CN110012589B - Assembling method of flexible circuit board module and flexible circuit board module - Google Patents
Assembling method of flexible circuit board module and flexible circuit board module Download PDFInfo
- Publication number
- CN110012589B CN110012589B CN201811613529.5A CN201811613529A CN110012589B CN 110012589 B CN110012589 B CN 110012589B CN 201811613529 A CN201811613529 A CN 201811613529A CN 110012589 B CN110012589 B CN 110012589B
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- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- metal conducting
- board body
- board module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides an assembling method of a flexible circuit board module and the flexible circuit board module, wherein the assembling method of the flexible circuit board module comprises the following steps: attaching a covering film to the flexible circuit board body; pressing the cover film on the flexible circuit board body; and processing an opening for exposing the metal conducting strip at a position, corresponding to the metal conducting strip on the flexible circuit board body, on the covering film. According to the invention, the cover film is firstly attached to the flexible circuit board body, then the cover film is opened corresponding to the metal conducting sheet, so that the alignment precision of the opening and the metal conducting sheet is improved, and the exposed area of the metal conducting sheet is not influenced by glue overflow.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of flexible circuit boards, in particular to an assembling method of a flexible circuit board module and the flexible circuit board module.
[ background of the invention ]
The flexible circuit board is covered with a layer of covering film to protect the copper wire or the via hole, the covering film needs to be exposed as a metal conducting sheet for contact or welding, and the general flow of the prior art is as follows: the method comprises the steps of pre-opening a cover film, then attaching the cover film to a flexible circuit board, and then pressing the cover film, however, in the attaching process, the opening and a metal conducting strip are difficult to align accurately, irregular glue overflow occurs in the attaching and pressing processes, the product quality is affected, and the miniaturization and the precision of the flexible circuit board are realized along with the application of the flexible circuit board, and the precision requirement cannot be met in the process.
Therefore, it is necessary to provide a method for assembling a flexible circuit board module that solves the above problems.
[ summary of the invention ]
The invention aims to provide an assembling method of a flexible circuit board module, which can ensure that an opening and a metal conducting strip are accurately aligned and glue overflow is not generated.
The technical scheme of the invention is as follows: an assembling method of a flexible circuit board module comprises the following steps:
a laminating step, laminating the covering film on the flexible circuit board body;
pressing, namely pressing the covering film on the flexible circuit board body;
and an opening step, namely processing an opening for exposing the metal conducting strip at a position, corresponding to the metal conducting strip on the flexible circuit board body, on the covering film.
Preferably, the opening is formed by laser cutting.
Preferably, the offset between the orthographic projection of the opening on the flexible circuit board body and the orthographic projection of the metal conductive sheet on the flexible circuit board body is less than or equal to 0.05 mm.
Preferably, the offset between the orthographic projection of the opening on the flexible circuit board body and the orthographic projection of the metal conductive sheet on the flexible circuit board body is 0.03 mm.
Preferably, the metal conductive sheet is circular.
Preferably, the diameter of the metal conducting strip is 0.25mm +/-0.05 mm.
The invention aims to provide a flexible circuit board module, which comprises a flexible circuit board body, a metal conducting sheet arranged on the flexible circuit board body and a front cover film covering the flexible circuit board body, wherein an opening for exposing the metal conducting sheet is formed in the front cover film corresponding to the metal conducting sheet, and the front cover film is attached by adopting the assembling method of the flexible circuit board module.
Preferably, the flexible circuit board body is provided with at least two metal conductive sheets, the front cover film is provided with openings, the number of which is the same as that of the metal conductive sheets, and each opening is arranged corresponding to one metal conductive sheet.
Preferably, the flexible circuit board body comprises a substrate with a first front surface and a first back surface, a front copper wire layer arranged on the first front surface and a back copper wire layer arranged on the first back surface, wherein the front copper wire layer is provided with a second front surface deviating from the substrate, the metal conducting strip is convexly arranged on the second front surface, and the front cover film covers the second front surface.
Preferably, the flexible circuit board body further comprises a back cover film, and the back cover film is attached to the surface, back to the substrate, of the front copper wire layer.
The invention has the beneficial effects that: the covering film is attached and pressed on the flexible circuit board body, and then the opening is carried out on the covering film corresponding to the metal conducting sheet, so that the alignment precision of the opening and the metal conducting sheet is improved, and the exposed area of the metal conducting sheet is not influenced by glue overflow.
[ description of the drawings ]
Fig. 1 is a schematic front view of a flexible circuit board module according to an embodiment of the present invention;
FIG. 2 is a side cross-sectional view of the flexible circuit board of FIG. 1;
fig. 3 is a flowchart of an assembly method of a flexible circuit board module according to an embodiment of the present invention.
100. A flexible circuit board module; 10. a flexible circuit board body; 1. a substrate; 21. a front copper wire layer; 22. a back copper wire layer; 31. a front cover film; 301. an opening; 32. a reverse side covering film; 4. A metal conducting strip.
[ detailed description ] embodiments
The invention will be further described with reference to the accompanying figures 1-2 and embodiments.
Referring to fig. 1 and fig. 3, the flexible circuit board module 100 includes a flexible circuit board body 10 and a metal conductive sheet 4 attached to the flexible circuit board body 10 for contact or welding, a front cover film 31 is further attached to the flexible circuit board body 10, and an opening is required on the front cover film 31 to expose the metal conductive sheet 4, and the assembly method of the flexible circuit board module 100 according to the embodiment of the present invention includes:
s11, adhering the front cover film 31 to the flexible circuit board body 10 through glue;
s12, pressing the front cover film 31 on the flexible circuit board body 10;
s13, processing the opening 301 for exposing the conductive metal sheet 4 on the front cover film 31 by laser, and in a specific operation, controlling the energy of the laser can make the laser cut only the front cover film 31.
In this embodiment, the edge line of the opening 301 is sintered by laser and the material is removed to form the opening 301, and the process of bonding and compressing the front cover film 31 and then laser opening 301 is adopted, so that the orthographic projection of the opening 301 on the flexible circuit board body 10 and the orthographic projection position deviation of the metal conductive sheet 4 on the flexible circuit board body 10 are less than or equal to 0.05mm, even reach 0.03mm, the alignment accuracy of the opening 301 and the metal conductive sheet 4 is effectively improved, and no glue overflow affects the exposed area of the metal conductive sheet 4.
Preferably, the metallic conductive sheet 4 is circular in shape, with a diameter of 0.25mm ± 0.05 mm. Of course, the size and shape of the conductive metal sheet 4 are not limited to this in a specific application, and for example, the shape of the conductive metal sheet 4 may also be rectangular or irregular.
In addition to laser, other cutting means may be used to form the opening 301, such as a knife cut.
Besides glue, the front cover film 31 and the flexible circuit board body 10 can be adhered by double-sided tape or the like.
Referring to fig. 2, the flexible circuit board body 10 includes a substrate 1, a front copper wire layer 21, a back copper wire layer 22, a front cover film 31 and a back cover film 32, the front copper wire layer 21 and the back copper wire layer 22 are respectively disposed on two opposite sides of the substrate 1, the front cover film 31 covers a side of the front copper wire layer 21 away from the substrate 1, the back cover film 32 covers a side of the back copper wire layer 22 away from the substrate 1, the metal conductive sheet 4 is disposed on a surface of the front copper wire layer 21 opposite to the substrate 1, and an opening 301 for exposing the metal conductive sheet 4 is formed on the front cover film 31 by the assembling method of the flexible circuit board module 100 according to the embodiment of the present invention.
Two rows of metal conducting strips 4 are arranged on the flexible circuit board body 10, each row is provided with 3 metal conducting strips 4, and the opening 301 is formed in the front cover film 31 corresponding to each metal conducting strip 4, so that the processing efficiency of the opening 301 is improved, and in other embodiments, the number and the arrangement mode of the metal conducting strips 4 are not limited to the above description.
The side of the reverse side copper wire layer 22 departing from the substrate 1 is provided with a reinforcing layer 5 which is arranged opposite to the metal conducting sheet 4, the reinforcing layer 5 is arranged corresponding to the metal conducting sheet 4, and thus, the reinforcing layer 5 is arranged between the reverse side copper wire layer 22 and the reverse side covering film 32 and is used for increasing the strength of the flexible circuit board body 10 corresponding to the metal conducting sheet 4 area. The reverse side covering film 32 is bonded with the reverse side copper wire layer 22 and the reinforcing layer 5, and the reinforcing layer 5 is not easy to peel off from the reverse side copper wire layer 22 due to the fixing effect of the reverse side covering film 32.
In the embodiment of the invention, when the front cover film 31 is assembled, the front cover film 31 is attached to and pressed on the flexible circuit board body 10, and then the opening of the front cover film 31 is exposed out of the metal conductive sheet 4 by laser, so that the opening 301 and the metal conductive sheet 4 are aligned accurately, the size precision is high, and no glue overflow affects the exposed area of the metal conductive sheet 4.
The flexible circuit board module 100 provided by the invention is preferably used for a loudspeaker.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (10)
1. An assembling method of a flexible circuit board module is characterized by comprising the following steps:
the method comprises the following steps of (1) attaching a reinforcing layer and a covering film to a flexible circuit board body, wherein the reinforcing layer is positioned between the covering film and the flexible circuit board body;
pressing, namely pressing the covering film on the flexible circuit board body;
and an opening step, wherein the position of the covering film corresponding to the metal conducting sheet on the flexible circuit board body is processed to form an opening for the metal conducting sheet to be exposed and to be arranged back to back with the reinforcing layer, the reinforcing layer is of a block structure, and the reinforcing layer is only arranged corresponding to the metal conducting sheet area to increase the strength of the flexible circuit board body corresponding to the metal conducting sheet area.
2. The method of assembling a flexible circuit board module according to claim 1, wherein: the opening is formed by machining in a laser cutting mode.
3. The method of assembling a flexible circuit board module according to claim 1, wherein: the orthographic projection of the opening on the flexible circuit board body and the orthographic projection of the metal conducting strip on the flexible circuit board body are less than or equal to 0.05 mm.
4. The method of assembling a flexible circuit board module according to claim 3, wherein: the orthographic projection of the opening on the flexible circuit board body and the orthographic projection of the metal conducting strip on the flexible circuit board body are deviated by 0.03 mm.
5. The method of assembling a flexible circuit board module according to claim 1, wherein: the metal conducting strip is circular.
6. The method of assembling a flexible circuit board module according to claim 5, wherein: the diameter of the metal conducting strip is 0.25mm +/-0.05 mm.
7. A flexible circuit board module comprises a flexible circuit board body, a metal conducting plate arranged on the flexible circuit board body and a front cover film covering the flexible circuit board body, wherein an opening for exposing the metal conducting plate is formed in the front cover film corresponding to the metal conducting plate, and the front cover film is attached by the assembling method of the flexible circuit board module according to any one of claims 1 to 6.
8. The flexible circuit board module of claim 7, wherein: the flexible circuit board body is provided with at least two metal conducting strips, the front cover film is provided with openings the number of which is the same as that of the metal conducting strips, and each opening corresponds to one metal conducting strip.
9. The flexible circuit board module of claim 8, wherein: the flexible circuit board body comprises a substrate with a first front surface and a first back surface, a front copper wire layer arranged on the first front surface and a back copper wire layer arranged on the first back surface, wherein the front copper wire layer is provided with a second front surface deviating from the substrate, a metal conducting strip is convexly arranged on the second front surface, and a front cover film covers the second front surface.
10. The flexible circuit board module of claim 9, wherein: the flexible circuit board body further comprises a reverse side covering film, and the reverse side covering film is attached to the surface, back to the substrate, of the reverse side copper wire layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613529.5A CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613529.5A CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110012589A CN110012589A (en) | 2019-07-12 |
| CN110012589B true CN110012589B (en) | 2021-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811613529.5A Expired - Fee Related CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Country Status (1)
| Country | Link |
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| CN (1) | CN110012589B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN114474699B (en) * | 2021-12-23 | 2024-02-02 | 深圳市鑫达辉软性电路科技有限公司 | Technology for increasing PT film on flexible circuit board cover film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307433B (en) * | 2011-04-03 | 2012-10-03 | 广东生益科技股份有限公司 | Method for manufacturing flexible printed circuit board |
| CN104797082A (en) * | 2015-05-14 | 2015-07-22 | 昆山意力电路世界有限公司 | Intensive-bonding-pad high-density board and windowing method thereof |
| CN105142337B (en) * | 2015-09-10 | 2018-05-22 | 深圳华麟电路技术有限公司 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
| CN206743663U (en) * | 2017-04-21 | 2017-12-12 | 华显光电技术（惠州）有限公司 | FPC golden finger structures and FPC welding structures |
| CN107231755A (en) * | 2017-07-21 | 2017-10-03 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof, mobile terminal |
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2018
- 2018-12-27 CN CN201811613529.5A patent/CN110012589B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN110012589A (en) | 2019-07-12 |
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