CN114746232A - Statistical data generation method, cutting device and system - Google Patents

Statistical data generation method, cutting device and system Download PDF

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Publication number
CN114746232A
CN114746232A CN202080082298.9A CN202080082298A CN114746232A CN 114746232 A CN114746232 A CN 114746232A CN 202080082298 A CN202080082298 A CN 202080082298A CN 114746232 A CN114746232 A CN 114746232A
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inspection
package
statistical data
unit
cutting
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CN114746232B (en
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高橋和宏
尾関貴俊
水田彩香
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

A statistical data generating method, comprising: the method includes a step of collecting inspection data including inspection result information of the package parts produced by cutting the package substrate and a step of generating statistical data based on the collected inspection data.

Description

Statistical data generation method, cutting device and system
Technical Field
The invention relates to a statistical data generation method, a cutting device and a system.
Background
Japanese patent laying-open No. 2008-4806 (patent document 1) discloses a method for managing the processing results of wafers. In this method, a cutting groove formed during processing of a wafer is photographed by a photographing device, and cutting groove data is generated based on the generated image information. The cutting groove data is accumulated and stored in a storage device in association with the image information and the position information. The stored cut groove data, image information, and the like are displayed on a display panel (see patent document 1).
Documents of the prior art
Patent document
Patent document 1 Japanese laid-open patent publication No. 2008-4806
Disclosure of Invention
As disclosed in patent document 1, a high level of production control is performed in a wafer process in a semiconductor production process. On the other hand, in the later process among the semiconductor production processes, high production management is not performed. However, due to the miniaturization of the package components and the like, high production management is required in the later process as compared with the conventional one.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a statistical data generating method, a cutting device, and a system, which can generate data used for realizing higher-level production management than in the past in a subsequent process.
A statistical data generating method according to an aspect of the present invention includes: the method includes a step of collecting inspection data including inspection result information of the package parts produced by cutting the package substrate and a step of generating statistical data based on the collected inspection data.
Further, a cutting device according to another aspect of the present invention includes a cutting mechanism, an inspection mechanism, and a calculation unit. The cutting mechanism is configured to produce a plurality of package parts by cutting the package substrate. The inspection mechanism is configured to inspect each of the plurality of package components. The calculation unit is configured to perform calculation using inspection data including inspection result information based on the inspection means. The arithmetic unit is configured to collect the inspection data and generate statistical data based on the collected inspection data.
Furthermore, a system according to another aspect of the invention is provided with the above-described cutting device and a storage device external to the cutting device. The storage device is configured to store the inspection data.
Effects of the invention
According to the present invention, it is possible to provide a statistical data generating method, a cutting device, and a system capable of generating data used for realizing higher-level production management than in the past in a later process.
Drawings
Fig. 1 is a diagram schematically showing a system.
Fig. 2 is a top view schematically showing the cutting device.
Fig. 3 is a side view schematically showing the spindle portion.
Fig. 4 is a diagram schematically showing the hardware configuration of the computer.
Fig. 5 is a diagram showing a relationship between functions realized by a computer.
Fig. 6 is a diagram for explaining inspection of the package size in QFN.
Fig. 7 is a diagram for explaining inspection regarding a corner angle in QFN.
Fig. 8 is a diagram for explaining the inspection of the bad flag in the QFN.
Fig. 9 is a diagram showing an example of the database.
Fig. 10 is a diagram showing an example of an image generated by the image generating unit.
Fig. 11 is a flowchart showing a procedure of storing the inspection result of the semiconductor package in the storage device.
Fig. 12 is a flowchart showing the procedure of outputting the statistical data.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.
[1. Structure of System ]
Fig. 1 is a diagram schematically showing a system 100 according to the present embodiment. As shown in fig. 1, the system 100 comprises a cutting device 1 and a storage device 30.
The dicing apparatus 1 is configured to dice the package substrate (object to be cut) into a plurality of package components. In the package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is sealed with resin.
Examples of the Package substrate include a BGA (Ball Grid Array) Package substrate, an LGA (Land Grid Array) Package substrate, a CSP (Chip Size Package) Package substrate, an LED (Light Emitting Diode) Package substrate, and a QFN (Quad Flat No-LED) Package substrate.
The cutting apparatus 1 is configured to inspect each of the plurality of packaged components that are diced. In the cutting apparatus 1, an image of each packaged component is captured, and inspection of each packaged component is performed based on the image. Inspection data is generated by this inspection, and each packaged component is classified as a "good product" or a "defective product".
The storage device 30 is configured to store inspection data generated by the inspection in the cutting apparatus 1. The storage device 30 sequentially accumulates the inspection data. The inspection data is not necessarily stored in the storage device 30, and may be stored in a memory or the like in the cutting device 1, for example.
Generally, in a wafer process in a semiconductor manufacturing process, high-level manufacturing management is performed. On the other hand, in the later process among the semiconductor production processes, high production management is not performed. However, due to miniaturization of the package components and the like, high production management is required in the later process.
The cutting apparatus 1 according to the present embodiment is configured to collect inspection data including inspection result information of the packaged parts, and generate statistical data based on the collected inspection data. By using statistical data of inspection data including inspection result information of the packaged component, for example, early detection of a problem occurring in a later process can be promoted. That is, according to the cutting apparatus 1, data (statistical data) used for higher-level production management than in the past in the later process can be generated. Hereinafter, the cutting apparatus 1 according to the present embodiment will be described in detail.
[2. Structure of cutting device ]
(2-1. integral construction of cutting device)
Fig. 2 is a plan view schematically showing the cutting device 1 according to the present embodiment. In the present embodiment, the package substrate P1 is used as a cutting object, and the package substrate P1 is diced into a plurality of semiconductor packages S1 by the dicing apparatus 1. Hereinafter, a surface of the package substrate P1 sealed with resin out of the two surfaces is referred to as a mold surface, and a surface opposite to the mold surface is referred to as a solder ball/lead surface.
As shown in fig. 2, the cutting apparatus 1 includes a cutting module a1 and an inspection/storage module B1 as components. The dicing module a1 is configured to produce a plurality of semiconductor packages S1 by dicing the package substrate P1. The inspection/housing module B1 is configured to inspect each of the produced plurality of semiconductor packages S1, and thereafter, house the semiconductor packages S1 in a tray. In the cutting apparatus 1, each component is detachable from and replaceable with respect to other components.
The dicing module a1 mainly includes a substrate supply unit 3, a positioning unit 4, a dicing table 5, a spindle unit 6, and a conveyance unit 7.
The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the cassette M1 accommodating a plurality of package substrates P1. At this time, the package substrate P1 has the solder balls/leads facing upward.
The positioning unit 4 positions the package substrate P1 by disposing the package substrate P1 pushed out from the substrate supply unit 3 on the rail portion 4 a. Thereafter, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5.
The cutting table 5 holds the cut package substrate P. In the present embodiment, a cutting apparatus 1 having a double cutting table structure having two cutting tables 5 is exemplified. The cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5 c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning portion 4 from below. The rotation mechanism 5b can rotate the holding member 5a in the θ direction of the drawing. The moving mechanism 5c can move the holding member 5a along the Y axis of the drawing.
The stem portion 6 cuts the package substrate P1 to dice the package substrate P1 into a plurality of semiconductor packages S1. In the present embodiment, the cutting apparatus 1 having a double spindle structure having two spindle portions 6 is exemplified. The spindle portion 6 is movable along the X axis and the Z axis of the drawing. The cutting device 1 may also be a single spindle structure having one spindle portion 6.
Fig. 3 is a side view schematically showing the spindle portion 6. As shown in fig. 3, the spindle portion 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fixing member 6 f.
The blade 6a cuts the package substrate P1 by high-speed rotation to dice the package substrate P1 into a plurality of semiconductor packages S1. The blade 6a is attached to the rotating shaft 6c in a state of being sandwiched by one flange (first flange) 6d and the other flange (second flange) 6 e. The first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by a fixing member 6f such as a nut. The first flange 6d is also referred to as an inner flange. The second flange 6e is disposed on the fixing member 6f side with the blade 6a interposed therebetween, and is also referred to as an outer flange.
The spindle portion 6 is provided with a cutting water nozzle for jetting cutting water toward the blade 6a rotating at a high speed, a cooling water nozzle for jetting cooling water, a cleaning water nozzle for jetting cleaning water for cleaning cutting chips and the like (none of them is shown), and the like.
Referring again to fig. 2, after the cutting table 5 sucks the package substrate P1, the first position confirmation camera 5d photographs the package substrate P1 and confirms the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, a mark position confirmation provided on the package substrate P1. The mark indicates, for example, a cutting position of the package substrate P1.
Thereafter, the cutting table 5 is moved towards the spindle portion 6 along the Y-axis of the figure. After the dicing table 5 is moved to below the mandrel portion 6, the package substrate P1 is diced by moving the dicing table 5 and the mandrel portion 6 relative to each other. Thereafter, the package substrate P1 is photographed by the second position confirmation camera 6b, the position of the package substrate P1 is confirmed, and the like, as necessary. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cut position and the cut width of the package substrate P1.
The dicing table 5 moves in a direction away from the spindle portion 6 along the Y axis direction of the drawing in a state where the plurality of semiconductor packages S1 that have been diced are sucked after the dicing of the package substrate P1 is completed. In this movement, the upper surface (solder ball/lead surface) of the semiconductor package S1 is cleaned and dried by the first cleaner 5 e.
The conveying unit 7 sucks and holds the semiconductor package S1 held by the dicing table 5 from above, and conveys the semiconductor package S1 to the inspection table 11 of the inspection/storage module B1. In this carrying process, the lower surface (mold surface) of the semiconductor package S1 is cleaned and dried by the second cleaner 7 a.
The inspection/housing module B1 mainly includes an inspection stage 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement section 14, and an extraction section 15.
For optical inspection of the semiconductor package S1, the inspection stage 11 holds the semiconductor package S1. The examination table 11 is movable along the X-axis of the figure. In addition, the inspection table 11 can be turned upside down. The inspection stage 11 is provided with a holding member for holding the semiconductor package S1 by sucking the semiconductor package S1.
The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (a solder ball/lead surface and a die surface) of the semiconductor package S1. Various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are disposed near the inspection stage 11 and pick up images upward. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively provided with an illumination device (not shown) that can emit light during inspection. In addition, the first optical inspection camera 12 may also be provided to the cutting module a 1.
The first optical inspection camera 12 images the mold surface of the semiconductor package S1 conveyed to the inspection stage 11 by the conveying unit 7. Thereafter, the carrier unit 7 places the semiconductor package S1 on the holding member of the inspection stage 11. After the holding member adsorbs the semiconductor package S1, the inspection stage 11 is turned upside down. The inspection stage 11 moves upward above the second optical inspection camera 13, and the solder ball/lead surface of the semiconductor package S1 is imaged by the second optical inspection camera 13. As described above, various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The examination items in the examination will be described in detail later.
The semiconductor package S1 subjected to the inspection is arranged in the arrangement unit 14. The arrangement portion 14 is movable along the Y axis of the drawing. The inspection stage 11 places the inspected semiconductor package S1 on the placement portion 14.
The extracting unit 15 transfers the semiconductor package S1 placed on the placement unit 14 to the tray. The semiconductor package S1 is classified as either a "good" or a "bad" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the respective results, the extracting unit 15 conveys each semiconductor package S1 to the non-defective product tray 15a or the defective product tray 15 b. That is, the non-defective products are stored in the non-defective product tray 15a, and the defective products are stored in the defective product tray 15 b. When the non-defective tray 15a and the defective tray 15b are filled with the semiconductor packages S1, respectively, the trays are replaced with new trays.
The cutting device 1 further comprises a computer 50. The computer 50 controls the operation of the cutting module a1 and the inspection/storage module B1. The computer 50 controls the operations of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement unit 14, and the extraction unit 15.
The computer 50 performs various inspections of the semiconductor package S1 based on, for example, image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The computer 50 collects the inspection data generated by the various inspections in the storage device 30 (fig. 1), and generates statistical data based on the collected inspection data. Next, the computer 50 will be described in detail.
(2-2. hardware configuration of computer)
Fig. 4 is a diagram schematically showing the hardware configuration of the computer 50. As shown in fig. 4, the computer 50 includes an arithmetic unit 70, an input/output I/F (interface) 90, a communication I/F91, and a storage unit 80, and the respective configurations are electrically connected via a bus.
The operation unit 70 includes a cpu (central Processing unit)72, a ram (random Access memory)74, a rom (read Only memory)76, and the like. The arithmetic unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 based on information processing.
The input/output I/F90 is configured to communicate with each component included in the cutting apparatus 1 via a signal line. The input/output I/F90 is used for transmitting data from the computer 50 to each component in the cutting apparatus 1 and receiving data transmitted from each component in the cutting apparatus 1 to the computer 50.
The communication I/F91 is configured to communicate with an external device (for example, the storage device 30 (fig. 1)) provided outside the cutting apparatus 1 via the internet. The communication I/F91 is constituted by, for example, a wired LAN (Local Area Network) module or a wireless LAN module.
The storage unit 80 is an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. The storage unit 80 may store inspection data generated by an inspection using the first optical inspection camera 12 and the second optical inspection camera 13.
(2-3. software structure for inspection of packaged parts)
Fig. 5 is a diagram showing the relationship between the functions realized by the computer 50. The computing unit 70 expands the control program 81 stored in the storage unit 80 in the RAM 74. Then, the CPU72 interprets and executes the control program 81 developed in the RAM74, and the computer 50 controls the components in the cutting apparatus 1. As shown in fig. 5, the computer 50 operates as an image acquisition unit 52, an inspection unit 54, a statistical data generation unit 56, and an image generation unit 58.
The image acquisition unit 52 transmits an imaging instruction to the first optical inspection camera 12 and the second optical inspection camera 13. The imaging instruction includes, for example, information for specifying the imaging range on the package substrate P1. Further, the image acquisition section 52 sequentially changes the shooting range. Thus, both surfaces of all the semiconductor packages S1 included in the package substrate P1 are photographed. The image acquisition unit 52 acquires image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 via the input/output I/F90.
The inspection unit 54 analyzes the image data acquired by the image acquisition unit 52, and performs various inspections on the semiconductor packages S1 included in the image data. Examples of the inspection items include "the Number of terminals (Lead Pad Number)", "bare Pad Defect (Die Pad Defect)", and "Mark Angle (Mark Angle)" in QFN.
Fig. 6 is a diagram for explaining the inspection of the number of terminals in QFN. Referring to fig. 6, the image ID1 is an image included in the image captured by the second optical inspection camera 13. That is, the image ID1 is an image indicating the face (solder ball/lead face) of the package component 60 opposite to the die face. A bare chip pad 61 is disposed in the center of the package component 60, and a plurality of terminals (electrode pads) 62 are disposed around the package component 60.
In the inspection of the number of terminals of the package component 60, the inspection unit 54 detects the number of terminals (the number of lead pads) on each side by image analysis. The checking unit 54 determines whether the number of terminals in each side is a predetermined number. The inspection unit 54 determines that the package component 60 is a non-defective product with respect to the "number of terminals" when the number of terminals in each side is a predetermined number, and determines that the package component 60 is a defective product with respect to the "number of terminals" when the number of terminals in each side is not the predetermined number. The inspection unit 54 associates the number of terminals on each side to be detected and the determination result of the non-defective product/defective product with the positional information of the package component 60 on the package substrate, and stores the result in the storage device 30. That is, the inspection unit 54 associates the measured value of the measurement object (in this example, "the number of terminals") obtained by the image analysis with the positional information of the package component 60 on the package substrate and stores the positional information in the storage device 30, not only the determination result of the non-defective product/defective product, but also the inspection items.
Fig. 7 is a diagram for explaining inspection of a bare die pad defect in QFN. Referring to fig. 7, the image ID2 is an image included in the image captured by the second optical inspection camera 13. That is, the image ID2 is a diagram showing the surface (solder ball/lead surface) of the package component 60 opposite to the die surface.
In the inspection of the bare die pad defect of the package component 60, the inspection unit 54 detects a foreign substance on the bare die pad 61 by image analysis. The inspection unit 54 determines whether the level of foreign matter present on the bare wafer pad 61 is within a predetermined range. The inspection unit 54 determines that the package component 60 is a good product with respect to the bare die pad defect when the level of the foreign matter present on the bare die pad 61 is within a predetermined range, and determines that the package component 60 is a bad product with respect to the bare die pad defect when the level of the foreign matter present on the bare die pad 61 is not within the predetermined range. The inspection unit 54 associates the determination result of the non-defective product/defective product with the positional information of the package component 60 in the package substrate, and stores the result in the storage device 30.
Fig. 8 is a diagram for explaining inspection regarding a mark angle in QFN. Referring to fig. 8, the image ID3 is an image included in the image captured by the first optical inspection camera 12. That is, the image ID3 is an image indicating the mold surface of the package component 60.
On the mold surface of the package component 60, for example, a brand mark or the like of the package component 60 is printed. In the inspection of the mark angle of the package component 60, the inspection unit 54 determines whether the inclination of the mark Mk1 printed on the surface of the package component 60 is within a predetermined range by image analysis. Inspection unit 54 determines that package component 60 is a non-defective product with respect to the mark angle when the inclination of mark Mk1 is within the predetermined range, and determines that package component 60 is a defective product with respect to the mark angle when the inclination of mark Mk1 is outside the predetermined range. The inspection unit 54 associates the determination result of the non-defective product/defective product with the positional information of the package component 60 on the package substrate, and stores the result in the storage device 30.
The inspection unit 54 can perform inspection of various other inspection items. Table 1 below shows an example of inspection items that can be inspected by the inspection unit 54.
[ Table 1]
Figure BDA0003663297740000091
Figure BDA0003663297740000101
In table 1, the inspection items corresponding to the BGAs indicate the inspection items in the solder ball/lead surfaces of the BGAs. Further, the inspection items corresponding to QFNs indicate inspection items in the solder ball/lead surface of QFNs. The inspection items commonly associated with the BGA and QFN dies are inspection items on the die surfaces.
Examples of the inspection specific to the package component included in the various inspection items in table 1 are "terminal shift", "terminal number", "terminal size", "terminal pitch", "terminal defect", "bare die pad size", "bare die pad defect", "bare die pad number", "terminal side face", "mark shift", "no mark", "mark angle", "broken mark", "broken character", "bleeding character", and "error character".
In the "terminal shift", the inspection unit 54 measures a shift of each terminal (lead) 62 from a predetermined position, and determines whether the shift is within a predetermined range. In the "terminal number", the inspection unit 54 determines whether or not the number of terminals 62 satisfies a predetermined specification. In the "terminal size", the inspection unit 54 determines whether or not the size of each terminal 62 is within a predetermined range. In the "terminal pitch", the inspection section 54 determines whether or not the length between the terminals 62 is within a predetermined range. In the "terminal defect", the inspection section 54 determines the presence or absence of foreign matter on the terminal 62. In the "bare die pad size", the inspection unit 54 determines whether or not the size of the bare die pad 61 exposed to the outside is within a predetermined range. In the "bare die pad defect", the inspection unit 54 determines whether or not there is a foreign object on the bare die pad 61. In the "die pad number", the inspection unit 54 determines whether or not the number of die pads 61 satisfies the specification. In the "terminal side surface", the inspection section 54 determines whether or not the state of the cut surface of the terminal (the side surface of the package component 60) is proper. In the "mark offset", the inspection unit 54 measures the offset of the mark Mk1 (brand mark or the like) from a predetermined position, and determines whether the offset is within a predetermined range. In the "no mark", the inspection unit 54 detects that there is no mark Mk1 that should be present. In the "mark angle", the inspection unit 54 determines whether or not the inclination of the mark Mk1 on the package component is within a predetermined range. In the "damage flag", the inspection unit 54 determines whether or not a part of the characters constituting the flag Mk1 is missing. In the "broken character", the inspection unit 54 detects that a part of the characters constituting the mark Mk1 is not sufficiently printed. In the "bleeding character", the inspection unit 54 determines whether or not the bleeding of a part of the characters constituting the mark Mk1 is within a predetermined range. In the "error character", the inspection unit 54 detects that a part of the characters constituting the mark Mk1 becomes different characters.
Referring again to fig. 5, the inspection data including the inspection result information by the inspection unit 54 is stored in the storage device 30. In the storage device 30, a plurality of inspection data are collected and managed in the database DB 1.
Fig. 9 is a diagram showing an example of the database DB 1. Referring to fig. 9, each row in the database DB1 represents inspection data for each packaged part 60. In each line, the result information is associated with different "lot", "number", "frame number", "position", and "inspection item".
For example, the package component 60 having the "number" of "2" is present at a position of "2" on the X-coordinate and "1" on the Y-coordinate in the package substrate (frame) P1 having the "frame number" of "1". The frame included in the packaged part 60 is included in a "lot" of "0000". The "lot" is a unit including a plurality of frames (package substrates P1). The packaged component 60 has a result of "1 (for example, defective product)" for the inspection item "0", a result of "0 (for example, defective product)" for the inspection item "1", and a result of "5.005 (measurement value)" for the inspection item "2".
A user of system 100 (fig. 1) can obtain statistical data from system 100 regarding the production status of semiconductor packages S1. The statistical data is generated based on the data stored in the database DB 1. For example, the user can analyze the problem point related to the production of the semiconductor package S1 by referring to the statistical data. The user specifies the range of data used for generating the statistical data based on the acquired statistical data. For example, the user specifies the range of data by inputting the data through an image 200 (fig. 10) described later. In the system 100, statistical data is generated using data within a specified range.
Referring again to fig. 5, the statistical data generating unit 56 acquires the inspection data from the storage device 30 in accordance with an instruction from the user, and generates statistical data by collecting the acquired inspection data. For example, the statistical data generator 56 generates statistical data associating each position in the package substrate P1 with the pass/fail status of the semiconductor package S1. The statistical data generator 56 generates statistical data indicating the failure rate for each position of the package substrates P1 from data indicating the pass/fail status of the semiconductor packages S1 having different positions of the plurality of package substrates P1 included in a specific lot, for example.
The image generator 58 generates visualized image data from the statistical data generated by the statistical data generator 56.
Fig. 10 is a diagram showing an example of the image 200 generated by the image generating unit 58. As shown in fig. 10, the image 200 includes a type selector 202, a pointer 214, a region T1, and a region T2. The user selects, via the type selection unit 202, whether the type of the package substrate to be analyzed is BGA or QFN. The user presses the instruction unit 214 with a cursor (mouse pointer) or the like to instruct statistical data to be output. The area T1 is an area representing an image in which statistical data in a specific package substrate (frame) is visualized. The area T2 is an area displaying an image visualizing statistical data in a particular lot.
The region T1 includes an input unit 204, a selection unit 206, and result output units 208, 210, and 212. The user inputs the "frame number" of the package substrate (frame) P1 to be analyzed via the input unit 204. The user selects "examination items" to be analyzed via the selection unit 206.
The result output unit 208 outputs a rectangular image as a whole. The rectangular image includes a plurality of blocks. The rectangular image corresponds to the package substrate P1, and the plurality of blocks correspond to the semiconductor packages S1, respectively. In this example, the upper left block of the rectangular image represents coordinates (1, 1). The X coordinate exists from "1" to "14" from the left to the right, and the Y coordinate exists from "1" to "48" from the upper to the lower. In this example, for example, the color of each block is discriminated according to the degree of failure of each package component 60. The user can visually confirm the occurrence of a failure at different positions in the package substrate by referring to the image output from the result output unit 208.
The result output unit 210 outputs, for example, the total number of semiconductor packages S1 included in the package substrate P1 to be analyzed, the number of non-defective products, and the number of defective products. The result output section 212 outputs, for example, the number of defective products and the occurrence rate of defective products.
The region T2 includes result output units 220, 224, 226 and a selection unit 222. The user selects "inspection item" to be analyzed via the selection unit 222.
The result output unit 224 outputs an image indicating a result of summing up defective product occurrence positions in the plurality of package substrates P1 included in the lot. In this image, the meaning indicated by the X coordinate and the Y coordinate is the same as that of the image output by the result output unit 208. The Z coordinate represents the total number of rejects occurring at that location. The user can visually recognize the occurrence of a defect at different positions in the package substrate by referring to the image output by the result output unit 224.
The result output unit 220 outputs, for example, the total number of package substrates P1, the total number of semiconductor packages S1, the number of non-defective products, and the number of defective products included in the lot to be analyzed. The result output section 226 outputs, for example, the number of defective products and the occurrence rate of defective products.
Referring again to fig. 5, the image generated by the image generator 58 is displayed on the monitor 20 included in the cutting apparatus 1. The user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20.
[3. actions ]
(3-1. cumulative action of examination result)
Fig. 11 is a flowchart showing a procedure of accumulating the inspection results of the semiconductor package S1 in the storage device 30. The processing shown in the flowchart is executed by the computer 50 in a predetermined loop.
Referring to fig. 11, the computer 50 instructs the first optical inspection camera 12 and the second optical inspection camera 13 to sequentially photograph a predetermined range of the package substrate P1 on the inspection stage 11 (step S100). The computer 50 sequentially acquires image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 (step S110). The computer 50 analyzes the acquired image data to perform various inspections with respect to the semiconductor packages S1 (step S120). The computer 50 updates the database DB1 to add the check data generated by the check (step S130).
By repeating steps S100 to S130, the inspection data of each semiconductor package S1 is sequentially added to the database DB 1.
(3-2. output action of statistical data)
Fig. 12 is a flowchart showing the procedure of outputting the statistical data. The processing shown in the flowchart is executed by the computer 50 in a predetermined cycle.
Referring to fig. 12, the computer 50 determines whether or not there is an output instruction of the statistical data from the user (step S200). For example, the computer 50 determines whether the instruction portion 214 is pressed by the user (fig. 10). When it is determined that there is no instruction to output the statistical data (no in step S200), the process moves to "return".
On the other hand, when it is determined that there is an instruction to output the statistical data (yes in step S200), the computer 50 reads the check data corresponding to the instruction content from the user from the storage device 30 (database DB1) (step S210). The computer 50 generates statistical data by collecting the read inspection data (step S220). The computer 50 generates image data visually displaying the statistical data (step S230). The computer 50 controls the monitor 20 (fig. 5) to display the generated image (step S240).
The user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20.
[4. characteristics ]
As described above, the cutting apparatus 1 according to the present embodiment is configured to collect inspection data including inspection result information of the packaged parts, and generate statistical data based on the collected inspection data. By using statistical data of inspection data including inspection result information of the packaged component, for example, initial discovery of a problem occurring in a later process can be promoted. That is, according to the cutting apparatus 1, data (statistical data) used for higher-level production management than in the past in the later process can be generated.
Further, in the dicing apparatus 1, the inspection data contains positional information of the semiconductor package S1 as an inspection target in the package substrate P1. Thus, according to the dicing apparatus 1, since the inspection result information of the semiconductor package S1 can be managed in association with the position information of the semiconductor package S1 in the package substrate P1, more useful statistical data can be generated.
[5 ] other embodiments ]
The idea of the above embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.
(5-1)
In the above embodiment, the computer 50 controls the entire cutting apparatus 1. However, the control of the cutting device 1 does not necessarily have to be performed by a computer. For example, the control of the cutting apparatus 1 may be performed by a plurality of computers. In this case, the control of the cutting apparatus 1 by the plurality of computers is realized by communication between the plurality of computers.
(5-2)
In the above embodiment, the image representing the generated statistical data is displayed on the monitor 20. However, the generated statistical data does not necessarily have to be displayed on the monitor 20. For example, the generated statistics may also be sent only to other devices.
(5-3)
In the above embodiment, the dicing of the package substrate P1, the inspection of the semiconductor package S1, and the generation of statistical data based on the inspection data are performed in the same dicing apparatus 1. However, this does not necessarily have to be performed by the same device. For example, it may be performed by other devices, respectively.
(5-4)
In the above embodiment, the positional information of the semiconductor package S1 in the package substrate P1 is managed on the database DB1 in association with the result information of each inspection item. However, the database DB1 does not necessarily have to contain the positional information of the semiconductor package S1 in the package substrate P1.
(5-5)
In the above embodiment, the dicing apparatus 1 includes the first optical inspection camera 12 and the second optical inspection camera 13 that respectively capture images of the die surface and the solder ball/lead surface of the semiconductor package S1. However, the optical inspection camera included in the dicing apparatus 1 is not limited to the first optical inspection camera 12 and the second optical inspection camera 13. For example, the cutting apparatus 1 may further include an optical inspection camera for inspecting a cut surface of the terminal (a side surface of the package component 60). In this case, an optical inspection camera for inspecting the cut surface is provided between the arrangement portion 14 and the non-defective product tray 15a, for example.
The embodiments of the present invention have been described above by way of example. That is, the detailed description and the drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings include components that are not essential to solve the problem. Therefore, since these unnecessary components are described in the detailed description and the drawings, it is not directly assumed that these unnecessary components are essential.
Further, the above-described embodiment is only one example of the present invention in various aspects. The above-described embodiments may be modified or changed in various ways within the scope of the present invention. That is, when the present invention is implemented, a specific configuration can be adopted as appropriate according to the embodiment.
Description of the reference numerals
1 cutting device
3 substrate supply part
4 positioning part
4a track part
5 cutting table
5a holding member
5b rotating mechanism
5c moving mechanism
5d first position confirmation camera
5e first cleaner
6 mandrel part
6a blade
6b second position confirmation Camera
6c rotating shaft
6d first Flange
6e second flange
6f fixing part
7 conveying part
7a second cleaner
11 inspection bench
12 first optical inspection camera
13 second optical inspection camera
14 arrangement part
15 extraction part
15a qualified product tray
15b tray for defective products
20 monitor
30 storage device
50 computer
52 image acquisition unit
54 inspection part
56 statistic data generating part
58 image generating part
60 packaging parts
61 bare die pad
62 terminal
70 arithmetic unit
72 CPU
74 RAM
76 ROM
80 storage part
81 control program
90 input/output I/F
91 communication I/F
100 system
200. ID1, ID2, ID3 images
202 type selection unit
204 input unit
206. 222 selection part
208. 210, 212, 220, 224, 226 result output part
214 indication part
A1 cutting module
B1 inspection/storage module
DB1 database
M1 casket
Mk1 Label
P1 packaging substrate
S1 semiconductor package
T1, T2, T3 region.

Claims (9)

1. A statistical data generating method, comprising:
collecting inspection data including inspection result information of the package parts produced by cutting the package substrate; and
and generating statistical data based on the collected inspection data.
2. The statistical data generation method according to claim 1,
the inspection data includes positional information of the package part in the package substrate.
3. The statistical data generation method according to claim 1 or 2, further comprising:
a step of individually inspecting a plurality of package parts produced by cutting the package substrate.
4. The statistical data generation method according to claim 3,
the inspection is an inspection related to the terminals of the package parts.
5. The statistical data generation method according to claim 3,
the inspection is an inspection related to a bare die pad of the package part.
6. The statistical data generation method according to claim 3,
the inspection is an inspection related to a mark formed on the surface of the package part.
7. The statistical data generation method according to any one of claims 1 to 6, further comprising a step of displaying an image representing the statistical data,
in the image, the position of the package part in the package substrate is associated with the inspection result of the package part.
8. A cutting device is provided with:
a cutting mechanism configured to produce a plurality of package parts by cutting the package substrate;
an inspection mechanism configured to inspect the plurality of package components, respectively; and
a calculation unit configured to perform a calculation using inspection data including inspection result information based on the inspection means,
the arithmetic unit is configured to collect the inspection data and generate statistical data based on the collected inspection data.
9. A system is provided with:
the cutting device of claim 8; and
a storage device external to the cutting device configured to store the inspection data.
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