CN115050677A - 一种晶圆传输装置及方法 - Google Patents
一种晶圆传输装置及方法 Download PDFInfo
- Publication number
- CN115050677A CN115050677A CN202210699074.3A CN202210699074A CN115050677A CN 115050677 A CN115050677 A CN 115050677A CN 202210699074 A CN202210699074 A CN 202210699074A CN 115050677 A CN115050677 A CN 115050677A
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- wafer
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 225
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 225
- 239000010703 silicon Substances 0.000 claims abstract description 225
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 172
- 238000001514 detection method Methods 0.000 description 15
- 239000013589 supplement Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210699074.3A CN115050677A (zh) | 2022-06-20 | 2022-06-20 | 一种晶圆传输装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210699074.3A CN115050677A (zh) | 2022-06-20 | 2022-06-20 | 一种晶圆传输装置及方法 |
Publications (1)
Publication Number | Publication Date |
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CN115050677A true CN115050677A (zh) | 2022-09-13 |
Family
ID=83162529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210699074.3A Pending CN115050677A (zh) | 2022-06-20 | 2022-06-20 | 一种晶圆传输装置及方法 |
Country Status (1)
Country | Link |
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CN (1) | CN115050677A (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120002409A (ko) * | 2010-06-30 | 2012-01-05 | 야마하하쓰도키 가부시키가이샤 | 부품 반송 방법, 부품 반송 장치 및 부품 실장 장치 |
JP2016134525A (ja) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | 移載装置および移載方法 |
CN106783705A (zh) * | 2016-11-30 | 2017-05-31 | 上海华力微电子有限公司 | 一种用于优化晶圆边缘缺陷的晶圆传送方法 |
CN111834271A (zh) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | 一种晶圆批量传送机构 |
CN113707587A (zh) * | 2021-05-07 | 2021-11-26 | 上海大族富创得科技有限公司 | 一种晶圆寻边装置以及寻边方法 |
CN114361086A (zh) * | 2021-12-28 | 2022-04-15 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其晶圆传输*** |
-
2022
- 2022-06-20 CN CN202210699074.3A patent/CN115050677A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120002409A (ko) * | 2010-06-30 | 2012-01-05 | 야마하하쓰도키 가부시키가이샤 | 부품 반송 방법, 부품 반송 장치 및 부품 실장 장치 |
JP2016134525A (ja) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | 移載装置および移載方法 |
CN106783705A (zh) * | 2016-11-30 | 2017-05-31 | 上海华力微电子有限公司 | 一种用于优化晶圆边缘缺陷的晶圆传送方法 |
CN111834271A (zh) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | 一种晶圆批量传送机构 |
CN113707587A (zh) * | 2021-05-07 | 2021-11-26 | 上海大族富创得科技有限公司 | 一种晶圆寻边装置以及寻边方法 |
CN114361086A (zh) * | 2021-12-28 | 2022-04-15 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其晶圆传输*** |
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Address after: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Applicant after: Shanghai Forsyte Robot Co.,Ltd. Address before: Room 1101, building 2, 188 Yizhou Road, Xuhui District, Shanghai Applicant before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
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Country or region after: China Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Applicant after: Shanghai Fosaite Technology Co.,Ltd. Address before: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Applicant before: Shanghai Forsyte Robot Co.,Ltd. Country or region before: China |