CN110424012A - A kind of electrolytic copper foil surface processing method - Google Patents
A kind of electrolytic copper foil surface processing method Download PDFInfo
- Publication number
- CN110424012A CN110424012A CN201910739434.6A CN201910739434A CN110424012A CN 110424012 A CN110424012 A CN 110424012A CN 201910739434 A CN201910739434 A CN 201910739434A CN 110424012 A CN110424012 A CN 110424012A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- passivating solution
- procedure
- electroplating work
- work procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
Abstract
The invention discloses a kind of electrolytic copper foil surface processing method, step includes: chromium trioxide and glucose is soluble in water, obtained passivating solution, wherein the concentration of the chromium trioxide is 0.4~0.8g/L, the concentration of the glucose is 2.4~6.0g/L；Copper foil is immersed in the passivating solution, carries out Electroless Plating Procedure and electroplating work procedure simultaneously at 20~28 DEG C, passivation current applied in the electroplating work procedure is 2~4A；Drying winding will be carried out by the copper foil of the Electroless Plating Procedure and electroplating work procedure.The surface treatment mode that the present invention is matched by using chemical plating with plating can form very fine and close protective film on the surface of copper foil, and passivating solution is easy to copper foil surface separation, is not necessarily to water-washing process, significantly reduces the cost of surface treatment process.
Description
Technical field
The present invention relates to electrolytic copper foil preparation field, especially a kind of electrolytic copper foil surface processing method.
Background technique
Currently, the method for preparing copper foil can be divided mainly into rolled copper foil and electrolytic copper foil, the consistency of rolled copper foil is higher,
Product surface is relatively smooth, quickly transmits conducive to the signal after printed circuit board is made, thus be usually used in high-frequency high-speed transmission and
On the fine printed circuit board of circuit, but since rolled copper foil process costs are much higher than electrolytic copper foil, and also deposited in process conditions
In many restrictions, so that being dfficult to apply to the large scale preparation of wide cut copper foil with rolled copper foil technique；And electrolytic copper foil is to pass through
The method that continuous electrolysis method produces copper foil is suitable for producing wide cut copper foil, and most common copper foil large-scale production side now
Method.
It usually needs to carry out surface passivating treatment to obtained foil after the process for carrying out electrolytic copper foil, mainly in life
A protective layer is adhered on the surface of foil, to prevent foil exposure to be oxidized in air, in the prior art frequently in foil table
Face is electroplated one layer of dissimilar metal protective layer and plays a protective role such as zinc or nickel to copper foil；But after electro-cladding,
It needs to be rinsed the copper foil after passivation using a large amount of deionized waters, so as to which the electroplate liquid for being attached to surface is sufficiently washed
It goes, just can be carried out drying after cleaning；This flushing process not only needs to consume a large amount of deionized water, also to it is used go from
Sub- water conductivity has higher requirement, so that the higher cost of existing passivation technology, therefore need to propose a kind of new copper foil table
Surface treatment method is to solve problems of the prior art.
Summary of the invention
The object of the present invention is to provide a kind of method for surface treating copper foil, are passivated in the prior art for solving
Amount of deionized water huge problem is consumed when foil.
In order to solve the above technical problems, step includes: by three the present invention provides a kind of electrolytic copper foil surface processing method
Chromium oxide and glucose are soluble in water, be made passivating solution, wherein the concentration of chromium trioxide be 0.4~0.8g/L, glucose it is dense
Degree is 2.4~6.0g/L；Copper foil is immersed in passivating solution, carries out Electroless Plating Procedure and galvanizer simultaneously at 20~28 DEG C
Sequence, passivation current applied in the electroplating work procedure are 2~4A；It will be carried out by the copper foil of Electroless Plating Procedure and electroplating work procedure
Drying winding.
Preferably, the pH value range of passivating solution is 2.3~3.0.
Preferably, the time of Electroless Plating Procedure is 6~20s.
Preferably, the time of electroplating work procedure is 1~5s.
Preferably, Electroless Plating Procedure and when electroplating work procedure, the flow of passivating solution is 1~3m3/h。
The beneficial effects of the present invention are: being in contrast to the prior art, the present invention is by using chemical plating and plating phase
The surface treatment mode of cooperation can form very fine and close protective film on the surface of copper foil, and passivating solution is easy to copper foil surface separation,
Without water-washing process, significantly reduce the cost of surface treatment process.
Detailed description of the invention
Fig. 1 is the process flow chart of one embodiment of electrolytic copper foil surface processing method in the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the scope of protection of the invention.
Referring to Fig. 1, Fig. 1 is the process flow chart of one embodiment of electrolytic copper foil surface processing method in the present invention.This
Electrolytic copper foil surface processing method in invention, step include:
S1: chromium trioxide and glucose is soluble in water, be made passivating solution, wherein the concentration of chromium trioxide be 0.4~
0.8g/L, the concentration of glucose are 2.4~6.0g/L.In this step, specifically, chromium trioxide is as passivation layer raw material, grape
Sugar forms generation hexavalent chromium after being used as reducing agent, chromium trioxide to be dissolved in water and reacts with glucose, and reaction equation is as follows:
C6H12O6+Cr6+→Cr3++H2O+CO2↑, the deposition raw material plated using trivalent chromic ion as subsequent chemistry；Due to needing to keep three
The state of valence chromium ion, needs the pH value of strict control passivating solution, and in present embodiment, preferred pH value range is 2.3~
3.0, the pH value of passivating solution can be adjusted by adding sulfuric acid solution appropriate.
S2: copper foil is immersed in passivating solution, carries out Electroless Plating Procedure and electroplating work procedure simultaneously at 20~28 DEG C, is electroplated
Passivation current applied in process is 2~4A.In this step, Electroless Plating Procedure and electroplating work procedure carry out simultaneously, but this
Two processes are held time and are slightly different；In present embodiment, time of preferred electroplating work procedure is 1~5s, using copper foil as
Cathode applies passivation current appropriate, free trivalent chromic ion and hexavalent chromium can be deposited on copper foil with galvanoplastic
Surface；The time of preferred Electroless Plating Procedure is 6~20s, while being electroplated, the trivalent chromic ion that is generated in passivating solution
Also chromium hydroxide can be increasingly generated, and is deposited on the surface of electrolysed copper foil, since chromium hydroxide is not soluble in water, so as to
To be constituted trivalent chromium hydroxide protective layer in copper foil surface, although Electroless Plating Procedure and electroplating work procedure are to start simultaneously at progress
, but preferably the Electroless Plating Procedure time be greater than the electroplating work procedure time, it is intended that electroplating work procedure and Electroless Plating Procedure simultaneously
The protective layer that will form crome metal and chromium hydroxide mixing composition when progress, when electroplating work procedure terminates and Electroless Plating Procedure still carries out
When will continue to form the protective layer being made of chromium hydroxide, i.e., cover one again on crome metal and chromium hydroxide mixed protection layer
Layer chromium hydroxide protective layer, mixed protection layer of the external chromium hydroxide protective layer also to inside containing crome metal have certain protection to make
With；Thus the double shielding layer of trivalent chromium hydroxide and crome metal is just formd, and the structure of the double shielding layer causes very much
It is close, improve the protective effect to copper foil, while above-mentioned passivating solution is to being formed by trivalent chromium hydroxide protective layer and containing gold
The mixed protection layer for belonging to chromium all has poor wetability, so passivating solution is easy to separate between double shielding layer
Without carrying out deionized water flushing process, passivating solution can be separated easily with the copper foil of plating matcoveredn, to make
Cost significantly reduces.In addition, being formed in the protective layer main component of copper foil surface for trivalent chromium hydroxide and crome metal, certainly
Also the intensity that hardener further increases protective layer can be can be used as mixed with minimal amount of trivalent chromium basic salt, such as chromium sulfate.
S3: drying winding will be carried out by the copper foil of electroplating work procedure.It, will be by the copper of S3 step electroplating work procedure in this step
Foil carries out drying winding, that is, completes the surface treatment process of copper foil, and in present embodiment, preferably heated-air drying mode is to completing S3
The copper foil of step is dried, while also can remove the surface stress of copper foil, in other embodiments can be according to the actual situation
Using other drying modes, it is not limited thereto.
In addition, in the present embodiment, when carrying out the Electroless Plating Procedure and electroplating work procedure of above-mentioned S2, preferred passivating solution
Flow is 1~3m3/ h, the purpose is to make passivating solution keep flowing and chromium ion is continuously replenished, so as to enable copper foil surface
Enough continuously it is surface-treated；In other embodiments, the flow velocity of passivating solution can also be adaptively adjusted, herein
It is not construed as limiting.
Embodiment 1
4g chromium trioxide and 26g glucose are dissolved in 10L water first, passivating solution is made, the concentration of chromium trioxide is at this time
The concentration of 0.4g/L, glucose are 2.6g/L, and adjust passivating solution pH value and be maintained at 2.3~3.0 ranges；Then copper foil is submerged
In passivating solution, Electroless Plating Procedure and electroplating work procedure are carried out simultaneously at 25 DEG C, and the Electroless Plating Procedure time is 7s, when electroplating work procedure
Between be 2s, passivation current applied in electroplating work procedure is 2A, and the flow for controlling passivating solution is 3m3/h；It finally will be by changing
The copper foil for learning plating process and electroplating work procedure carries out drying winding by hot-air drying device, the copper foil after being surface-treated.
Embodiment 2
6g chromium trioxide and 39g glucose are dissolved in 10L water first, passivating solution is made, the concentration of chromium trioxide is at this time
The concentration of 0.6g/L, glucose are 3.9g/L, and adjust passivating solution pH value and be maintained at 2.3~3.0 ranges；Then copper foil is submerged
In passivating solution, Electroless Plating Procedure and electroplating work procedure are carried out simultaneously at 25 DEG C, the Electroless Plating Procedure time is 12s, electroplating work procedure
Time is 3s, and passivation current applied in electroplating work procedure is 3A, and the flow for controlling passivating solution is 3m3/h；To finally it pass through
The copper foil of Electroless Plating Procedure and electroplating work procedure carries out drying winding by hot-air drying device, the copper foil after being surface-treated.
Embodiment 3
8g chromium trioxide and 58g glucose are dissolved in 10L water first, passivating solution is made, the concentration of chromium trioxide is at this time
The concentration of 0.8g/L, glucose are 5.8g/L, and adjust passivating solution pH value and be maintained at 2.3~3.0 ranges；Then copper foil is submerged
In passivating solution, Electroless Plating Procedure and electroplating work procedure are carried out simultaneously at 25 DEG C, the Electroless Plating Procedure time is 18s, electroplating work procedure
Time is 5s, and passivation current applied in electroplating work procedure is 4A, and the flow for controlling passivating solution is 3m3/h；To finally it pass through
The copper foil of Electroless Plating Procedure and electroplating work procedure carries out drying winding by hot-air drying device, the copper foil after being surface-treated.
Use 4.5 μm of ultra-thin foils of same material as the copper being surface-treated in above-described embodiment 1~3
Foil, and copper foil obtained in Examples 1 to 3 is respectively designated as sample 1, sample 2 and sample 3, respectively to its tensile strength,
Surface roughness, surface tension, high temperature oxidation resistance many index are tested, and wherein high temperature oxidation resistance is by certain temperature
Spending lower copper foil maintains the time of not oxidation stain to characterize；And control sample is set, which is using in the prior art
Obtained by common nickel-zinc technique.Table 1 is please referred to, table 1 is copper foil sample and the multinomial survey of control sample in Examples 1 to 3
Try the data comparison table of index, it can be seen that for control sample, sample 1~3 all has better tensile strength and anti-height
Warm oxidisability, smooth surface roughness is lower, ensure that copper foil has more excellent performance；Meanwhile lower surface tension make it is blunt
The step of changing and be easier to separate between liquid and protective layer, can saving deionized water flushing in the prior art, makes surface-treated
The cost of journey significantly reduces；In addition, the ingredient of passivating solution is simple, preparation process is simple, reduces cost of material, is conducive to industry
Large-scale production.
Table 1
It is in contrast to the prior art, the surface treatment mode that the present invention is matched by using chemical plating with plating,
Very fine and close protective film can be formed on the surface of copper foil, and passivating solution is easy to copper foil surface separation, is not necessarily to water-washing process, makes surface
The cost for the treatment of process significantly reduces.
It should be noted that the above various embodiments belongs to same inventive concept, the description of each embodiment emphasizes particularly on different fields, In
Not detailed place is described in separate embodiment, can refer to the description in other embodiments.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art, In
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.
Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (5)
1. a kind of electrolytic copper foil surface processing method, which is characterized in that step includes:
Chromium trioxide and glucose is soluble in water, passivating solution is made, wherein the concentration of the chromium trioxide is 0.4~0.8g/
L, the concentration of the glucose are 2.4~6.0g/L；
Copper foil is immersed in the passivating solution, carries out Electroless Plating Procedure and electroplating work procedure, the electricity simultaneously at 20~28 DEG C
Plating passivation current applied in process is 2~4A；
Drying winding will be carried out by the copper foil of the Electroless Plating Procedure and electroplating work procedure.
2. electrolytic copper foil surface processing method according to claim 1, which is characterized in that the pH value model of the passivating solution
Enclose is 2.3~3.0.
3. electrolytic copper foil surface processing method according to claim 1, which is characterized in that the Electroless Plating Procedure when
Between be 6~20s.
4. electrolytic copper foil surface processing method according to claim 1, which is characterized in that the time of the electroplating work procedure
For 1~5s.
5. electrolytic copper foil surface processing method according to claim 1, which is characterized in that the Electroless Plating Procedure and institute
When stating electroplating work procedure, the flow of passivating solution is 1~3m3/h。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910739434.6A CN110424012A (en) | 2019-08-12 | 2019-08-12 | A kind of electrolytic copper foil surface processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910739434.6A CN110424012A (en) | 2019-08-12 | 2019-08-12 | A kind of electrolytic copper foil surface processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110424012A true CN110424012A (en) | 2019-11-08 |
Family
ID=68414098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910739434.6A Pending CN110424012A (en) | 2019-08-12 | 2019-08-12 | A kind of electrolytic copper foil surface processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110424012A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110923755A (en) * | 2019-12-17 | 2020-03-27 | 九江德福科技股份有限公司 | Surface anti-oxidation process for lithium-ion battery copper foil |
| CN111394765A (en) * | 2020-04-02 | 2020-07-10 | 广东嘉元科技股份有限公司 | Electrolytic copper foil surface treatment process |
| CN112323001A (en) * | 2020-10-31 | 2021-02-05 | 湖北中一科技股份有限公司 | Aging treatment process method for reducing warping of electrolytic copper foil |
| CN114507851A (en) * | 2022-02-18 | 2022-05-17 | 梅州市威利邦电子科技有限公司 | Low-chromium washing-free anti-oxidation liquid for electrolytic copper foil for lithium ion battery and washing-free anti-oxidation process thereof |
| CN115613018A (en) * | 2022-09-26 | 2023-01-17 | 深圳惠科新材料有限公司 | Copper foil anti-oxidation treatment system and treatment method |
-
2019
- 2019-08-12 CN CN201910739434.6A patent/CN110424012A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110923755A (en) * | 2019-12-17 | 2020-03-27 | 九江德福科技股份有限公司 | Surface anti-oxidation process for lithium-ion battery copper foil |
| CN110923755B (en) * | 2019-12-17 | 2021-07-30 | 九江德福科技股份有限公司 | Surface anti-oxidation process for lithium-ion battery copper foil |
| CN111394765A (en) * | 2020-04-02 | 2020-07-10 | 广东嘉元科技股份有限公司 | Electrolytic copper foil surface treatment process |
| CN112323001A (en) * | 2020-10-31 | 2021-02-05 | 湖北中一科技股份有限公司 | Aging treatment process method for reducing warping of electrolytic copper foil |
| CN114507851A (en) * | 2022-02-18 | 2022-05-17 | 梅州市威利邦电子科技有限公司 | Low-chromium washing-free anti-oxidation liquid for electrolytic copper foil for lithium ion battery and washing-free anti-oxidation process thereof |
| CN115613018A (en) * | 2022-09-26 | 2023-01-17 | 深圳惠科新材料有限公司 | Copper foil anti-oxidation treatment system and treatment method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110424012A (en) | A kind of electrolytic copper foil surface processing method | |
| CN110438531B (en) | Preparation method and system of ultrathin copper foil applied to lithium battery | |
| CN106011965B (en) | A kind of fine roughening treatment technique of electrolytic copper foil surface | |
| CN106757245B (en) | A kind of process of surface treatment of melanism copper foil | |
| Zhang et al. | Electrodeposition of high corrosion resistance Cu/Ni–P coating on AZ91D magnesium alloy | |
| CN102560584B (en) | Additive for electrolytic copper foil and surface treatment process of very low profile electrolytic copper foil | |
| GB1401815A (en) | Method for producing material for printed circuits | |
| CN102363884B (en) | Surface treatment process for zinc alloy die casting | |
| CN109023447A (en) | A kind of preparation method of high-intensity and high-tenacity layered nano-structure copper | |
| CN110219028A (en) | A kind of high blackness dumb light metal black composite deposite and preparation method thereof | |
| CN103469267A (en) | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same | |
| CN103806053A (en) | Dual-pulse gold plating process | |
| CN105970261A (en) | Chrome-free treatment technology preventing surface oxidation of copper foil | |
| CN106460217A (en) | Multilayer plating film and article having multilayer plating film | |
| CN109518131A (en) | A kind of ultrathin copper foil with carrier, ultrathin copper foil production method and device | |
| CN106544709B (en) | A kind of process of surface treatment improving electrolytic copper foil high-temp antioxidizing performance | |
| WO2016205134A2 (en) | Plating bronze on polymer sheets | |
| CN113981494B (en) | Surface treatment process for reducing heat loss rate of electrolytic copper foil in peel strength | |
| CN102534717A (en) | Method for preparing lead dioxide electrode plate on engineering plastic substrate | |
| CN112962128B (en) | Coarsening process method of high-peeling-resistance copper foil | |
| CN105063677A (en) | Electroplating nickel solution and electroplating method thereof | |
| CN114016098A (en) | Copper-clad plate electroplating Ni-Co-Ce film plating solution for PCB and film preparation method | |
| RU2549037C2 (en) | Method of surface preparation of stainless steel items prior to galvanic copperplating | |
| CN110079794A (en) | A kind of nanometer easily welds high hard wear-and corrosion-resistant fancy alloys catalytic liquid and preparation method thereof | |
| CN109440157B (en) | Preparation method of brown conductive sponge |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191108 |