CN114675510A - Wafer placing device of photoetching machine - Google Patents
Wafer placing device of photoetching machine Download PDFInfo
- Publication number
- CN114675510A CN114675510A CN202210595922.6A CN202210595922A CN114675510A CN 114675510 A CN114675510 A CN 114675510A CN 202210595922 A CN202210595922 A CN 202210595922A CN 114675510 A CN114675510 A CN 114675510A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- conveying mechanism
- disposed
- lithography
- photoetching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer placing device of a photoetching machine, which relates to the technical field of photoetching machines and comprises a box body, a first conveying mechanism, a second conveying mechanism, a photoetching module and a silicon wafer supporting mechanism, wherein a photoetching chamber and a conveying chamber are arranged inside the box body, the first conveying mechanism is arranged in the photoetching chamber, at least part of the first conveying mechanism extends out of the box body, the second conveying mechanism is arranged in the conveying chamber, part of the second conveying mechanism extends out of the box body, the photoetching module is arranged in the photoetching chamber and is positioned on the inner wall of the upper side of the box body, and the first conveying mechanism and the second conveying mechanism are respectively provided with the silicon wafer supporting mechanism in a sliding mode and are used for carrying silicon wafers. According to the invention, the box body can be directly loaded and unloaded outside the box body, the box body does not need to be opened, the continuous work of the photoetching machine can be realized, the detection of the integrity of the silicon wafer can be realized, the silicon wafer with worn surface or incomplete surface can be automatically removed, and the processing quality can be ensured.
Description
Technical Field
The invention relates to the technical field of photoetching machines, in particular to a wafer placing device of a photoetching machine.
Background
A lithography machine, also called a mask alignment exposure machine, an exposure system, a lithography system, etc., is a core equipment for manufacturing a chip. It uses the technology similar to photo printing to print the fine pattern on the mask plate on the silicon chip by the exposure of light.
However, the existing lithography machine usually needs to open the cabinet door before each detection to put in the wafer, then close the cabinet door to perform the lithography operation, and after the lithography operation is completed, the cabinet door needs to be opened again, the photo-etched wafer silicon wafer is taken out, then the wafer to be photo-etched is put in, and the above operations are repeated, which is troublesome to operate, and the lithography machine cannot continuously perform the operation.
Disclosure of Invention
The invention aims to provide a wafer placing device of a photoetching machine, which is used for solving the technical problem.
The technical scheme adopted by the invention is as follows: the utility model provides a photoetching machine put wafer device, includes box, first conveying mechanism, second conveying mechanism, photoetching module and silicon chip supporting mechanism, the inside of box is equipped with photoetching room and delivery room, first conveying mechanism locates in the photoetching room, and at least part stretches out the box, second conveying mechanism locates in the delivery room to some stretches out the box, photoetching module locates in the photoetching room and be located on the upside inner wall of box, first conveying mechanism and be equipped with one on the second conveying mechanism respectively slidable silicon chip supporting mechanism for the delivery the silicon chip.
Preferably, the first conveying mechanism comprises two first sliding rails arranged in parallel and a first sliding block arranged on each first sliding rail, and one end of each first sliding rail extends out of the box body.
Preferably, the second conveying mechanism includes two second slide rails arranged side by side and a second slide block arranged on each of the second slide rails, wherein the first slide block and the second slide block are respectively connected to one of the silicon wafer supporting mechanisms.
As a further preferred option, still including rejecting the mechanism, it locates to reject the mechanism in the lithography chamber, it includes collection box, first electric telescopic handle, third slide rail and first sucking disc to reject the mechanism, the third slide rail is located on the upside inner wall of box, and be located the lithography module is kept away from one side of transport chamber, be equipped with on the third slide rail first electric telescopic handle, first electric telescopic handle's lower extreme is equipped with first sucking disc, be equipped with on one side outer wall of box the collection box, the recovery mouth has been seted up to one side of box, the collection box with recovery mouth intercommunication.
Preferably, the photoetching machine further comprises a material guide plate, the material guide plate is arranged in the photoetching chamber, one side of the material guide plate abuts against one side of the bottom wall of the recovery port, and the height of the other side of the material guide plate is higher than that of one side of the material guide plate.
Preferably, a silicon wafer detection station and a silicon wafer processing station are arranged in the photoetching chamber, the removing mechanism is located at the silicon wafer detection station, and the photoetching module is located at the silicon wafer processing station.
Preferably, the silicon wafer detection device further comprises cameras, wherein the cameras are arranged at the bottom and the top of the silicon wafer detection station and are used for detecting the integrity of the silicon wafer.
Preferably, the lithography system further comprises a first sensor, wherein the first sensor is arranged in the lithography chamber and is positioned right below the lithography module.
As a further preferred option, the silicon wafer processing device further comprises a third conveying mechanism, the third conveying mechanism comprises a third guide rail and a third sliding block arranged on the third guide rail, one end of the third guide rail is located in the conveying chamber, a linear motor is arranged at one end of the third guide rail, the other end of the third guide rail extends into the silicon wafer processing station, a silicon wafer supporting mechanism is further arranged on the third guide rail, and the linear motor drives the silicon wafer supporting mechanism.
Preferably, the conveying device further comprises a conveying module, the conveying mechanism is arranged above the second conveying mechanism, the conveying module comprises a fourth sliding rail arranged in the conveying chamber, a second electric telescopic rod is arranged on the fourth sliding rail, a second sucking disc is arranged at the lower end of the second electric telescopic rod, and a first driving motor used for driving the second electric telescopic rod to slide is arranged on one side of the fourth sliding rail.
The technical scheme has the following advantages or beneficial effects: (1) according to the invention, through the arrangement of the first conveying mechanism, the second conveying mechanism and the third conveying mechanism, the materials can be directly loaded and unloaded outside the box body, the box body does not need to be opened, and the continuous work of the photoetching machine can be realized; (2) according to the invention, the detection of the integrity of the silicon wafer can be realized, the silicon wafer with worn or incomplete surface can be automatically removed, only the intact silicon wafer is reserved for photoetching, and the processing quality can be ensured.
Drawings
FIG. 1 is a schematic view of a first perspective view of a wafer placing apparatus of a lithography machine according to the present invention;
FIG. 2 is a schematic diagram of a second perspective view of a wafer placing apparatus of the lithography machine according to the present invention;
FIG. 3 is a first schematic structural diagram of the interior of a wafer placing device of a lithography machine according to the present invention;
FIG. 4 is a second schematic structural view of the interior of the wafer placing device of the lithography machine according to the present invention;
FIG. 5 is a third schematic view of the internal structure of the wafer placing device of the lithography machine according to the present invention;
FIG. 6 is a fourth schematic structural view of the interior of the wafer placing device of the lithography machine according to the present invention;
FIG. 7 is a fifth schematic view of the interior of the wafer placing device of the lithography machine according to the present invention;
FIG. 8 is a schematic structural view of a silicon wafer support mechanism according to the present invention.
In the figure: 1. a box body; 2. a first conveying mechanism; 201. a first slide rail; 3. a second conveying mechanism; 301. a second slide rail; 4. a lithography module; 6. a silicon wafer supporting mechanism; 601. an outer frame; 602. a gasket support module; 7. a rejection mechanism; 701. a recycling bin; 702. a first electric telescopic rod; 703. a third slide rail; 704. a first suction cup; 705. a recovery port; 706. a material guide plate; 8. a camera; 9. a third conveying mechanism; 901. a third guide rail; 902. a linear motor; 10. a carrying module; 101. a fourth slide rail; 102. a second electric telescopic rod; 103. a second suction cup; 11. a base plate; 12. a controller; 121. a display; 122. an indicator light; 123. a start button; 124. a stop button.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic view of a first perspective view of a wafer placing apparatus of a lithography machine according to the present invention; FIG. 2 is a schematic diagram of a second perspective view of a wafer placing apparatus of the lithography machine according to the present invention; FIG. 3 is a first schematic structural diagram of the interior of a wafer placing device of a lithography machine according to the present invention; FIG. 4 is a second schematic structural view of the interior of the wafer placing device of the lithography machine according to the present invention; FIG. 5 is a third schematic view of the internal structure of the wafer placing device of the lithography machine according to the present invention; FIG. 6 is a fourth schematic structural view of the interior of the wafer placing device of the lithography machine according to the present invention; FIG. 7 is a fifth schematic view of the interior of the wafer placing device of the lithography machine according to the present invention; FIG. 8 is a schematic structural view of a silicon wafer support mechanism according to the present invention. Referring to fig. 1-8, a preferred embodiment is shown, which illustrates a wafer placing device of a lithography machine, including a box 1, a first conveying mechanism 2, a second conveying mechanism 3, a lithography module 4 and a silicon wafer supporting mechanism 6, wherein a lithography chamber and a conveying chamber are arranged inside the box 1, the first conveying mechanism 2 is arranged in the lithography chamber, and at least a part of the first conveying mechanism extends out of the box 1, the second conveying mechanism 3 is arranged in the conveying chamber, and a part of the second conveying mechanism extends out of the box 1, the lithography module 4 is arranged in the lithography chamber and is located on an upper inner wall of the box 1, and the first conveying mechanism 2 and the second conveying mechanism 3 are respectively provided with a silicon wafer supporting mechanism 6 in a sliding manner for carrying silicon wafers. In this embodiment, as shown in fig. 1, a bottom plate 11 is disposed at the bottom of the box 1 for supporting the box 1, wherein the first conveying mechanism 2 and the second conveying mechanism 3 are both provided with a silicon wafer supporting mechanism 6 for fixing and carrying a silicon wafer, the silicon wafer supporting mechanism 6 on the first conveying mechanism 2 is used for conveying the silicon wafer into the photolithography chamber for silicon wafer integrity detection and photolithography processing, the second conveying mechanism 3 is used for conveying the silicon wafer after photolithography out of the box 1, a worker can complete loading and unloading of the silicon wafer outside the box 1, and continuous operation can be achieved without opening the box 1 for loading or unloading. And the silicon wafer after photoetching enters the conveying chamber. Wherein, the silicon wafer supporting mechanism 6 can be used for placing silicon wafers with different sizes. The lithography module 4 in this embodiment is of a conventional structure and will not be described in detail herein.
Further, as a preferred embodiment, the first conveying mechanism 2 includes two first sliding rails 201 arranged in parallel and a first sliding block arranged on each first sliding rail 201, and one end of each first sliding rail 201 extends out of the box body 1.
Further, as a preferred embodiment, the second conveying mechanism 3 includes two second slide rails 301 disposed side by side and a second slide block disposed on each second slide rail 301, wherein the first slide block and the second slide block are respectively connected to a silicon wafer supporting mechanism 6. In this embodiment, the axis of the second slide rail 301 coincides with the axis of the first slide rail 201, and a third conveying mechanism 9 is disposed between the first slide rail 201 and the second slide rail 301, wherein the first motors are disposed on the side edges of the first slide rail 201 and the second slide rail 301, and are used for driving the silicon wafer supporting mechanisms 6 on the first slide rail 201 and the second slide rail 301 to slide. The silicon wafer supporting mechanism 6 in this embodiment is slidably connected to the first slide rail 201 through the first slider, and slidably connected to the second slide rail 301 through the second slider.
Further, as a preferred embodiment, the device further comprises a removing mechanism 7, the removing mechanism 7 is disposed in the photolithography chamber, the removing mechanism 7 comprises a recycling bin 701, a first electric telescopic rod 702, a third sliding rail 703 and a first suction disc 704, the third sliding rail 703 is disposed on an inner wall of an upper side of the box body 1 and is located on one side, far away from the conveying chamber, of the photolithography module 4, the first electric telescopic rod 702 is disposed on the third sliding rail 703, the first suction disc 704 is disposed at a lower end of the first electric telescopic rod 702, the recycling bin 701 is disposed on an outer wall of one side of the box body 1, a recycling port 705 is disposed on one side of the box body 1, and the recycling bin 701 is communicated with the recycling port 705. In this embodiment, a second motor is disposed on one side of the third slide rail 703, and is used for the first electric telescopic rod 702 to slide along the third slide rail 703. The removing mechanism 7 is used for removing the silicon wafer which is incomplete or has a damaged surface, and when the silicon wafer is detected to be incomplete or the surface has a damaged surface, the first electric telescopic rod 702 drives the first suction disc 704 to move downwards and suck the silicon wafer. Then the second motor drives the first electric telescopic rod 702 to drive the damaged silicon wafer to move to the recovery opening 705, then the first sucker 704 loosens the silicon wafer, so that the silicon wafer enters the recovery box 701, and the complete silicon wafer enters the silicon wafer supporting mechanism 6 on the third conveying mechanism 9 under the action of the first sucker 704. The third slide rail 703 in this embodiment is provided along the width direction of the box body 1.
Further, as a preferred embodiment, the photolithography room further includes a material guiding plate 706, the material guiding plate 706 is disposed in the photolithography room, one side of the material guiding plate 706 abuts against one side of the bottom wall of the recycling port 705, and the height of the other side of the material guiding plate 706 is higher than the height of one side of the material guiding plate 706. In this embodiment, the material guide plate 706 is provided to facilitate the damaged silicon wafer to slide into the recycling bin 701. The material guide plate 706 is disposed in an inclined manner, so that the silicon wafers can conveniently enter the recycling bin 701.
Further, as a preferred embodiment, a silicon wafer detection station and a silicon wafer processing station are arranged in the photoetching chamber, the removing mechanism 7 is located in the silicon wafer detection station, and the photoetching module 4 is located in the silicon wafer processing station.
Further, as a preferred embodiment, the silicon wafer detection device further comprises a camera 8, and the cameras 8 are arranged at the bottom and the top of the silicon wafer detection station and used for detecting the integrity of the silicon wafer. In this embodiment, as shown in fig. 5, when the silicon wafer enters the silicon wafer detection station, the camera 8 automatically takes a picture and uploads the integrity of the identified silicon wafer, if the silicon wafer is intact, the first chuck 704 moves the silicon wafer into the silicon wafer supporting mechanism 6 on the third conveying mechanism 9, and the third conveying mechanism 9 moves the intact silicon wafer to the silicon wafer processing station for photolithography processing. When the silicon wafer leaves the silicon wafer supporting mechanism 6 on the first conveying mechanism 2, the first conveying mechanism 2 can drive the silicon wafer supporting mechanism 6 on the first conveying mechanism to leave the box body 1, and the silicon wafer to be processed can be placed continuously.
Further, as a preferred embodiment, the lithography apparatus further comprises a first sensor, and the first sensor is disposed in the lithography chamber and located right below the lithography module 4. In this embodiment, the first sensor is configured to detect a position of the silicon wafer, and when the third conveying mechanism 9 moves the silicon wafer to a specified position in the silicon wafer processing station, the third conveying mechanism 9 stops operating, and the photolithography module 4 starts performing photolithography processing on the silicon wafer. After the photolithography is completed, the third conveying mechanism 9 moves the silicon wafer into the conveying chamber.
Further, as a preferred embodiment, the silicon wafer processing system further includes a third conveying mechanism 9, the third conveying mechanism 9 includes a third guide rail 901 and a third slider disposed on the third guide rail 901, one end of the third guide rail 901 is located in the conveying chamber, one end of the third guide rail 901 is provided with a linear motor 902, the other end of the third guide rail 901 extends into the silicon wafer processing station, the third guide rail 901 is further provided with a silicon wafer supporting mechanism 6, and the linear motor 902 drives the silicon wafer supporting mechanism 6. In this embodiment, as shown in fig. 3, the third conveying mechanism 9 is used for conveying the complete silicon wafer to the silicon wafer processing station, and conveying the processed silicon wafer to the conveying chamber, and the silicon wafer in the conveying chamber enters the silicon wafer supporting mechanism 6 on the second conveying mechanism 3 under the action of the carrying mechanism, and leaves the box 1 under the action of the second conveying mechanism 3. The linear motor 902 can drive the silicon wafer supporting mechanism 6 on the third conveying mechanism 9 to reciprocate.
Further, as a preferred embodiment, the conveying device further comprises a conveying module 10, the conveying device is arranged above the second conveying device 3, the conveying module 10 comprises a fourth slide rail 101 arranged in the conveying chamber, the fourth slide rail 101 is arranged on the inner wall of the upper side of the box body 1, a second electric telescopic rod 102 is arranged on the fourth slide rail 101, a second suction cup 103 is arranged at the lower end of the second electric telescopic rod 102, and a first driving motor for driving the second electric telescopic rod 102 to slide is arranged on one side of the fourth slide rail 101. In this embodiment, the conveying mechanism is used for moving the silicon wafer in the conveying chamber into the silicon wafer supporting mechanism 6 on the second conveying mechanism 3. The first driving motor can drive the second electric telescopic rod 102 to slide along the fourth slide rail 101, the fourth slide rail 101 is arranged along the direction from the photoetching chamber to the conveying chamber (the length direction of the box body 1), the second electric telescopic rod 102 can drive the second sucker 103 to move up and down, and the second sucker 103 is used for sucking silicon wafers. In this embodiment, the first suction cup 704 and the second suction cup 103 are both vacuum cups, and suction pipes are disposed above the first suction cup 704 and the second suction cup 103. In this embodiment, the first electric telescopic rod 702 and the second electric telescopic rod 102 are respectively connected to the corresponding sliding rails through a connecting base.
In this embodiment, still include second sensor and third sensor, wherein, be equipped with second sensor and third sensor in the transfer room, second sensor and third sensor all locate the bottom of transfer room, wherein, the second sensor is used for detecting the silicon chip in the silicon chip supporting mechanism 6 on the second conveying mechanism 3, when the second sensor detects the silicon chip, second conveying mechanism 3 automatic drive silicon chip supporting mechanism 6 drives the silicon chip and leaves box 1, after the completion of unloading of silicon chip, second conveying mechanism 3 drives the silicon chip supporting mechanism 6 on it and enters into the transfer room once more. The third sensor is used for detecting the silicon wafers in the silicon wafer supporting mechanism 6 on the third conveying mechanism 9, when the third sensor detects the silicon wafers, the third conveying mechanism 9 stops acting, and the conveying mechanism automatically conveys the silicon wafers to the second conveying mechanism 3. When the carrying mechanism carries the silicon wafer from the third conveying mechanism 9 to the second conveying mechanism 3, the third conveying mechanism 9 automatically drives the silicon wafer supporting mechanism 6 thereon to enter the silicon wafer processing station.
In this embodiment, as shown in fig. 1, a controller 12 is disposed on an outer side wall of the box 1, the controller 12 includes a display 121, an indicator 122 is disposed on a lower side of the display 121, and a start button 123 and a stop button 124 are disposed on two sides of the display 121. The first motor, the second motor, the first electric telescopic rod 702, the second electric telescopic rod 102, the camera 8, the first sensor, the photolithography module 4, the linear motor 902, the first driving motor, the second sensor, the third sensor and the like are all connected with the controller 12, and the operation of the device is controlled by the controller 12. Indicator light 122 is used to indicate the operating status of the device, start button 123 is used to control the device to start, and stop button 124 is used to control the device to stop.
In this embodiment, each silicon wafer supporting mechanism 6 includes an outer frame 601, the outer frame is rectangular, and a gasket supporting module 602 is disposed at each corner inside the outer frame 601, wherein each gasket supporting module 602 is disposed in a step shape, as shown in fig. 8. The silicon wafer supporting mechanism 6 is in a step shape and is provided with a plurality of supporting surfaces, and can adapt to silicon wafers with different sizes.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a photoetching machine put wafer device which characterized in that, includes box, first conveying mechanism, second conveying mechanism, photoetching module and silicon chip supporting mechanism, the inside of box is equipped with photoetching room and delivery room, first conveying mechanism locates in the photoetching room, and at least part stretches out the box, second conveying mechanism locates in the delivery room to partly stretch out the box, the photoetching module is located in the photoetching room and be located on the upside inner wall of box, first conveying mechanism and be equipped with one on the second conveying mechanism respectively slidable silicon chip supporting mechanism for the delivery the silicon chip.
2. The wafer placing device of the lithography machine according to claim 1, wherein the first conveying mechanism comprises two first slide rails arranged in parallel and a first slide block arranged on each first slide rail, and one end of each of the two first slide rails extends out of the box body.
3. The wafer placing device of the lithography machine according to claim 2, wherein the second conveying mechanism comprises two second slide rails arranged side by side and a second slide block arranged on each second slide rail, wherein the first slide block and the second slide block are respectively connected with one silicon wafer supporting mechanism.
4. The wafer placing device of the lithography machine according to claim 2, further comprising a removing mechanism, wherein the removing mechanism is disposed in the lithography chamber, the removing mechanism comprises a recycling bin, a first electric telescopic rod, a third slide rail and a first suction cup, the third slide rail is disposed on an inner wall of an upper side of the box body and is located on a side of the lithography module away from the conveying chamber, the first electric telescopic rod is disposed on the third slide rail, the first suction cup is disposed at a lower end of the first electric telescopic rod, the recycling bin is disposed on an outer wall of one side of the box body, a recycling opening is disposed on one side of the box body, and the recycling bin is communicated with the recycling opening.
5. The wafer placing device of the lithography machine according to claim 4, further comprising a material guiding plate, wherein the material guiding plate is disposed in the lithography chamber, one side of the material guiding plate abuts against one side of the bottom wall of the recovery opening, and the height of the other side of the material guiding plate is higher than the height of one side of the material guiding plate.
6. The wafer placing device of the lithography machine as claimed in claim 4, wherein a silicon wafer detection station and a silicon wafer processing station are arranged in the lithography chamber, the removing mechanism is located at the silicon wafer detection station, and the lithography module is located at the silicon wafer processing station.
7. The wafer placing device of the lithography machine as claimed in claim 6, further comprising a camera, wherein the camera is arranged at the bottom and the top of the silicon wafer detection station and is used for detecting the integrity of the silicon wafer.
8. The wafer placing device of the lithography machine as claimed in claim 7, further comprising a first sensor, wherein the first sensor is disposed in the lithography chamber, and the first sensor is located directly below the lithography module.
9. The wafer placing device of the lithography machine according to claim 6, further comprising a third conveying mechanism, wherein the third conveying mechanism comprises a third guide rail and a third slider arranged on the third guide rail, one end of the third guide rail is located in the conveying chamber, one end of the third guide rail is provided with a linear motor, the other end of the third guide rail extends into the silicon wafer processing station, the third guide rail is further provided with the silicon wafer supporting mechanism, and the linear motor drives the silicon wafer supporting mechanism.
10. The wafer placing device of the lithography machine according to claim 1, further comprising a carrying module, wherein the carrying mechanism is disposed above the second conveying mechanism, the carrying module includes a fourth slide rail disposed in the conveying chamber, a second electric telescopic rod is disposed on the fourth slide rail, a second suction cup is disposed at a lower end of the second electric telescopic rod, and a first driving motor for driving the second electric telescopic rod to slide is disposed at one side of the fourth slide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210595922.6A CN114675510A (en) | 2022-05-30 | 2022-05-30 | Wafer placing device of photoetching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210595922.6A CN114675510A (en) | 2022-05-30 | 2022-05-30 | Wafer placing device of photoetching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114675510A true CN114675510A (en) | 2022-06-28 |
Family
ID=82079514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210595922.6A Pending CN114675510A (en) | 2022-05-30 | 2022-05-30 | Wafer placing device of photoetching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114675510A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510516A (en) * | 2002-08-30 | 2004-07-07 | Asml荷兰有限公司 | Photoetching device, manufacturing method for the component and component therefrom |
| CN204230217U (en) * | 2014-11-18 | 2015-03-25 | 天津中环领先材料技术有限公司 | A kind of Novel silicon slice cleaning basket |
| CN207852633U (en) * | 2017-11-29 | 2018-09-11 | 南通苏民新能源科技有限公司 | A kind of PECVD graphite carrying plates for carrying different size silicon chips |
| CN208225854U (en) * | 2018-06-14 | 2018-12-11 | 苏州映真智能科技有限公司 | A kind of silicon wafer rejecting mechanism |
| CN208505923U (en) * | 2018-08-14 | 2019-02-15 | 厦门福信光电集成有限公司 | One kind being based on machine vision silicon wafer on-line measuring device |
| CN111273521A (en) * | 2020-03-06 | 2020-06-12 | 苏州源卓光电科技有限公司 | Automatic material loading and unloading single-table-board double-station exposure machine |
| CN111522205A (en) * | 2020-04-09 | 2020-08-11 | 东莞科视自动化科技有限公司 | Rotary high-speed automatic alignment exposure equipment |
| CN212364791U (en) * | 2020-07-08 | 2021-01-15 | 上海芯立电子科技有限公司 | Photoetching machine with automatic feeding equipment |
| CN112407841A (en) * | 2020-10-23 | 2021-02-26 | 江苏迪盛智能科技有限公司 | Automatic feeding and discharging system and method for exposure machine |
| CN113879846A (en) * | 2021-08-30 | 2022-01-04 | 华研芯测半导体(苏州)有限公司 | Cascade vacuum cavity device with built-in conveying mechanism and conveying method |
-
2022
- 2022-05-30 CN CN202210595922.6A patent/CN114675510A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510516A (en) * | 2002-08-30 | 2004-07-07 | Asml荷兰有限公司 | Photoetching device, manufacturing method for the component and component therefrom |
| CN204230217U (en) * | 2014-11-18 | 2015-03-25 | 天津中环领先材料技术有限公司 | A kind of Novel silicon slice cleaning basket |
| CN207852633U (en) * | 2017-11-29 | 2018-09-11 | 南通苏民新能源科技有限公司 | A kind of PECVD graphite carrying plates for carrying different size silicon chips |
| CN208225854U (en) * | 2018-06-14 | 2018-12-11 | 苏州映真智能科技有限公司 | A kind of silicon wafer rejecting mechanism |
| CN208505923U (en) * | 2018-08-14 | 2019-02-15 | 厦门福信光电集成有限公司 | One kind being based on machine vision silicon wafer on-line measuring device |
| CN111273521A (en) * | 2020-03-06 | 2020-06-12 | 苏州源卓光电科技有限公司 | Automatic material loading and unloading single-table-board double-station exposure machine |
| CN111522205A (en) * | 2020-04-09 | 2020-08-11 | 东莞科视自动化科技有限公司 | Rotary high-speed automatic alignment exposure equipment |
| CN212364791U (en) * | 2020-07-08 | 2021-01-15 | 上海芯立电子科技有限公司 | Photoetching machine with automatic feeding equipment |
| CN112407841A (en) * | 2020-10-23 | 2021-02-26 | 江苏迪盛智能科技有限公司 | Automatic feeding and discharging system and method for exposure machine |
| CN113879846A (en) * | 2021-08-30 | 2022-01-04 | 华研芯测半导体(苏州)有限公司 | Cascade vacuum cavity device with built-in conveying mechanism and conveying method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI553758B (en) | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus | |
| EP1182694A2 (en) | Processing system for substrate | |
| CN112621863B (en) | Automatic cutting system | |
| CN110911311A (en) | Visual inspection machine to wafer after cutting | |
| CN111468425A (en) | Silicon wafer crystal flower sorting machine | |
| KR101718144B1 (en) | Vision inspection device of contact lens | |
| CN113002150B (en) | Full-automatic screen printing machine for wafer | |
| CN214638294U (en) | Full-automatic chip laser coding detection equipment | |
| CN112659427B (en) | Automatic production and processing system for elastic base plate | |
| CN115647598A (en) | Automatic marking working method of battery cover plate | |
| CN111921876B (en) | Code scanning detection system of code scanning classification equipment for automatic warehousing | |
| CN115931931A (en) | Semiconductor X-ray detection device | |
| CN218191082U (en) | Automatic go up unloading outward appearance and detect machine | |
| CN110000537B (en) | Packing tube and plug assembling production mechanical equipment | |
| CN111921877A (en) | Code scanning detection method for automatic storage code scanning classification equipment | |
| CN114675510A (en) | Wafer placing device of photoetching machine | |
| CN116698745A (en) | Full-automatic retest AOI equipment | |
| CN219616140U (en) | Carousel formula AOI check out test set | |
| CN219785648U (en) | Automatic visual detection and laser rejection equipment for chip | |
| CN216745991U (en) | Cell-phone center plane degree detects machine | |
| CN217190994U (en) | Film-pasted glass sheet detection marking equipment | |
| CN217387111U (en) | Device for short-distance transmission wafer surface detection | |
| CN116422594A (en) | Carousel formula AOI check out test set | |
| CN116021392A (en) | Full-automatic equipment for wafer chamfering | |
| CN217358409U (en) | Hole site inspection machine capable of automatically discharging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220628 |
|
| RJ01 | Rejection of invention patent application after publication |