CN114086164A

CN114086164A - Anti-oxidation PCB (printed circuit board) and manufacturing process thereof

Info

Publication number: CN114086164A
Application number: CN202111422804.7A
Authority: CN
Inventors: 李春红; 徐积综
Original assignee: Shenzhen Tengdaxiang Electronic Technology Co ltd
Current assignee: Shenzhen Tengdaxiang Electronic Technology Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-02-25

Abstract

The invention discloses an antioxidant PCB (printed Circuit Board) and a manufacturing process thereof, and relates to the technical field of manufacturing of printed circuit boards, wherein the manufacturing process comprises the steps of oil removal, water washing, etching, water washing, chemical nickel plating, polishing, protection treatment, magnesium electroplating of a thin layer, cleaning the surface of the PCB by using an over-alkaline degreasing agent, and the degreasing agent 1: adding water in a proportion of 10-15 to prepare working solution, uniformly stirring the working solution, using the working solution at normal temperature, completely soaking the PCB, and periodically checking the pH value in the using process to keep the pH value of the degreased solution at about 8; washing with clear water after 10 minutes, wherein the water is required to be cleaned; soaking the PCB in sulfate for 5 minutes, and washing with clear water again; the invention has the advantages of improving the oxidation resistance and corrosion resistance of the conductive hole of the oxidation-resistant PCB, improving the yield of the PCB after long-term storage, polishing a workpiece and conveniently switching electroplating at any time, and the production of the PCB is more automatic.

Description

Anti-oxidation PCB (printed circuit board) and manufacturing process thereof

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to an antioxidant PCB and a manufacturing process thereof.

Background

Printed circuit boards are important electronic components and are providers of electrical connections for electronic components. The yield of the PCB industry accounts for more than one fourth of the total yield of the electronic component industry, is the industry with the largest proportion in the subdivision industry of each electronic component, is widely used in a plurality of fields such as automobile electronics, communication equipment, medical electronics, industrial control equipment, clean energy, intelligent security, aerospace, military products and the like, and the oxidation resistance of the PCB can influence the quality and the service life of the PCB.

The prior art has the following defects: in the long-term storage of the PCB, because the surface of the PCB is coated with copper in the conductive hole and is contacted with air for a long time, and no protective measures are taken, the oxidation phenomenon is serious, the conductive performance between the PCB and an electronic element is influenced, the existing PCB can not be guaranteed to leave a factory and can be stored well immediately, the conductive hole can be contacted with air, the moisture and oil stain in the air can enter the conductive hole sometimes when the PCB is transported, the conductive hole is oxidized when the PCB is stored for a long time, and therefore the measures for preventing the conductive hole from being oxidized when the PCB leaves the factory are required.

Therefore, it is necessary to invent an oxidation-resistant PCB and a manufacturing process thereof.

Disclosure of Invention

The invention provides an anti-oxidation PCB and a manufacturing process thereof, wherein a magnesium oxide thin layer is electroplated on the surface of the PCB before delivery, and is soaked in a copper antioxidant to form an anti-oxidation film, and finally, when an electronic element is mounted, a grinding rod is used for rotating a circle in a conductive hole to remove the magnesium oxide thin layer for protecting the inner wall of the conductive hole against oxidation, so that the problems in the background technology are solved.

In order to achieve the above purpose, the invention provides the following technical scheme: an anti-oxidation PCB printed circuit board and a manufacturing process thereof comprise degreasing, washing, etching, washing, chemical nickel plating, polishing, protective treatment and magnesium electroplating thin layer, and the method comprises the following specific steps:

the method comprises the following steps: deoiling, at first wash PCB printed circuit board surface through alkaline degreaser, degreaser 1: adding water in a proportion of 10-15 to prepare working solution, uniformly stirring the working solution, using the working solution at normal temperature, completely soaking the PCB, and periodically checking the pH value in the using process to keep the pH value of the degreased solution at about 8;

step two: washing with water, wherein after 10 minutes, the washing is carried out with clear water, and the washing is required to be cleaned;

step three: etching, namely soaking the PCB in sulfate for 5 minutes;

step four: washing with water, namely washing with clean water again, wherein the water is required to be cleaned;

step five: chemical nickel plating, wherein the plating solution uses nickel sulfate, nickel acetate and the like as main salts, and hypophosphite and sodium borohydride as reducing agents, and the chemical nickel plating is carried out in neutral solution at normal temperature;

step six: polishing, namely polishing the conductive holes on the surface of the PCB by using a polishing machine;

step seven: protection treatment, namely placing the PCB into a soaking box, soaking the PCB for 30 minutes by using a copper antioxidant, standing and soaking for 30 minutes, and finally taking out and completely drying the PCB;

step eight: electroplating a magnesium thin layer, cleaning the PCB after being soaked by the copper antioxidant, putting a conductive hole of the PCB in a liquid magnesium solution as an anode after cleaning, taking the PCB as a cathode, adding an alkaline plating solution electrolyte according to the proportion of 60% of caustic alkali, 20% of soluble copper salt and 15% of soluble zinc salt, and 5% of an additive, and electroplating for 90 minutes by using an electrolysis device.

Preferably, the operation steps of polishing the PCB by the polishing machine in the sixth step are as follows:

s1: firstly, placing the left end of a PCB in an electric workpiece clamp I arranged on the top of a workbench for clamping;

s2: the polishing machine is rotated to a downward position by starting the servo motor I, the manufacturing device is moved up and down and left and right by the vertical electric slide rail and the horizontal electric slide rail I, the electric telescopic rod is used for stretching and retracting front and back, and polishing work is carried out in a conductive hole in the surface of the PCB.

Preferably, the operation steps of putting the PCB into a soaking box for soaking in the seventh step are as follows:

s1: the PCB printed circuit board is placed in the soaking box by starting the transmission device, the copper antioxidant which is one millimeter higher than the PCB printed circuit board is poured in, then the vibration motor is started, the vibration motor starts to work on the soaking box, the copper antioxidant and the PCB printed circuit board are driven to vibrate for minutes, then the PCB printed circuit board is statically soaked for minutes, and finally the PCB printed circuit board is taken out and completely dried.

Preferably, the operation steps of electroplating the magnesium thin layer on the PCB by the electrolysis device in the step eight are as follows:

s1: starting a servo motor I to rotate the manufacturing device by 120 degrees, rotating the electrolytic device to a downward position, then starting a transmission device, clamping the left end of the PCB through a transverse electric slide rail II and a linear motor by using an electric workpiece clamp II, moving the electrolytic device up and down and left and right through a vertical electric slide rail and the transverse electric slide rail I, performing front and back stretching by using an electric telescopic rod to match, respectively placing an electroplating cylinder I and an electroplating cylinder II at the bottom and the top of the PCB, and aligning to an opening on the surface of the PCB;

s2: starting a servo motor II to drive a gear to drive a rack and an electroplating cylinder II to move towards the PCB until the electroplating cylinder II and the electroplating cylinder I clamp the conductive hole on the surface of the PCB;

s3: and starting a water pump I and a water pump II to infuse the alkaline plating solution in the storage tank and the liquid magnesium in the charging tank into the electroplating cylinder II and the electroplating cylinder I, wherein the liquid magnesium and the electrolyte of the alkaline plating solution are communicated up and down through the surface opening of the PCB, and a generator is started to be electrified through a positive conductive head and a negative conductive head to generate electrolytic reaction, so that a layer of antioxidant film is plated on the inner wall of the opening on the surface of the PCB.

Preferably, PCB printed circuit board preparation equipment still includes the casing, drive arrangement is installed at the casing top, drive arrangement includes vertical electronic slide rail of vertical installation at the casing top and transversely installs the horizontal electronic slide rail one in vertical electronic slide rail one side, electric telescopic handle is installed to a horizontal electronic slide rail output, electric telescopic handle output fixed connection servo motor one, the burnishing machine is installed to a servo motor output.

Preferably, electrolytic device is installed at the burnishing machine top, electrolytic device includes the cylinder, water pump one is installed to cylinder one side, a water pump output end fixed connection liquid pipe, the opening is seted up to cylinder one side, electroplating barrel one is installed to the opening inner wall, the anodal conductive head of an electroplating barrel inner wall fixed connection, electroplating barrel two is cup jointed in the activity of cylinder top, the rack is installed to one side, the gear is connected in the meshing of rack output end, two outputs of gear fixed connection servo motor, water pump two is installed at the cylinder top, two output fixed connection material jars of water pump, the electrically conductive head of negative pole is installed to two inner walls of electroplating barrel, the generator is installed to the cylinder bottom.

Preferably, the clamping device is installed at the top of the shell and further comprises a workbench, and the electric workpiece clamp I is installed at the top of the workbench.

Preferably, casing top fixed connection transmission device, transmission device is still including installing the horizontal electronic slide rail two at the casing top, two output end fixed connection linear electric motors of electronic slide rail, the right-angle board is installed to the linear electric motor output, the electronic work piece of right-angle board top fixed connection presss from both sides two.

Preferably, soak device is installed at the casing top, soak device is still including installing the vibrating motor at the casing top, the box that soaks is installed to the vibrating motor output, soak box one end fixed connection gag lever post, the limiting plate is cup jointed in the gag lever post surface activity, limiting plate top fixed connection fixed plate.

An antioxidant PCB printed circuit board is prepared by the process.

The invention has the beneficial effects that:

1. the stability of the electroplated nickel layer in the air is very high, because the metal nickel has very strong passivation ability, a layer of extremely thin passivation film can be rapidly generated on the surface, the corrosion of atmosphere, alkali and certain acid can be resisted, and the nickel has conductivity and does not influence the conductivity of the conductive hole;

2. polishing the conductive hole on the surface of the PCB by using a polishing machine to enable the surface of the inner wall of the conductive hole to be smoother and ensure the stability of an antioxidant film formed by subsequent soaking of a copper antioxidant; step seven: protection treatment, namely placing the PCB into a soaking box, soaking the PCB for 30 minutes by using a copper antioxidant, standing and soaking for 30 minutes, finally taking out and completely drying the PCB, and forming a layer of compact monomolecular protective film on the surface of copper after soaking treatment by using the copper antioxidant, so that the contact between air and the surface of the copper can be effectively isolated, thereby achieving the purposes of preventing corrosion and discoloration and not influencing the performances of the workpiece such as conductivity, welding and the like;

placing a conductive hole of a PCB (printed Circuit Board) in a liquid magnesium solution to serve as an anode, using the PCB as a cathode, adding an alkaline plating solution electrolyte, namely electroplating by using an electrolytic device according to the proportion of 60% of caustic alkali, 20% of soluble copper salt and 15% of soluble zinc salt and 5% of additive for 90 minutes, oxidizing to form a magnesium oxide thin layer on the surface, wherein the thickness of the magnesium oxide thin layer is 5-30 micrometers, the thickness of the magnesium oxide thin layer reaches 25-150 micrometers, and finally, when an electronic element is installed again, (because the conductivity of magnesium is weaker, but the oxidation resistance is stronger) the magnesium oxide thin layer serving as the oxidation resistance of the inner wall of the conductive hole is scraped and removed by rotating a polishing rod in the conductive hole for one circle, so that a copper oxidation resistance film layer is exposed, and the corrosion resistance and the oxidation resistance are enhanced.

Drawings

FIG. 1 is a left effect diagram of the PCB manufacturing equipment provided by the present invention;

FIG. 2 is a right side effect view of the PCB manufacturing apparatus provided in the present invention;

FIG. 3 is a schematic structural diagram of a driving device and an electrolysis device provided by the present invention;

FIG. 4 is a schematic view of the structure of an electrolysis apparatus according to the present invention;

FIG. 5 is a schematic bottom view of the electrolyzer of the present invention;

figure 6 is a schematic view of a clamping device according to the present invention;

FIG. 7 is a schematic structural diagram of a transmission device according to the present invention;

fig. 8 is a schematic structural view of the soaking device provided by the invention.

In the figure: the PCB manufacturing equipment comprises PCB manufacturing equipment 100, a shell 101, a driving device 200, a vertical electric sliding rail 201, a horizontal electric sliding rail 202, a manufacturing device 250, an electric telescopic rod 251, a storage tank 252, a first servo motor 253, an electrolysis device 260, a column 261, a first water pump 262, a liquid pipe 263, a first electroplating barrel 264, a positive electrode conductive head 265, a second electroplating barrel 266, a rack 267, a gear 268, a second servo motor 269, a second water pump 270, a charging bucket 271, a negative electrode conductive head 272, a generator 280, a polishing machine 290, a clamping device 300, a workbench 301, a first electric workpiece clamp 302, a transmission device 400, a horizontal electric sliding rail two 401, a linear motor 402, a right-angle plate 403, a second electric workpiece clamp 404, a soaking device 502, a soaking device 500, a vibration motor 501, a soaking box 502, a limiting rod 503, a limiting plate 504 and a fixing plate 505.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

Referring to fig. 1-8, the present invention provides an antioxidant PCB and a manufacturing process thereof, in order to achieve the above object, the present invention provides the following technical solutions: an anti-oxidation PCB printed circuit board and a manufacturing process thereof comprise degreasing, washing, etching, washing, chemical nickel plating, polishing, protective treatment and magnesium electroplating thin layer, and the method comprises the following specific steps:

step three: etching, namely soaking the PCB in sulfate for 5 minutes;

Further, the operation steps of polishing the PCB by the polishing machine in the sixth step are as follows:

s1: firstly, placing the left end of a PCB in an electric workpiece clamp I302 arranged on the top of a workbench 301 for clamping;

s2: the polishing machine 290 is rotated to a downward position by starting the first servo motor 253, the manufacturing device 250 is moved up and down and left and right by the first vertical electric slide rail 201 and the first horizontal electric slide rail 202, and the electric telescopic rod 251 is used for stretching and retracting back and forth to polish the conductive holes in the surface of the PCB.

Further, the operation steps of putting the PCB into a soaking box for soaking in the seventh step are as follows:

s1: the transmission device 400 is started to place the PCB in the soaking box 502, the copper antioxidant one millimeter higher than the PCB is poured in, then the vibration motor 501 is started, the vibration motor 501 starts to work on the soaking box 502 to drive the copper antioxidant and the PCB to vibrate for 30 minutes, then the PCB is statically soaked for 30 minutes, and finally the PCB is taken out and completely dried.

Further, the operation steps of the electrolytic device for electroplating the magnesium thin layer on the PCB in the step eight are as follows:

s1: starting a servo motor 253 to rotate the manufacturing device 250 by 120 degrees, rotating the electrolytic device 260 to a downward position, then starting the transmission device 400, clamping the left end of the PCB by using an electric workpiece clamp II 404 through a transverse electric sliding rail II 401 and a linear motor 402, moving the electrolytic device 260 up and down and left and right through a vertical electric sliding rail 201 and a transverse electric sliding rail I202, performing front and back stretching and matching by using an electric telescopic rod 251, and respectively placing an electroplating cylinder I264 and an electroplating cylinder II 266 at the bottom and the top of the PCB to align to an opening on the surface of the PCB;

s2: the second servo motor 269 is started to drive the gear 268 to drive the rack 267 and the second electroplating cylinder 266 to move towards the PCB until the second electroplating cylinder 266 and the first electroplating cylinder 264 clamp the conductive hole on the surface of the PCB;

s3: and starting a first water pump 262 and a second water pump 270 to infuse the alkaline plating solution in the storage tank 252 and the liquid magnesium in the material tank 271 into a second electroplating cylinder 266 and a first electroplating cylinder 264, wherein the liquid magnesium and the electrolyte of the alkaline plating solution are communicated up and down through the surface opening of the PCB, and a generator 280 is started to be electrified through a positive conductive head 265 and a negative conductive head 272 to generate an electrolytic reaction, so that the inner wall of the surface opening of the PCB is plated with an anti-oxidation film.

Further, the PCB printed circuit board manufacturing equipment 100 further comprises a housing 101, a driving device 200 is installed at the top of the housing 101, the driving device 200 comprises a vertical electric sliding rail 201 vertically installed at the top of the housing 101 and a first horizontal electric sliding rail 202 horizontally installed on one side of the vertical electric sliding rail 201, an electric telescopic rod 251 is installed at the output end of the first horizontal electric sliding rail 202, the output end of the electric telescopic rod 251 is fixedly connected with a first servo motor 253, and a polishing machine 290 is installed at the output end of the first servo motor 253.

Further, the top of the polishing machine 290 is provided with an electrolysis device 260, the electrolysis device 260 comprises a cylinder 261, one side of the cylinder 261 is provided with a first water pump 262, an output end of the first water pump 262 is fixedly connected with a liquid pipe 263, one side of the cylinder 261 is provided with an opening (not labeled), the inner wall of the opening (not labeled) is provided with a first electroplating cylinder 264, the inner wall of the first electroplating cylinder 264 is fixedly connected with a positive electrode conductive head 265, the top of the cylinder 261 is movably sleeved with a second electroplating cylinder 266, one side of the cylinder 266 is provided with a rack 267, the output end of the rack 267 is engaged with a gear 268, the gear 268 is fixedly connected with an output end of a second servo motor 269, the top of the cylinder 261 is provided with a second water pump 270, the output end of the second water pump 270 is fixedly connected with a material tank 271, the inner wall of the second electroplating cylinder 266 is provided with a negative electrode conductive head 272, and the bottom of the cylinder 261 is provided with a generator 280, the workpiece can be conveniently polished and can be electroplated.

Further, a clamping device 300 is mounted on the top of the housing 101, the clamping device 300 further comprises a workbench 301, and an electric work clamp 302 is mounted on the top of the workbench 301, so that a Printed Circuit Board (PCB) can be fixed conveniently.

Further, casing 101 top fixed connection transmission device 400, transmission device 400 is still including installing two 401 horizontal electronic slide rails at casing 101 top, two 401 output end fixed connection linear electric motor 402 of electronic slide rail, right-angle board 403 is installed to linear electric motor 402 output end, two 404 electronic work holders of right-angle board 403 top fixed connection make PCB printed circuit board's production more automatic through transmission device 400.

Further, soak device 500 is installed at casing 101 top, soak device 500 is still including installing vibrating motor 501 at casing 101 top, soak box 502 is installed to vibrating motor 501 output, soak box 502 one end fixed connection gag lever post 503, limiting plate 504 is cup jointed in the activity of gag lever post 503 surface, limiting plate 504 top fixed connection fixed plate 505, through vibrating motor 501's vibration, it is more even when making the copper antioxidant form in the electrically conductive hole.

An antioxidant PCB printed circuit board is prepared by the process.

The using process of the invention is as follows: because the chemical activity and the oxygen affinity of magnesium are extremely strong, the surface is very easy to be oxidized, a special pretreatment method is adopted, and the method comprises the following steps: deoiling, at first wash PCB printed circuit board surface through alkaline degreaser, degreaser 1: adding water in a proportion of 10 to 15 to prepare working solution, uniformly stirring the working solution, using the working solution at normal temperature, completely soaking the PCB, periodically checking the pH value in the using process to keep the pH value of degreasing solution at about 8, ensuring that the alkaline cleaning agent does not cause any corrosion to the copper surface, namely can clean the oil stain, utilizes the hydrophilic group and the oleophilic group in the molecular structure of the surfactant to be adsorbed on the interface between the oil stain and the solution, the hydrophilic group points to the solution and the lipophilic group points to the oil stain, and the hydrophilic group and the lipophilic group are arranged directionally, so that the oil-liquid interfacial tension is greatly reduced, under the stirring action, the oil stain is loosened and is easily dispersed into tiny oil droplets to be separated from the surface of the PCB, and the surfactant and the builder are emulsified and dispersed to ensure that the oil droplets cannot be combined with each other and re-adhered to the surface of the PCB so as to achieve the cleaning action; step two: washing with water for 10 minutes, and then washing with clear water, wherein the water is required to be cleaned, and the residual oil stains adhered to the surface of the PCB are washed clean; step three: etching, namely soaking the PCB in sulfate for 5 minutes to remove oxide skin and rusty substances on the surface of the PCB; step four: washing, namely washing with clean water again, wherein the water is required to be washed clean, and sulfate adhered to the surface of the PCB is washed away; step five: chemical nickel plating, wherein the plating solution uses nickel sulfate, nickel acetate and the like as main salts, hypophosphite and sodium borohydride as reducing agents, the chemical nickel plating is carried out in a neutral solution at normal temperature, the stability of an electroplated nickel layer in the air is very high, a layer of extremely thin passivation film can be rapidly generated on the surface due to the very strong passivation capability of metal nickel, the corrosion of atmosphere, alkali and certain acids can be resisted, and the nickel has conductivity and does not influence the conductivity of a conductive hole; step six: polishing, namely polishing the conductive hole on the surface of the PCB by using a polishing machine to enable the surface of the inner wall of the conductive hole to be smoother and ensure the stability of an antioxidant film formed by subsequent soaking of a copper antioxidant; step seven: the PCB is placed in a soaking box and soaked by using a copper antioxidant for 30 minutes, then is statically soaked for 30 minutes, finally is taken out and completely dried, and after the copper antioxidant is used for soaking treatment, a compact monomolecular protective film is formed on the surface of copper (the copper antioxidant can only form a film on the surface of the copper and cannot influence a PCB (printed circuit board) substrate), so that the contact between air and the surface of the copper can be effectively isolated, the corrosion and discoloration prevention is realized, and the performances of the workpiece such as conductivity, welding and the like are not influenced; step eight: electroplating, namely cleaning the PCB soaked by the copper antioxidant, putting the conductive hole of the PCB into a liquid magnesium solution as an anode and the PCB as a cathode after cleaning, adding an alkaline plating solution electrolyte according to 60 percent of caustic alkali, 20 percent of soluble copper salt, 15 percent of soluble zinc salt and 5 percent of additive are electroplated by an electrolytic device for 90 minutes, and are oxidized to form a magnesium oxide thin layer on the surface, the thickness is 5-30 microns, the magnesium oxide thin layer reaches 25-150 microns, and finally when the electronic element is mounted, the thin magnesium oxide layer for protecting the inner wall of the conductive hole against oxidation can be scraped and removed by rotating the grinding rod in the conductive hole for a circle, so that the copper oxidation resistant film layer is exposed, and the corrosion resistance and the oxidation resistance are enhanced;

the specific operation method of polishing, protection treatment and electroplating comprises the following steps:

firstly, placing the left end of a PCB in an electric workpiece clamp I302 arranged on the top of a workbench 301 for clamping; the polishing machine 290 is rotated to a downward position by starting the servo motor I253, the manufacturing device 250 is moved up and down and left and right by the vertical electric slide rail 201 and the horizontal electric slide rail I202, and the electric telescopic rod 251 is used for stretching and retracting back and forth to polish the conductive holes in the surface of the PCB; starting the transmission device 400 to place the PCB in the soaking box 502, pouring a copper antioxidant one millimeter higher than the PCB, then starting the vibration motor 501, starting the vibration motor 501 to work the soaking box 502 to drive the copper antioxidant and the PCB to vibrate for 30 minutes, then standing and soaking for 30 minutes, finally taking out and completely drying, and enabling the copper antioxidant to be more uniformly formed in the conductive hole through the vibration of the vibration motor 501; starting a servo motor 253 to rotate the manufacturing device 250 by 120 degrees, rotating the electrolytic device 260 to a downward position, then starting the transmission device 400, clamping the left end of the PCB by using an electric workpiece clamp II 404 through a transverse electric sliding rail II 401 and a linear motor 402, moving the electrolytic device 260 up and down and left and right through a vertical electric sliding rail 201 and a transverse electric sliding rail I202, performing front and back stretching and matching by using an electric telescopic rod 251, and respectively placing an electroplating cylinder I264 and an electroplating cylinder II 266 at the bottom and the top of the PCB to align to an opening on the surface of the PCB; the second servo motor 269 is started to drive the gear 268 to drive the rack 267 and the second electroplating cylinder 266 to move towards the PCB until the second electroplating cylinder 266 and the first electroplating cylinder 264 clamp the conductive hole on the surface of the PCB; the first water pump 262 and the second water pump 270 are started to pump the alkaline plating solution in the storage tank 252 and the liquid magnesium in the material tank 271 into the second electroplating cylinder 266 and the first electroplating cylinder 264, the liquid magnesium and the electrolyte of the alkaline plating solution are communicated up and down through the surface opening of the PCB, and the generator 280 is started to be electrified through the positive conductive head 265 and the negative conductive head 272 to generate an electrolytic reaction, so that the inner wall of the surface opening of the PCB is plated with a layer of oxidation resistant film, the oxidation resistance of the PCB is improved, and the method has the advantages of being convenient for a user to operate and improving the production rate.

The above is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made in accordance with the technical solution of the present invention are within the scope of the claims of the present invention.

Claims

1. The manufacturing process of the antioxidant PCB printed circuit board is characterized by comprising the following steps of degreasing, washing, etching, washing, chemical nickel plating, polishing, protecting treatment and magnesium thin layer electroplating:

step three: etching, namely soaking the PCB in sulfate for 5 minutes;

step seven: protection treatment, namely placing the PCB in a soaking box, soaking the PCB for 30 minutes by using a copper antioxidant, standing and soaking the PCB for 30 minutes, and finally taking out the PCB, completely airing the PCB and completely airing the PCB;

step eight: electroplating a magnesium thin layer, cleaning the PCB after being soaked by the copper antioxidant, putting a conductive hole of the PCB in a liquid magnesium solution as an anode after cleaning, taking the PCB as a cathode, adding an alkaline plating solution according to the proportion of 60% of caustic alkali, 20% of soluble copper salt and 15% of soluble zinc salt, 5% of an additive, and electroplating for 90 minutes by using an electrolysis device.

2. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 1, wherein: the operation steps of polishing the PCB printed circuit board by the polishing machine in the sixth step are as follows:

s1: firstly, placing the left end of a PCB in an electric workpiece clamp I (302) arranged at the top of a workbench (301) for clamping;

s2: the polishing machine (290) is rotated to a downward position by starting the servo motor I (253), the manufacturing device (250) is moved up and down and left and right by the vertical electric sliding rail (201) and the transverse electric sliding rail I (202), the electric telescopic rod (251) is used for stretching and retracting forwards and backwards, and polishing work is carried out in a conductive hole in the surface of the PCB.

3. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 1, wherein: in the seventh step, the operation steps of putting the PCB into a soaking box for soaking are as follows:

s1: the transmission device (400) is started to place the PCB in the soaking box (502), the copper antioxidant which is one millimeter higher than the PCB is poured in, then the vibration motor (501) is started, the vibration motor (501) starts to work on the soaking box (502), the copper antioxidant and the PCB are driven to vibrate for 30 minutes, then the PCB is statically soaked for 30 minutes, and finally the PCB is taken out and completely dried.

4. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 1, wherein: the operation steps of electroplating the magnesium thin layer on the PCB by the electrolysis device in the step eight are as follows:

s1: starting a servo motor I (253), rotating the manufacturing device (250) by 120 degrees, rotating the electrolytic device (260) to a downward position, then starting the transmission device (400), clamping the left end of the PCB by using an electric workpiece clamp II (404) through a transverse electric sliding rail II (401) and a linear motor (402), moving the electrolytic device (260) up and down and left and right through a vertical electric sliding rail (201) and a transverse electric sliding rail I (202), using an electric telescopic rod (251) to stretch and retract back and forth to be matched, respectively placing an electroplating cylinder I (264) and an electroplating cylinder II (266) at the bottom and the top of the PCB, and aligning openings on the surface of the PCB;

s2: starting a second servo motor (269) to drive a gear (268) to drive a rack (267) and a second electroplating cylinder (266) to move towards the PCB until the second electroplating cylinder (266) and the first electroplating cylinder (264) clamp the conductive hole on the surface of the PCB;

s3: and starting a first water pump (262) and a second water pump (270) to infuse the alkaline plating solution in the storage tank (252) and the liquid magnesium in the charging bucket (271) into a second electroplating barrel (266) and a first electroplating barrel (264), wherein the liquid magnesium and the alkaline plating solution (electrolyte) are communicated up and down through the surface opening of the PCB, and a generator (280) is started to be electrified through a positive conductive head (265) and a negative conductive head (272) to generate an electrolytic reaction, so that the inner wall of the surface opening of the PCB is plated with an antioxidant film.

5. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 1, wherein: PCB printed circuit board preparation equipment (100) still includes casing (101), drive arrangement (200) are installed at casing (101) top, drive arrangement (200) include vertical electronic slide rail (201) of vertical installation at casing (101) top and transversely install horizontal electronic slide rail (202) in vertical electronic slide rail (201) one side, electric telescopic handle (251) are installed to horizontal electronic slide rail (202) output, electric telescopic handle (251) output fixed connection servo motor (253), burnishing machine (290) are installed to servo motor (253) output.

6. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 5, wherein: the electrolytic device (260) is installed at the top of the polishing machine (290), the electrolytic device (260) comprises a cylinder (261), a first water pump (262) is installed on one side of the cylinder (261), a first water pump (262) output end is fixedly connected with a liquid pipe (263), an opening is formed in one side of the cylinder (261), a first electroplating cylinder (264) is installed on the inner wall of the opening, a first electroplating cylinder (264) inner wall is fixedly connected with a positive conductive head (265), a second electroplating cylinder (266) is movably sleeved at the top of the cylinder (261), a rack (267) is installed on one side of the cylinder (266), an output end of the rack (267) is meshed with a connecting gear (268), a second gear (268) is fixedly connected with an output end of a second servo motor (269), a second water pump (270) is installed at the top of the cylinder (261), an output end of the second water pump (270) is fixedly connected with a material tank (271), and a negative conductive head (272) is installed on the inner wall of the second electroplating cylinder (266), the bottom of the column (261) is provided with a generator (280).

7. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 5, wherein: the clamping device (300) is installed on the top of the shell (101), the clamping device (300) further comprises a workbench (301), and the top of the workbench (301) is provided with a first electric workpiece clamp (302).

8. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 5, wherein: casing (101) top fixed connection transmission device (400), transmission device (400) are still including installing horizontal electronic slide rail two (401) at casing (101) top, electronic slide rail two (401) output end fixed connection linear electric motor (402), right-angle board (403) are installed to linear electric motor (402) output, right-angle board (403) top fixed connection electric work holder two (404).

9. The manufacturing process of the oxidation-resistant PCB printed circuit board as claimed in claim 5, wherein: soak device (500) is installed at casing (101) top, soak device (500) are still including installing vibrating motor (501) at casing (101) top, soak box (502) are installed to vibrating motor (501) output, soak box (502) one end fixed connection gag lever post (503), limiting plate (504) are cup jointed in gag lever post (503) surface activity, limiting plate (504) top fixed connection fixed plate (505).

10. An oxidation resistant PCB printed circuit board processed from any of claims 1-9.