CN114746232B - Statistical data generation method, cutting device and system - Google Patents

Statistical data generation method, cutting device and system Download PDF

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Publication number
CN114746232B
CN114746232B CN202080082298.9A CN202080082298A CN114746232B CN 114746232 B CN114746232 B CN 114746232B CN 202080082298 A CN202080082298 A CN 202080082298A CN 114746232 B CN114746232 B CN 114746232B
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inspection
package
image
data
unit
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CN114746232A (en
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高橋和宏
尾関貴俊
水田彩香
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

A statistical data generation method, comprising: a step of assembling inspection data including inspection result information of the package parts produced by cutting the package substrate and a step of generating statistical data based on the assembled inspection data.

Description

Statistical data generation method, cutting device and system
Technical Field
The invention relates to a statistical data generation method, a cutting device and a system.
Background
Japanese patent application laid-open No. 2008-4806 (patent document 1) discloses a method for managing a processing result of a wafer. In the method, a cutting groove formed during processing of a wafer is photographed by a photographing device, and cutting groove data is generated based on the generated image information. The cutting groove data is stored in a storage device in an accumulated manner in association with the image information and the position information. The stored cutting groove data, image information, and the like are displayed on a display panel (see patent document 1).
Prior art literature
Patent literature
Patent document 1 Japanese patent laid-open No. 2008-4806
Disclosure of Invention
As disclosed in patent document 1, high-level production management is performed in the wafer process during the production process of semiconductors. On the other hand, in the latter process among the production processes of semiconductors, high production management is not performed. However, due to miniaturization of the package components, there is a demand for high-level production management in the post-process as compared with the conventional ones.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a statistical data generation method, a cutting device, and a system capable of generating data used for realizing higher production management in a later process than in the past.
The statistical data generation method according to an aspect of the present invention includes: a step of collecting inspection data including inspection result information of the package parts produced by cutting the package substrate, and a step of generating statistical data based on the collected inspection data.
In addition, a cutting device according to another aspect of the present invention includes a cutting mechanism, an inspection mechanism, and an arithmetic unit. The cutting mechanism is configured to produce a plurality of package parts by cutting the package substrate. The inspection mechanism is configured to inspect the plurality of package components, respectively. The calculation unit is configured to perform calculation using inspection data including inspection result information based on the inspection means. The computing unit is configured to collect inspection data and generate statistical data based on the collected inspection data.
Furthermore, a system according to another aspect of the invention is provided with the above-described cutting device and a storage device external to the cutting device. The storage device is configured to store inspection data.
Effects of the invention
According to the present invention, it is possible to provide a statistical data generation method, a cutting device, and a system, which can generate data used for realizing higher production management than before in a later process.
Drawings
Fig. 1 is a diagram schematically illustrating a system.
Fig. 2 is a top view schematically showing a cutting device.
Fig. 3 is a side view schematically showing the spindle portion.
Fig. 4 is a diagram schematically showing a hardware configuration of a computer.
Fig. 5 is a diagram showing a relationship between functions implemented by a computer.
Fig. 6 is a diagram for explaining the inspection regarding the package size in QFN.
Fig. 7 is a diagram for explaining an inspection regarding a corner angle in QFN.
Fig. 8 is a diagram for explaining the inspection of the bad mark in the QFN.
Fig. 9 is a diagram showing an example of a database.
Fig. 10 is a diagram showing an example of an image generated by the image generating unit.
Fig. 11 is a flowchart showing a sequence of storing the inspection result of the semiconductor package in the storage device.
Fig. 12 is a flowchart showing a sequence of outputting statistical data.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding portions in the drawings are denoted by the same reference numerals, and the description thereof is not repeated.
[1. Structure of System ]
Fig. 1 is a diagram schematically showing a system 100 according to the present embodiment. As shown in fig. 1, the system 100 comprises a cutting device 1 and a storage device 30.
The dicing device 1 is configured to divide a package substrate (object to be cut) into a plurality of package components by dicing the package substrate. In the package substrate, the substrate on which the semiconductor chip is mounted or the lead frame is sealed with a resin.
Examples of the package substrate include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package: chip size package) package substrate, an LED (Light Emitting Diode: light emitting diode) package substrate, and a QFN (Quad Flat No-lead) package substrate.
The dicing device 1 is configured to inspect a plurality of package components each divided into blocks. In the dicing apparatus 1, an image of each package is captured, and inspection of each package is performed based on the image. Inspection data is generated by this inspection, and each package component is classified as "good" or "bad".
The storage device 30 is configured to store inspection data generated by the inspection in the cutting device 1. The storage device 30 sequentially accumulates the inspection data. The inspection data is not necessarily stored in the storage device 30, but may be stored in a memory or the like in the cutting device 1, for example.
Generally, in a wafer process in a semiconductor production process, high-level production management is performed. On the other hand, in the latter process among the production processes of semiconductors, high production management is not performed. However, high production management is required also in the post-process due to miniaturization of the package components and the like.
The dicing apparatus 1 according to the present embodiment is configured to collect inspection data including inspection result information of the packaged parts, and generate statistical data based on the collected inspection data. By using statistical data of inspection data including inspection result information of the packaged parts, for example, it is possible to promote early detection of problems occurring in a later process. That is, according to the cutting device 1, data (statistical data) used for higher production management than before in the later process can be generated. Hereinafter, the cutting device 1 according to the present embodiment will be described in detail.
[2 ] Structure of cutting device ]
(2-1. Integral Structure of cutting device)
Fig. 2 is a plan view schematically showing the cutting device 1 according to the present embodiment. In the present embodiment, the package substrate P1 is used as the object to be cut, and the package substrate P1 is diced into a plurality of semiconductor packages S1 by the dicing apparatus 1. Hereinafter, the resin-sealed surface of the two surfaces of the package substrate P1 is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a solder ball/lead surface.
As shown in fig. 2, the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as constituent elements. The dicing module A1 is configured to produce a plurality of semiconductor packages S1 by dicing the package substrate P1. The inspection/storage module B1 is configured to inspect each of the plurality of semiconductor packages S1 produced, and then store the semiconductor packages S1 in a tray. In the cutting device 1, each component is detachable from and replaceable with other components.
The dicing module A1 mainly includes a substrate supply portion 3, a positioning portion 4, a dicing table 5, a spindle portion 6, and a carrying portion 7.
The substrate supply unit 3 pushes out the package substrates P1 one by one from the magazine M1 accommodating the plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 has the solder balls/leads arranged facing upward.
The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 by disposing the package substrate P1 on the rail portion 4 a. Thereafter, the positioning unit 4 conveys the positioned package substrate P1 to the dicing table 5.
The dicing stage 5 holds the diced package substrate P. In the present embodiment, the cutting device 1 having a double-table structure with two tables 5 is exemplified. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning portion 4 from below. The rotation mechanism 5b can rotate the holding member 5a in the θ direction in the figure. The moving mechanism 5c can move the holding member 5a along the Y axis of the drawing.
The spindle portion 6 divides the package substrate P1 into a plurality of semiconductor packages S1 by dicing the package substrate P1. In the present embodiment, the cutting device 1 having the double-spindle structure with two spindle portions 6 is exemplified. The spindle portion 6 is movable along the X-axis and the Z-axis of the drawing. The cutting device 1 may also be a single-spindle structure having one spindle portion 6.
Fig. 3 is a side view schematically showing the spindle portion 6. As shown in fig. 3, the spindle portion 6 includes a blade 6a, a rotation shaft 6c, a first flange 6d, a second flange 6e, and a fixing member 6f.
The blade 6a cuts the package substrate P1 by rotating at a high speed, thereby dividing the package substrate P1 into a plurality of semiconductor packages S1. The blade 6a is attached to the rotation shaft 6c in a state of being sandwiched by one flange (first flange) 6d and the other flange (second flange) 6 e. The first flange 6d and the second flange 6e are fixed to the rotation shaft 6c by a fixing member 6f such as a nut. The first flange 6d is also called an inner flange. The second flange 6e is disposed on the fixing member 6f side with the blade 6a interposed therebetween, and is also called an outer flange.
The spindle portion 6 is provided with a cutting water nozzle for spraying cutting water toward the blade 6a rotating at a high speed, a cooling water nozzle for spraying cooling water, a cleaning water nozzle for spraying cleaning water for cleaning cutting dust and the like (neither shown), and the like.
Referring again to fig. 2, after the dicing table 5 adsorbs the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. The confirmation using the first position confirmation camera 5d is, for example, a mark position confirmation provided on the package substrate P1. The mark indicates, for example, a dicing position of the package substrate P1.
Thereafter, the cutting table 5 moves toward the spindle portion 6 along the Y axis of the drawing. After the dicing table 5 is moved below the spindle 6, the package substrate P1 is diced by relatively moving the dicing table 5 and the spindle 6. After that, the package substrate P1 is photographed by the second position confirmation camera 6b as necessary, and the position of the package substrate P1 is confirmed, etc. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the dicing position, dicing width, and the like of the package substrate P1.
The dicing table 5 moves in a direction away from the spindle 6 along the Y axis direction in the drawing in a state where the diced semiconductor packages S1 are suctioned after dicing of the package substrate P1 is completed. During this movement, cleaning and drying of the upper surface (solder ball/lead surface) of the semiconductor package S1 are performed by the first cleaner 5 e.
The conveying unit 7 suctions the semiconductor packages S1 held by the dicing table 5 from above, and conveys the semiconductor packages S1 to the inspection table 11 of the inspection/storage module B1. During this conveyance, the second cleaner 7a cleans and dries the lower surface (mold surface) of the semiconductor package S1.
The inspection/storage module B1 mainly includes an inspection stage 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement portion 14, and an extraction portion 15.
For optical inspection of the semiconductor package S1, the inspection stage 11 holds the semiconductor package S1. The inspection stage 11 is movable along the X-axis of the drawing. The inspection table 11 can be turned upside down. The inspection stage 11 is provided with a holding member for holding the semiconductor package S1 by sucking the semiconductor package S1.
The first optical inspection camera 12 and the second optical inspection camera 13 capture two faces (solder ball/lead face and die face) of the semiconductor package S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the semiconductor package S1 are performed. The first optical inspection camera 12 and the second optical inspection camera 13 are disposed in the vicinity of the inspection stage 11, respectively, and are arranged to take an image from above. The first optical inspection camera 12 and the second optical inspection camera 13 are each provided with an illumination device (not shown) capable of radiating light at the time of inspection. In addition, the first optical inspection camera 12 may also be disposed at the dicing module A1.
The first optical inspection camera 12 captures a mold surface of the semiconductor package S1 transported to the inspection stage 11 by the transport unit 7. Then, the conveying section 7 places the semiconductor package S1 on the holding member of the inspection stage 11. After the holding member adsorbs the semiconductor package S1, the inspection stage 11 is turned upside down. The inspection stage 11 moves upward of the second optical inspection camera 13, and the solder ball/lead surface of the semiconductor package S1 is photographed by the second optical inspection camera 13. As described above, various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection items in the inspection will be described in detail later.
The inspected semiconductor package S1 is arranged in the arranging section 14. The arrangement portion 14 is movable along the Y axis of the figure. The inspection stage 11 disposes the inspected semiconductor package S1 in the disposing section 14.
The extracting section 15 conveys the semiconductor packages S1 arranged in the arranging section 14 to the tray. The semiconductor package S1 is classified as "good" or "bad" based on the inspection result using the first optical inspection camera 12 and the second optical inspection camera 13. The extracting unit 15 conveys each semiconductor package S1 to the tray 15a for a good product or the tray 15b for a bad product based on the respective results. That is, the acceptable product is stored in the acceptable product tray 15a, and the unacceptable product is stored in the unacceptable product tray 15b. When the tray 15a for the acceptable product and the tray 15b for the unacceptable product are filled with the semiconductor package S1, respectively, the tray is replaced with a new tray.
The cutting device 1 further comprises a computer 50. The computer 50 controls the operations of the cutting module A1 and the inspection/storage module B1. The operations of the substrate supply unit 3, the positioning unit 4, the dicing stage 5, the spindle unit 6, the carrying unit 7, the inspection stage 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement unit 14, and the extraction unit 15 are controlled by the computer 50, for example.
Further, the computer 50 performs various inspections of the semiconductor package S1 based on, for example, the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The computer 50 aggregates the inspection data generated by the various inspections in the storage device 30 (fig. 1), and generates statistical data based on the aggregated inspection data. Next, the computer 50 will be described in detail.
(2-2. Hardware architecture of computer)
Fig. 4 is a diagram schematically showing a hardware configuration of the computer 50. As shown in fig. 4, the computer 50 includes a computing unit 70, an input/output I/F (interface) 90, a communication I/F91, and a storage unit 80, and the respective components are electrically connected via a bus.
The arithmetic unit 70 includes CPU (Central Processing Unit), RAM (Random Access Memory), 74, ROM (Read Only Memory), 76, and the like. The computing unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 based on the information processing.
The input/output I/F90 is configured to communicate with each constituent element included in the cutting device 1 via a signal line. The input/output I/F90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50.
The communication I/F91 is configured to communicate with an external device (for example, the storage device 30 (fig. 1)) provided outside the cutting device 1 via the internet. The communication I/F91 is constituted by, for example, a wired LAN (Local Area Network: local area network) module or a wireless LAN module.
The storage unit 80 is an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. The storage unit 80 may store inspection data generated by inspection using the first optical inspection camera 12 and the second optical inspection camera 13.
(2-3. Software architecture for inspection of packaged parts)
Fig. 5 is a diagram showing the relationship between functions realized by the computer 50. The arithmetic unit 70 expands the control program 81 stored in the storage unit 80 in the RAM 74. Then, the operation unit 70 interprets and executes the control program 81 developed in the RAM74 by the CPU72, and the computer 50 controls the respective components in the cutting device 1. As shown in fig. 5, the computer 50 performs operations as an image acquisition unit 52, an inspection unit 54, a statistical data generation unit 56, and an image generation unit 58.
The image acquisition unit 52 transmits a shooting instruction to the first optical inspection camera 12 and the second optical inspection camera 13. The photographing instruction includes, for example, information for specifying a photographing range in the package substrate P1. Further, the image acquisition section 52 sequentially changes the shooting range. Thereby, both surfaces of the semiconductor package S1 included in the package substrate P1 are photographed. The image acquisition unit 52 acquires image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 via the input/output I/F90.
The inspection unit 54 analyzes the image data acquired by the image acquisition unit 52, and performs various inspections of the semiconductor packages S1 included in the image data. Examples of inspection items include "Number of terminals (Lead Pad Number)", "Die Pad Defect", and "Mark Angle" in QFN.
Fig. 6 is a diagram for explaining the inspection regarding the number of terminals in QFN. Referring to fig. 6, an image ID1 is an image included in an image captured by the second optical inspection camera 13. That is, the image ID1 is an image indicating the surface (solder ball/lead surface) of the package component 60 opposite to the mold surface. A die pad 61 is disposed in the center of the package 60, and a plurality of terminals (electrode pads) 62 are disposed around the package 60.
In the inspection of the number of terminals of the package component 60, the inspection unit 54 detects the number of terminals (the number of lead pads) on each side by image analysis. The inspection unit 54 determines whether or not the number of terminals on each side is a predetermined number. The inspection unit 54 determines that the package component 60 is a good product with respect to the "number of terminals" when the number of terminals in each side is a predetermined number, and determines that the package component 60 is a bad product with respect to the "number of terminals" when the number of terminals in each side is not a predetermined number. The inspection unit 54 associates and stores the number of terminals on each side detected and the result of the determination of the pass/fail with the positional information of the package component 60 in the package substrate in the storage device 30. That is, the inspection unit 54 stores, in the storage device 30, not only the result of the determination of the pass/fail but also the measured value (in this example, the "number of terminals") of the measurement object obtained by the image analysis in association with the positional information of the package component 60 on the package substrate based on the inspection item.
Fig. 7 is a diagram for explaining an inspection regarding a bare die pad defect in QFN. Referring to fig. 7, the image ID2 is an image included in the image captured by the second optical inspection camera 13. That is, the image ID2 is a diagram showing the surface (solder ball/lead surface) of the package component 60 opposite to the die surface.
In the inspection of the die pad defect of the package component 60, the inspection unit 54 detects the foreign matter on the die pad 61 by image analysis. The inspection unit 54 determines whether or not the level of the foreign matter present on the die pad 61 is included in a predetermined range. The inspection unit 54 determines that the package component 60 is a good product with respect to the die pad defect when the level of the foreign matter present on the die pad 61 is included in the predetermined range, and determines that the package component 60 is a bad product with respect to the die pad defect when the level of the foreign matter present on the die pad 61 is not included in the predetermined range. The inspection unit 54 associates and stores the result of the determination of the pass/fail with the positional information of the package component 60 in the package substrate in the storage device 30.
Fig. 8 is a diagram for explaining the inspection regarding the mark angle in QFN. Referring to fig. 8, an image ID3 is an image included in an image captured by the first optical inspection camera 12. That is, the image ID3 is an image showing the mold surface of the package component 60.
On the mold surface of the package part 60, for example, brand marks or the like of the package part 60 are printed. In the inspection of the mark angle of the package component 60, the inspection unit 54 determines whether or not the inclination of the mark Mk1 printed on the surface of the package component 60 is within a predetermined range by image analysis. The inspection unit 54 determines that the package component 60 is a good product with respect to the mark angle when the inclination of the mark Mk1 is within a predetermined range, and determines that the package component 60 is a bad product with respect to the mark angle when the inclination of the mark Mk1 is outside the predetermined range. The inspection unit 54 associates and stores the result of the determination of the pass/fail with the positional information of the package component 60 in the package substrate in the storage device 30.
The inspection section 54 can perform inspection of various other inspection items. Table 1 below shows an example of an inspection item that can be inspected by the inspection unit 54.
TABLE 1
In table 1, inspection items corresponding to BGAs indicate inspection items in solder ball/lead surfaces of BGAs. Further, the inspection items corresponding to QFN represent inspection items in the solder ball/lead plane of QFN. The inspection items corresponding to the common use indicate inspection items in the mold surfaces of the BGA and QFN.
Examples of the inspection specific to the package component among the various inspection items included in table 1 are "terminal shift", "terminal number", "terminal size", "terminal pitch", "terminal defect", "die pad size", "die pad defect", "die pad number", "terminal side", "mark shift", "no mark", "mark angle", "broken mark", "broken character", "oozed character", "error character".
In the "terminal offset", the inspection unit 54 measures the offset of each terminal (lead) 62 from a predetermined position, and determines whether the offset is within a predetermined range. In the "terminal number", the checking unit 54 determines whether or not the number of the terminals 62 meets a predetermined specification. In the "terminal size", the inspection unit 54 determines whether or not the size of each terminal 62 is within a predetermined range. In the "terminal pitch", the inspection section 54 determines whether or not the length between the terminals 62 is within a predetermined range. In the "terminal defect", the inspection unit 54 determines whether or not foreign matter is present on the terminal 62. In the "die pad size", the inspection unit 54 determines whether or not the size of the die pad 61 exposed to the outside is within a predetermined range. In the "die pad defect", the inspection unit 54 determines whether or not foreign matter is present on the die pad 61. In the "die pad number", the inspection unit 54 determines whether or not the number of die pads 61 meets a predetermined specification. In the "terminal side face", the inspection portion 54 judges whether or not the state of the cut surface of the terminal (the side face of the package part 60) is appropriate. In the "mark shift", the inspection unit 54 measures the shift of the mark Mk1 (brand mark or the like) from the predetermined position, and determines whether the shift is within the predetermined range. In the "no mark", the inspection unit 54 detects that there is no mark Mk1 that should be present. In the "mark angle", the inspection unit 54 determines whether or not the inclination of the mark Mk1 on the package part is within a predetermined range. In the "broken mark", the inspection unit 54 determines whether or not a part of the characters constituting the mark Mk1 is missing. In the "broken character", the inspection unit 54 detects that a part of the characters constituting the mark Mk1 is not sufficiently printed. In the "oozed character", the inspection unit 54 determines whether oozing of a part of the characters constituting the mark Mk1 is within a predetermined range. In the "error character", the inspection unit 54 detects that a part of the characters constituting the mark Mk1 is different.
Referring again to fig. 5, inspection data including inspection result information based on inspection unit 54 is stored in storage device 30. In the storage device 30, a plurality of inspection data are collected and managed on the database DB1.
Fig. 9 is a diagram showing an example of the database DB1. Referring to fig. 9, each row in database DB1 represents inspection data of each package component 60. In each row, the result information of the "lot", "number", "frame number", "position", and "inspection item" is associated with each other.
For example, the package component 60 having the "number" 2 "is present at a position of" 2 "on the X-coordinate and" 1 "on the Y-coordinate in the package substrate (frame) P1 having the" frame number "1". The frames contained by the package part 60 are contained in a "lot" of "0000". The "lot" is a unit including a plurality of frames (package substrates P1). The package component 60 is "1 (e.g., reject)" as a result of the inspection item "0", 0 (e.g., reject) "as a result of the inspection item" 1", and 5.005 (measured value)" as a result of the inspection item "2".
A user of the system 100 (fig. 1) can acquire statistical data from the system 100 regarding the production status of the semiconductor package S1. The statistical data is generated based on the data stored in the database DB1. For example, the user can analyze a problem point related to the production of the semiconductor package S1 by referring to the statistical data. The user specifies the range of data used for generating the statistical data from the acquired statistical data. For example, the user designates the range of data by performing input via an image 200 (fig. 10) described later. In the system 100, statistics are generated using data within a specified range.
Referring again to fig. 5, the statistic data generating unit 56 acquires the inspection data from the storage device 30 in accordance with an instruction from the user, and generates statistic data by aggregating the acquired inspection data. The statistic data generating unit 56 generates, for example, statistic data in which each position in the package substrate P1 is associated with a pass/fail condition of the semiconductor package S1. The statistical data generating unit 56 generates statistical data indicating the reject ratio for each of the positions of the package substrates P1 from data indicating the pass/fail conditions of the semiconductor packages S1 for each of the positions of the package substrates P1 included in a specific lot.
The image generation unit 58 generates visualized image data from the statistic data generated by the statistic data generation unit 56.
Fig. 10 is a diagram showing an example of the image 200 generated by the image generating unit 58. As shown in fig. 10, the image 200 includes a category selection unit 202, an instruction unit 214, a region T1, and a region T2. The user selects whether the type of the package substrate to be analyzed is BGA or QFN via the type selecting unit 202. The user also presses the instruction unit 214 with a cursor (mouse pointer) or the like to instruct the output of the statistical data. The area T1 is an area representing an image in which statistical data in a specific package substrate (frame) is visualized. Region T2 is a region in which an image in which statistical data in a specific lot is visualized is displayed.
The area T1 includes an input unit 204, a selection unit 206, and result output units 208, 210, and 212. The user inputs the "frame number" of the package substrate (frame) P1 to be analyzed via the input unit 204. The user selects "inspection item" to be analyzed via the selection unit 206.
The result output unit 208 outputs a rectangular image as a whole. The rectangular image includes a plurality of blocks. The rectangular image corresponds to the package substrate P1, and the plurality of blocks corresponds to the semiconductor package S1. In this example, the upper left block of the rectangular image represents coordinates (1, 1). The X-coordinate exists from "1" to "14" from the left toward the right, and the Y-coordinate exists from "1" to "48" from the top toward the bottom. In this example, for example, the color of each block is discriminated according to the degree of failure of each package component 60. The user can visually confirm the occurrence of failure at different positions in the package substrate by referring to the image output by the result output unit 208.
The result output unit 210 outputs, for example, the total number of semiconductor packages S1, the number of non-defective products, and the number of defective products included in the package substrate P1 to be analyzed. The result output unit 212 outputs, for example, the number of defective products and the occurrence rate of defective products.
The area T2 includes the result output units 220, 224, 226 and the selection unit 222. The user selects "inspection item" to be analyzed via the selection unit 222.
The result output unit 224 outputs an image indicating the result of the summation of the defective product occurrence positions in the plurality of package substrates P1 included in the lot. In this image, the meaning of the X-coordinate and the Y-coordinate is the same as that of the image output by the result output unit 208. The Z-coordinate represents the total number of rejects occurring at that location. The user can visually recognize the occurrence of failure according to the position in the package substrate by referring to the image output by the result output unit 224.
The result output unit 220 outputs, for example, the total number of package substrates P1, the total number of semiconductor packages S1, the number of non-defective products, and the number of defective products included in the batch to be analyzed. The result output unit 226 outputs, for example, the number of defective products and the occurrence rate of defective products.
Referring again to fig. 5, the image generated by the image generating section 58 is displayed on the monitor 20 included in the cutting apparatus 1. The user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20.
[3. Action ]
(3-1. Cumulative action of inspection results)
Fig. 11 is a flowchart showing a procedure of accumulating the inspection results of the semiconductor package S1 in the storage device 30. The processing shown in the flowchart is executed by the computer 50 in a predetermined cycle.
Referring to fig. 11, the computer 50 instructs the first optical inspection camera 12 and the second optical inspection camera 13 to sequentially capture a predetermined range of the package substrate P1 on the inspection stage 11 (step S100). The computer 50 sequentially acquires image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 (step S110). The computer 50 performs various inspections on the semiconductor packages S1 by analyzing the acquired image data (step S120). The computer 50 updates the database DB1 so as to add the inspection data generated by the inspection (step S130).
By repeating steps S100 to S130, inspection data of each semiconductor package S1 is sequentially added to the database DB1.
(3-2. Output action of statistical data)
Fig. 12 is a flowchart showing a sequence of outputting statistical data. The processing shown in the flowchart is executed by the computer 50 in a predetermined cycle.
Referring to fig. 12, the computer 50 determines whether there is an output instruction of statistical data from the user (step S200). For example, the computer 50 determines whether the instruction unit 214 (fig. 10) is pressed by the user. When it is determined that there is no output instruction of the statistical data (no in step S200), the process moves to "return".
On the other hand, when it is determined that there is an output instruction of the statistical data (yes in step S200), the computer 50 reads the check data conforming to the instruction content from the user from the storage device 30 (database DB 1) (step S210). The computer 50 generates statistical data by compiling the read inspection data (step S220). The computer 50 generates image data that visually displays the statistical data (step S230). The computer 50 controls the monitor 20 (fig. 5) in such a manner that the generated image is displayed (step S240).
The user can statistically grasp the production condition of the semiconductor package S1 by referring to the image displayed on the monitor 20.
[4. Characteristics ]
As described above, the dicing device 1 according to the present embodiment is configured to collect inspection data including inspection result information of the packaged parts, and generate statistical data based on the collected inspection data. By using statistical data including inspection data of inspection result information of the packaged component, for example, initial discovery of a problem occurring in a later process can be promoted. That is, according to the cutting device 1, data (statistical data) used for higher production management than before in the later process can be generated.
In addition, in the dicing apparatus 1, the inspection data includes positional information of the semiconductor package S1 to be inspected in the package substrate P1. Thus, according to the dicing apparatus 1, the inspection result information of the semiconductor packages S1 can be managed in association with the positional information of the semiconductor packages S1 on the package substrate P1, so that more useful statistical data can be generated.
[5 ] other embodiments ]
The idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.
(5-1)
In the above embodiment, the computer 50 controls the entire cutting device 1. However, the control of the cutting device 1 does not necessarily have to be performed by one computer. For example, the control of the cutting device 1 may also be performed by a plurality of computers. In this case, the control of the cutting device 1 based on the plurality of computers is realized by communication between the plurality of computers.
(5-2)
In the above embodiment, the image representing the generated statistical data is displayed on the monitor 20. However, the generated statistics do not necessarily have to be displayed on the monitor 20. For example, the generated statistics may also be transmitted only to other devices.
(5-3)
In the above embodiment, dicing of the package substrate P1, inspection of the semiconductor packages S1, and generation of statistical data based on the inspection data are performed in the same dicing apparatus 1. However, this does not necessarily have to be performed by the same device. For example, it may be performed by another device.
(5-4)
In the above embodiment, the positional information of the semiconductor package S1 on the package substrate P1 and the result information of each inspection item are managed on the database DB1 in association with each other. However, the database DB1 does not necessarily have to contain positional information of the semiconductor package S1 in the package substrate P1.
(5-5)
In the above embodiment, the dicing apparatus 1 includes the first optical inspection camera 12 and the second optical inspection camera 13 that capture images of the die surface and the solder ball/lead surface of the semiconductor package S1, respectively. However, the optical inspection camera provided in the dicing apparatus 1 is not limited to the first optical inspection camera 12 and the second optical inspection camera 13. For example, the dicing device 1 may further include an optical inspection camera for inspecting a dicing surface of the terminal (a side surface of the package part 60). In this case, an optical inspection camera for inspecting the cut surface is provided between the placement unit 14 and the acceptable tray 15a, for example.
The embodiments of the present invention are described above by way of illustration. That is, for the purpose of illustration, a detailed description and drawings are disclosed. Accordingly, the components described in the detailed description and the drawings include components not necessary for solving the problems. Therefore, since these unnecessary components are described in the detailed description and drawings, these unnecessary components should not be directly considered to be necessary.
Further, the above-described embodiment is merely one example of the present invention in various aspects. The above-described embodiments may be modified or altered in various ways within the scope of the invention. That is, in carrying out the present invention, a specific configuration can be adopted appropriately according to the embodiment.
Description of the reference numerals
1. Cutting device
3. Substrate supply unit
4. Positioning part
4a track portion
5. Cutting table
5a holding member
5b rotating mechanism
5c moving mechanism
5d first position confirmation camera
5e first cleaner
6. Spindle part
6a blade
6b second position confirmation camera
6c rotating shaft
6d first flange
6e second flange
6f fixing part
7. Conveying part
7a second cleaner
11. Inspection bench
12. First optical inspection camera
13. Second optical inspection camera
14. Arrangement part
15. Extraction part
15a tray for qualified products
15b tray for reject
20. Monitor
30. Storage device
50. Computer with a memory for storing data
52. Image acquisition unit
54. Inspection part
56. Statistical data generating unit
58. Image generating unit
60. Packaging part
61. Bare die pad
62. Terminal for connecting a plurality of terminals
70. Calculation unit
72 CPU
74 RAM
76 ROM
80. Storage unit
81. Control program
90. Input-output I/F
91. Communication I/F
100. System and method for controlling a system
200. ID1, ID2, ID3 image
202. Category selection unit
204. Input unit
206. 222 selection part
208. 210, 212, 220, 224, 226 result output unit
214. Indication part
A1 Cutting module
B1 Inspection/storage module
DB1 database
M1 box
Mk1 markers
P1 packaging substrate
S1 semiconductor package
T1, T2, T3 regions.

Claims (6)

1. A statistical data generation method, comprising:
a step of collecting inspection data including respective inspection result information of a plurality of package parts produced by cutting a plurality of package substrates;
a step of generating statistical data based on the collected inspection data;
generating image data representing an image of the generated statistical data; and
a step of receiving an input of one of the plurality of package substrates,
the image is associated with respective positions of the plurality of package parts included in the inputted package substrate, and respective inspection results of the plurality of package parts included in the inputted package substrate are displayed.
2. The statistical data generating method according to claim 1, wherein,
the inspection is an inspection related to a terminal of the package part.
3. The statistical data generating method according to claim 1, wherein,
the inspection is an inspection related to a die pad of the packaged part.
4. The statistical data generating method according to claim 1, wherein,
the inspection is an inspection related to a mark formed on a surface of the package part.
5. A cutting device is provided with:
a cutting mechanism configured to produce a plurality of package parts by cutting the package substrate;
an inspection mechanism configured to inspect the plurality of package components, respectively;
an arithmetic unit configured to perform arithmetic operation using inspection data including inspection result information based on the inspection means;
an image generation unit that generates image data; and
an input section for receiving an input from one of the plurality of package substrates,
the operation unit is configured to collect the inspection data, generate statistical data based on the collected inspection data,
the image generation unit is configured to generate image data representing an image of the statistical data generated by the calculation unit,
the image is associated with respective positions of a plurality of package parts included in the package substrate input via the input section, and displays respective inspection results of the plurality of package parts included in the package substrate input via the input section.
6. A system is provided with:
the cutting device of claim 5; and
and a storage device external to the cutting device configured to store the inspection data.
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