CN114855227A - Ashing method in electrolytic copper foil surface treatment process - Google Patents
Ashing method in electrolytic copper foil surface treatment process Download PDFInfo
- Publication number
- CN114855227A CN114855227A CN202210586686.1A CN202210586686A CN114855227A CN 114855227 A CN114855227 A CN 114855227A CN 202210586686 A CN202210586686 A CN 202210586686A CN 114855227 A CN114855227 A CN 114855227A
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- China
- Prior art keywords
- copper foil
- ashing
- electrolytic copper
- roller
- washing
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000011889 copper foil Substances 0.000 title claims abstract description 55
- 238000004380 ashing Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004381 surface treatment Methods 0.000 title claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 230000007704 transition Effects 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 11
- 230000003647 oxidation Effects 0.000 abstract description 11
- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 239000011888 foil Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 1
- 239000011701 zinc Substances 0.000 description 8
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses an ashing method in the surface treatment process of electrolytic copper foil, which comprises the following steps: s1 the electrolytic copper foil is washed by acid, coarsened and solidified, then passes through a washing transition roller and a washing liquid lower roller, and is washed by water in a first washing tank; s2 the electrolytic copper foil is ashed in an ashing tank by a water washing press roll and an ashing liquid lower roll, wherein the ashing liquid in the ashing tank comprises K 4 P 2 O 7 :150‑155g/L、Zn 2+ :2.0‑2.5g/L、Ni 2+ 1.0-1.2 g/L; s3 the electrolytic copper foil passes through an ashing press roller and a water washing press roller and is washed in a water washing tank II; s4 the electrolytic copper foil is rolled after being washed by water and pressed by a roller and finally baked. The method can electroplate a layer of compact zinc-nickel on the copper foil in the ashing liquid, so that the surface color of the ashing foil is uniform, the high-temperature oxidation resistance of the copper foil is improved, the chemical corrosion resistance of the electrolytic copper foil is improved, and the poor film sticking phenomenon caused by copper foil oxidation in the PCB processing process is reduced.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil surface treatment, in particular to an ashing method in the electrolytic copper foil surface treatment process.
Background
The electrolytic copper foil mainly comprises a Copper Clad Laminate (CCL) and a Printed Circuit Board (PCB), and the PCB mainly has the function of providing a connecting circuit among all elements. With the rapid development of the PCB industry, the requirements on the surface of the electrolytic copper foil are higher, and especially the corrosion resistance of the copper foil and the high-temperature oxidation resistance of the copper foil are higher and higher. Therefore, an electrolytic copper foil surface treatment ashing method is a problem which is urgently needed to be solved at present.
Disclosure of Invention
In view of the above technical problems in the related art, the present invention provides an ashing method for electrolytic copper foil surface treatment, which can overcome the above disadvantages in the prior art.
In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:
an ashing method in an electrolytic copper foil surface treatment process comprises the following steps:
s1 the electrolytic copper foil is firstly washed, coarsened and solidified, then passes through a washing transition roller and a washing liquid lower roller, and is washed in a washing tank I;
s2 the electrolytic copper foil passes through a washing press roller and an ashing liquid lower roller to be ashed in an ashing tank, wherein the ashing liquid in the ashing tank comprises K 4 P 2 O 7 :150-155g/L、Zn 2+ :2.0-2.5g/L、Ni 2+ :1.0-1.2g/L；
S3 the electrolytic copper foil passes through an ashing press roller and a water washing press roller and is washed in a water washing tank II;
s4 the electrolytic copper foil is rolled after passing through a water washing press roller and finally being baked.
Further, the first rinsing tank is water with a pH value of 8.
Further, the water in the second rinsing bath is water with the pH value of 6.
Further, the pH value of the ashing liquid is 9.5-10.
The invention has the beneficial effects that: the ashing method in the electrolytic copper foil surface treatment process can electroplate a layer of compact zinc-nickel on the electrolytic copper foil in the ashing liquid, so that the surface color of the ashed foil is uniform, the high-temperature oxidation resistance of the copper foil is improved, the chemical corrosion resistance of the electrolytic copper foil is improved, and the poor film pasting phenomenon caused by copper foil oxidation in the PCB processing process is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart showing an ashing method in the surface treatment process of an electrolytic copper foil according to an embodiment of the present invention;
in the figure: 1. the device comprises a water washing transition roller, 2, a water washing liquid lower roller, 3, a water washing compression roller, 4, an ashing liquid lower roller, 5, an ashing compression roller, 6, a water washing compression roller, 7, a water washing compression roller, 8, a first water washing tank, 9, an ashing tank, 10 and a second water washing tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
As shown in fig. 1, the ashing method in the electrolytic copper foil surface treatment process according to the embodiment of the present invention includes the steps of:
s1 the electrolytic copper foil is firstly washed, coarsened and solidified, then passes through a washing transition roller 1 and a washing liquid lower roller 2, and is washed in a washing tank I8;
s2 the electrolytic copper foil passes through a water washing press roller 3 and a lower roller 4 of ashing liquid to be ashed in an ashing tank 9, wherein the ashing liquid in the ashing tank 9 comprises K 4 P 2 O 7 :150-155g/L、Zn 2+ :2.0-2.5g/L、Ni 2+ :1.0-1.2g/L，K 4 P 2 O 7 150-155g/L is used for producing a complex by utilizing potassium pyrophosphate and copper, and utilizing a part of free potassium pyrophosphate to stabilize the complex, improve the uniform plating capacity of a plating solution, improve the fineness of crystals of an ashed copper foil, ensure the glossiness and Zn 2+ 2.0-2.5g/L can improve the corrosion resistance of the ashed copper foil, Ni 2+ 1.0-1.2g/L can improve the high-temperature oxidation resistance of the copper foil;
s3 the electrolytic copper foil passes through an ashing press roller 5 and a water washing press roller 6 and is washed in a second washing tank 10;
s4 the electrolytic copper foil is rolled after passing through a water washing press roller 7 and finally being baked.
The first rinsing bath 8 is water with a pH value of 8, so that the copper foil with weak acidity in the curing bath can be better cleaned.
The second rinsing bath 10 is water with the pH value of 6, so that the copper foil with alkalinity from the ashing bath can be better cleaned.
The pH value of the ashing liquid is 9.5-10, so that each ion is in a relatively stable state, and the copper foil is more stable in the ashing electroplating process.
For the convenience of understanding the above technical aspects of the present invention, the following detailed description will be given of the above technical aspects of the present invention in terms of specific modes of use.
Example 1
The ashing method in the electrolytic copper foil surface treatment process comprises the following steps:
as shown in table 1, (1) ashing liquid preparation process: k 4 P 2 O 7 :150-155g/L；Zn 2+ :2.0-2.5g/L；Ni 2+ 1.0-1.2 g/L; the pH value is 9.5-10. (ii) a (2) And (3) carrying out uniform appearance color and luster inspection and high-temperature oxidation resistance inspection on the ashed copper foil.
Example 1 specific experimental data are as follows (table 1):
TABLE 1
Comparative example
The ashing step was the same as in example 1, except that K in the ashing solution was changed 4 P 2 O 7 、Zn 2+ 、Ni 2+ Concentration and pH:
as shown in table 2, the ashed copper foil was subjected to an appearance color uniformity test and a high-temperature oxidation resistance test.
Comparative example specific experimental data are as follows (table 2):
TABLE 2
According to the experimental results of example 1 and comparative example, K in the final ashing liquid preparation method 4 P 2 O 7 :150-155g/L；Zn 2+ :2.0-2.5g/L；Ni 2+ 1.0-1.2 g/L; the pH value is 9.5-10, and the electrolytic copper foil can be electroplated with a layer of compact zinc and nickel in the ashing liquid by the surface treatment ashing method, so that the surface color of the ashed foil is uniform, and the high-temperature oxidation resistance of the copper foil is greatly improved.
In conclusion, by means of the technical scheme, the electrolytic copper foil can be electroplated with a layer of dense zinc and nickel in the ashing liquid, so that the surface color of the ashing foil is uniform, the high-temperature oxidation resistance of the copper foil is improved, the chemical corrosion resistance of the electrolytic copper foil is improved, and the poor film pasting phenomenon caused by copper foil oxidation in the PCB processing process is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (4)
1. An ashing method in the surface treatment process of electrolytic copper foil is characterized by comprising the following steps:
s1 the electrolytic copper foil is firstly washed, coarsened and solidified, then passes through a washing transition roller (1) and a washing liquid lower roller (2), and is washed in a washing tank I (8);
s2 the electrolytic copper foil passes through a water washing press roller (3) and an ashing liquid lower roller (4) and is ashed in an ashing tank (9), wherein the ashing liquid in the ashing tank (9) comprises K 4 P 2 O 7 :150-155g/L、Zn 2+ :2.0-2.5g/L、Ni 2+ :1.0-1.2g/L；
S3 the electrolytic copper foil passes through an ashing press roller (5) and a water washing press roller (6) and is washed in a second washing tank (10);
s4 the electrolytic copper foil passes through a water washing press roller (7), and is finally baked and wound.
2. The ashing method as claimed in claim 1, wherein the first rinsing bath (8) is water having a pH of 8.
3. The ashing method according to claim 1, wherein the second rinsing bath (10) contains water having a pH of 6.
4. The ashing method according to claim 1, wherein the ashing liquid has a pH of 9.5 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210586686.1A CN114855227A (en) | 2022-05-26 | 2022-05-26 | Ashing method in electrolytic copper foil surface treatment process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210586686.1A CN114855227A (en) | 2022-05-26 | 2022-05-26 | Ashing method in electrolytic copper foil surface treatment process |
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| Publication Number | Publication Date |
|---|---|
| CN114855227A true CN114855227A (en) | 2022-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210586686.1A Pending CN114855227A (en) | 2022-05-26 | 2022-05-26 | Ashing method in electrolytic copper foil surface treatment process |
Country Status (1)
| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005139546A (en) * | 2003-10-14 | 2005-06-02 | Mitsui Mining & Smelting Co Ltd | Blacking surface-treated copper foil, process for producing the blackening surface-treated copper foil and, using the blacking surface-treated copper foil, electromagnetic wave shielding conductive mesh |
| CN110093640A (en) * | 2019-05-13 | 2019-08-06 | 江西理工大学 | A kind of electrolytic copper foil additive and cathode copper process of surface treatment |
| CN114197000A (en) * | 2021-12-27 | 2022-03-18 | 山东金宝电子股份有限公司 | Surface treatment method for improving corrosion resistance of electrolytic copper foil |
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2022
- 2022-05-26 CN CN202210586686.1A patent/CN114855227A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005139546A (en) * | 2003-10-14 | 2005-06-02 | Mitsui Mining & Smelting Co Ltd | Blacking surface-treated copper foil, process for producing the blackening surface-treated copper foil and, using the blacking surface-treated copper foil, electromagnetic wave shielding conductive mesh |
| CN110093640A (en) * | 2019-05-13 | 2019-08-06 | 江西理工大学 | A kind of electrolytic copper foil additive and cathode copper process of surface treatment |
| CN114197000A (en) * | 2021-12-27 | 2022-03-18 | 山东金宝电子股份有限公司 | Surface treatment method for improving corrosion resistance of electrolytic copper foil |
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