CN114683223A

CN114683223A - Wafer carrying platform

Info

Publication number: CN114683223A
Application number: CN202210317587.3A
Authority: CN
Inventors: 不公告发明人
Original assignee: Suzhou Sihang Semiconductor Technology Co ltd
Current assignee: Suzhou Sihang Semiconductor Technology Co ltd
Priority date: 2022-03-29
Filing date: 2022-03-29
Publication date: 2022-07-01
Anticipated expiration: 2042-03-29
Also published as: CN114683223B

Abstract

The invention provides a wafer carrier, which belongs to the field of high-precision machines and comprises carrier footing, a carrier base, a carrier upper base, a carrier main shaft, a wafer carrier disc, a carrier disc brake assembly, a main shaft elastic support assembly, a centering fork assembly and a carrier bottom surface vacuum brake assembly, wherein the carrier footing is arranged on the carrier base; through the scheme, the wafer and the silicon wafer which are flexibly supported can be suspended to wait for detection or treat a workpiece, so that the high-precision suspension supporting effect is achieved, the precision and the stability of the carrying platform are guaranteed, and the semiconductor volume detection and high-precision processing field with the moving platform is convenient to popularize and apply.

Description

Wafer carrying platform

Technical Field

The invention belongs to the field of high-precision machines, and particularly relates to a wafer carrier.

Background

In inspection and processing techniques, a stable table is generally required, and the table is generally supported on a bottom surface by a frame or a foot. However, in a detection system with a high-precision motion table, a stage is a main bearing mechanism, and the existing stage has a complex structure and poor damping and shock-absorbing effects, so that for a traditional workbench, besides a ground pin, a damping spring and the like, the performance of the stage needs to be improved to adapt to a stage system for high-precision detection or processing.

Disclosure of Invention

In order to overcome the disadvantages of the prior art, an object of the present invention is to provide a wafer stage, which can solve the above problems.

A wafer carrier comprises carrier feet, a carrier base, a carrier upper base, a carrier main shaft, a wafer carrier disc, a carrier disc brake assembly, a main shaft elastic support assembly and a centering fork assembly; wherein, the footing of the carrier adopts an air-float foot margin; the stage base is floatingly or slidingly supported on a frame by a plurality of the stage feet; the carrier upper seat is arranged on the carrier base; the carrier spindle is vertically arranged in bearing holes formed in the carrier base and the carrier upper base; the middle part of the bottom surface of the wafer carrying disc is fixed to the top surface of the carrying platform main shaft; the plurality of carrying disc brake assemblies are arranged between the carrying platform upper base and the wafer carrying disc and used for braking the wafer carrying disc; the main shaft elastic support assembly is used for elastically connecting the carrier main shaft with the carrier base and/or the carrier upper base so as to enhance the stability of the carrier main shaft; the alignment fork assembly is arranged between the upper base of the carrier and the wafer carrying disc and used for passive alignment resetting of the wafer carrying disc.

Further, the bottom foot of the carrying platform comprises an air floating cushion, a threaded column, a clamp body, a hoop, an air nozzle, a sealing ring, a bearing steel ball, an air hole disc and an air source control assembly; the bearing steel ball sets up the inside central authorities of air supporting pad, the bottom of screw thread post is passed through the sealing washer setting and is in on the air supporting pad, clamp body screw thread cup joints on the screw thread post and height-adjustable, the lock ring cup joints to the department is used for the direct support and the spacing of external mechanism in the upper segment of clamp body periphery, the air cock is installed be used for pressure adjustment on the air supporting pad, it is a plurality of the setting of gas pocket dish equipartition is in the bottom of air supporting pad provides the pressure of blowing away to the below of air supporting pad through the suction nozzle in the air cock, provides the absorption atmospheric pressure to the below of air supporting pad through the suction nozzle in the air cock, controls the air pressure difference who blows away atmospheric pressure and absorption atmospheric pressure through air source control assembly and realizes the suspension support of wafer microscope carrier.

Furthermore, the air floatation cushion comprises a base body and a supporting ring seat which are integrally formed, and the supporting ring seat is convexly arranged on the top surface of the base body; a steel ball valve seat is arranged in the middle of the top surface of the boss-shaped base body; the base body is internally provided with a transverse air passage, a longitudinal inner air passage and a longitudinal outer air passage which are communicated, wherein the longitudinal outer air passage is provided with two air nozzles for mounting the two air nozzles, the longitudinal outer air passage correspondingly provided with the air blowing nozzles is communicated with a plurality of longitudinal air blowing passages which are sealed at the upper part and opened at the lower part, and the bottom opening of the longitudinal air blowing passage is provided with the air hole disc for providing positive pressure; the longitudinal outer air passage correspondingly provided with the air inlet nozzle is communicated with the plurality of longitudinal inner air passages and is used for providing negative pressure; and a sealing ring groove is formed in the bottom of the inner ring surface of the supporting ring seat and used for mounting a sealing ring.

Further, the main shaft of the carrying platform comprises a shaft body, a shaft sleeve, an air sealing ring, a motor and an end cover; the shaft body and the motor are sleeved in the shaft sleeve, and the shaft body is driven to move by the motor; the air sealing ring is sleeved on the shaft sleeve; the two end covers are arranged at the upper end of the shaft body and the lower end of the shaft sleeve; the wafer carrying disc is connected to the shaft body in a rotating mode through an end cover at the top end; the main shaft elastic support assembly is arranged on the shaft sleeve and an end cover at the bottom end of the shaft sleeve.

Further, the elastic support assembly of the spindle comprises an upper support piece and an elastic lower support piece; the upper supporting piece is arranged on the outer extending part of the shaft sleeve and is simultaneously connected with the upper base of the carrying platform; the elastic lower supporting piece is arranged between the bottom surface of the end cover at the lower part of the shaft sleeve and the bottom surface of the base of the carrying platform; the stable support of the main shaft of the carrying platform is realized through the upper support piece and the elastic lower support piece.

Furthermore, the wafer carrier also comprises a carrier outer end assembly and a carrier closing plate; the microscope carrier base comprises a microscope carrier upper base, a microscope carrier outer end assembly, a microscope carrier closing plate, an X-axis beam, a microscope carrier upper base and a microscope carrier outer end assembly, wherein the microscope carrier closing plate is connected with the microscope carrier upper base and the microscope carrier outer end assembly in a spanning mode from the top, the lower space is used for arranging the X-axis beam, and the microscope carrier upper base and the microscope carrier outer end assembly are oppositely arranged at the two longitudinal ends of the microscope carrier base.

Furthermore, two groups of beam stop air floating cushions are arranged on two opposite surfaces of the carrier upper seat and the carrier outer end assembly.

Furthermore, the wafer carrier further comprises two horizontal limiting members, and the two horizontal limiting members are arranged at two horizontal ends of the carrier base.

Compared with the prior art, the invention has the beneficial effects that: by the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspended manner to wait for detection or wait for processing, so that a high-precision suspension supporting effect is achieved, the precision and the stability of the carrying platform are ensured, and the wafer carrying platform is convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving platforms.

Drawings

FIG. 1 is a schematic view of one embodiment of a wafer carrier;

fig. 2 is a schematic view of another embodiment of a wafer carrier;

FIG. 3 is a schematic view of a wafer stage from one perspective;

FIG. 4 is a schematic view of a stage spindle and spindle spring support assembly;

FIG. 5 is a schematic view of a carrier foot assembly;

FIG. 6 is an exploded view of the carrier foot;

FIG. 7 is an angled cross-sectional view of an air bearing pad;

FIG. 8 is a cross-sectional view of an alternative angle of the air bearing pad;

FIG. 9 is a schematic view of another perspective of the stage foot;

FIG. 10 is a cross-sectional view of a threaded post;

FIG. 11 is a cross-sectional view of the clamp body;

fig. 12 is a cross-sectional view of a stage foot assembly;

in the figure:

300. a wafer carrier;

301. carrying platform footing; 1. an air-bearing cushion; 11. a base body; 12. a support ring seat; 13. a steel ball valve seat; 14. a transverse airway; 15. a longitudinal inner airway; 16. a longitudinal outer duct; 17. a longitudinal central airway; 18. a seal ring groove; 2. a threaded post; 21. a conical seat; 22. an external threaded section; 23. a necking section; 24. an outer adjustment head; 211. a conical steel ball cavity; 3. a clamp body; 31. a seat opening section; 32. an internal thread section; 33. an adjustment section; 311. a conical seat opening; 331. adjusting the clearance; 34. an outer stop ring; 35. an inner stop collar; 4. encircling; 41. an embracing gap; 42. screw holes; 43. a nut adjusting hole; 5. an air tap; 6. a seal ring; 7. bearing steel balls; 8. a vent disc;

302. a carrier base;

303. a carrying platform upper seat;

304. a stage main shaft; 3041. a shaft body; 3042. a shaft sleeve; 3043. sealing the air ring; 3044. an end cap;

305. a wafer carrying tray;

306. a carrier disc brake assembly;

307. a main shaft elastic supporting component; 3071. an upper support member; 3072. an elastic lower support member; 30721. a base adapter block; 30722. a cartridge clip; 30723. a spring plate;

308. a return fork assembly; .

309. A bearing platform outer end component; 3091. an outer end switching block; 3092. the beam is connected with an air floating cushion in a switching way;

3010. a stage closing plate;

3011. the crossbeam stops the air floating cushion;

3012. a lateral limit piece;

3013. vacuum brake assembly on the bottom surface of the carrier.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

First embodiment

Referring to fig. 1, a wafer stage 300 includes a stage foot 301, a stage base 302, a stage upper base 303, a stage spindle 304, a wafer carrier plate 305, a carrier plate brake assembly 306, a spindle resilient support assembly 307, and a centering fork assembly 308.

Arrangement relation: wherein the platform footing 301 is an air-float footing; the stage base 302 is floatingly or slidably supported on a frame (not shown) by a plurality of the stage feet 301; the stage upper base 303 is arranged on the stage base 302; the carrier spindle 304 is vertically arranged in bearing holes formed in the carrier base 302 and the carrier upper base 303; the middle of the bottom surface of the wafer carrier 305 is fixed to the top surface of the stage spindle 304; a plurality of disc brake assemblies 306 are arranged between the carrier upper base 303 and the wafer carrier disc 305 and used for braking the wafer carrier disc 305; the elastic spindle support assembly 307 is used for elastically connecting the stage spindle 304 with the stage base 302 and/or the stage upper base 303, so as to enhance the stability of the stage spindle 304; the alignment fork assembly 308 is disposed between the carrier upper base 303 and the wafer boat 305 for passive alignment return of the wafer boat 305.

Platform footing

Referring to fig. 5-12, the carrier foot 301 includes an air floating pad 1, a threaded post 2, a clamp body 3, a clamp ring 4, an air faucet 5, a seal ring 6, a bearing steel ball 7, an air vent disc 8, and an air source control assembly (not shown).

Connection relation: referring to fig. 6, 9 and 12, a bearing steel ball 7 is disposed in the center of the air floating pad 1, the bottom of the threaded column 2 is disposed on the air floating pad 1 through a seal ring 6, the clamp body 3 is in threaded sleeve connection with the threaded column 2 and is adjustable in height, the hoop 4 is in sleeve connection with the upper peripheral section of the clamp body 3 for direct support and limiting of an external mechanism, the air nozzle 5 is mounted on the air floating pad 1 for pressure adjustment, a plurality of air hole discs 8 are uniformly disposed at the bottom of the air floating pad 1, blow-off air pressure is provided to the lower side of the air floating pad 1 through an air inlet nozzle in the air nozzle 5, adsorption air pressure is provided to the lower side of the air floating pad 1 through an air suction nozzle in the air nozzle 5, and the air pressure difference between the blow-off air pressure and the adsorption air pressure is controlled by an air source control assembly to achieve suspension support of the wafer carrier 300.

Referring to fig. 7, 8 and 12, the air bearing pad 1 includes a base body 11 and a support ring seat 12, which are integrally formed, wherein the support ring seat 12 is convexly disposed on the top surface of the base body 11; a steel ball valve seat 13 is arranged in the middle of the top surface of the boss-shaped base body 11; a transverse air passage 14, a longitudinal inner air passage 15 and a longitudinal outer air passage 16 which are communicated are arranged in the base body 11, wherein two air nozzles 5 are arranged on the longitudinal outer air passage 16, the longitudinal outer air passage 16 on which the air blowing nozzles are correspondingly arranged is communicated with a plurality of longitudinal air blowing passages which are sealed at the upper part and opened at the lower part, and the air hole disc 8 is arranged at the bottom opening of the longitudinal air blowing passages and is used for providing positive pressure; the longitudinal outer air passage 16 correspondingly provided with the air inlet nozzle is communicated with the plurality of longitudinal inner air passages 15 and is used for providing negative pressure; and a sealing ring groove 18 is formed at the bottom of the inner ring surface of the supporting ring seat 12 and used for installing the sealing ring 6.

Furthermore, a longitudinal central air passage 17 is formed below the steel ball valve seat 13 and is used for providing negative pressure for the bearing steel ball 7.

Referring to fig. 6 and 10, the threaded column 2 comprises a conical seat 21, an external threaded section 22, a necking section 23 and an external adjusting head 24 which are integrally formed, a conical steel ball cavity 211 is formed in the middle of the bottom surface of the conical seat 21 upwards, and the conical steel ball cavity 211 and the steel ball valve seat 13 of the air bearing cushion 1 form a containing cavity for the bearing steel ball 7 together; the outer adjustment head 24 comprises an adjustment structure protruding out of the top of the neck section 23 or an adjustment structure recessed into the top of the neck section 23.

Further, the outer adjusting head 24 is in the form of an adjusting structure protruding out of the top of the neck section 23, such as a nut; the outer adjusting head 24 is an adjusting structure recessed in the top of the necking section 23, such as a groove, a cross groove, a triangular groove, an inner hexagon, etc.

Wherein, referring to fig. 6, 11 and 12, the band body 3 includes a seat section 31, an internal thread section 32 and an adjusting section 33 which are integrally formed; a conical seat opening 311 matched with the conical seat 21 of the threaded column 2 is formed on the inner side surface of the seat opening section 31; the internal thread of the internal thread section 32 is matched with the external thread section 22 of the threaded column 2; the adjusting section 33 is formed into an elastic adjusting part by forming adjusting gaps 331 which are uniformly distributed in the axial direction, and the adjusting section 33 realizes radial adjustment through the expansion and contraction of the adjusting gaps 331; the outer peripheral surface of the internal thread section 32 adjacent to the adjusting section 33 is convexly formed into an outer stop ring 34 for the lower positioning of the clasp 4.

Further, the inner diameter of the adjusting section 33 is smaller than that of the inner thread section 32, so that an inner stop shoulder 35 is formed at the abutment of the two.

Referring to fig. 5, 6 and 12, a hoop gap 41 is formed on an annular section of the hoop 4, and a screw hole 42 and a nut adjusting hole 43 are formed through two hoop ends, which are butted with the hoop gap 41, so that the locking degree of the hoop 4 is adjusted by a bolt.

Carrying platform main shaft

Referring to fig. 4, the stage spindle 304 includes a shaft body 3041, a shaft sleeve 3042, an air seal ring 3043, a motor (not shown), and an end cover 3044; the shaft body 3041 and the motor are sleeved in the shaft sleeve 3042, and the shaft body 3041 is driven to move by the motor; the air sealing ring 3043 is sleeved on the shaft sleeve 3042; the two end covers 3044 are disposed on the upper end of the shaft body 3041 and the lower end of the shaft sleeve 3042; the wafer carrier 305 is connected to the shaft 3041 through an end cap 3044; the main shaft elastic supporting assembly 307 is disposed on the shaft sleeve 3042 and an end cover 3044 at the bottom end of the shaft sleeve 3042.

Referring to fig. 4, the spindle elastic support assembly 307 includes an upper support 3071 and an elastic lower support 3072; the upper supporting piece 3071 is arranged on an extending part of the shaft sleeve 3042, and the upper supporting piece 3071 is connected with the platform deck upper base 303 at the same time; the elastic lower support 3072 is arranged between the bottom surface of the end cover 3044 at the lower part of the shaft sleeve 3042 and the bottom surface of the platform base 302; stable support of the stage spindle 304 is achieved by the upper support 3071 and the elastic lower support 3072.

Wherein, the elastic lower supporting piece 3072 comprises a base adapter block 30721, a spring piece clip 30722 and a spring piece 30723; the elastic sheet 30723 is horizontally arranged, the inner end of the elastic sheet is connected to the end cover 3044 at the lower part of the carrier spindle 304, and the outer end of the elastic sheet is clamped and fixed by the elastic sheet clamp 30722; the upper end of the spring plate clip 30722 is connected and fixed with the base adapter block 30721, and the upper part of the base adapter block 30721 is fixed on the carrier base 302.

The spindle elastic support assembly 307 includes a plurality of elastic lower support members 3072; preferably two groups.

Further, the wafer stage 300 further includes two lateral position-limiting members 3012, where the two lateral position-limiting members 3012 are disposed at two lateral ends of the stage base 302.

Second embodiment

Referring to fig. 2 and 3, wafer carrier 300 further includes a carrier outer end assembly 309 and a carrier closure plate 3010; the stage closing plate 3010 is connected to the stage upper base 303 and the stage outer end assembly 309 in a straddling manner from the top, the lower space is used for arranging an X-axis beam, and the stage upper base 303 and the stage outer end assembly 309 are oppositely arranged at two longitudinal ends of the stage base 302.

The outer end assembly 309 of the carrier includes an outer end adapter 3091 and a beam adapter air pad 3092. The bottom surface of the outer end transfer block 3091 is higher than the bottom surface of the stage base 302.

Two sets of beam stop air-floating pads 3011 are disposed on two opposite surfaces of the stage upper base 303 and the stage outer end assembly 309 for supporting two side edges of the X-axis beam.

Further, the wafer carrier 300 further comprises a carrier bottom surface vacuum brake component 3013, the carrier bottom surface vacuum brake component 3013 is arranged on the bottom surface of the carrier base 301, and when the overall brake of the wafer carrier 300 is required, the carrier bottom surface vacuum brake component 3013 generates vacuum negative pressure to adsorb the surface of a machine table or a rack on the bottom surface of the carrier, so that the wafer carrier 300 is positioned and braked; conversely, the brake is canceled by breaking the vacuum.

The carrying platform can be used for high-precision supporting of wafers and other similar plate products, and can be applied to high-precision detection and processing machines, such as machines of quantity detection machines of semiconductor wafers and photovoltaic wafers, high-precision measuring mechanisms, three-coordinate measuring machines and the like, so that stable supporting, vibration absorbing and positioning effects are improved.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A wafer carrier is characterized in that: the wafer carrier (300) comprises a carrier foot (301), a carrier base (302), a carrier upper base (303), a carrier spindle (304), a wafer carrier disc (305), a carrier disc brake assembly (306), a spindle elastic support assembly (307) and a centering fork assembly (308);

wherein the carrier footing (301) adopts an air-float foot margin;

the stage base (302) is floatingly or slidingly supported on a frame by a plurality of the stage feet (301); the stage upper base (303) is arranged on the stage base (302);

the carrier spindle (304) is vertically arranged in bearing holes formed in the carrier base (302) and the carrier upper base (303);

the middle of the bottom surface of the wafer carrier plate (305) is fixed to the top surface of the carrier spindle (304);

a plurality of carrier disc brake assemblies (306) are arranged between the carrier upper base (303) and the wafer carrier disc (305) and used for braking the wafer carrier disc (305);

the main shaft elastic support assembly (307) is used for elastically connecting the stage main shaft (304) with the stage base (302) and/or the stage upper base (303) so as to enhance the stability of the stage main shaft (304);

the alignment fork assembly (308) is arranged between the carrier upper base (303) and the wafer carrying disc (305) and is used for passive alignment resetting of the wafer carrying disc (305).

2. The wafer carrier of claim 1, wherein: the carrier foot (301) comprises an air floating cushion (1), a threaded column (2), a hoop body (3), an embracing ring (4), an air tap (5), a sealing ring (6), a bearing steel ball (7), an air hole disc (8) and an air source control assembly; the bearing steel balls (7) are arranged in the center of the inner part of the air floating cushion (1), the bottom of the threaded column (2) is arranged on the air floating cushion (1) through a sealing ring (6), the clamp body (3) is sleeved on the threaded column (2) in a threaded manner and has adjustable height, the hoop (4) is sleeved at the upper section of the periphery of the hoop body (3) and is used for directly supporting and limiting an external mechanism, the air tap (5) is arranged on the air floating cushion (1) and used for pressure adjustment, a plurality of air hole discs (8) are uniformly distributed at the bottom of the air floating cushion (1), blowing-off air pressure is provided to the lower part of the air floating cushion (1) through an air inlet nozzle in the air nozzle (5), the air suction nozzle in the air nozzle (5) provides adsorption air pressure to the lower part of the air floating cushion (1), the air pressure difference between the blowing air pressure and the adsorption air pressure is controlled by the air source control assembly to realize the suspension support of the wafer carrier (300).

3. The wafer carrier as recited in claim 2, wherein: the air floating cushion (1) comprises a base body (11) and a supporting ring seat (12) which are integrally formed, wherein the supporting ring seat (12) is convexly arranged on the top surface of the base body (11); a steel ball valve seat (13) is arranged in the middle of the top surface of the boss-shaped base body (11); the base body (11) is internally provided with a transverse air passage (14), a longitudinal inner air passage (15) and a longitudinal outer air passage (16) which are communicated, wherein the longitudinal outer air passage (16) is provided with two air nozzles (5), the longitudinal outer air passage (16) correspondingly provided with air blowing nozzles is communicated with a plurality of longitudinal air blowing passages which are sealed at the upper part and opened at the lower part, and the bottom opening of the longitudinal air blowing passage is provided with the air hole disc (8) for providing positive pressure; the longitudinal outer air passage (16) correspondingly provided with the air inlet nozzle is communicated with the longitudinal inner air passages (15) and is used for providing negative pressure; and a sealing ring groove (18) is formed in the bottom of the inner ring surface of the support ring seat (12) and used for mounting a sealing ring (6).

4. The wafer carrier as recited in claim 1, wherein: the carrier spindle (304) comprises a shaft body (3041), a shaft sleeve (3042), an air sealing ring (3043), a motor and an end cover (3044); the shaft body (3041) and the motor are sleeved in the shaft sleeve (3042), and the shaft body (3041) is driven to move through the motor; the air sealing ring (3043) is sleeved on the shaft sleeve (3042); the two end covers (3044) are arranged at the upper end of the shaft body (3041) and the lower end of the shaft sleeve (3042); the wafer carrying disc (305) is connected to the shaft body (3041) through an end cover (3044) at the top end; the main shaft elastic support assembly (307) is arranged on the shaft sleeve (3042) and an end cover (3044) at the bottom end of the shaft sleeve (3042).

5. The wafer carrier as claimed in claim 1 or 4, characterized in that: the main shaft elastic supporting assembly (307) comprises an upper supporting piece (3071) and an elastic lower supporting piece (3072); the upper supporting piece (3071) is arranged on the outer extension part of the shaft sleeve (3042), and the upper supporting piece (3071) is simultaneously connected with the carrier upper base (303); the elastic lower support piece (3072) is arranged between the bottom surface of the end cover (3044) at the lower part of the shaft sleeve (3042) and the bottom surface of the platform deck base (302); the stable support of the stage spindle (304) is achieved by the upper support member (3071) and the elastic lower support member (3072).

6. The wafer carrier as claimed in claim 5, wherein: the elastic lower support part (3072) comprises a base adapter block (30721), a spring plate clip (30722) and a spring plate (30723); the elastic sheet (30723) is horizontally arranged, the inner end of the elastic sheet is connected to an end cover (3044) at the lower part of the carrier spindle (304), and the outer end of the elastic sheet is clamped and fixed by the elastic sheet clamp (30722); the upper end of the elastic sheet clamp (30722) is connected and fixed with the base transfer block (30721), and the upper part of the base transfer block (30721) is fixed on the carrier base (302).

7. The wafer carrier as claimed in claim 5, wherein: the spindle elastic support assembly (307) includes a plurality of the elastic lower supports (3072).

8. The wafer carrier of claim 1, wherein: the wafer carrier (300) further comprises a carrier outer end assembly (309) and a carrier closing plate (3010); the carrier closing plate (3010) is connected to the carrier upper base (303) and the carrier outer end assembly (309) in a spanning mode from the top, the lower space is used for arranging an X-axis beam, and the carrier upper base (303) and the carrier outer end assembly (309) are oppositely arranged at two longitudinal ends of the carrier base (302).

9. The wafer carrier of claim 8, wherein: two groups of beam stop air floating pads (3011) are arranged on two opposite surfaces of the carrier upper seat (303) and the carrier outer end assembly (309).

10. The wafer carrier of claim 9, wherein: the wafer carrier (300) further comprises transverse limiting pieces (3012), and the two transverse limiting pieces (3012) are arranged at two transverse ends of the carrier base (302).