CN115181423A - High-strength low-dielectric-constant polyphenylene sulfide composition, and preparation method and application thereof - Google Patents
High-strength low-dielectric-constant polyphenylene sulfide composition, and preparation method and application thereof Download PDFInfo
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
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- C—CHEMISTRY; METALLURGY
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- C08L2205/00—Polymer mixtures characterised by other features
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Abstract
The invention discloses a high-strength low-dielectric-constant polyphenylene sulfide composition, which comprises the following raw materials in parts by weight: 30-60 parts of polyphenylene sulfide resin; 10-40 parts of polyphenyl ether resin; 1-40 parts of inorganic filler; 1-10 parts of a compatilizer; 0.1-1 part of coupling agent. The glass fiber is adopted as one of the inorganic fillers, so that the composition has lower dielectric constant and dielectric loss and higher mechanical property, and the hollow glass beads and other fillers enable the product to obtain a partial hollow structure, so that the dielectric constant of the composition can be obviously reduced; the preparation method of the low dielectric constant polyphenylene sulfide composition provided by the invention can be realized by adopting the conventional double-screw extruder, the process is simple and easy to control, the requirement on equipment is not high, the used equipment is general polymer processing equipment, the investment is not high, and the industrial production is facilitated.
Description
Technical Field
The patent application relates to the technical field of high polymer materials, in particular to a high-strength low-dielectric-constant polyphenylene sulfide composition, a preparation method and application thereof.
Background
Polyphenylene Sulfide (PPS) is a special engineering plastic with excellent performance, has excellent high temperature resistance, corrosion resistance, self-flame retardance and electrical property, and can be widely used in the fields of infrastructure construction, aerospace, pharmaceutical daily chemicals and the like after being physically or chemically modified. In particular, in the field of electronic and electrical appliances, polyphenylene sulfide is widely applied. However, the conventional polyphenylene sulfide material has a high dielectric constant and a large influence on electromagnetic signals.
At present, there are three main development ways for reducing the dielectric constant of polyphenylene sulfide composite materials: 1. a physical modification method, which adopts other materials with lower dielectric constant and polyphenylene sulfide to carry out blending; 2. a chemical modification method, wherein fluorine atoms are introduced into molecular chains of polyphenylene sulfide to reduce the stacking density of the molecular chains; 3. the composite modification method introduces a large-volume structure or a micropore structure or introduces a large molecular chain side group. The mode 1 is simpler and more convenient to operate, has higher industrial application capacity, and can be prepared only by screening out proper low dielectric fillers and then performing a melt extrusion process, so that more attention is paid.
At present, in the process of reducing the dielectric constant of polyphenylene sulfide through blending modification by a physical method, commonly used materials mainly comprise polytetrafluoroethylene, glass fibers with low dielectric constant, hollow glass beads and the like. For example: chinese patent CN 108165010A discloses a high thermal conductivity low dielectric polyphenylene sulfide composite material and a preparation method thereof, the composite material comprises: 100 parts of polyphenylene sulfide resin, 10-40 parts of glass fiber, 30-60 parts of boron nitride, 5-15 parts of compatilizer, 0.8-3.0 parts of coupling agent, 1.0-5.0 parts of dispersing agent and 0.4-1.2 parts of antioxidant. Chinese patent CN 109705577A discloses a PPS with low dielectric coefficient, toughening agent particles are ground and screened by a grinding machine, and then PPS resin, hollow glass beads, PPS toughening agent powder and glass fiber with low dielectric coefficient are mixed and extruded to form. Chinese patent CN 108250751A discloses a polyphenylene sulfide resin composition with low dielectric constant and a preparation method thereof. The polyphenylene sulfide resin composition is mainly prepared from 20-80 parts of PPS resin, 15-40 parts of glass fiber, 0.5-10 parts of hollow microspheres, 3-15 parts of flexibilizer, 0.3-3 parts of antioxidant, 0.3-3 parts of heat stabilizer, 0.5-2 parts of lubricant and 0-3 parts of nucleating agent by mass. Chinese patent CN 108329692A discloses a polyphenylene sulfide resin composition with low dielectric constant and a preparation method thereof. The polyphenylene sulfide resin composition is mainly prepared from 20-80 parts of PPS resin, 15-40 parts of glass fiber, 0.3-5 parts of cage-like silsesquioxane, 3-15 parts of toughening agent, 0.3-3 parts of antioxidant, 0.5-3 parts of heat stabilizer, 0.3-3 parts of lubricant and 0-3 parts of nucleating agent by mass.
At present, the 5G technology is rapidly developed in China, and the composite material suitable for 5G has wide market demand. The transmission speed and loss of 5G signals are higher than those of 4G, generally, the dielectric constant of 4G products for resin materials is only required to be less than 3.7, and the dielectric constant of 5G products for resin materials is required to be less than 3.2. This is an increasing demand for higher mechanical strength and lower dielectric constant for low dielectric materials. However, the application of polyphenylene sulfide in the 5G field is greatly limited by the characteristics of polyphenylene sulfide, so how to develop a high-strength low-dielectric-constant polyphenylene sulfide composition becomes a latest research hotspot of technicians.
Disclosure of Invention
In view of the above disadvantages of the prior art, the present application aims to provide a high-strength polyphenylene sulfide composition with low dielectric constant and a preparation method thereof, which solves the above problems of the prior art. Therefore, the method has wide application prospect in the fields of 5G base stations, micro base station systems, data communication terminals and antenna radio frequency modules.
In order to achieve the purpose, the invention provides the following technical scheme:
the high-strength low-dielectric-constant polyphenylene sulfide composition is composed of the following raw materials in parts by weight:
further, the polyphenylene sulfide resin has a melt flow rate of 400 to 2000g/10min at 316 ℃ under a load of 5 kg.
Further, the melt flow rate of the polyphenylene ether resin at 315 ℃ under a load of 10kg is 20 to 60g/10min.
Furthermore, the inorganic filler is a composition of glass fibers and any one of hollow glass microspheres, silicon dioxide, zeolite, boron nitride and diatomite, and the glass fibers are filled, so that on one hand, the glass fiber provides better mechanical properties for the material, and on the other hand, the composition has lower dielectric constant and dielectric loss; the hollow glass beads and the like provide a hollow structure for the composition, and air with low dielectric constant and low dielectric loss is introduced, so that the density of the material can be reduced, and the dielectric constant and the dielectric loss of the composition can be obviously reduced.
Furthermore, the compatilizer is hydrogenated styrene-butadiene-styrene copolymer grafted maleic anhydride, so that the impact property of the PPS composition can be improved, and the maleic anhydride group of the compatilizer can react with the terminal hydroxyl group of PPS or the inorganic filler and the silane coupling agent for coating the inorganic filler, so that the compatibility among the PPS, the PPO and the inorganic filler is improved.
Further, the coupling agent is a silane coupling agent. A chemical bridge is formed between the inorganic filler and the organic polymer, which is coupled by the direct chemical action of its alkoxy groups with the trace of hydroxyl groups adsorbed on the surface of the inorganic filler.
The preparation method of the high-strength low-dielectric-constant polyphenylene sulfide composition comprises the following steps:
s1, respectively drying polyphenylene sulfide resin and polyphenylene oxide resin;
s2, weighing the polyphenylene sulfide resin, the polyphenylene oxide resin, the inorganic filler, the compatilizer and the coupling agent according to the weight part ratio, and then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing;
and S3, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding an inorganic filler through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
Further, the drying environment in step S1 is: drying at 80-110 deg.C for 2-8 hr;
in step S2, a stirrer is adopted for the mixing step, the rotating speed of the stirrer is 500-2000rpm, and the stirring time is 5-20 minutes.
Further, the process parameters of each section of the parallel twin-screw extruder in the step S3 are as follows: the feeding section is 260-320 ℃, the plasticizing shearing section is 270-320 ℃, the die head temperature is 290-320 ℃, and the screw rotating speed is 200-600rpm;
the shape of the screw of the parallel double-screw extruder is single thread, and the length-diameter ratio of the screw is 35-50.
Compared with the prior art, the invention has the beneficial effects that:
1. the glass fiber is adopted as one of the inorganic fillers, so that the composition has lower dielectric constant and dielectric loss and higher mechanical property, and the hollow glass beads and other fillers enable the product to obtain partial hollow structure, thereby obviously reducing the dielectric constant of the composition;
2. aiming at the defect of poor compatibility and processing performance of resin and inorganic filler in the existing low-dielectric-constant polyphenylene sulfide composition, the low-addition compatilizer is adopted, so that the compatibility among PPS, PPO and the inorganic filler is improved, the dielectric constant of the composition can be maintained at a lower level, the compatilizer adopts hydrogenated styrene-butadiene-styrene copolymer grafted maleic anhydride, the impact performance of the composition can be improved, and the dielectric performance and mechanical performance requirements of a 5G antenna oscillator are met;
3. the preparation method of the low dielectric constant polyphenylene sulfide composition provided by the invention can be realized by adopting the conventional double-screw extruder, the process is simple and easy to control, the requirement on equipment is not high, the used equipment is general polymer processing equipment, the investment is not high, and the industrial production is facilitated.
Detailed Description
The following embodiments of the present application are described by specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure of the present application. The present application is capable of other and different embodiments and its several details are capable of modifications and various changes in detail without departing from the spirit of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The raw materials used in the examples and comparative examples of the present invention were as follows:
polyphenylene sulfide resin with melt flow rate of 450-600g/10min at 316 deg.C and 5kg load, selected from Zhejiang Xin and Cheng Bing GmbH, model number PPS-3450;
polyphenylene ether resin with melt flow rate of 40-50g/10min at 315 deg.C under 10kg load, selected from Nantong Xinchen synthetic materials GmbH, model number PPO-LXR045;
the compatilizer is hydrogenated styrene-butadiene-styrene copolymer grafted maleic anhydride, the grafting ratio of maleic acid is 1%, and the compatilizer is selected from Shenyang Ketong plastic Co., ltd, and the model is SEBS-g-MAH;
glass fiber selected from Taishan fibers Ltd, type HMG443R-10-3.0.
The hollow glass beads have the compressive strength of 60MPa, are selected from Minnesota mining and machine manufacturing company of America and have the model number of IM16K;
the silane coupling agent is selected from KBE-903, a product of Nippon shin-Etsu chemical Co.
The present invention will be described in detail with reference to specific examples.
Example 1:
the embodiment provides a high-strength low-dielectric-constant polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 10 parts of hollow glass beads, 5 parts of glass fiber and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at the temperature of 90 ℃ for drying for 3 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, hollow glass beads, glass fibers, a compatilizer and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
s300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding the hollow glass beads and the glass fibers through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 320 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 310 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Example 2
The embodiment provides a high-strength low-dielectric-constant polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
41.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 20 parts of hollow glass beads, 10 parts of glass fiber and 0.5 part of coupling agent.
The preparation process is the same as in example 1.
Example 3
The embodiment provides a high-strength low-dielectric-constant polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
36.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 30 parts of hollow glass beads, 10 parts of glass fiber and 0.5 part of coupling agent.
The preparation process is the same as in example 1.
Example 4
The embodiment provides a high-strength low-dielectric-constant polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 10 parts of hollow glass microsphere, 5 parts of glass fiber and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at the temperature of 100 ℃ for drying for 4 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, hollow glass beads, glass fibers, a compatilizer and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
and S300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding the hollow glass beads and the glass fibers through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 315 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 305 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Example 5
The embodiment provides a high-strength low-dielectric-constant polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 10 parts of hollow glass microsphere, 5 parts of glass fiber and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at the temperature of 110 ℃ for drying for 2 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, hollow glass beads, glass fibers, a compatilizer and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 5 minutes in the stirrer with the rotating speed of 600rpm;
s300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding the hollow glass beads and the glass fibers through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feed section was 315 ℃, the plasticizing shear section was 285 ℃, the die temperature was 310 ℃ and the screw speed was 280rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Comparative example 1
The comparative example provides a polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at a temperature of 90 ℃ for drying for 3 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, a compatilizer and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
s300, adding the mixed mixture into a parallel double-screw extruder through a feeder, and performing melt extrusion granulation to obtain the polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 320 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 310 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Comparative example 2
The comparative example provides a polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 5 parts of glass fiber and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at the temperature of 90 ℃ for drying for 3 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, glass fiber, compatilizer and coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
and S300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding glass fibers through side feeding, and performing melt extrusion granulation to obtain the polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 320 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 310 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder was a single-screw, and the length-diameter ratio L/D of the screw was 40.
Comparative example 3
The comparative example provides a polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 3 parts of compatilizer, 10 parts of hollow glass beads and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at the temperature of 90 ℃ for drying for 3 hours,
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, hollow glass beads, a compatilizer and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
s300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding the hollow glass beads through side feeding, and performing melt extrusion granulation to obtain the polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 320 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 310 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Comparative example 4
The embodiment provides a polyphenylene sulfide composition, which is prepared from the following raw materials in parts by weight:
51.2 parts of polyphenylene sulfide, 30 parts of polyphenylene oxide, 10 parts of hollow glass beads, 5 parts of glass fiber and 0.5 part of coupling agent.
The preparation process comprises the following steps:
s100, placing the polyphenylene sulfide resin and the polyphenylene oxide resin at a temperature of 90 ℃ for drying for 3 hours;
s200, weighing polyphenylene sulfide resin, polyphenylene oxide resin, hollow glass beads, glass fibers and a coupling agent according to the weight parts; then adding the polyphenylene sulfide resin, the polyphenylene oxide resin and the coupling agent into a stirrer together for mixing, and mixing for 10 minutes in the stirrer with the rotating speed of 500 rpm;
s300, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding the hollow glass beads and the glass fibers through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
The technological parameters of each section of the parallel double-screw extruder are as follows: the feeding section is 320 ℃, the plasticizing shearing section is 280 ℃, the die head temperature is 310 ℃, and the screw rotating speed is 300rpm. The screw shape of the parallel twin-screw extruder is single thread, and the length-diameter ratio L/D of the screw is 40.
Performance testing
The composite materials prepared in examples 1 to 5 and comparative examples 1 to 4 were processed into standard bars, and the tensile strength, flexural strength, izod notched impact strength, heat distortion temperature and dielectric constant of the composite materials prepared in examples 1 to 5 and comparative examples 1 to 4 were measured, respectively, and the results are shown in table 1.
TABLE 1 results of Performance test of examples 1-5 and comparative examples 1-4
From the test results of examples 1 to 3, it is understood that the dielectric constant of the material decreases with the increase of the inorganic filler, but the dielectric constant of the material becomes stable after increasing to a certain extent.
According to the test results of the embodiments 1, 4 and 5, the parameters of the preparation process have small influence on the test results, the process is simple and easy to control, and the requirement on equipment is not high.
According to the test results of the example 1 and the comparative examples 1 to 3, the glass fiber is filled in the material, so that on one hand, the material is provided with better mechanical property, on the other hand, the material can have crossed dielectric constant and dielectric loss, and the hollow glass beads provide a hollow structure for the material, so that the dielectric constant and the dielectric loss of the material are obviously reduced.
According to the test results of the example 1 and the comparative example 4, the mechanical property of the material is effectively improved by adding the compatilizer.
According to the high-strength low-dielectric-constant polyphenylene sulfide composition, the interface bonding force and compatibility among PPS, PPO and an inorganic filler are improved by adding the compatilizer and the silane coupling agent, and meanwhile, the processability of the PPS composition is improved by adding the lubricant, so that the high-strength low-dielectric-constant polyphenylene sulfide composition with excellent comprehensive performance is prepared.
According to the invention, the hydrogenated styrene-butadiene-styrene copolymer grafted maleic anhydride with good compatibility with PPS resin is used as the compatilizer, so that not only can the impact property of the PPS composition be improved, but also the maleic anhydride group of the compatilizer can react with the PPS or the terminal hydroxyl group of the inorganic filler and the silane coupling agent for coating the inorganic filler, so that the compatibility among the PPS, the PPO and the inorganic filler is improved.
The inorganic filler adopted by the invention is any composition of glass fiber, hollow glass microspheres, silicon dioxide, zeolite, boron nitride and diatomite. The glass fiber is adopted for filling, so that on one hand, better mechanical property is provided for the material, and on the other hand, the composition has lower dielectric constant and dielectric loss; the hollow glass beads and the like provide a hollow structure for the composition, and air with low dielectric constant and low dielectric loss is introduced, so that the density of the material can be reduced, and the dielectric constant and the dielectric loss of the composition can be obviously reduced. The hollow glass bead is a hollow spherical powdery inorganic non-metallic material, the main component of the hollow glass bead is soda lime borosilicate glass, and the cavity of the hollow glass bead is filled with inert gases such as dilute nitrogen, carbon dioxide and the like, so that the dielectric constant of the hollow glass bead is only 1.2-1.5 (1 GHz).
The silane coupling agent used in the present invention is attributed to its effect on the interface, i.e., it can form a chemical bridge between the inorganic filler and the organic polymer, which is coupled by the direct chemical action of its alkoxy groups with the trace amount of hydroxyl groups adsorbed on the surface of the inorganic filler, while its organic phase has good compatibility with PPS.
The above-described embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the present application. Those skilled in the art can modify and/or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims be embraced by the present application.
Claims (10)
1. The high-strength low-dielectric-constant polyphenylene sulfide composition is characterized by comprising the following raw materials in parts by weight:
2. the high strength low dielectric constant polyphenylene sulfide composition of claim 1, wherein the polyphenylene sulfide resin has a melt flow rate of 400-2000g/10min at 316 ℃ under a 5kg load.
3. The high strength low dielectric constant polyphenylene sulfide composition of claim 1, wherein the polyphenylene ether resin has a melt flow rate of 20-60g/10min at 315 ℃ under a 10kg load.
4. The high-strength low-dielectric-constant polyphenylene sulfide composition as claimed in claim 1, wherein the inorganic filler is a composition of glass fiber and any one of hollow glass beads, silica, zeolite, boron nitride and diatomite.
5. The high strength low dielectric constant polyphenylene sulfide composition of claim 1, wherein the compatibilizer is a hydrogenated styrene-butadiene-styrene copolymer grafted maleic anhydride.
6. The high strength low dielectric constant polyphenylene sulfide composition of claim 1, wherein the coupling agent is a silane coupling agent.
7. A method for preparing the high-strength low-dielectric-constant polyphenylene sulfide composition according to any of claims 1 to 6, comprising the steps of:
s1, respectively drying polyphenylene sulfide resin and polyphenylene oxide resin;
s2, weighing the polyphenylene sulfide resin, the polyphenylene oxide resin, the inorganic filler, the compatilizer and the coupling agent according to the weight part ratio, and then adding the polyphenylene sulfide resin, the polyphenylene oxide resin, the compatilizer and the coupling agent into a stirrer together for mixing;
and S3, adding the mixed mixture into a parallel double-screw extruder through a feeder, adding an inorganic filler through side feeding, and performing melt extrusion granulation to obtain the high-strength low-dielectric-constant polyphenylene sulfide composition.
8. The method of claim 7, wherein the drying environment in step S1 is: drying at 80-110 deg.C for 2-8 hr;
in step S2, a stirrer is adopted for the mixing step, the rotating speed of the stirrer is 500-2000rpm, and the stirring time is 5-20 minutes.
9. The method for preparing the high-strength low-dielectric-constant polyphenylene sulfide composition according to claim 7, wherein the process parameters of each section of the parallel twin-screw extruder in the step S3 are as follows: the feeding section is 260-320 ℃, the plasticizing shearing section is 270-320 ℃, the die head temperature is 290-320 ℃, and the screw rotating speed is 200-600rpm;
the shape of the screw of the parallel double-screw extruder is a single thread, and the length-diameter ratio of the screw is 35-50.
10. Use of the high-strength low-dielectric-constant polyphenylene sulfide composition according to any one of claims 1 to 6 in the field of 5G base stations, micro base station systems, data communication terminals, and antenna rf modules.
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