WO2003046952A3 - Semiconductor component handling device having an electrostatic dissipating film - Google Patents

Semiconductor component handling device having an electrostatic dissipating film Download PDF

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Publication number
WO2003046952A3
WO2003046952A3 PCT/US2002/038076 US0238076W WO03046952A3 WO 2003046952 A3 WO2003046952 A3 WO 2003046952A3 US 0238076 W US0238076 W US 0238076W WO 03046952 A3 WO03046952 A3 WO 03046952A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
moldable material
handling device
semiconductor component
component handling
Prior art date
Application number
PCT/US2002/038076
Other languages
French (fr)
Other versions
WO2003046952B1 (en
WO2003046952A2 (en
Inventor
Sanjiv M Bhatt
Shawn D Eggum
Original Assignee
Entegris Inc
Sanjiv M Bhatt
Shawn D Eggum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Sanjiv M Bhatt, Shawn D Eggum filed Critical Entegris Inc
Priority to US10/496,679 priority Critical patent/US20050056601A1/en
Priority to AU2002352956A priority patent/AU2002352956A1/en
Priority to EP02789916A priority patent/EP1470570A4/en
Priority to JP2003548279A priority patent/JP2005510868A/en
Priority to KR10-2004-7007903A priority patent/KR20040062966A/en
Publication of WO2003046952A2 publication Critical patent/WO2003046952A2/en
Publication of WO2003046952A3 publication Critical patent/WO2003046952A3/en
Publication of WO2003046952B1 publication Critical patent/WO2003046952B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • B29C70/76—Moulding on edges or extremities of the preformed part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Stackable Containers (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Packaging For Recording Disks (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A system and method for including a thin conductive polymer film (10), such as carbon-filled PEEK, in the molding process for handlers (34), transporters, carriers, trays (36) and like devices utilized in the semiconductor processing industry. The conductive film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material (30). The molding process causes a surface of the film (10) to bond to a contact surface of the moldable material (30) such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where electrostatic dissipation is needed.
PCT/US2002/038076 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film WO2003046952A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/496,679 US20050056601A1 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film
AU2002352956A AU2002352956A1 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film
EP02789916A EP1470570A4 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film
JP2003548279A JP2005510868A (en) 2001-11-27 2002-11-26 Semiconductor element handling device with electrostatic dissipative film
KR10-2004-7007903A KR20040062966A (en) 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33368601P 2001-11-27 2001-11-27
US60/333,686 2001-11-27

Publications (3)

Publication Number Publication Date
WO2003046952A2 WO2003046952A2 (en) 2003-06-05
WO2003046952A3 true WO2003046952A3 (en) 2003-12-11
WO2003046952B1 WO2003046952B1 (en) 2004-02-26

Family

ID=23303841

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/038076 WO2003046952A2 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having an electrostatic dissipating film

Country Status (8)

Country Link
US (1) US20050056601A1 (en)
EP (1) EP1470570A4 (en)
JP (1) JP2005510868A (en)
KR (1) KR20040062966A (en)
CN (1) CN1741885A (en)
AU (1) AU2002352956A1 (en)
TW (1) TW200301009A (en)
WO (1) WO2003046952A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005521236A (en) * 2001-11-27 2005-07-14 エンテグリス・インコーポレーテッド Semiconductor parts handling equipment with performance film
JP4584023B2 (en) * 2005-05-17 2010-11-17 信越ポリマー株式会社 Substrate storage container and manufacturing method thereof
US20070154717A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US20070154716A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Composite material
US20070152195A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Electrostatic dissipative composite material
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
KR20170100353A (en) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 Tray accommodating semiconductor device and cover therefor
KR101843982B1 (en) * 2017-02-22 2018-03-30 윤세원 Electronic components magazine and fabricating method thereof
JP6578033B2 (en) * 2018-01-29 2019-09-18 ウォン ユン、セ Manufacturing method of electronic component container
US10950485B2 (en) 2019-04-17 2021-03-16 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
DE102019125819A1 (en) 2019-04-17 2020-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. SEMICONDUCTOR PROCESSING DEVICE AND METHOD USING AN ELECTROSTATIC DISCHARGE (ESD) PREVENTIVE LAYER

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186338A (en) * 1991-07-11 1993-02-16 Eastman Kodak Company Pallet for holding a cassette
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6248262B1 (en) * 2000-02-03 2001-06-19 General Electric Company Carbon-reinforced thermoplastic resin composition and articles made from same
US20010030144A1 (en) * 2000-04-12 2001-10-18 Masahisa Nemoto Chip tray
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088294B2 (en) * 1988-05-17 1996-01-29 三井東圧化学株式会社 IC wafer container
DE19924182B4 (en) * 1998-05-28 2008-04-17 Entegris, Inc., Chaska Carrier for semiconductor wafers to be processed, stored and / or transported
JP2005521236A (en) * 2001-11-27 2005-07-14 エンテグリス・インコーポレーテッド Semiconductor parts handling equipment with performance film

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186338A (en) * 1991-07-11 1993-02-16 Eastman Kodak Company Pallet for holding a cassette
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6248262B1 (en) * 2000-02-03 2001-06-19 General Electric Company Carbon-reinforced thermoplastic resin composition and articles made from same
US20010030144A1 (en) * 2000-04-12 2001-10-18 Masahisa Nemoto Chip tray

Also Published As

Publication number Publication date
TW200301009A (en) 2003-06-16
US20050056601A1 (en) 2005-03-17
JP2005510868A (en) 2005-04-21
AU2002352956A8 (en) 2003-06-10
CN1741885A (en) 2006-03-01
KR20040062966A (en) 2004-07-09
WO2003046952B1 (en) 2004-02-26
EP1470570A4 (en) 2007-12-12
AU2002352956A1 (en) 2003-06-10
WO2003046952A2 (en) 2003-06-05
EP1470570A2 (en) 2004-10-27

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