CN217387111U - Device for short-distance transmission wafer surface detection - Google Patents
Device for short-distance transmission wafer surface detection Download PDFInfo
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- CN217387111U CN217387111U CN202220651568.XU CN202220651568U CN217387111U CN 217387111 U CN217387111 U CN 217387111U CN 202220651568 U CN202220651568 U CN 202220651568U CN 217387111 U CN217387111 U CN 217387111U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses a device for short-distance transmission wafer surface detection, which comprises a bottom plate, a wafer support-out mechanism, a wafer back-jacking mechanism, a CCD industrial camera mechanism, a wafer boat lifting mechanism and a wafer ejection mechanism; the wafer ejecting mechanism, the CCD industrial camera mechanism, the wafer boat lifting mechanism and the wafer ejecting machine are all arranged on the bottom plate, the wafer ejecting mechanism is arranged on the wafer ejecting mechanism to form a wafer ejecting and ejecting combination mechanism, and the wafer is ejected from the wafer boat or ejected back to the wafer boat through the wafer ejecting and ejecting combination mechanism. The utility model discloses avoided the wafer wearing and tearing, not needed remote transmission, reduced the advantage of testing platform volume, improved the work efficiency and the yield that the wafer detected.
Description
Technical Field
The utility model relates to the field of semiconductor technology, in particular to a device that is used for short distance transmission wafer surface to detect.
Background
In the semiconductor industry, wafer inspection is an essential link after a wafer is cleaned and dried, and the wafer surface defect inspection generally requires high efficiency and accuracy, and can quickly and effectively capture defects. For the detection of the surface defects of the wafer, the visual inspection by a microscope is mainly adopted at the earliest. The examination by manpower has become increasingly unwieldy. At present, a relatively wide wafer surface defect detection method based on image processing is used.
The main technical problem to be solved at this time is to adapt to a carrying method for defect detection of image processing and develop a wafer detection device which is short in distance, convenient to detect and stable. Meanwhile, the wafer sampling inspection can be realized.
In 2019, Wangyu invented a wafer defect detection device (authorization notice number: CN 210376165U). The advantage of this patent lies in, the adoption detects in a seal box, telescopic link and driving motor have been added to the inside of seal box, the telescopic link can hold up the wafer body, and driving motor drives the carousel when moving and rotates, and then make the wafer body rotate, the wafer body carries out the defect detection at the rotation in-process, the inside of x optical measurement head to the wafer body carries out the crack detection, mend the illumination that the worn-out fur gives different angles with second light filling lamp, the dust of being convenient for exposes in taking the image, the seal box, the sealing door, sealed apron carries out light isolation to equipment, avoid external light to cause the interference to the shooting of camera, promote the accuracy of data. The wafer detection device has the defects that the wafer needs to pass through a long conveying distance in the detection process, and the wafer is inevitably abraded and scratched in the conveying process, so that the yield is reduced, and the production cost is increased.
In 2021, Li Huaiyang et al invented a wafer drying device (grant publication No. CN 212567289U). The advantage of this patent is in the visual detection equipment that provides, and the wafer tiling is on objective platform, and the light source shines the wafer on the objective platform, and the camera is towards objective platform and takes a picture to the wafer on the objective platform: the light source goes up and down through the second riser in order to adjust the relative height between light source and the wafer, promotes the effect of shooing of camera: the camera goes up and down through first riser in order to adjust the relative height position relation between camera and the wafer and shoot the edge of wafer, and the user obtains wafer edge shape and the thickness of judging the wafer through the picture at wafer edge that the camera was shot, and is very convenient, can not scratch the wafer. The device has the defect that the device does not solve the problem of wafer loading and unloading, and finally, the loading and unloading are realized in an automatic mode.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the prior art defect, providing a device for short distance transmission wafer surface detects, solved current wafer and needed remote transmission at the detection step, reduced the wafer and caused wearing and tearing in data send process.
The purpose of the utility model is realized like this: a device for short-distance transmission wafer surface detection comprises a bottom plate, a wafer carrying-out mechanism, a wafer back-jacking mechanism, a CCD industrial camera mechanism, a wafer boat lifting mechanism and a wafer ejecting mechanism; the wafer ejecting mechanism, the CCD industrial camera mechanism, the wafer boat lifting mechanism and the wafer ejecting machine are all arranged on the bottom plate, the wafer ejecting mechanism is arranged on the wafer ejecting mechanism to form a wafer ejecting and ejecting combination mechanism, and the wafer is ejected from the wafer boat or ejected back to the wafer boat through the wafer ejecting and ejecting combination mechanism.
The utility model adopts the above technical scheme, compare with prior art, beneficial effect is: 1) the device can realize defect detection of the wafers in the whole wafer boat and can also realize spot inspection of any wafer in the wafer boat;
2) when the wafer is pushed into the wafer boat, the contact area between the wafer and the wafer boat can be reduced, so that excessive abrasion between the wafer and the wafer boat groove is avoided;
3) the wafer can be taken out of the wafer boat for surface defect detection, and after the detection is finished, the wafer can be placed into the wafer boat on the original way without long-distance transmission; the advantage of reducing the testing platform volume has improved the work efficiency and the yield that wafer detected.
In order to realize that the wafer is lifted out of the wafer boat, the wafer lifting mechanism comprises a first lead screw mechanism, a sucker, a long arm, a clamping plate, a first sliding block, a second cylinder and a guide rail; the sucking disc is installed on long arm, long arm and first slider link together through splint, the second cylinder is installed on first slider, through linear motion about the second cylinder drives long arm, first slider is installed on the guide rail, realizes the front and back linear motion of first slider through first lead screw mechanism.
In order to enable the U-shaped tray to push the detected wafers back into the wafer boat, the wafer pushing-back mechanism comprises the U-shaped tray, a second sliding block and a first air cylinder; the U-shaped tray is installed on the second sliding block, the second sliding block is placed in the guide groove of the long arm, and the second sliding block is driven by the first cylinder to move back and forth in the guide groove.
In order to facilitate the positioning of the wafer, the front end of the U-shaped tray is in a step shape.
Further, the wafer boat lifting mechanism comprises a support, a cylindrical guide rail, a third slide block and a wafer boat supporting plate; the support is installed on the bottom plate, the wafer boat supporting plate is installed on a third sliding block, the third sliding block is installed on the cylindrical guide rail, and the wafer boat supporting plate is driven by the sliding blocks to lift up and down.
In order to prevent the position of the wafer boat from deviating in the working process, a wafer boat positioning device is arranged on the wafer boat supporting plate.
In order to realize the ejection action of the wafer, the wafer ejection mechanism comprises a boss, a second screw mechanism, a fourth sliding block and a top plate; the boss is fixed on the bottom plate, the top plate is installed on the fourth sliding block, and the fourth sliding block is driven to do linear reciprocating motion through the second lead screw mechanism, so that the wafer is pushed out.
In order to accurately complete the supporting and the jacking of the wafer, the U-shaped tray, the sucker and the wafer top plate are arranged at the same height.
Drawings
Fig. 1 is a perspective view of the overall structure of the present invention.
Fig. 2 is a perspective view of the wafer ejecting and ejecting mechanism of the present invention.
Fig. 3 is a perspective view of the wafer ejecting mechanism of the present invention.
Fig. 4 is a perspective view of the boat lifting mechanism of the present invention.
The device comprises a base plate 1, a wafer carrying-out mechanism 2, a first screw mechanism 21, a sucking disc 22, a long arm 23, a clamping plate 24, a first sliding block 25, a second air cylinder 26 and a guide rail 27, wherein the wafer carrying-out mechanism is arranged on the base plate; 3, a wafer back-jacking mechanism, a 31U-shaped tray, a 32 second sliding block and a 33 first air cylinder; the device comprises a 4 CCD industrial camera mechanism, a 5 wafer, a 6 wafer boat, a 7 wafer boat lifting mechanism, a 71 bracket, a 72 cylindrical guide rail, a 73 third slide block, a 74 wafer boat supporting plate, an 8 wafer ejection mechanism, an 81 second lead screw mechanism, a 82 fourth slide block, an 83 top plate and an 84 boss.
Detailed Description
The device for detecting the surface of the wafer transmitted in a short distance as shown in fig. 1 comprises a bottom plate 1, a wafer carrying-out mechanism 2, a wafer back-jacking mechanism 3, a CCD industrial camera mechanism 4, a wafer boat 6, a wafer boat lifting mechanism 7 and a wafer ejecting mechanism 8; the wafer ejecting mechanism 2, the CDD industrial camera mechanism 4, the wafer boat lifting mechanism 7 and the wafer ejecting mechanism 8 are all arranged on the bottom plate 1, the wafer ejecting mechanism 3 is arranged on the wafer ejecting mechanism 2 to form a wafer ejecting and ejecting combined mechanism, and the wafer 5 is ejected from the wafer boat 6 or the wafer 5 is ejected back to the wafer boat 6 through the wafer ejecting and ejecting combined mechanism.
As shown in fig. 2, the wafer carrying-out mechanism 2 includes a first lead screw mechanism 21, a suction cup 22, a long arm 23, a clamp plate 24, a first slider 25, a second cylinder 26, and a guide rail 27; the sucking disc 22 is installed on the long arm 23, the long arm 23 is connected with the first sliding block 25 through the clamping plate 24, the second cylinder 26 is installed on the first sliding block 25, the long arm 23 is driven to linearly move up and down through the second cylinder 26, the first sliding block 25 is installed on the guide rail 27, the first screw mechanism 21 is used for realizing the front and back linear movement of the first sliding block 25, and therefore the wafer 5 is lifted out of the wafer boat 6.
The wafer back-jacking mechanism 3 comprises a U-shaped tray 31, a second slide block 32 and a first air cylinder 33; the U-shaped tray 31 is arranged on the second sliding block 32, the second sliding block 32 is arranged in the guide groove of the long arm 23, the first air cylinder 33 drives the second sliding block 32 to move back and forth in the guide groove, the detected wafers are pushed back into the wafer boat 6 through the U-shaped tray 31, the front end of the U-shaped tray 31 is in a step shape, the wafers are convenient to position, the wafer 5 can be pushed back into the wafer boat 6 by matching with the lifting action of the long arm 23, the contact with the wafer boat groove is reduced, and excessive abrasion is avoided.
As shown in fig. 3, the wafer ejection mechanism 8 includes a boss 84, a second lead screw mechanism 81, a fourth slider 82, and a top plate 83; the boss 84 is fixed on the bottom plate 1, the top plate 83 is installed on the fourth slider 82, the fourth slider 82 is driven by the second lead screw mechanism 81 to do linear reciprocating motion, the ejection action of the wafer 5 is realized, and the U-shaped tray 31, the suction cup 22 and the wafer top plate 83 are installed at the same height during installation.
As shown in fig. 4, the boat lifting mechanism 7 includes a bracket 71, a cylindrical guide 72, a third slider 73, and a boat pallet 74; the support 71 is installed on the bottom plate 1, the boat supporting plate 74 is installed on the third slider 73, the third slider is installed on the cylindrical guide rail 72, the boat supporting plate 74 is driven by the slider to ascend and descend, the boat positioning device is arranged on the boat supporting plate 74, namely, one end of the boat supporting plate 74 is provided with a boat clamping position, the position of the boat 6 can be well limited, and the problem that the boat 6 deviates in the working process is avoided.
The CCD industrial camera mechanism 4 comprises a CCD industrial camera, two cylindrical rods and six knob heads, the CCD industrial camera is clamped and fixed by the two knobs, and the height of the camera can be adjusted by rotating the knobs.
The utility model discloses during operation, the wafer boat is gone up and down to a certain specific height by lifting mechanism 7, and wafer ejection mechanism 8 is ejecting wafer boat 6 with a slice wafer 5 this moment. When the wafer 5 is mostly separated from the wafer boat 6, the wafer 5 is sucked by the suction cup 22; then, the wafer carrying-out mechanism 2 takes the wafer 5 out of the wafer boat 6 completely, and the CCD industrial camera performs an imaging operation on the surface of the wafer 5. After the photographing is finished, the wafer is sent into the wafer boat 6 through the sucking disc 22; finally, since the suction cup 22 cannot enter the boat 6, after the wafer 5 contacts the boat 6, the long arm 23 is raised for fine adjustment, and the wafer lift-back mechanism 3 lifts the wafer 5 back into the boat 6, thereby finally realizing the whole wafer detection process.
The present invention is not limited to the above embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some replacements and transformations for some technical features without creative labor according to the disclosed technical contents, and these replacements and transformations are all within the protection scope of the present invention.
Claims (8)
1. A device for short-distance wafer surface transmission detection is characterized by comprising a bottom plate (1), a wafer support-out mechanism (2), a wafer back-jacking mechanism (3), a CCD industrial camera mechanism (4), a wafer boat (6), a wafer boat lifting mechanism (7) and a wafer ejection mechanism (8); the wafer ejecting mechanism (2), the CCD industrial camera mechanism (4), the wafer boat lifting mechanism (7) and the wafer ejecting mechanism (8) are all installed on the bottom plate (1), the wafer ejecting mechanism (3) is installed on the wafer ejecting mechanism (2) to form a wafer ejecting and ejecting combination mechanism, and the wafer is ejected from the wafer boat (6) or ejected to the wafer boat (6) through the wafer ejecting and ejecting combination mechanism.
2. The device for short-distance wafer surface transmission detection as claimed in claim 1, wherein the wafer carrying-out mechanism (2) comprises a first lead screw mechanism (21), a suction cup (22), a long arm (23), a clamping plate (24), a first slide block (25), a second air cylinder (26) and a guide rail (27); the sucker (22) is installed on the long arm (23), the long arm (23) is connected with the first sliding block (25) through the clamping plate (24), the second cylinder (26) is installed on the first sliding block (25), the long arm (23) is driven to move linearly up and down through the second cylinder (26), the first sliding block (25) is installed on the guide rail (27), and the front and back linear movement of the first sliding block (25) is achieved through the first lead screw mechanism (21).
3. The device for short-distance wafer surface transmission detection as claimed in claim 2, wherein the wafer back-jacking mechanism (3) comprises a U-shaped tray (31), a second slide block (32) and a first air cylinder (33); the U-shaped tray (31) is installed on the second sliding block (32), the second sliding block (32) is placed in the guide groove of the long arm (23), the second sliding block (32) is driven to move back and forth in the guide groove through the first air cylinder (33), and the wafers are ejected back into the wafer boat (6) through the U-shaped tray (31).
4. The device for short-distance transmission wafer surface detection as claimed in claim 3, wherein the front end of the U-shaped tray (31) is stepped.
5. The apparatus for short distance transport wafer surface inspection according to claim 1, wherein the boat lifting mechanism (7) comprises a support (71), a cylindrical guide (72), a third slider (73) and a boat pallet (74); the support (71) is arranged on the bottom plate (1), the boat supporting plate (74) is arranged on a third sliding block (73), the third sliding block is arranged on a cylindrical guide rail (72), and the boat supporting plate (74) is driven by the sliding blocks to lift up and down.
6. The device for short-distance wafer surface detection of claim 5, wherein the boat supporting plate (74) is provided with a boat positioning device.
7. The device for short-distance wafer surface transmission detection as claimed in claim 3, wherein the wafer ejection mechanism (8) comprises a boss (84), a second lead screw mechanism (81), a fourth slide block (82) and a top plate (83); the boss (84) is fixed on the bottom plate (1), the top plate (83) is installed on the fourth sliding block (82), and the fourth sliding block (82) is driven to do linear reciprocating motion through the second lead screw mechanism (81), so that the wafer is pushed out.
8. The device for short-distance wafer surface detection of transmission according to claim 7, wherein the U-shaped tray (31), the suction cup (22) and the wafer top plate (83) are installed at the same height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220651568.XU CN217387111U (en) | 2022-03-24 | 2022-03-24 | Device for short-distance transmission wafer surface detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220651568.XU CN217387111U (en) | 2022-03-24 | 2022-03-24 | Device for short-distance transmission wafer surface detection |
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| Publication Number | Publication Date |
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| CN217387111U true CN217387111U (en) | 2022-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220651568.XU Active CN217387111U (en) | 2022-03-24 | 2022-03-24 | Device for short-distance transmission wafer surface detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938985A (en) * | 2022-11-17 | 2023-04-07 | 安徽超元半导体有限公司 | Microscopic device for wafer visual inspection and automatic illumination method thereof |
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2022
- 2022-03-24 CN CN202220651568.XU patent/CN217387111U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938985A (en) * | 2022-11-17 | 2023-04-07 | 安徽超元半导体有限公司 | Microscopic device for wafer visual inspection and automatic illumination method thereof |
| CN115938985B (en) * | 2022-11-17 | 2023-08-29 | 安徽超元半导体有限公司 | Microscopic device for wafer visual inspection and automatic illumination method thereof |
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