862201 A CN202210862201 A CN 202210862201A CN 115268225 A CN115268225 A CN 115268225A
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- China
- Prior art keywords
- plate
- shaped auxiliary
- supporting device
- automatic exposure
- backing plate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a supporting device for an automatic exposure machine of a printed circuit board. The device comprises a base plate and a U-shaped auxiliary plate, wherein the base plate is provided with a plurality of through holes; the backing plate is used for supporting the PCB; the U-shaped auxiliary plate is U-shaped; the U-shaped auxiliary plate is detachably arranged on the surface of the backing plate and is used for surrounding the PCB and covering part of the through holes. The invention has the following beneficial effects: through redesign and use to the backing plate, when having avoided the not unidimensional PCB board of conversion, the process of frequently installing and tearing down of original backing plate has reduced wearing and tearing. The increased U-shaped auxiliary plate and the scale are calibrated, PCB boards of various sizes can be perfectly matched, the original time for replacing the base plate is saved, the process of sealing by sticking an adhesive tape is avoided, the labor is saved, and the operation efficiency is improved. The plate changing times are reduced, so that the cross contamination of dust, sundries and the like generated by the abrasion of the backing plate is reduced, and the exposure quality is improved.
Description
Technical Field
The invention relates to a supporting device for an automatic exposure machine of a printed circuit board.
Background
The development of the communication technology enables the laser automatic imaging technology to be widely applied to the pattern transfer process of the printed circuit board, the used full automatic (LDI) exposure machine can directly image on the PCB, a film negative film is not needed, the deviation caused by the expansion and contraction and the alignment of the negative film is reduced, and a more precise circuit can be manufactured. LDI exposure machine table surface needs use the backing plate in order to guarantee PCB board and mesa vacuum laminating, and the application method of backing plate at present is according to different board sizes, selects with PCB board size phase-match or the bleeder vent backing plate that is close, can have following problem or not enough:
1. when the size of the PCB is smaller than the area of the air suction holes of the base plate, redundant air suction holes need to be sealed manually by using an adhesive tape so as to ensure the vacuum pressure of the table board, the deviation of the adhesive tape can cause poor vacuum at the edge of the PCB, foreign matters falling due to frictional contact between the adhesive tape and the base plate can cause cross contamination in the exposure process, the exposure quality can be reduced, and the product yield is influenced.
2. When the not unidimensional PCB board of preparation, need frequently to adorn and pull down not unidimensional backing plate, collide with and lead to backing plate corner damage, the dust that the wearing and tearing process produced can lead to exposing the foreign matter, influences the product yield, and the backing plate counterpoint degree of excessive wearing and tearing and vacuum absorption ability decline lead to the life of backing plate to shorten, need change through the exposure machine supplier, and is expensive.
Disclosure of Invention
One of the objectives of the present invention is to overcome the deficiencies of the prior art and to provide a supporting device for an automatic exposure machine of a printed circuit board, which reduces the abrasion of a pad plate.
In order to realize the purpose, the invention is realized by the following technical scheme:
support arrangement for printed wiring board automatic exposure machine, its characterized in that includes:
the base plate is provided with a plurality of through holes; the backing plate is used for supporting the PCB;
the U-shaped auxiliary plate is U-shaped;
the U-shaped auxiliary plate is detachably arranged on the surface of the backing plate and used for surrounding the PCB and covering part of the through holes.
According to an embodiment of the present invention, each of the backing plates is provided with a plurality of the U-shaped auxiliary plates; the widths of the plurality of U-shaped auxiliary plates are different.
According to one embodiment of the invention, the supporting device further comprises a machine table, wherein the machine table is provided with a groove; the backing plate is detachably arranged in the groove.
According to one embodiment of the invention, the machine table is provided with scale marks.
According to one embodiment of the invention, the base plate is detachably or non-detachably connected with the machine platform.
According to one embodiment of the invention, the U-shaped auxiliary plate is bonded to the table or the backing plate.
According to one embodiment of the invention, the U-shaped auxiliary plate is bonded to the backing plate or the table by film tape.
According to an embodiment of the present invention, the U-shaped auxiliary plate and the pad plate are connected by magnetic attraction.
According to one embodiment of the invention, the backing plate is a polymer material plate with copper foils attached to two surfaces; the U-shaped auxiliary plate is a polymer material plate.
The automatic exposure fixing method of the printed circuit board is characterized by comprising the following steps:
1) Providing a machine table, wherein the machine table is provided with a groove, an air pumping groove is arranged in the groove, and the air pumping groove is communicated with a vacuumizing device; the machine table is provided with scale marks;
2) Providing a base plate, wherein the base plate is provided with a through hole, the base plate is arranged in the groove, the base plate is detachably connected or non-detachably connected with the machine table, and the through hole is communicated with the air exhaust groove;
3) Providing a printed circuit board, placing the printed circuit board on the surface of the base plate, positioning the printed circuit board according to the scale marks, and covering a part of the through hole by the printed circuit board;
4) Providing a U-shaped auxiliary plate, wherein the U-shaped auxiliary plate is arranged on the surface of the backing plate and surrounds the printed circuit board; the U-shaped auxiliary plate covers the other part of the through hole;
5) And bonding the U-shaped auxiliary plate with the base plate and/or the machine table by using an adhesive tape.
The invention has the following beneficial effects:
1. through redesign and use of the backing plate, the process that the original backing plate is frequently assembled and disassembled when PCBs with different sizes are converted is avoided, abrasion is reduced, and the service life of the LDI backing plate is prolonged from the current 1 year to more than 3 years. Every 5000 yuan of original structure backing plate, every backing plate can practice thrift 10000 yuan each year, very big saving manufacturing cost.
2. The added U-shaped auxiliary plate and the scale are calibrated, so that PCB plates of various sizes can be perfectly matched, the original time for replacing the base plate is saved, the process of sealing by an adhesive tape is avoided, the labor is saved, and the operation efficiency is improved.
3. The plate changing times are reduced, so that the cross contamination of dust, sundries and the like generated by the abrasion of the backing plate is reduced, and the exposure quality is improved.
Drawings
FIG. 1 is a schematic structural diagram of a supporting device for an automatic exposure machine of a printed circuit board according to the present invention.
Fig. 2 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.
Detailed Description
As shown in fig. 1 and 2, the supporting device 100 for a pcb automatic exposure machine includes a base 110, a pad 120, and a U-shaped auxiliary plate 130. The backing plate 120 is connected to the machine table 110, and the U-shaped auxiliary plate 130 is detachably disposed on the surface of the backing plate 120.
The machine table 110 is provided with a groove 111, and the groove 111 is used for accommodating the pad 120. An air exhaust groove 112 is formed in the groove 111 of the machine table 110. The evacuation tank 112 is in communication with an evacuation device (not shown). The machine 110 is provided with scale marks 113. The graduation mark 113 is disposed at one side of the groove 111.
The backing plate 120 is a double-sided copper-clad plate, and comprises a polymer material layer 121 and a copper foil 122. The upper and lower surfaces of the polymer material layer 121 are respectively provided with a copper foil 122. The pad plate 120 is provided with a plurality of through holes 123. The through hole 123 penetrates the pad plate 120. The shape of the pad 120 is determined according to the printed wiring board 200. In one example as shown, the backing plate 120 is rectangular. The pad 120 is disposed in the recess 111 for supporting the printed wiring board 200 to be exposed. The through hole 123 is opposite to the air pumping groove 112, and the printed circuit board 200 can be pumped on the surface of the backing plate 120 by the air pumping device through the air pumping groove 112 and the through hole 123. The size of the pad 120 is larger than all of the printed wiring boards 200 that need to be exposed, or is comparable to the size of the printed wiring boards 200 of the maximum size that needs to be exposed. When the printed wiring board 200 is placed on the pad 120, a part of the through-hole 123 is covered and a part of the through-hole 123 is exposed. The more through holes 123 covered by the printed wiring board 200, the better the adsorption effect. The larger the difference in size between the printed wiring board 200 and the pad 120, the more the through holes 123 are exposed.
The U-shaped auxiliary plate 130 is U-shaped and is a polymer material plate. The U-shaped auxiliary plate 130 is placed on the surface of the backing plate 120 and detachably connected to the backing plate 120 or the machine table 110, and the connection manner may be adhesion, such as adhesion using a film tape. The U-shaped auxiliary board 130 surrounds the printed wiring board 200 from three sides. The side of the printed wiring board 200 opposite to the graduation mark 113 is not surrounded by the U-shaped auxiliary board 130 so that the printed wiring board 200 can be accurately positioned according to the graduation mark 113 when it is placed on the pad plate 120. The through-hole 123 not covered by the printed wiring board 200 is covered. Each of the backing plates 120 is provided with a plurality of U-shaped auxiliary plates 130 having a width. An appropriate U-shaped auxiliary board 130 is selected according to the size of the printed wiring board 200. The printed wiring board 200 and the U-shaped auxiliary board 130 together cover the through-hole 123 of the pad plate 120.
According to an alternative embodiment of the present invention, the U-shaped auxiliary plate 130 and the backing plate 120 may also be connected by magnetic attraction, for example, magnetic materials are respectively disposed on the U-shaped auxiliary plate 130 and the backing plate 120 to attract each other.
An automatic exposure fixing method for printed circuit boards, as shown in fig. 1 and fig. 2, comprises the steps of:
1) Providing a machine table 110, wherein the machine table 110 is provided with a groove, and an air exhaust groove 112 is arranged in the groove; the air-pumping groove 112 is communicated with a vacuum-pumping device (not shown in the figure); the machine table 110 is provided with scale marks 113;
2) Providing a base plate 120, wherein the base plate 120 is provided with a through hole 123, the base plate 120 is arranged in the groove and is detachably connected or non-detachably connected with the machine table 110, and the through hole 123 is communicated with the air exhaust groove 112;
3) Providing a printed circuit board 200, placing the printed circuit board 200 on the surface of the backing plate 120, positioning the printed circuit board 200 according to the scale marks 113, and covering a part of the through hole 123 by the printed circuit board 200;
4) Providing a U-shaped auxiliary board 130, wherein the U-shaped auxiliary board 130 is arranged on the surface of the backing board 120 and is arranged around the printed circuit board 200; the U-shaped auxiliary plate 130 covers another part of the through hole 123;
5) And adhering the U-shaped auxiliary plate 130 to the backing plate 120 and/or the machine table 110 by using an adhesive tape (not shown).
The invention has the following beneficial effects:
1. through redesign and use to the backing plate, when having avoided the not unidimensional PCB board of conversion, the process of frequently assembling and disassembling of original backing plate has reduced wearing and tearing, makes LDI backing plate life-span prolong to more than 3 years from present 1 year. The original structure backing plate is 5000 yuan per piece, 10000 yuan can be saved per backing plate per year, and the production cost is greatly saved.
2. The added U-shaped auxiliary plate and the scale can perfectly match with the PCB plates with various sizes, the original time for replacing the base plate is saved, the process of sealing by sticking adhesive tape is avoided, the original supporting device is used for replacing the double-table-board base plate for about 4 minutes/time on average, the supporting device is used for replacing the double-table-board base plate for about 1 minute/time on average, the efficiency is improved by 75 percent, and the labor is saved; the base plate is changed for 30 times per day on average, the daily time is saved by 1.5 hours, the daily yield is improved by about 6 percent (1.5/24 = 0.06), and the working efficiency is effectively improved.
3. By using the supporting device, the plate changing times are reduced, further, the cross contamination of dust impurities and the like generated by the abrasion of the base plate is reduced, the exposure quality is improved, the scrap rate of 5 products respectively using the original supporting device and the supporting device in the invention caused by the exposure impurities is counted, as shown in figure 1, the scrap rate is reduced by 32%, and the effect is obvious.
TABLE 1 scrap due to Exposure to debris
| | Date | Product | 1 | Product 2 | Product 3 | Product 4 | Product 5 | Mean value of |
| Original device | 2021-Q4 | 0.15％ | 0.14％ | 0.21％ | 0.08％ | 0.17％ | 0.150％ | |
| The invention relates to a device | 2022-Q1 | 0.08％ | 0.07％ | 0.15％ | 0.06％ | 0.12％ | 0.096％ |
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (10)
1. Support arrangement for printed wiring board automatic exposure machine, its characterized in that includes:
the base plate is provided with a plurality of through holes; the backing plate is used for supporting the PCB;
the U-shaped auxiliary plate is U-shaped;
the U-shaped auxiliary plate is detachably arranged on the surface of the backing plate and is used for surrounding the PCB and covering part of the through holes.
2. The supporting device for a printed wiring board automatic exposure machine according to claim 1, wherein each of the pad plates is provided with a plurality of the U-shaped auxiliary plates; the widths of the plurality of U-shaped auxiliary plates are different.
3. The supporting device for the automatic exposure machine of the printed circuit board according to claim 1, wherein the supporting device further comprises a machine table, the machine table is provided with a groove; the backing plate is detachably arranged in the groove.
4. The supporting device of claim 3, wherein the machine table has graduation marks.
5. The supporting device for automatic exposure machine of printed circuit board according to claim 3, wherein the pad is detachably connected or non-detachably connected to the machine table.
6. The supporting device for automatic exposure machine of printed circuit board according to claim 3, wherein the U-shaped auxiliary plate is adhered to the machine table or the backing plate.
7. The supporting device for the automatic exposure machine of printed circuit board according to claim 6, wherein the U-shaped auxiliary plate is bonded to the pad plate or the machine table by a film tape.
8. The supporting device for a printed wiring board automatic exposure machine according to claim 1, wherein an air suction groove is provided in the recess, and the air suction groove is communicated with a vacuum suction device.
9. The supporting device for an automatic exposure machine of printed wiring board according to claim 1, wherein the U-shaped auxiliary plate is connected to the pad plate by magnetic attraction.
10. The supporting device for a printed wiring board automatic exposure machine according to claim 1, wherein the pad plate is a polymeric material plate with copper foil attached to both sides; the U-shaped auxiliary plate is a polymer material plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210862201.7A CN115268225A (en) | 2022-07-20 | 2022-07-20 | Supporting device for automatic exposure machine of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210862201.7A CN115268225A (en) | 2022-07-20 | 2022-07-20 | Supporting device for automatic exposure machine of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115268225A true CN115268225A (en) | 2022-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210862201.7A Pending CN115268225A (en) | 2022-07-20 | 2022-07-20 | Supporting device for automatic exposure machine of printed circuit board |
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| Country | Link |
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| CN (1) | CN115268225A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016676A1 (en) * | 2022-07-20 | 2024-01-25 | 上海美维电子有限公司 | Automatic exposure and fixation method for printed circuit board |
-
2022
- 2022-07-20 CN CN202210862201.7A patent/CN115268225A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016676A1 (en) * | 2022-07-20 | 2024-01-25 | 上海美维电子有限公司 | Automatic exposure and fixation method for printed circuit board |
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