CN114944355A - High-efficient packaging hardware is used in integrated circuit chip design - Google Patents
High-efficient packaging hardware is used in integrated circuit chip design Download PDFInfo
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- CN114944355A CN114944355A CN202210888902.8A CN202210888902A CN114944355A CN 114944355 A CN114944355 A CN 114944355A CN 202210888902 A CN202210888902 A CN 202210888902A CN 114944355 A CN114944355 A CN 114944355A
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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Abstract
The invention belongs to the technical field of chip packaging, and particularly relates to a high-efficiency packaging device for integrated circuit chip design. The automatic glue dispensing device comprises a conveyor belt, wherein a plurality of groups of glue dispensing units are distributed on one side of the conveyor belt at equal intervals, and each glue dispensing unit comprises two groups of first support frames; the two groups of first supporting frames are symmetrically arranged on two sides of the conveyor belt, a servo motor is arranged on one group of the first supporting frames, and a transmission gear is connected to the output end of the servo motor in a transmission manner; an electric push rod is arranged between the two groups of first support frames, and a feeding head mounting plate is mounted at the bottom of the electric push rod; a plurality of groups of feeding pipes are distributed at the bottom of the feeding head mounting plate at equal intervals; the feeding device is characterized in that a central rotating rod is arranged below the feeding pipe, a spiral sliding groove is formed in the central rotating rod, a spiral sliding block is connected to the spiral sliding groove in a sliding mode, and a batch glue dispensing mechanism is sleeved on the central rotating rod. The invention can improve the dispensing effect and realize batch operation.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a high-efficiency packaging device for integrated circuit chip design.
Background
In recent years, with the advance of technology, integrated circuit chips have become one of the indispensable components of various electronic products. After the chip is fabricated, a subsequent packaging operation is performed to connect the chip to an external circuit.
When the chip is packaged, firstly, fixing glue is coated on the chip base, then the chip is adhered on the chip base, and the existing glue dispensing equipment can only dispense glue on the chip base independently, so that batch operation cannot be realized, and the working efficiency is reduced. And the existing dispensing equipment can only smear the fixing glue on the chip base from right above, so that the dispensing range is too small, the adhesion degree is reduced, and the problems of bulging and the like are caused. Thereby reducing the dispensing effect.
Disclosure of Invention
In order to solve the problems, the invention provides a high-efficiency packaging device for designing an integrated circuit chip, which comprises a conveyor belt, wherein a plurality of groups of glue dispensing units are arranged on one side of the conveyor belt at equal intervals;
the glue dispensing unit comprises two groups of first supporting frames; the two groups of first supporting frames are symmetrically arranged on two sides of the conveyor belt, a servo motor is arranged on one group of the first supporting frames, and a transmission gear is connected to the output end of the servo motor in a transmission manner; an electric push rod is arranged between the two groups of first support frames, and a feeding head mounting plate is mounted at the bottom of the electric push rod; a plurality of groups of feeding pipes are distributed at the bottom of the feeding head mounting plate at equal intervals; a central rotating rod is arranged below the feeding pipe, a spiral chute is formed in the central rotating rod, a spiral sliding block is connected to the spiral chute in a sliding mode, and a batch glue dispensing mechanism is sleeved on the central rotating rod;
the batch glue dispensing mechanism comprises a spiral rotary cylinder; the spiral rotary cylinder is sleeved on the central rotary rod, and the inner wall of the spiral rotary cylinder is connected with the spiral sliding block; a transmission rod is arranged at one end port of the spiral rotary drum close to the servo motor, a plurality of groups of obliquely arranged teeth are arranged on the transmission rod in an annular array, and the transmission rod is meshed with the transmission gear through the teeth; a plurality of groups of rubber inlet pipes with the same quantity as the inclined chutes are distributed on the spiral rotary drum at equal intervals, and the bottom of the material adding pipe is movably communicated with the rubber inlet pipes; the bottom of the rubber inlet pipe is communicated with a dispensing head body.
Furthermore, a plurality of groups of belt body through grooves are distributed on the conveyor belt at equal intervals, each group of belt body through grooves is provided with a group of chip conveying units, and each chip conveying unit comprises a conveying frame bottom frame and a conveying frame body; the conveying frame bottom frame is arranged in a group of belt body through grooves corresponding to the conveying frame bottom frame, a first through groove is formed in the center of the conveying frame bottom frame, and the bottom of the first through groove is communicated with the belt body through grooves; two groups of first sliding grooves are symmetrically arranged at the edges of two sides of the top of the bottom frame of the conveying frame; the conveying frame body is movably attached to the top of the bottom frame of the conveying frame, two groups of limiting sliding strips are symmetrically arranged on the outer walls of two sides of the conveying frame body, and the limiting sliding strips are movably clamped in two groups of first sliding grooves respectively.
Furthermore, a second through groove is formed in the center of the conveying frame body, and the bottom of the second through groove is communicated with the first through groove; two sets of diaphragm draw-in grooves have been seted up to conveying frame body top both sides edge symmetry, movable joint has a frame material mechanism in the diaphragm draw-in groove.
Further, the material erecting mechanism comprises a transverse plate; the transverse plate is movably clamped in the transverse plate clamping groove, one end of the transverse plate extends to the outside of the conveying frame body, and a first vertical plate is fixedly installed on one end of the transverse plate; the diaphragm other end extends to directly over the second leads to the groove, and fixed mounting has the second riser, second riser bottom extends to the second and leads to the inslot, and fixed mounting has first frame flitch.
Furthermore, a first plate groove is formed in one side wall, close to a central axis in the length direction of the second through groove, of the first material erecting plate; a second material supporting plate is connected in the first plate groove in a sliding mode, the other end of the second material supporting plate movably extends to the outside of the first plate groove, and a second plate groove is formed in the end opening; a plurality of groups of pin limiting holes are arranged at the tops of the first material supporting plate and the second material supporting plate at equal intervals along the length direction of the first material supporting plate and the second material supporting plate; the diameter of the bottom of the pin limiting hole is smaller than that of the opening of the pin limiting hole.
Furthermore, a cover plate is arranged between the material adding pipe and the batch glue dispensing mechanism, and the cover plate is of a plate-shaped structure with a sector-ring-shaped section; the equal interval distribution has the oblique spout of a plurality of groups the same with adding material pipe quantity on the top inner wall on the cover plate inner wall, oblique spout sets up for the slope, and the top has seted up and has added material pipe through-hole, every group add material pipe through-hole all be located rather than a set of corresponding adding under the material pipe.
Furthermore, one end of the rubber inlet pipe, which is far away from the spiral rotating cylinder, is connected in the inclined chute in a sliding manner; the bottom of the material adding pipe movably penetrates into the through hole of the material adding pipe and is communicated with the rubber inlet pipe.
Further, a chip mounting unit is arranged on one side of the dispensing unit, a plastic packaging unit is arranged on one side, away from the dispensing unit, of the chip mounting unit, and the plastic packaging unit comprises an upper electric sliding table; the upper electric sliding table is positioned on one side of the chip mounting unit away from the dispensing unit, and the sliding direction of the upper electric sliding table is vertically arranged; and the output end of the upper electric sliding table is connected with a first sliding rod in a sliding mode, the other end of the first sliding rod extends to the position right above the conveying belt, and a plastic package heating cover is fixedly installed on the other end of the first sliding rod.
Furthermore, a molding heating system is arranged in the plastic packaging heating cover; a plurality of composition molds are clamped at the bottom of the plastic packaging heating cover at equal intervals; and a feeding hole is formed in the top of the plastic packaging heating cover, and two ends of the feeding hole are respectively communicated with the second material storage box and the cavity of each group of forming dies.
Further, a lower electric sliding table is mounted at the bottom of the upper electric sliding table, and the sliding direction of the lower electric sliding table is vertically arranged; a second sliding rod is connected to the output end of the lower electric sliding table in a sliding mode, the other end of the second sliding rod extends to the position right below the conveyor belt, a preheating plate is fixedly installed on the second sliding rod, and a preheating heating system is arranged in the preheating plate; the top of the preheating plate is provided with lower support bars, and the lower support bars movably extend into any group of second through grooves; and a plurality of group-forming cushion blocks with the same number as the forming dies are distributed on the top of the lower supporting strip at equal intervals.
The invention has the beneficial effects that:
1. before dispensing, firstly, a material adding pipe is used for injecting fixing glue into the dispensing head body. When the chip base moves to the position right below the dispensing head body, the servo motor is started, and the transmission rod and the spiral rotary drum are driven to rotate through the servo motor. So that the dispensing head body can radially smear the fixed glue on the chip base. And because the extending direction of the spiral chute is spiral, the dispensing head body can not only carry out circular motion, but also can carry out displacement in the horizontal direction, thereby further enlarging the dispensing range and improving the gluing effect.
2. After the glue dispensing is finished, the servo motor drives the glue inlet pipe to move below the through hole of the filling pipe again, so that the material adding work of the fixing glue can be completed in the process that the conveying belt conveys the next group of chip bases. The continuity of the dispensing work is ensured, the automation degree is improved while batch operation is realized, and the labor intensity is reduced.
3. Through set up the spacing hole of pin at first frame flitch and second frame flitch top, be used for spacing to chip base in batches, need not extra fixed establishment, conveniently take, still accelerated the encapsulation speed simultaneously. And through the communicating relation of the strip body through groove, the first through groove and the second through groove, the chip base can be heated and plastically packaged from the upper end and the lower end of the plastic packaging unit conveniently, and the convenience of plastic packaging work is improved.
4. Utilize forming die and shaping cushion to heat the chip base from two upper and lower directions simultaneously, not only make it be heated more evenly, the plastic envelope effect is better, also need not to take off the chip base from the conveyer belt simultaneously and carry out the plastic envelope alone to this has improved whole smoothness nature of encapsulation work and work efficiency.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 shows a schematic structural diagram of a packaging arrangement according to an embodiment of the invention;
FIG. 2 shows an exploded schematic view of a chip transfer unit according to an embodiment of the invention;
FIG. 3 shows a schematic structural diagram of a racking mechanism according to an embodiment of the present invention;
FIG. 4 shows a cross-sectional schematic view of a racking mechanism according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a dispensing unit according to an embodiment of the invention;
FIG. 6 shows an enlarged schematic view within circle A of FIG. 5 according to an embodiment of the present invention;
FIG. 7 shows a schematic bottom view of a shroud plate according to an embodiment of the invention;
FIG. 8 illustrates an exploded view of a shroud, a batch size dispensing mechanism, and a center rotating bar according to an embodiment of the present invention;
FIG. 9 shows a port cross-sectional view of a patch according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a plastic packaging unit according to an embodiment of the invention;
FIG. 11 shows an enlarged schematic view within circle B of FIG. 10 according to an embodiment of the present invention.
In the figure: 100. a conveyor belt; 200. a chip transfer unit; 210. a bottom frame of the conveying frame; 211. a first through groove; 212. a first chute; 220. a conveying frame body; 221. a second through groove; 222. a limiting slide bar; 223. a transverse plate clamping groove; 230. a material supporting mechanism; 231. a transverse plate; 232. a first vertical plate; 233. a second vertical plate; 234. a first material supporting plate; 235. a first plate groove; 236. a pin limiting hole; 237. a second material supporting plate; 238. a second plate groove; 300. a dispensing unit; 301. a first material storage box; 310. a first support frame; 320. a servo motor; 321. a transmission gear; 330. an electric push rod; 331. a feeding head mounting plate; 332. an electromagnetic valve; 333. a glue inlet; 334. a feeding pipe; 340. a cover plate; 341. an inclined chute; 342. a through hole of the feeding pipe; 350. a batch glue dispensing mechanism; 351. a screw rotary cylinder; 352. a dispensing head mounting plate; 353. feeding a rubber tube; 354. a dispensing head body; 355. a material conveying pipe; 356. a transmission rod; 360. a central rotating rod; 361. a spiral chute; 400. a chip mounting unit; 500. a plastic package unit; 501. a second material storage tank; 510. powering up the electric sliding table; 520. a first slide bar; 530. plastically packaging the heating cover; 531. a feed inlet; 540. forming a mold; 550. a lower electric sliding table; 551. a second slide bar; 560. preheating a plate; 570. a lower supporting strip; 580. and (6) forming the cushion block.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a high-efficiency packaging device for designing an integrated circuit chip, which comprises a conveyor belt 100. For example, as shown in fig. 1, a plurality of groups of belt body through grooves are equidistantly distributed on the conveyor belt 100, and each group of belt body through grooves is provided with a group of chip conveying units 200. The chip transfer unit 200 is used to place a chip pad.
A dispensing unit 300 is arranged on one side of the conveyor belt 100, an output end of the dispensing unit 300 extends right above the conveyor belt 100, and a first storage box 301 is communicated with one side of a main body of the dispensing unit 300. Glue is applied to the die pad by the glue dispensing unit 300 for bonding the die pad and the die.
A chip mounting unit 400 is disposed at one side of the dispensing unit 300, and an output end of the chip mounting unit 400 is movably attached to each set of the chip transfer units 200. The chip mounting unit 400 is used to mount a chip on the dispensing point of the chip base and connect the chip with each pin.
One side of the chip mounting unit 400, which is far away from the dispensing unit 300, is provided with a plastic packaging unit 500, and one side of the main body of the plastic packaging unit 500 is communicated with a second material storage box 501.
The chip transfer unit 200 includes a transfer frame bottom frame 210 and a transfer frame body 220. For example, as shown in fig. 2, the bottom frame 210 of the conveying frame is installed in a set of belt through slots corresponding to the bottom frame 210 of the conveying frame, a first through slot 211 is opened at the center of the bottom frame 210 of the conveying frame, and the bottom of the first through slot 211 is communicated with the belt through slots. Two sets of first sliding chutes 212 are symmetrically arranged at two side edges of the top of the bottom frame 210. The conveying frame body 220 is movably attached to the top of the conveying frame bottom frame 210, two groups of limiting sliding strips 222 are symmetrically arranged on the outer walls of two sides of the conveying frame body 220, and the two groups of limiting sliding strips 222 are movably clamped in the two groups of first sliding grooves 212 respectively. The center of the conveying frame body 220 is provided with a second through groove 221, and the bottom of the second through groove 221 is communicated with the first through groove 211. Two sets of horizontal plate draw-in grooves 223 have been seted up to conveying frame body 220 top both sides edge symmetry, movable joint has frame material mechanism 230 in the horizontal plate draw-in groove 223.
The material lifting mechanism 230 includes a horizontal plate 231. For example, as shown in fig. 3 and 4, the horizontal plate 231 is movably clamped in the horizontal plate clamping groove 223, one end of the horizontal plate 231 extends to the outside of the conveying frame body 220, and a first vertical plate 232 is fixedly mounted on the horizontal plate 231. The other end of the horizontal plate 231 extends to a position right above the second through groove 221 and is fixedly provided with a second vertical plate 233, and the bottom of the second vertical plate 233 extends into the second through groove 221 and is fixedly provided with a first material support plate 234. A first plate groove 235 is formed on a side wall of the first material supporting plate 234 close to the central axis of the second through groove 221 in the length direction. A second material holding plate 237 is slidably connected in the first plate groove 235, the other end of the second material holding plate 237 movably extends to the outside of the first plate groove 235, and a second plate groove 238 is opened at the port. The tops of the first material holding plate 234 and the second material holding plate 237 are arranged with a plurality of groups of pin limiting holes 236 at equal intervals along the length direction. The diameter of the bottom of the pin limiting hole 236 is smaller than that of the opening thereof.
Preferably, the material supporting mechanism 230 may further include, but is not limited to, a third material supporting plate and a fourth material supporting plate, the third material supporting plate is slidably connected in the second plate groove 238, the other end of the third material supporting plate movably extends to the outside of the second plate groove 238, and the port opening is provided with the third plate groove, the fourth material supporting plate is slidably connected in the third plate groove, the other end of the fourth material supporting plate movably extends to the outside of the third plate groove, and the port opening is provided with the fourth plate groove.
When the dispensing machine works, a plurality of groups of chip bases are required to be arranged in a row on two groups of material arranging mechanisms, firstly, a corresponding group of pin limiting holes 236 are selected according to the specification width of the chip bases, if the width of the chip bases is narrow, the second material arranging plate 237 is drawn out from the first plate groove 235, pins are placed in the corresponding group of pin limiting holes 236 on the second material arranging plate 237, then, the conveyor belt 100 is started, and the conveyor belt 100 is utilized to convey the groups of chip bases to the lower part of the dispensing unit 300 for batch dispensing.
The pin limiting holes 236 are formed in the tops of the first material placing plate 234 and the second material placing plate 237, so that the chip bases in batches are limited, an additional fixing mechanism is not needed, the chip bases are convenient to take, and meanwhile the packaging speed is increased. And through the communicating relation of the belt body through groove, the first through groove 211 and the second through groove 221, the chip base can be heated and plastically packaged from the upper end and the lower end of the plastic packaging unit 500 conveniently, and the convenience of plastic packaging work is improved.
The diameter of the bottom of the pin limiting hole 236 is smaller than the diameter of the opening at the top, so that the inner wall of the pin limiting hole 236 is inclined, pins with various specifications and diameters can be limited, and the overall compatibility of the chip conveying unit 200 is improved.
The dispensing unit 300 includes two first supporting frames 310. Illustratively, as shown in fig. 5, 6 and 7, two sets of the first supporting frames 310 are symmetrically arranged on both sides of the conveyor belt 100, and a top plate is installed between the two sets of the first supporting frames 310. One group of the first support frames 310 is provided with a servo motor 320, and the output end of the servo motor 320 extends to the position right above the conveyor belt 100 and is connected with a transmission gear 321 in a transmission manner. An electric push rod 330 is installed at the bottom of the top plate, and a material adding head installation plate 331 is installed at the bottom of the electric push rod 330. It has a plurality of groups of solenoid valves 332 to add stub bar mounting panel 331 bottom along the length direction of conveying frame body 220 equidistant distribution, seted up on the solenoid valve 332 and advanced gluey mouth 333, advance gluey mouth 333 other end with first storage case 301 intercommunication. The bottom of the electromagnetic valve 332 is communicated with a feeding pipe 334. Add material pipe 334 below and be equipped with central bull stick 360, spiral chute 361 has been seted up on the central bull stick 360, spiral chute 361 is the heliciform. The spiral chute 361 is connected with a spiral sliding block in a sliding manner, and the central rotating rod 360 is sleeved with a batch glue dispensing mechanism 350. One end of the spiral sliding block is fixedly arranged on the inner wall of the main body of the batch glue dispensing mechanism 350, and the power input end of the batch glue dispensing mechanism 350 is meshed with the transmission gear 321. Be equipped with cover plate 340 between material pipe 334 and the mechanism 350 is glued to batch, cover plate 340 sets up to be fan-shaped platelike structure for the cross-section. A plurality of groups of inclined chutes 341 with the same number as the material adding pipes 334 are distributed on the inner wall of the top of the inner wall of the cover plate 340 at equal intervals. The inclined sliding groove 341 is disposed in an inclined manner. And the top of the inclined chute 341 is provided with a material adding pipe through hole 342, and each group of the material adding pipe through holes 342 are positioned under a group of the material adding pipes 334 corresponding to the material adding pipe through holes 342.
The batch dispensing mechanism 350 includes a spiral rotary cylinder 351. Illustratively, as shown in fig. 8 and 9, the spiral cylinder 351 is sleeved on the central rotating rod 360, and the inner wall of the spiral cylinder is fixedly connected with the spiral slider. A transmission rod 356 is arranged at one end port of the spiral rotating cylinder 351 close to the servo motor 320, a plurality of groups of obliquely arranged teeth are arranged on the transmission rod 356 in an annular array, and the transmission rod 356 is meshed with the transmission gear 321 through the teeth. A plurality of groups of dispensing head mounting plates 352 with the same number as the inclined chutes 341 are distributed on the spiral rotating cylinder 351 at equal intervals, rubber inlet tubes 353 are mounted at the tops of the dispensing head mounting plates 352, and the other ends of the rubber inlet tubes 353 are connected in the inclined chutes 341 in a sliding manner. The bottom of the material adding pipe 334 movably penetrates into the material adding pipe through hole 342 and is communicated with the rubber inlet pipe 353. The bottom of the dispensing head mounting plate 352 is provided with a dispensing head body 354, the input end of the dispensing head body 354 is communicated with a material conveying pipe 355, and the other end of the material conveying pipe 355 is communicated with the output end of the rubber inlet pipe 353.
Before dispensing, the electric push rod 330 is first started to drive each group of material adding pipes 334 to descend, and then the outlets of the material adding pipes 334 penetrate through the material adding pipe through holes 342 and are communicated with the corresponding group of rubber inlet pipes 353. Then, each set of electromagnetic valves 332 is activated, so that the fixing glue in the first storage tank 301 enters the feeding pipe 334 through the glue inlet 333, and then enters the glue head body 354 through the glue inlet pipe 353. When the chip base moves to a position right below the dispensing head body 354, the servo motor 320 is started, the transmission gear 321 is driven to rotate by the servo motor 320, and then the transmission gear 321 drives the transmission rod 356 and the spiral rotary drum 351 to rotate. So that the dispensing head body 354 can radially spread the fixing glue on the chip base. And because the extension direction of the spiral chute 361 is spiral, the dispensing head body 354 can not only perform circular motion, but also perform displacement in the horizontal direction, so that the dispensing range is further expanded, and the gluing effect is improved.
After dispensing, the servo motor 320 drives the glue inlet pipe 353 to move to the position below the through hole 342 of the material adding pipe again, so that the material adding work of fixing glue can be completed in the process that the conveyor belt 100 conveys the next group of chip bases. The continuity of the dispensing work is ensured, the automation degree is improved while batch operation is realized, and the labor intensity is reduced.
The plastic packaging unit 500 includes an upper electric slide table 510. For example, as shown in fig. 10 and 11, the upper electric sliding table 510 is located on a side of the chip mounting unit 400 away from the dispensing unit 300, and a sliding direction of the upper electric sliding table 510 is vertically arranged. And the output end of the upper electric sliding table 510 is connected with a first sliding rod 520 in a sliding manner, the other end of the first sliding rod 520 extends to the position right above the conveyor belt 100, a plastic package heating cover 530 is fixedly installed, and a molding heating system is arranged in the plastic package heating cover 530. The bottom of the plastic packaging heating cover 530 is clamped with a plurality of forming molds 540 at equal intervals. The top of the plastic packaging heating cover 530 is provided with a feed inlet 531, and two ends of the feed inlet 531 are respectively communicated with the cavities of the second material storage tank 501 and the forming molds 540. The bottom of the upper electric sliding table 510 is provided with a lower electric sliding table 550, and the sliding direction of the lower electric sliding table 550 is vertical. And the output end of the lower electric sliding table 550 is connected with a second slide bar 551 in a sliding manner, the other end of the second slide bar 551 extends to the position under the conveyor belt 100, a preheating plate 560 is fixedly installed on the second slide bar 551, and a preheating heating system is arranged in the preheating plate 560. The top of the preheating plate 560 is provided with a lower support bar 570, and the lower support bar 570 movably extends into any group of the second through grooves 221. And a plurality of group-forming cushion blocks 580 with the same number as that of the forming molds 540 are distributed at the top of the lower supporting bars 570 at equal intervals.
After the dispensing operation is completed, the die pad is transferred to the die mounting unit 400 by the transfer belt 100, and the die is mounted on the die pad by the dispensing unit. Then, the chip and the leads are bonded by the chip mounting unit 400. After the completion, each group of chip bases is conveyed to the space between the plastic packaging heating cover 530 and the preheating plate 560 by the conveyor belt 100.
Then, the molding heating system and the preheating heating system are started to respectively raise the temperature of the plastic package heating cover 530 and the temperature of the preheating plate 560 to between 80 and 140 ℃ and between 40 and 70 ℃. The upper and lower electric slide tables 510 and 550 are simultaneously actuated to lift each set of the pads 580 into the second through-grooves 221 and to hold the corresponding set of the chip pads from the bottom. And each set of molding dies 540 is covered on the chip base from the top, and a sealed cavity can be formed by combining the molding dies 540 with the molding pads 580. Then, the liquid epoxy resin in the second storage tank 501 is conveyed to each group of sealed cavities. And carrying out molding and curing on the mixture by using high temperature. Thereby completing the plastic package work of the chip.
Utilize forming die 540 and shaping cushion 580 to heat the chip base from two upper and lower directions simultaneously, not only make it be heated more evenly, the plastic envelope effect is better, also need not to take off the chip base from conveyer belt 100 simultaneously and carry out the plastic envelope alone to this has improved whole smoothness nature of encapsulation work and work efficiency.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides an integrated circuit chip designs and uses high-efficient packaging hardware which characterized in that: the automatic glue dispensing device comprises a conveyor belt (100), wherein a plurality of groups of glue dispensing units (300) are arranged on one side of the conveyor belt (100) at equal intervals;
the dispensing unit (300) comprises two groups of first supporting frames (310); the two groups of first supporting frames (310) are symmetrically arranged on two sides of the conveyor belt (100), a servo motor (320) is arranged on one group of the first supporting frames (310), and a transmission gear (321) is connected to the output end of the servo motor (320) in a transmission manner; an electric push rod (330) is arranged between the two groups of first supporting frames (310), and a feeding head mounting plate (331) is mounted at the bottom of the electric push rod (330); a plurality of groups of feeding pipes (334) are distributed at the bottom of the feeding head mounting plate (331) at equal intervals; a central rotating rod (360) is arranged below the feeding pipe (334), a spiral chute (361) is formed in the central rotating rod (360), a spiral sliding block is connected onto the spiral chute (361) in a sliding mode, and a batch glue dispensing mechanism (350) is sleeved on the central rotating rod (360);
the batch glue dispensing mechanism (350) comprises a spiral rotary cylinder (351); the spiral rotating cylinder (351) is sleeved on the central rotating rod (360), and the inner wall of the spiral rotating cylinder is connected with the spiral sliding block; a transmission rod (356) is arranged at one end opening, close to the servo motor (320), of the spiral rotating cylinder (351), a plurality of groups of obliquely arranged teeth are arranged on the transmission rod (356) in an annular array, and the transmission rod (356) is meshed and connected with the transmission gear (321) through the teeth; a plurality of groups of rubber inlet pipes (353) with the same number as the inclined sliding grooves (341) are distributed on the spiral rotating cylinder (351) at equal intervals, and the bottom of the material adding pipe (334) is movably communicated with the rubber inlet pipes (353); the bottom of the rubber inlet pipe (353) is communicated with a dispensing head body (354).
2. The efficient packaging apparatus for integrated circuit chip design according to claim 1, wherein: a plurality of groups of belt body through grooves are distributed on the conveying belt (100) at equal intervals, each group of belt body through grooves is provided with a group of chip conveying units (200), and each chip conveying unit (200) comprises a conveying frame bottom frame (210) and a conveying frame body (220); the conveying frame bottom frame (210) is arranged in a group of belt body through grooves corresponding to the conveying frame bottom frame, a first through groove (211) is formed in the center of the conveying frame bottom frame (210), and the bottom of the first through groove (211) is communicated with the belt body through grooves; two groups of first sliding grooves (212) are symmetrically arranged at the edges of two sides of the top of the bottom frame (210) of the conveying frame; the conveying frame body (220) is movably attached to the top of the bottom frame (210) of the conveying frame, two groups of limiting sliding strips (222) are symmetrically mounted on the outer walls of two sides of the conveying frame body (220), and the two groups of limiting sliding strips (222) are movably clamped in the two groups of first sliding grooves (212) respectively.
3. The high efficiency packaging apparatus for integrated circuit chip design according to claim 2, wherein: a second through groove (221) is formed in the center of the conveying frame body (220), and the bottom of the second through groove (221) is communicated with the first through groove (211); two sets of transverse plate clamping grooves (223) are symmetrically formed in the edges of the two sides of the top of the conveying frame body (220), and a material erecting mechanism (230) is movably clamped in the transverse plate clamping grooves (223).
4. A high efficiency packaging apparatus for integrated circuit chip design as defined in claim 3, wherein: the material erecting mechanism (230) comprises a transverse plate (231); the transverse plate (231) is movably clamped in the transverse plate clamping groove (223), one end of the transverse plate (231) extends to the outside of the conveying frame body (220), and a first vertical plate (232) is fixedly installed on the transverse plate (231); the other end of the transverse plate (231) extends to the position right above the second through groove (221), a second vertical plate (233) is fixedly mounted on the transverse plate, the bottom of the second vertical plate (233) extends into the second through groove (221), and a first material supporting plate (234) is fixedly mounted on the second vertical plate.
5. The efficient packaging apparatus of claim 4, wherein: a first plate groove (235) is formed in one side wall, close to a central axis in the length direction of the second through groove (221), of the first material support plate (234); a second material supporting plate (237) is connected in the first plate groove (235) in a sliding mode, the other end of the second material supporting plate (237) movably extends to the outside of the first plate groove (235), and a second plate groove (238) is formed in the end opening; a plurality of groups of pin limiting holes (236) are arranged at the tops of the first material holding plate (234) and the second material holding plate (237) at equal intervals along the length direction of the first material holding plate and the second material holding plate; the diameter of the bottom of the pin limiting hole (236) is smaller than that of the opening of the pin limiting hole.
6. The high efficiency packaging apparatus for integrated circuit chip design according to claim 2, wherein: a cover plate (340) is arranged between the material adding pipe (334) and the batch glue dispensing mechanism (350), and the cover plate (340) is of a plate-shaped structure with a sector-ring-shaped section; cover plate (340) inner wall upper top portion on the equidistant distribution have with add oblique spout (341) of a plurality of groups that material pipe (334) quantity is the same, spout (341) set up for the slope to one side, and the top has seted up and has added material pipe through-hole (342), every group add material pipe through-hole (342) all be located rather than corresponding a set of material pipe (334) under.
7. The efficient packaging apparatus of claim 6, wherein: one end of the rubber inlet pipe (353) far away from the spiral rotating cylinder (351) is connected in the inclined sliding groove (341) in a sliding manner; the bottom of the material adding pipe (334) movably penetrates into the through hole (342) of the material adding pipe and is communicated with the rubber inlet pipe (353).
8. The high efficiency packaging apparatus for integrated circuit chip design according to claim 2, wherein: a chip mounting unit (400) is arranged on one side of the dispensing unit (300), a plastic packaging unit (500) is arranged on one side, away from the dispensing unit (300), of the chip mounting unit (400), and the plastic packaging unit (500) comprises an upper electric sliding table (510); the upper electric sliding table (510) is positioned on one side of the chip mounting unit (400) far away from the dispensing unit (300), and the sliding direction of the upper electric sliding table (510) is vertical; and the output end of the upper electric sliding table (510) is connected with a first sliding rod (520) in a sliding manner, the other end of the first sliding rod (520) extends to the position right above the conveyor belt (100), and a plastic package heating cover (530) is fixedly mounted on the other end of the first sliding rod.
9. The efficient packaging apparatus for integrated circuit chip design according to claim 8, wherein: a molding heating system is arranged in the plastic packaging heating cover (530); a plurality of forming molds (540) are clamped at the bottom of the plastic packaging heating cover (530) at equal intervals; a feed inlet (531) is formed in the top of the plastic package heating cover (530), and two ends of the feed inlet (531) are communicated with the cavities of the second storage box (501) and the forming molds (540) respectively.
10. The high efficiency packaging apparatus for integrated circuit chip design according to claim 9, wherein: the bottom of the upper electric sliding table (510) is provided with a lower electric sliding table (550), and the sliding direction of the lower electric sliding table (550) is vertical; a second sliding rod (551) is connected to the output end of the lower electric sliding table (550) in a sliding mode, the other end of the second sliding rod (551) extends to the position under the conveyor belt (100), a preheating plate (560) is fixedly installed on the other end of the second sliding rod, and a preheating heating system is arranged in the preheating plate (560); the top of the preheating plate (560) is provided with a lower support bar (570), and the lower support bar (570) movably extends into any group of second through grooves (221); and a plurality of group-forming cushion blocks (580) with the same number as the forming molds (540) are distributed at the tops of the lower supporting bars (570) at equal intervals.
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| CN116779496B (en) * | 2023-08-21 | 2023-12-26 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
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