CN115106336B - Novel electroplating silver plating process and equipment for laser pump source chip base - Google Patents
Novel electroplating silver plating process and equipment for laser pump source chip base Download PDFInfo
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- CN115106336B CN115106336B CN202210848790.3A CN202210848790A CN115106336B CN 115106336 B CN115106336 B CN 115106336B CN 202210848790 A CN202210848790 A CN 202210848790A CN 115106336 B CN115106336 B CN 115106336B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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Abstract
The invention discloses a new technology and equipment for electroplating silver on a laser pump source chip base, belonging to the technical field of laser auxiliary devices, comprising the following steps: the method comprises the following steps: sawing the raw material of the laser pump source chip base according to the processing size, and annealing to remove stress to obtain a semi-finished product; step two: the invention carries out CNC rough machining on the obtained semi-product and carries out annealing stress relief again, and the invention carries out ultrasonic degreasing-cleaning-electrolytic degreasing-cleaning-organic solvent degreasing-cleaning-pickling-cleaning-etching-cleaning-mercurizing-cleaning-electroplating-passivation-drying processes on the base, thereby realizing the silver plating on the surface of the base, and solving the problems of poor light source formability, poor light concentration, poor chip welding capability and high cost of a gold plating mode of the prior chip luminescence.
Description
Technical Field
The invention relates to the technical field of laser auxiliary devices, in particular to a novel process and equipment for electroplating silver on a laser pump source chip base.
Background
Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as the working substance. Due to the difference in material structure, the specific process of generating laser light in different types is special. The semiconductor laser has the advantages of small volume, light weight, high efficiency and the like, and is widely applied to various fields of industry, military, medical treatment, communication and the like. The base is the heart position of laser instrument, and the base is used for giving off the heat that the chip produced during operation, increases the chip and heats into welding adhesion, and its performance plays decisive effect to the laser instrument.
At present, the base is often plated with gold on the surface thereof by a traditional electroplating method during manufacturing, but the gold plating method has the following disadvantages in long-term use:
firstly, the light source of the chip luminescence has poor formability and poor light concentration;
secondly, the chip welding capacity is poor;
thirdly, the cost of the gold plating mode is high;
although silver plating is carried out on the surface of the base in the current market, no special equipment is used for operation, and products are often moved back and forth among a plurality of pieces of equipment, so that the phenomena of high cost investment, low processing efficiency and the like exist.
Disclosure of Invention
The invention is provided in view of the above and/or the problems existing in the existing novel process and equipment for plating silver on the laser pump source chip base.
Therefore, the invention aims to provide a novel process and equipment for electroplating silver on a laser pump source chip base, which can solve the existing problems.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
a novel electroplating silver plating process for a laser pump source chip base comprises the following specific steps:
the method comprises the following steps: sawing the raw material of the laser pump source chip base according to the processing size, and annealing to remove stress to obtain a semi-finished product;
step two: carrying out CNC rough machining on the obtained semi-product, and annealing and destressing again;
step three: carrying out CNC (computer numerical control) finish machining on the rough machined semi-finished product, and removing burrs on the surface of the semi-finished product through a magnetic grinding machine;
step four: deoiling the semi-finished product, and performing sand blasting after drying;
step five: and (3) carrying out silver electroplating on the semi-product, wherein the silver electroplating process comprises the following steps:
the first process comprises the following steps: putting the semi-product into the fixing groove, and rotating the hand-screwed screw until the semi-product is extruded and fixed by the extrusion plate, so that the semi-product is fixed;
and a second process: the semi-product is moved to the upper part of the ultrasonic oil removal box body through the first rotating assembly, the semi-product is lowered into the ultrasonic oil removal agent through the lifting assembly, meanwhile, ultrasonic waves are generated through the ultrasonic generator and the ultrasonic transducer, so that the semi-product is subjected to ultrasonic oil removal, and the semi-product is restored to the original position after oil removal;
and a third process: the semi-product is moved to the cleaning box through the first rotating assembly and the lifting assembly, meanwhile, external water sequentially flows into the second spray head through the third pipeline and the fourth pipeline through the second water pump, so that the water is sprayed to the semi-product to realize cleaning, and the semi-product is restored to the original position after cleaning;
and (4) a fourth process: the semi-product is moved into an alkaline solution through the first rotating assembly and the lifting assembly, the semi-product is in contact with the first conductive column, meanwhile, the first copper plate and the first conductive column generate electricity through the first storage battery, electrolytic oil removal is carried out on the semi-product, and after oil removal, the semi-product is restored to the original position;
and a fifth process: repeating the third flow to clean the semi-finished product;
and a sixth process: moving the semi-product into an organic solution through a first rotating assembly and a lifting assembly to achieve chemical degreasing of the semi-product, and restoring the semi-product to the original position after degreasing;
a seventh process: repeating the third flow to clean the semi-product;
and (eight) flow: the semi-product is moved to the pickling tank and positioned above the pickling solution through the first rotating assembly and the lifting assembly, meanwhile, the pickling solution sequentially flows into the first nozzle through the first pipeline and the second pipeline through the first water pump, so that the pickling solution is sprayed to the semi-product, the semi-product is pickled, and the semi-product is restored to the original position after pickling;
the process is nine: repeating the third flow to clean the semi-finished product;
and (5) a flow ten: moving the semi-product into etching solution through the first rotating assembly and the lifting assembly to etch the semi-product, and restoring the semi-product to the original position after etching;
and eleventh, a flow is as follows: repeating the third flow to clean the semi-finished product;
a twelfth process: moving the semi-product into an amalgamation solution through a first rotating assembly and a lifting assembly so as to realize amalgamation treatment on the semi-product, and restoring the semi-product to the original position after the treatment;
a thirteen process: repeating the third flow to clean the semi-product;
the process is fourteen: the semi-product is moved into the electroplating solution through the first rotating assembly and the lifting assembly, and is contacted with the second conductive column, meanwhile, the second copper plate and the second conductive column generate electricity through the second storage battery, so that the semi-product is electroplated, and after electroplating, the semi-product is restored to the original position;
a fifteenth procedure: repeating the third flow to clean the semi-finished product;
sixthly, the process is as follows: moving the semi-product into a strong oxidant through a first rotating assembly and a lifting assembly to passivate the semi-product, and restoring the semi-product to the original position after passivation;
seventeen, the process is as follows: the semi-product is moved into the drying box through the first rotating assembly and the lifting assembly, meanwhile, air filtered from the outside is sucked into the hollow pipe through the fan, the air sucked into the hollow pipe is heated by the U-shaped heating pipe, and the heated air is blown to the semi-product, so that the semi-product is dried;
step six: and carrying out reliability test on the semi-finished product to obtain a finished product.
A new device for electroplating silver plating on a laser pump source chip base comprises:
the supporting rods are fixedly arranged at the top of the bottom plate, four groups of supporting rods are arranged, a workbench is fixedly arranged at the top of the supporting rods, a supporting shaft is fixedly arranged at the middle end of the top of the workbench, and an ultrasonic oil removing assembly, an electrolytic oil removing assembly, an organic solvent oil removing assembly, an acid washing assembly, an etching assembly, a mercurizing assembly, an electroplating assembly, a passivation assembly, a drying assembly and a cleaning assembly are sequentially arranged on the periphery of the top of the workbench in a circular manner;
a first rotating assembly mounted on top of the support shaft;
a second rotating assembly mounted on the first rotating assembly;
the first rotating assembly and the second rotating assembly are both provided with lifting assemblies;
and the lifting assembly is provided with a fixing assembly for fixing a half product.
As a preferred scheme of the novel device for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the first rotating assembly includes:
the supporting plate is fixedly arranged at the top of the supporting shaft, the first box body is fixedly arranged on the supporting plate, and a first servo motor is fixedly arranged on the inner wall of the first box body;
the first rotating shaft is rotatably connected to the first box body through a bearing, an output shaft of the first servo motor is fixedly connected with the first rotating shaft with the same diameter, and the first rotating plate is fixedly installed on the first rotating shaft;
the second rotating assembly includes:
the second box body is fixedly arranged on the first rotating plate, and a second servo motor is fixedly arranged on the inner wall of the second box body;
a second rotating shaft is rotatably connected to the second box body through a bearing, an output shaft of the second servo motor is fixedly connected with the second rotating shaft with the same diameter, and a second rotating plate is fixedly installed on the second rotating shaft;
the output shaft of the first servo motor is coaxial with the output shaft of the second servo motor.
As a preferred scheme of the novel equipment for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the lifting assembly comprises:
the box body is fixedly installed at the bottom of the first rotating plate and the bottom of the second rotating plate, the hydraulic cylinder is fixedly installed on the inner wall of the box body, and the output end of the hydraulic cylinder is provided with the fixing component through the piston rod.
As a preferred scheme of the novel device for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the fixing assembly includes:
the output end of the hydraulic cylinder is fixedly provided with the fixed block through a piston rod, and the inner wall of the bottom end of the fixed block is provided with a fixed groove;
and the hand-screwed screw is in threaded connection with the fixed block, and one end of the fixed block extends into the fixed groove and is fixedly provided with the extrusion plate.
As a preferred scheme of the novel device for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the ultrasonic oil removing assembly comprises:
the ultrasonic oil removal tank body is fixedly arranged on the workbench, and an ultrasonic oil removal agent is arranged in an inner cavity of the ultrasonic oil removal tank body;
the first fixing plate is fixedly arranged on the ultrasonic oil removal box body, and an ultrasonic generator is fixedly arranged on the first fixing plate;
the ultrasonic transducer is fixedly arranged on the inner wall of the ultrasonic oil removing tank body and is positioned in the ultrasonic oil removing agent, and the ultrasonic generator is connected with the ultrasonic transducer;
the electrolytic degreasing assembly comprises:
the electrolytic tank is fixedly arranged on the workbench, an alkaline solution is arranged in an inner cavity of the electrolytic tank, a first copper plate is fixedly arranged on one side of the inner wall of the electrolytic tank, and a first conductive column is fixedly arranged on the side wall of the electrolytic tank, which is opposite to the first copper plate;
the second fixed plate is fixedly installed on the electrolytic tank, the first storage battery is fixedly installed on the second fixed plate, the positive pole of the first storage battery is electrically connected with the first copper plate, and the negative pole of the first storage battery is electrically connected with the first conductive column.
As a preferred scheme of the novel equipment for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the organic solvent deoiling subassembly includes:
the organic solvent de-oiling box is fixedly arranged on the workbench, an organic solution is arranged in an inner cavity of the organic solvent de-oiling box, and the organic solution consists of styrene, perchloroethylene, trichloroethylene and ethylene glycol ether;
the pickling subassembly includes:
the pickling tank is fixedly arranged on the workbench, and an inner cavity of the pickling tank is provided with a pickling solution which consists of hydrochloric acid, phosphoric acid, hydrogen peroxide, a stabilizer and a surfactant;
the pickling line comprises a pickling tank, a first fixing plate, a second fixing plate, a first water pump, a second pipeline and a third pipeline, wherein the first fixing plate is fixedly installed on the pickling tank;
the device comprises a first nozzle, wherein a plurality of first nozzles are fixedly installed on the periphery of the inner wall of the top end of the pickling tank, and one end of a second pipeline is fixedly connected with a hose installed on the first nozzle through a multi-way connector.
As a preferred scheme of the novel device for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the etched component comprises:
the etching device comprises an etching box fixedly arranged on a workbench, wherein an inner cavity of the etching box is provided with etching liquid, and the etching liquid consists of sulfuric acid, hydrochloric acid, nitric acid, hydrofluoric acid and phosphoric acid;
the mercurizing assembly includes:
the mercurization case of fixed mounting on the workstation, the inner chamber of mercurization case is equipped with mercurization solution, and mercurization solution comprises mercuric chloride, mercury oxide, potassium cyanide.
As a preferred scheme of the novel equipment for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the electroplating assembly comprises:
the electroplating box is fixedly arranged on the workbench, an electroplating solution is arranged in an inner cavity of the electroplating box and consists of silver nitrate and potassium cyanide, a second copper plate is fixedly arranged on one side of the inner wall of the electroplating box, and a second conductive post is fixedly arranged on the side wall of the electroplating box, which is opposite to the second copper plate;
the fourth fixing plate is fixedly arranged on the electroplating box, the second storage battery is fixedly arranged on the fourth fixing plate, the positive electrode of the second storage battery is electrically connected with the second copper plate, and the negative electrode of the second storage battery is electrically connected with the second conductive column;
the passivation assembly includes:
the passivation box is fixedly installed on the workbench, a strong oxidant is arranged in an inner cavity of the passivation box and consists of trivalent cobalt salt, persulfate, peroxide, potassium dichromate, potassium permanganate, chlorate and fuming sulfuric acid.
As a preferred scheme of the novel device for electroplating silver on the laser pump source chip base, the invention comprises the following steps: the drying assembly comprises:
the drying box is fixedly arranged on the workbench, and hollow pipes are fixedly arranged on the inner walls of the two ends of the drying box;
the fan is fixedly arranged on the inner wall of the outer side of the hollow pipe;
the two ends of the inner wall of the outer side of the hollow pipe are fixedly provided with connecting rods, and a U-shaped heating pipe is fixedly arranged between the two groups of connecting rods;
the cleaning assembly comprises:
a cleaning box fixedly arranged on the workbench;
the second water pump is fixedly arranged at the top of the fifth fixing plate, a third pipeline connected with an external water source is fixedly arranged at the input end of the second water pump, and a fourth pipeline is fixedly arranged at the output end of the second water pump;
and a plurality of second spray heads are fixedly mounted on the periphery of the inner wall of the top end of the cleaning box, and one end of a fourth pipeline is fixedly connected with a hose mounted on the second spray head through a multi-way connector.
Compared with the prior art:
1. the method comprises the steps of carrying out ultrasonic degreasing, cleaning, electrolytic degreasing, cleaning, organic solvent degreasing, cleaning, pickling, cleaning, etching, cleaning, mercurizing, cleaning, electroplating, cleaning, passivating and drying on a base, and has the advantages that silver plating is carried out on the surface of the base, so that the problems that the existing light source for chip luminescence is poor in formability, poor in light concentration, poor in chip welding capacity and high in cost of a gold plating mode are solved;
2. the method has the advantages that the method cleans oil stains on the surface of the base through ultrasonic degreasing, electrolytic degreasing and organic solvent degreasing, and cleans oxide skin and rust on the surface of the base through acid washing and etching, and solves the problem that the surface of the base is not effectively cleaned during processing, so that the processing quality of a product can be improved, and the damage rate is reduced;
3. by integrating the ultrasonic degreasing component, the electrolytic degreasing component, the organic solvent degreasing component, the pickling component, the etching component, the mercurizing component, the electroplating component, the passivation component, the drying component and the cleaning component on one device, the phenomenon that the base needs to move back and forth when the base is machined is avoided, so that the time is greatly saved, meanwhile, the machining efficiency is improved, and the investment of cost is reduced;
4. the cooperation through first rotating assembly and second rotating assembly is used, has the effect that the realization can carry out simultaneous processing to the multiunit base, through can carrying out simultaneous processing to the multiunit base, has the effect that further improves machining efficiency.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic top view of the table of the present invention;
FIG. 4 is a schematic view of an ultrasonic degreasing assembly according to the present invention;
FIG. 5 is a schematic view of an electrolytic degreasing assembly according to the invention;
FIG. 6 is a schematic view of an organic solvent degreasing assembly according to the present invention;
FIG. 7 is a schematic view of a pickling assembly according to the invention;
FIG. 8 is a schematic view of an etched component according to the present invention;
FIG. 9 is a schematic view of an amalgamation component of the present invention;
FIG. 10 is a schematic view of a plating assembly of the present invention;
FIG. 11 is a schematic view of a passivation assembly of the present invention;
FIG. 12 is a schematic view of a drying assembly according to the present invention;
FIG. 13 is a schematic view of a cleaning assembly of the present invention.
In the figure: a bottom plate 10, a support rod 11, a workbench 12, a support shaft 13, a first rotating assembly 20, a support plate 21, a first box 22, a first servo motor 23, a first rotating shaft 24, a first rotating plate 25, a second rotating assembly 30, a second box 31, a second servo motor 32, a second rotating shaft 33, a second rotating plate 34, a lifting assembly 40, a box 41, a hydraulic cylinder 42, a fixing assembly 50, a fixing block 51, a fixing groove 52, a hand screw 53, a pressing plate 54, an ultrasonic degreasing assembly 61, an ultrasonic degreasing box 611, a first fixing plate 612, an ultrasonic generator 613, an ultrasonic transducer 614, an ultrasonic degreasing agent 615, an electrolytic degreasing assembly 62, an electrolytic box 621, a second fixing plate 622, a first storage battery 623, a first copper plate 624, a first conductive column 625, an alkaline solution 626, an organic solvent assembly 63, a degreasing agent for electrolytic degreasing, a first conductive column 625, an alkaline solution 626, and a second solvent assembly 63 the device comprises an organic solvent oil removing tank 631, an organic solution 632, a pickling assembly 64, a pickling tank 641, a third fixing plate 642, a first water pump 643, a first pipeline 644, a second pipeline 645, a first spray head 646, a pickling solution 647, an etching assembly 65, an etching tank 651, an etching solution 652, a mercurizing assembly 66, a mercurizing tank 661, a mercurizing solution 662, a plating assembly 67, a plating tank 671, a fourth fixing plate 672, a second storage battery 673, a second copper plate 674, a second conductive post 675, a plating solution 676, a passivation assembly 68, a passivation tank 681, a strong oxidant 682, a drying assembly 69, a drying tank 691, a hollow pipe 692, a fan 693, a connecting rod 694, a U-shaped heating pipe 695, a cleaning assembly 70, a cleaning tank 71, a fifth fixing plate 72, a second water pump 73, a third pipeline 74, a fourth pipeline 75 and a second spray head 76.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The invention provides a novel electroplating silver plating process for a laser pump source chip base, which comprises the following steps of:
the method comprises the following steps: sawing the raw material of the laser pump source chip base according to the processing size, and annealing to remove stress to obtain a semi-finished product;
step two: carrying out CNC rough machining on the obtained semi-product, and annealing and destressing again;
step three: carrying out CNC (computer numerical control) finish machining on the rough machined semi-finished product, and removing burrs on the surface of the semi-finished product through a magnetic grinding machine;
step four: carrying out deoiling treatment on the semi-product, and carrying out sand blasting after drying;
step five: and (3) carrying out silver electroplating on the semi-product, wherein the silver electroplating process comprises the following steps:
the first process comprises the following steps: putting the semi-product into the fixing groove 52, and rotating the hand screw 53 until the extrusion plate 54 extrudes and fixes the semi-product, so as to fix the semi-product;
and a second process: the semi-product is moved to the upper part of an ultrasonic oil removal box body 611 through a first rotating assembly 20, and is lowered into an ultrasonic oil removal agent 615 through a lifting assembly 40, meanwhile, ultrasonic waves are generated through an ultrasonic generator 613 and an ultrasonic transducer 614, so that ultrasonic oil removal is carried out on the semi-product, and the semi-product is restored to the original position after oil removal;
and a third process: the semi-product is moved into the cleaning box 71 through the first rotating assembly 20 and the lifting assembly 40, meanwhile, external water flows into the second spray head 76 through the third pipeline 74 and the fourth pipeline 75 sequentially through the second water pump 73, so that the water is sprayed to the semi-product to realize cleaning, and the semi-product is restored to the original position after cleaning;
and a fourth process: the semi-product is moved into the alkaline solution 626 through the first rotating assembly 20 and the lifting assembly 40, and the semi-product is in contact with the first conductive column 625, and at the same time, the first copper plate 624 and the first conductive column 625 are powered through the first storage battery 623, so that electrolytic degreasing of the semi-product is realized, and after degreasing, the semi-product is restored to the original position;
and a fifth process: repeating the third flow to clean the semi-finished product;
and a sixth process: the semi-product is moved into the organic solution 632 through the first rotating assembly 20 and the lifting assembly 40 to achieve chemical degreasing of the semi-product, and after degreasing, the semi-product is restored to the original position;
a seventh process: repeating the third flow to clean the semi-finished product;
and (eight) flow: the semi-product is moved to the pickling tank 641 through the first rotating assembly 20 and the lifting assembly 40 and is positioned above the pickling solution 647, and meanwhile, the pickling solution 647 sequentially flows into the first nozzle 646 through the first pipeline 644 and the second pipeline 645 through the first water pump 643, so that the pickling solution 647 is sprayed to the semi-product, the semi-product is pickled, and the semi-product is restored to the original position after pickling;
the process is nine: repeating the third flow to clean the semi-finished product;
and (5) a flow ten: moving the semi-product into an etching solution 652 through the first rotating assembly 20 and the lifting assembly 40 to etch the semi-product, and restoring the semi-product to the original position after etching;
eleventh, the process is as follows: repeating the third flow to clean the semi-finished product;
the process flow is twelve: moving the semi-product into the mercurizing solution 662 by means of the first rotating assembly 20 and the lifting assembly 40 to effect the mercurizing treatment of the semi-product, after which the semi-product is returned to its original position;
a thirteen process: repeating the third flow to clean the semi-finished product;
the process is fourteen: the semi-finished product is moved into the electroplating solution 676 through the first rotating assembly 20 and the lifting assembly 40, and is in contact with the second conductive column 675, meanwhile, the second copper plate 674 and the second conductive column 675 generate electricity through the second storage battery 673, so that the semi-finished product is electroplated, and after electroplating, the semi-finished product is restored to the original position;
a fifteenth procedure: repeating the third flow to clean the semi-finished product;
sixthly, the process is as follows: the semi-product is moved into a strong oxidant 682 through the first rotating assembly 20 and the lifting assembly 40 to realize passivation of the semi-product, and after passivation, the semi-product is restored to the original position;
seventeen, the process is as follows: the half-product is moved into the drying box 691 through the first rotating assembly 20 and the lifting assembly 40, meanwhile, air filtered from the outside is sucked into the hollow pipe 692 through the fan 693, the air sucked into the hollow pipe 692 is heated by the U-shaped heating pipe 695, and the heated air is blown to the half-product, so that the half-product is dried;
step six: and carrying out reliability test on the semi-finished product to obtain a finished product.
The invention provides a new device for electroplating silver on a laser pump source chip base, please refer to fig. 1-13, which comprises:
as shown in fig. 1 and 3: the device comprises a base plate 10, wherein supporting rods 11 are fixedly arranged at the top of the base plate 10, the supporting rods 11 are four groups in total, a workbench 12 is fixedly arranged at the top of each supporting rod 11, a supporting shaft 13 is fixedly arranged at the middle end of the top of the workbench 12, and an ultrasonic oil removing assembly 61, an electrolytic oil removing assembly 62, an organic solvent oil removing assembly 63, an acid washing assembly 64, an etching assembly 65, a mercurizing assembly 66, an electroplating assembly 67, a passivating assembly 68, a drying assembly 69 and a cleaning assembly 70 are sequentially arranged on the periphery of the top of the workbench 12 in a circular arrangement manner;
a first rotating assembly 20, the first rotating assembly 20 being mounted on top of the support shaft 13;
a second rotating assembly 30, the second rotating assembly 30 being mounted on the first rotating assembly 20;
the lifting assembly 40 is arranged on each of the first rotating assembly 20 and the second rotating assembly 30;
and the fixing assemblies 50 are arranged on each group of lifting assemblies 40, and the fixing assemblies 50 for fixing the half-products are arranged on the lifting assemblies.
As shown in fig. 1 to 3, the first rotating assembly 20 includes:
a supporting plate 21 fixedly arranged at the top of the supporting shaft 13, wherein a first box 22 is fixedly arranged on the supporting plate 21, and a first servo motor 23 is fixedly arranged on the inner wall of the first box 22;
a first rotating shaft 24 rotatably connected to the first case 22 through a bearing, an output shaft of the first servo motor 23 is fixedly connected to the first rotating shaft 24 having the same diameter, and a first rotating plate 25 is fixedly mounted on the first rotating shaft 24;
after the first servo motor 23 is started, the first rotating shaft 24 drives the first rotating plate 25 to rotate through the first servo motor 23;
the second rotating assembly 30 includes:
a second box 31 fixedly arranged on the first rotating plate 25, wherein a second servo motor 32 is fixedly arranged on the inner wall of the second box 31;
a second rotating shaft 33 rotatably connected to the second box 31 through a bearing, an output shaft of the second servo motor 32 is fixedly connected to the second rotating shaft 33 with the same diameter, and a second rotating plate 34 is fixedly mounted on the second rotating shaft 33;
after the second servo motor 32 is started, the second rotating shaft 33 drives the second rotating plate 34 to rotate through the second servo motor 32;
the output shaft of the first servo motor 23 is coaxial with the output shaft of the second servo motor 32;
the elevating assembly 40 includes:
the box body 41 is fixedly arranged at the bottom of each of the first rotating plate 25 and the second rotating plate 34, the hydraulic cylinder 42 is fixedly arranged on the inner wall of the box body 41, and the output end of the hydraulic cylinder 42 is provided with the fixing component 50 through a piston rod;
a starting hydraulic cylinder 42 having a function of lifting the fixing member 50 by a piston rod of the hydraulic cylinder 42;
the fixing assembly 50 includes:
the output end of the hydraulic cylinder 42 is fixedly provided with the fixed block 51 through a piston rod, and the inner wall of the bottom end of the fixed block 51 is provided with a fixed groove 52;
and a hand screw 53, wherein the hand screw 53 is screwed on the fixing block 51, and one end of the fixing block 51 extends into the fixing groove 52 and is fixedly provided with a pressing plate 54.
As shown in fig. 4, the ultrasonic degreasing assembly 61 includes:
an ultrasonic oil removal box body 611 fixedly arranged on the workbench 12, wherein an ultrasonic oil removal agent 615 is arranged in the inner cavity of the ultrasonic oil removal box body 611;
a first fixing plate 612 fixedly installed on the ultrasonic oil removing tank body 611, and an ultrasonic generator 613 is fixedly installed on the first fixing plate 612;
and the ultrasonic transducer 614 is fixedly arranged on the inner wall of the ultrasonic degreasing box body 611, the ultrasonic transducer 614 is positioned in the ultrasonic degreasing agent 615, and the ultrasonic generator 613 is connected with the ultrasonic transducer 614.
As shown in fig. 5, the electrolytic degreasing assembly 62 includes:
an electrolytic tank 621 fixedly mounted on the worktable 12, an alkaline solution 626 is provided in an inner cavity of the electrolytic tank 621, a first copper plate 624 is fixedly mounted on one side of an inner wall of the electrolytic tank 621, and a first conductive post 625 is fixedly mounted on a side wall of the electrolytic tank 621 opposite to the first copper plate 624;
the second fixing plate 622 is fixedly installed on the electrolytic tank 621, the first storage battery 623 is fixedly installed on the second fixing plate 622, the positive electrode of the first storage battery 623 is electrically connected with the first copper plate 624, and the negative electrode of the first storage battery 623 is electrically connected with the first conductive post 625.
As shown in fig. 6, the organic solvent degreasing assembly 63 includes:
an organic solvent de-oiling tank 631 fixedly installed on the worktable 12, wherein an inner cavity of the organic solvent de-oiling tank 631 is provided with an organic solution 632, and the organic solution 632 consists of styrene, perchloroethylene, trichloroethylene and ethylene glycol ether;
the components in the organic solution 632 are, by weight: 10-20 g of styrene, 6-8 g of perchloroethylene, 4-8 g of trichloroethylene and 2-4 g of ethylene glycol ether, wherein:
preferably: 10g of styrene, 6g of perchloroethylene, 4g of trichloroethylene and 2g of ethylene glycol ether;
most preferably: 20g of styrene, 8g of perchloroethylene, 8g of trichloroethylene and 4g of ethylene glycol ether;
more preferably: 15g of styrene, 7g of perchloroethylene, 6g of trichloroethylene and 3g of ethylene glycol ether.
As shown in fig. 7, the pickling assembly 64 includes:
the pickling tank 641 is fixedly installed on the workbench 12, and an inner cavity of the pickling tank 641 is provided with a pickling solution 647, wherein the pickling solution 647 consists of hydrochloric acid, phosphoric acid, hydrogen peroxide, a stabilizer and a surfactant;
the components in the pickling solution 647 are, by weight: 8-10 g of hydrochloric acid, 6-8 g of phosphoric acid, 4-6 g of hydrogen peroxide, 2-4 g of stabilizer and 2-4 g of surfactant, wherein:
preferably, the following components are used: 8g of hydrochloric acid, 6g of phosphoric acid, 4g of hydrogen peroxide, 2g of stabilizer and 2g of surfactant;
most preferably: 10g of hydrochloric acid, 8g of phosphoric acid, 6g of hydrogen peroxide, 4g of stabilizer and 4g of surfactant;
more preferably: 9g of hydrochloric acid, 7g of phosphoric acid, 5g of hydrogen peroxide, 3g of a stabilizer and 3g of a surfactant;
a third fixing plate 642 fixedly installed on the pickling tank 641, a first water pump 643 is fixedly installed on the third fixing plate 642, a first pipeline 644 is fixedly installed at the input end of the first water pump 643, one end of the first pipeline 644 extends into the pickling solution 647 and is fixedly installed on the pickling tank 641, and a second pipeline 645 is fixedly installed at the output end of the first water pump 643;
a plurality of first nozzles 646 are fixedly arranged on the periphery of the inner wall of the top end of the first nozzle 646 and the pickling tank 641, and one end of the second pipeline 645 is fixedly connected with a hose arranged on the first nozzle 646 through a multi-way joint.
As shown in fig. 8, the etched member 65 includes:
an etching box 651 fixedly arranged on the workbench 12, wherein an etching solution 652 is arranged in the inner cavity of the etching box 651, and the etching solution 652 consists of sulfuric acid, hydrochloric acid, nitric acid, hydrofluoric acid and phosphoric acid;
the etching solution 652 comprises the following components by weight: 8-12 g of sulfuric acid, 4-8 g of hydrochloric acid, 4-8 g of nitric acid, 1-3 g of hydrofluoric acid and 2-6 g of phosphoric acid, wherein:
preferably: 8g of sulfuric acid, 4g of hydrochloric acid, 4g of nitric acid, 1g of hydrofluoric acid and 2g of phosphoric acid;
most preferably: 12g of sulfuric acid, 8g of hydrochloric acid, 8g of nitric acid, 3g of hydrofluoric acid and 6g of phosphoric acid;
more preferably: 10g of sulfuric acid, 6g of hydrochloric acid, 6g of nitric acid, 2g of hydrofluoric acid and 4g of phosphoric acid.
As shown in fig. 9, the mercuriizing assembly 66 includes:
an amalgamation box 661 fixedly installed on the worktable 12, an amalgamation solution 662 is arranged in the inner cavity of the amalgamation box 661, and the amalgamation solution 662 is composed of mercuric chloride, mercuric oxide and potassium cyanide;
the ingredients in the mercurialized solution 662 were, by weight: 4g-6g of mercuric chloride, 2g-6g of mercuric oxide and 2g-4g of potassium cyanide, wherein:
preferably, the following components are used: 4g of mercuric chloride, 2g of mercuric oxide and 2g of potassium cyanide;
most preferably: 6g of mercuric chloride, 6g of mercuric oxide and 4g of potassium cyanide;
more preferably: 5g of mercuric chloride, 4g of mercuric oxide and 3g of potassium cyanide.
As shown in fig. 10, the plating assembly 67 includes:
a plating tank 671 fixedly installed on the workbench 12, wherein an inner cavity of the plating tank 671 is provided with a plating solution 676, the plating solution 676 consists of silver nitrate and potassium cyanide, a second copper plate 674 is fixedly installed on one side of the inner wall of the plating tank 671, and a second conductive pillar 675 is fixedly installed on the side wall of the plating tank 671 opposite to the second copper plate 674;
the plating solution 676 contains the following components by weight: 2g-4g of silver nitrate and 2g-4g of potassium cyanide, wherein:
preferably: 2g of silver nitrate and 2g of potassium cyanide;
most preferably: 4g of silver nitrate and 4g of potassium cyanide;
more preferably: 3g of silver nitrate and 3g of potassium cyanide;
a fourth fixing plate 672 fixedly arranged on the electroplating tank 671, a second storage battery 673 is fixedly arranged on the fourth fixing plate 672, the positive pole of the second storage battery 673 is electrically connected with the second copper plate 674, and the negative pole of the second storage battery 673 is electrically connected with the second conductive column 675.
As shown in fig. 11, passivation assembly 68 includes:
a passivation box 681 fixedly installed on the workbench 12, wherein a strong oxidant 682 is arranged in the inner cavity of the passivation box 681, and the strong oxidant 682 consists of trivalent cobalt salt, persulfate, peroxide, potassium dichromate, potassium permanganate, chlorate and fuming sulfuric acid;
the plating solution 676 contains the following components by weight: 12g-14g of trivalent cobalt salt, 12g-16g of persulfate, 8g-12g of peroxide, 8g-14g of potassium dichromate, 7g-9g of potassium permanganate, 6g-10g of chlorate and 4g-8g of fuming sulfuric acid, wherein:
preferably: 12g of trivalent cobalt salt, 12g of persulfate, 8g of peroxide, 8g of potassium dichromate, 7g of potassium permanganate, 6g of chlorate and 4g of fuming sulfuric acid;
most preferably: 14g of trivalent cobalt salt, 16g of persulfate, 12g of peroxide, 14g of potassium dichromate, 9g of potassium permanganate, 10g of chlorate and 8g of fuming sulfuric acid;
more preferably: 13g of trivalent cobalt salt, 14g of persulfate, 10g of peroxide, 11g of potassium dichromate, 8g of potassium permanganate, 8g of chlorate and 6g of fuming sulfuric acid.
As shown in fig. 12, the drying assembly 69 includes:
a drying box 691 fixedly arranged on the workbench 12, wherein hollow pipes 692 are fixedly arranged on the inner walls of the two ends of the drying box 691;
the fan 693 is fixedly arranged on the inner wall of the outer side of the hollow pipe 692;
the connecting rods 694 are fixedly installed at two ends of the outer side inner wall of the hollow pipe 692, and the U-shaped heating pipe 695 is fixedly installed between the two groups of connecting rods 694.
As shown in fig. 13, the washing assembly 70 includes:
a cleaning tank 71 fixedly installed on the table 12;
a fifth fixing plate 72 fixedly installed on the washing tank 71, a second water pump 73 fixedly installed on the top of the fifth fixing plate 72, a third pipe 74 connected with an external water source fixedly installed on the input end of the second water pump 73, and a fourth pipe 75 fixedly installed on the output end of the second water pump 73;
and a plurality of second spray heads 76 are fixedly arranged on the periphery of the inner wall of the top end of the second spray head 76 and the cleaning box 71, and one end of a fourth pipeline 75 is fixedly connected with a hose arranged on the second spray heads 76 through a multi-way joint.
Working principle of the first rotating assembly 20 and the second rotating assembly 30: when a set of half-products are installed on the fixed assemblies 50 on the first rotating assembly 20 and the second rotating assembly 30, and when the half-products on the first rotating assembly 20 are subjected to ultrasonic oil removal, the half-products on the second rotating assembly 30 can be moved to the ultrasonic oil removal assembly 61 through the second rotating assembly 30, and ultrasonic oil removal is performed on the half-products under the action of the lifting assembly 40 on the second rotating assembly, so that multiple sets of half-products can be processed simultaneously.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of this invention can be used in any combination as long as there is no structural conflict, and the combination is not exhaustively described in this specification merely for the sake of brevity and resource savings. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. A novel electroplating silver plating process for a laser pump source chip base is characterized by comprising the following specific steps:
the method comprises the following steps: sawing the raw material of the laser pump source chip base according to the processing size, and annealing to remove stress to obtain a semi-finished product;
step two: carrying out CNC rough machining on the obtained semi-product, and annealing and destressing again;
step three: carrying out CNC (computer numerical control) finish machining on the rough machined semi-finished product, and removing burrs on the surface of the semi-finished product through a magnetic grinding machine;
step four: carrying out deoiling treatment on the semi-product, and carrying out sand blasting after drying;
step five: and (3) carrying out silver electroplating on the semi-product, wherein the silver electroplating process comprises the following steps:
the first process is as follows: putting the semi-product into the fixing groove (52), and rotating the hand screw (53) until the extrusion plate (54) extrudes and fixes the semi-product, so as to fix the semi-product;
and a second process: the semi-product is moved to the upper part of an ultrasonic oil removal box body (611) through a first rotating assembly (20), and is lowered into an ultrasonic oil removal agent (615) through a lifting assembly (40), meanwhile, ultrasonic waves are generated through an ultrasonic generator (613) and an ultrasonic transducer (614), so that ultrasonic oil removal is carried out on the semi-product, and the semi-product is restored to the original position after oil removal;
and a third process: the semi-product is moved into a cleaning box (71) through a first rotating assembly (20) and a lifting assembly (40), meanwhile, external water flows into a second spray head (76) through a third pipeline (74) and a fourth pipeline (75) sequentially through a second water pump (73), so that the water is sprayed to the semi-product to realize cleaning, and the semi-product is recovered to the original position after cleaning;
and a fourth process: the semi-product is moved into an alkaline solution (626) through a first rotating assembly (20) and a lifting assembly (40), and the semi-product is in contact with a first conductive column (625), meanwhile, a first storage battery (623) enables a first copper plate (624) and the first conductive column (625) to generate electricity, so that electrolytic oil removal is carried out on the semi-product, and after oil removal, the semi-product is restored to the original position;
and a fifth process: repeating the third flow to clean the semi-finished product;
and a sixth process: moving the semi-product into an organic solution (632) through a first rotating assembly (20) and a lifting assembly (40) to achieve chemical degreasing of the semi-product, and after degreasing, returning the semi-product to the original position;
a seventh process: repeating the third flow to clean the semi-finished product;
and (eight) flow: the semi-product is moved to a pickling tank (641) through a first rotating assembly (20) and a lifting assembly (40) and is positioned above a pickling solution (647), meanwhile, the pickling solution (647) sequentially flows into a first spray head (646) through a first pipeline (644) and a second pipeline (645) through a first water pump (643), so that the pickling solution (647) is sprayed to the semi-product, the semi-product is pickled, and after pickling, the semi-product is recovered to the original position;
the process is nine: repeating the third flow to clean the semi-product;
and (5) a flow ten: moving the semi-product into an etching solution (652) through a first rotating assembly (20) and a lifting assembly (40) to etch the semi-product, and restoring the semi-product to the original position after etching;
eleventh, the process is as follows: repeating the third flow to clean the semi-product;
the process flow is twelve: moving the semi-product into an amalgamation solution (662) by means of a first rotating assembly (20) and a lifting assembly (40) to effect amalgamation of the semi-product, after which the semi-product is returned to its original position;
a thirteen process: repeating the third flow to clean the semi-product;
the process is fourteen: the semi-finished product is moved into the electroplating solution (676) through the first rotating assembly (20) and the lifting assembly (40), and the semi-finished product is in contact with the second conductive post (675), meanwhile, the second copper plate (674) and the second conductive post (675) generate electricity through the second storage battery (673), so that the semi-finished product is electroplated, and after electroplating, the semi-finished product is restored to the original position;
a fifteenth procedure: repeating the third flow to clean the semi-product;
sixthly, the process is as follows: the semi-product is moved into a strong oxidant (682) through a first rotating assembly (20) and a lifting assembly (40) so as to passivate the semi-product, and the semi-product is restored to the original position after passivation;
seventeen, the process is as follows: the semi-product is moved into the drying box (691) through the first rotating assembly (20) and the lifting assembly (40), meanwhile, air filtered from the outside is sucked into the hollow pipe (692) through the fan (693), the air sucked into the hollow pipe (692) is heated by the U-shaped heating pipe (695), and the heated air is blown to the semi-product, so that the semi-product is dried;
step six: and carrying out reliability test on the semi-finished product to obtain the finished product.
2. The utility model provides a laser pump source chip base electroplates new equipment of silver-plating which characterized in that includes:
the device comprises a base plate (10), the top of the base plate (10) is fixedly provided with support rods (11), the support rods (11) are four groups in total, the top of the support rods (11) is fixedly provided with a workbench (12), the top middle end of the workbench (12) is fixedly provided with a support shaft (13), and the periphery of the top of the workbench (12) is circularly arranged and is sequentially provided with an ultrasonic oil removing assembly (61), an electrolytic oil removing assembly (62), an organic solvent oil removing assembly (63), an acid washing assembly (64), an etching assembly (65), a mercurizing assembly (66), an electroplating assembly (67), a passivation assembly (68), a drying assembly (69) and a cleaning assembly (70);
a first rotating assembly (20), said first rotating assembly (20) being mounted on top of the support shaft (13);
a second rotating assembly (30), said second rotating assembly (30) being mounted on the first rotating assembly (20);
the lifting assembly (40) is arranged on each of the first rotating assembly (20) and the second rotating assembly (30);
each group of lifting assemblies (40) is provided with a fixing assembly (50) for fixing a half product;
the ultrasonic oil removal assembly (61) comprises:
the ultrasonic oil removal tank body (611) is fixedly arranged on the workbench (12), and an ultrasonic oil removal agent (615) is arranged in the inner cavity of the ultrasonic oil removal tank body (611);
a first fixing plate (612) fixedly installed on the ultrasonic oil removal tank body (611), wherein an ultrasonic generator (613) is fixedly installed on the first fixing plate (612);
the ultrasonic transducer (614) is fixedly arranged on the inner wall of the ultrasonic oil removal box body (611), the ultrasonic transducer (614) is positioned in the ultrasonic oil removal agent (615), and the ultrasonic generator (613) is connected with the ultrasonic transducer (614);
the electrolytic degreasing assembly (62) comprises:
the electrolytic tank (621) is fixedly arranged on the workbench (12), an alkaline solution (626) is arranged in an inner cavity of the electrolytic tank (621), a first copper plate (624) is fixedly arranged on one side of the inner wall of the electrolytic tank (621), and a first conductive post (625) is fixedly arranged on the side wall of the electrolytic tank (621) opposite to the first copper plate (624);
the second fixing plate (622) is fixedly arranged on the electrolytic tank (621), the first storage battery (623) is fixedly arranged on the second fixing plate (622), the positive electrode of the first storage battery (623) is electrically connected with the first copper plate (624), and the negative electrode of the first storage battery (623) is electrically connected with the first conductive column (625);
the organic solvent degreasing assembly (63) comprises:
the organic solvent de-oiling box (631) is fixedly arranged on the workbench (12), an organic solution (632) is arranged in the inner cavity of the organic solvent de-oiling box (631), and the organic solution (632) consists of styrene, perchloroethylene, trichloroethylene and ethylene glycol ether;
the pickling assembly (64) comprises:
the pickling tank (641) is fixedly arranged on the workbench (12), an inner cavity of the pickling tank (641) is provided with a pickling solution (647), and the pickling solution (647) consists of hydrochloric acid, phosphoric acid, hydrogen peroxide, a stabilizer and a surfactant;
a third fixing plate (642) fixedly installed on the pickling tank (641), a first water pump (643) is fixedly installed on the third fixing plate (642), a first pipeline (644) is fixedly installed at the input end of the first water pump (643), one end of the first pipeline (644) extends into the pickling solution (647) and is fixedly installed on the pickling tank (641), and a second pipeline (645) is fixedly installed at the output end of the first water pump (643);
the periphery of the inner wall of the top end of the pickling tank (641) is fixedly provided with a plurality of first nozzles (646), and one end of a second pipeline (645) is fixedly connected with a hose arranged on the first nozzles (646) through a multi-way joint;
the etched component (65) comprises:
the etching device comprises an etching box (651) fixedly arranged on a workbench (12), wherein an etching solution (652) is arranged in the inner cavity of the etching box (651), and the etching solution (652) consists of sulfuric acid, hydrochloric acid, nitric acid, hydrofluoric acid and phosphoric acid;
the mercurizing assembly (66) includes:
an amalgamation box (661) fixedly installed on the workbench (12), wherein an amalgamation solution (662) is arranged in an inner cavity of the amalgamation box (661), and the amalgamation solution (662) is composed of mercuric chloride, mercuric oxide and potassium cyanide;
the plating assembly (67) includes:
the electroplating tank (671) is fixedly installed on the workbench (12), an electroplating solution (676) is arranged in an inner cavity of the electroplating tank (671), the electroplating solution (676) is composed of silver nitrate and potassium cyanide, a second copper plate (674) is fixedly installed on one side of the inner wall of the electroplating tank (671), and a second conductive column (675) is fixedly installed on the side wall, opposite to the second copper plate (674), of the electroplating tank (671);
a fourth fixing plate (672) fixedly installed on the electroplating tank (671), wherein a second storage battery (673) is fixedly installed on the fourth fixing plate (672), the positive electrode of the second storage battery (673) is electrically connected with a second copper plate (674), and the negative electrode of the second storage battery (673) is electrically connected with a second conductive column (675);
the passivation assembly (68) includes:
the passivation device comprises a passivation box (681) fixedly mounted on a workbench (12), wherein a strong oxidant (682) is arranged in an inner cavity of the passivation box (681), and the strong oxidant (682) consists of trivalent cobalt salt, persulfate, peroxide, potassium dichromate, potassium permanganate, chlorate and fuming sulfuric acid;
the drying assembly (69) comprises:
the drying box (691) is fixedly arranged on the workbench (12), and hollow pipes (692) are fixedly arranged on the inner walls of the two ends of the drying box (691);
the fan (693) is fixedly installed on the inner wall of the outer side of the hollow pipe (692);
the two ends of the outer side inner wall of the hollow pipe (692) are fixedly provided with connecting rods (694), and a U-shaped heating pipe (695) is fixedly arranged between the two groups of connecting rods (694);
the washing assembly (70) comprises:
a cleaning box (71) fixedly arranged on the workbench (12);
a fifth fixing plate (72) fixedly installed on the washing tank (71), a second water pump (73) is fixedly installed at the top of the fifth fixing plate (72), a third pipeline (74) connected with an external water source is fixedly installed at the input end of the second water pump (73), and a fourth pipeline (75) is fixedly installed at the output end of the second water pump (73);
the periphery of the inner wall of the top end of the cleaning box (71) is fixedly provided with a plurality of second spray heads (76), and one end of a fourth pipeline (75) is fixedly connected with a hose arranged on the second spray heads (76) through a multi-way connector.
3. The new apparatus for electroplating silver plating on a laser pump source chip base as claimed in claim 2, wherein the first rotating assembly (20) comprises:
the supporting plate (21) is fixedly arranged at the top of the supporting shaft (13), the first box body (22) is fixedly arranged on the supporting plate (21), and the first servo motor (23) is fixedly arranged on the inner wall of the first box body (22);
a first rotating shaft (24) is rotatably connected to the first box body (22) through a bearing, an output shaft of the first servo motor (23) is fixedly connected with the first rotating shaft (24) with the same diameter, and a first rotating plate (25) is fixedly arranged on the first rotating shaft (24);
the second rotating assembly (30) comprises:
a second box body (31) fixedly arranged on the first rotating plate (25), wherein a second servo motor (32) is fixedly arranged on the inner wall of the second box body (31);
a second rotating shaft (33) is rotatably connected to the second box body (31) through a bearing, an output shaft of the second servo motor (32) is fixedly connected with the second rotating shaft (33) with the same diameter, and a second rotating plate (34) is fixedly installed on the second rotating shaft (33);
the output shaft of the first servo motor (23) is coaxial with the output shaft of the second servo motor (32).
4. The new laser pump source chip base electroplating silver plating equipment according to claim 3, wherein the lifting assembly (40) comprises:
the box body (41) is fixedly installed at the bottom of each of the first rotating plate (25) and the second rotating plate (34), the hydraulic cylinder (42) is fixedly installed on the inner wall of each of the box bodies (41), and the output end of each hydraulic cylinder (42) is provided with the fixing component (50) through the piston rod.
5. The new apparatus for electroplating silver plating on laser pump source chip base according to claim 4, wherein the fixing assembly (50) comprises:
the output end of the hydraulic cylinder (42) is fixedly provided with the fixed block (51) through a piston rod, and the inner wall of the bottom end of the fixed block (51) is provided with a fixed groove (52);
the manual screw (53) is in threaded connection with the fixing block (51), and one end of the fixing block (51) extends into the fixing groove (52) and is fixedly provided with the extrusion plate (54).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210848790.3A CN115106336B (en) | 2022-07-19 | 2022-07-19 | Novel electroplating silver plating process and equipment for laser pump source chip base |
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| CN202210848790.3A CN115106336B (en) | 2022-07-19 | 2022-07-19 | Novel electroplating silver plating process and equipment for laser pump source chip base |
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| CN115106336B true CN115106336B (en) | 2023-03-31 |
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| CN116288583B (en) * | 2023-05-19 | 2023-08-08 | 常州江苏大学工程技术研究院 | Novel electroplating silver-plating process and equipment for laser pump source chip base |
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| DE10310071B3 (en) * | 2003-03-07 | 2004-08-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for galvanizing components with metallic coatings comprises moving the component to be coated through process stations using a gripper (20), and immersing in galvanic baths |
| KR101142640B1 (en) * | 2009-09-15 | 2012-05-11 | 함영철 | Arm lifting type automatic plating equipment |
| CN202415725U (en) * | 2011-12-28 | 2012-09-05 | 尼尔金属(苏州)有限公司 | System for copper plating on yellow brass substrate |
| CN203668543U (en) * | 2014-01-17 | 2014-06-25 | 四川渝邻汽车零部件有限公司 | Piston tinning machine |
| CN104562112B (en) * | 2015-02-02 | 2017-04-05 | 湖北三江航天红林探控有限公司 | A kind of ledrite silver plating process |
| CN105525244B (en) * | 2015-12-30 | 2018-06-29 | 河北工业大学 | A kind of structural member galvanizing manipulator |
| CN208933485U (en) * | 2018-10-30 | 2019-06-04 | 江西日佳铜业有限公司 | A kind of energy saving and environment friendly copper pipe cleaning production apparatus |
| CN209636356U (en) * | 2019-03-22 | 2019-11-15 | 余姚市爱迪升电镀科技有限公司 | A kind of plating disk workbench |
| CN210945839U (en) * | 2019-10-31 | 2020-07-07 | 天津瑞鑫金属表面处理有限公司 | Full-automatic electroplating production line |
| CN111014162A (en) * | 2019-12-17 | 2020-04-17 | 徐州振丰超声电子有限公司 | Permanent magnet cleaning, pickling and activating integrated machine before electroplating |
| CN111575776B (en) * | 2020-05-25 | 2021-05-14 | 太仓市华夏电镀有限公司 | Barrel plating production line and barrel plating process thereof |
| CN113355727A (en) * | 2021-06-08 | 2021-09-07 | 东台启程精密电子技术有限公司 | Anodic oxidation production line and production process |
| CN114059120A (en) * | 2021-12-14 | 2022-02-18 | 江苏固家智能科技有限公司 | Laser pump source chip base and new process for plating and silver plating on tube shell |
| CN114192488B (en) * | 2022-02-15 | 2022-05-20 | 江苏月生达机械制造有限公司 | Bridge accessory processing equipment |
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