CN114675167A - PCBA needle bed testing machine and testing method - Google Patents

PCBA needle bed testing machine and testing method Download PDF

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Publication number
CN114675167A
CN114675167A CN202210578243.8A CN202210578243A CN114675167A CN 114675167 A CN114675167 A CN 114675167A CN 202210578243 A CN202210578243 A CN 202210578243A CN 114675167 A CN114675167 A CN 114675167A
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CN
China
Prior art keywords
testing
needle bed
testing machine
test
tested card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210578243.8A
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Chinese (zh)
Inventor
严六平
包智杰
毛国梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Hongtai Semiconductor Technology Co ltd
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Nanjing Hongtai Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Nanjing Hongtai Semiconductor Technology Co ltd filed Critical Nanjing Hongtai Semiconductor Technology Co ltd
Priority to CN202210578243.8A priority Critical patent/CN114675167A/en
Publication of CN114675167A publication Critical patent/CN114675167A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention provides a needle bed testing machine of PCBA and a testing method, and the testing method provides feasibility of leading out a part of test signals to a testing device on other dimensions by reducing the density or the number of test points on a single dimension. The invention provides a PCBA needle bed testing machine, which comprises a horizontal testing component and a vertical testing component, wherein the horizontal testing component is used for testing a tested card in a horizontal dimension by the testing machine, and the vertical testing component is used for testing the tested card in a vertical dimension by the testing machine. The invention uses the existing tested card terminal on the board card as the test interface of another dimension, and no additional test points are needed in PCB design, thereby reducing the number of test points and the processing difficulty of the needle bed of the test equipment. The technical scheme has the advantages of low cost, high safety factor, high speed and high efficiency.

Description

PCBA needle bed testing machine and testing method
Technical Field
The invention belongs to the technical field of semiconductor test equipment, and particularly relates to a needle bed testing machine and a testing method for PCBA.
Background
The existing PCBA design is more and more complex, the board density is higher and more, more and more test point signals are needed for signal test integrity, and the design difficulty of the PCBA is increased.
At present, semiconductor test equipment utilizing a needle bed for testing can only move on one dimension to complete testing, so that when the density of test points of a tested board card is very high, the requirement on the machining precision of the needle bed of the test equipment is higher and higher, and the machining period can not meet the production requirement. And the test point density is too high, so that the processing is difficult, the defective rate is easy to increase, and the processing cost is increased.
In the use, when the test point is too close, have the risk that touches between the thimble and lead to the short circuit.
Disclosure of Invention
The present invention addresses the above technical problems by reducing the test point density or number in a single dimension, and proposes the feasibility of extracting a portion of the test signals to the test device in other dimensions.
The invention provides a PCBA needle bed testing machine, which comprises a horizontal testing component and a vertical testing component, wherein the horizontal testing component is used for testing a tested card by a testing machine in a horizontal dimension, and the vertical testing component is used for testing the tested card in a vertical dimension.
Furthermore, the horizontal testing component comprises a horizontal guide rail, a supporting plate is slidably mounted on the horizontal guide rail, the supporting plate is used for placing a tested card, the end of the horizontal guide rail in the target direction is provided with a testing machine terminal of a testing machine, and the testing machine terminal corresponds to the tested card terminal on the tested card one to one.
Further, the vertical testing component comprises a vertical guide rail and a testing machine needle bed, the vertical guide rail is vertically arranged and fixedly installed at the lower end of the horizontal guide rail, the testing machine needle bed is horizontally arranged and slidably installed on the vertical guide rail, and the needle bed structure of the testing machine needle bed faces upwards.
A PCBA test method applies the needle bed testing machine, and the test method comprises the following steps:
s1, fixing the card to be tested on a supporting plate of a horizontal guide rail of the needle bed testing machine;
s2, the supporting plate is pushed forwards along the X-axis direction of the horizontal guide rail, so that the tested card terminal on the tested card is reliably butted with the corresponding tester terminal on the vertical surface of the tester, and the butted terminal is used as a positioning base point of the tested card in the horizontal direction;
s3, vertically lifting the needle bed of the testing machine along the Z-axis direction, and upwards jacking the needle bed to a testing point on the bottom surface of the tested card;
s4, directly transferring the signal to be tested to a tester for testing by using the terminal on the tested card;
further, the above test method for the PCBA further includes:
and S5, when the card to be tested needs to be separated from the testing machine, lowering the needle bed of the testing machine, and then withdrawing the supporting plate and the card to be tested to the side of an operator from the horizontal direction, so that the separation of the card to be tested and the testing machine can be completed.
The invention relates to a needle bed testing machine of PCBA and a testing method, the PCBA to be tested is horizontally fixed on a rack supporting plate, and then the supporting plate is pushed forwards along the X-axis direction, so that a tested card terminal and a testing machine terminal on the vertical surface of a needle bed, namely a butt joint terminal, are reliably butted. And then the needle bed is vertically lifted along the Z-axis direction, so that the test probe of the needle bed accurately jacks the test point on the bottom surface of the board card to be tested.
And the signal is butted by utilizing the tester terminal on the vertical plane and the tester, and the tested signal is directly transferred into the tester for testing. On one hand, when the design of the board card is omitted, the work and difficulty of adding test points on the base plate of the tested card by the signals are increased. On the other hand, the needle bed is manufactured without reprocessing the probes. On the premise of not reducing the working efficiency, the cost is saved, the economic benefit is improved, and the risk of short circuit between the detected signals is eliminated.
The invention uses the existing terminal on the tested card as the test interface of another dimension, and no additional test point is needed in PCB design, thereby reducing the number of test points and the processing difficulty of the needle bed of the test equipment. The technical scheme has the advantages of low cost, high safety factor, high speed and high efficiency.
Drawings
Fig. 1 is a schematic top view of a testing machine according to the present invention.
Fig. 2 is a schematic side view of the testing machine apparatus of the present invention, which also shows the testing method in the vertical direction.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
The general testing device can only move on one dimension, and for tested cards with dense testing points, the ejector pin positioning and processing difficulty of the testing device is increased, the defective rate is easily caused, and the processing cost is increased.
For a specific tested card, the area is limited, and test points cannot be added without limit.
In actual tests, short circuit between the thimbles is easily caused when the thimbles are too dense, so that the time required to be confirmed before power-on test is increased for using enterprises, and even the damage to a tested board card is caused.
To address this situation, it is desirable to minimize the density or number of test points in a single dimension. Therefore, in the technical scheme provided by the invention, a feasible scheme of leading out a part of the test signals to the test device in other dimensions is provided.
The invention provides a PCBA needle bed testing machine and a PCBA testing method based on the PCBA needle bed testing machine.
In order to complete the test based on the second dimension, the testing machine not only comprises a horizontal testing component, but also comprises a vertical testing component, the horizontal testing component is used for the testing machine to complete the test in the horizontal dimension, namely the X-axis direction, and the vertical testing component is used for the testing machine to complete the test in the vertical dimension, namely the Z-axis direction, wherein the horizontal testing component comprises a horizontal guide rail, a supporting plate is installed on the horizontal guide rail and used for placing the tested card, and the tail end of the target direction of the horizontal guide rail is provided with a testing machine terminal of the testing machine. And for the placing direction of the tested card on the horizontal guide rail upper supporting plate, the tested card terminal on the tested card is arranged opposite to the tester terminal. When the supporting plate runs towards the direction of the test machine terminal on the horizontal guide rail, the tested card is driven to move towards the direction of the test machine terminal, and as the tested card terminal on the tested card is arranged opposite to the test machine terminal, when the tested card moves to the state that the tested card terminal is contacted with the test machine terminal, signal transmission can be executed, and test is executed.
The vertical testing component comprises a vertical guide rail and a testing machine needle bed, in the embodiment, the vertical guide rail is vertically arranged and fixedly arranged at the lower end of the horizontal guide rail, the testing machine needle bed is horizontally arranged and arranged on the vertical guide rail, the needle bed structure of the testing machine needle bed faces upwards, and when a tested card is placed on the horizontal guide rail, the surface (the bottom surface of the tested card) with a connectable testing point on the horizontal plane faces downwards, namely the direction facing the needle bed structure of the testing machine needle bed.
The invention also provides a PCBA test method, which comprises the following test processes:
and 1, placing the tested card on a supporting plate of the testing equipment and fixing the tested card.
And 2, as shown in the figure 1, pushing the supporting plate forwards along a horizontal guide rail (X-axis direction) to enable the tested card terminal on the tested card to be inserted into the test machine terminal on the vertical surface of the test machine. And synchronously completing the positioning in the horizontal direction. In the process, the test machine terminal on the vertical surface of the test machine is provided with a PCB board card on the surface, and the upper surface of the test machine terminal is provided with a terminal which is welded and matched with the tested card terminal of the tested card.
And 3, as shown in the figure 2, lifting the testing machine needle bed upwards along the vertical direction (Z-axis direction) so that the probes are propped against the testing points on the bottom surface of the tested card.
And 4, directly transferring the signal to be tested into the tester for testing by using the terminal on the tested card, mounting a self-contained PCB card on the back surface of the tester, welding a terminal matched with the terminal of the tested card on the PCB card, and directly transferring the signal to be tested into the tester after the terminal is butted on the terminal of the tested card.
The tester and the testing method of the invention omit the work of adding test points on the base plate of the tested card by the signals. The probes do not need to be processed when the needle bed is manufactured, and the probe cost and the needle bed processing cost are saved. The direct butt joint is carried out through the terminals, and the risk of short circuit between signals is avoided.
Through the two steps, the compression fit of the tested card and the equipment in two dimensions can be realized.
And 5, lowering the needle bed of the testing machine when the tested card and the testing equipment need to be separated.
And 6, returning the supporting plate and the tested card to the side of an operator from the horizontal direction, and then completing the separation of the tested card and the testing machine.
The invention discloses a PCBA testing machine and a testing method based on the testing machine, wherein the PCBA testing machine comprises the following steps:
the design difficulty of the PCB of the tested card can be reduced, and the integrity of the signal of the tested card is improved. The interface is simple, and the cost is low. The risk in practical application is reduced. The whole switching process is fast and efficient.
The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims (3)

1. The utility model provides a PCBA's needle bed test machine which characterized in that: the device comprises a horizontal test component and a vertical test component, wherein the horizontal test component is used for a tester to test a tested card in a horizontal dimension, and the vertical test component is used for the tester to test in a vertical dimension;
the horizontal testing component comprises a horizontal guide rail, a supporting plate is slidably mounted on the horizontal guide rail and used for placing a tested card, the end of the horizontal guide rail in the target direction is provided with a testing machine terminal of a testing machine, and the testing machine terminal corresponds to the tested card terminal on the tested card one by one;
the vertical testing component comprises a vertical guide rail and a testing machine needle bed, the vertical guide rail is vertically arranged and fixedly installed at the lower end of the horizontal guide rail, the testing machine needle bed is horizontally arranged and slidably installed on the vertical guide rail, and the needle bed structure of the testing machine needle bed faces upwards.
2. A test method of PCBA using the needle bed testing machine of claim 1, the test method comprising the steps of:
s1, fixing the card to be tested on a supporting plate of a horizontal guide rail of the needle bed testing machine;
s2, the supporting plate is pushed forwards along the X-axis direction of the horizontal guide rail, so that the tested card terminal on the tested card is reliably butted with the corresponding tester terminal on the vertical surface of the tester, and the butted terminal is used as a positioning base point of the tested card in the horizontal direction;
s3, vertically lifting the needle bed of the testing machine along the Z-axis direction, and upwards jacking the needle bed to a testing point on the bottom surface of the tested card;
and S4, directly transferring the signal to be tested to the tester for testing by using the terminal on the tested card.
3. A method of testing a PCBA as claimed in claim 2, further comprising:
when the tested card and the needle bed testing machine need to be separated, the needle bed of the testing machine is firstly lowered, and then the supporting plate and the tested card are retracted to the side of an operator from the horizontal direction, so that the separation of the tested card and the testing machine can be completed.
CN202210578243.8A 2022-05-26 2022-05-26 PCBA needle bed testing machine and testing method Pending CN114675167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210578243.8A CN114675167A (en) 2022-05-26 2022-05-26 PCBA needle bed testing machine and testing method

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Application Number Priority Date Filing Date Title
CN202210578243.8A CN114675167A (en) 2022-05-26 2022-05-26 PCBA needle bed testing machine and testing method

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Publication Number Publication Date
CN114675167A true CN114675167A (en) 2022-06-28

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203133242U (en) * 2013-02-01 2013-08-14 上海宏测半导体科技有限公司 Three-degree-of-freedom control platform
CN103760386A (en) * 2014-01-06 2014-04-30 北京航空航天大学 Universal clamp device for circuit testing
CN107728044A (en) * 2017-11-24 2018-02-23 广东菲柯特电子科技有限公司 Double-sided circuit board testing device
CN207571263U (en) * 2017-11-24 2018-07-03 广东菲柯特电子科技有限公司 Double-sided circuit board testing device
CN207832961U (en) * 2018-01-24 2018-09-07 安徽锐能科技有限公司 test device for PCB
CN215005725U (en) * 2021-05-31 2021-12-03 南京宏泰半导体科技有限公司 Manual lifting device of semiconductor test equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203133242U (en) * 2013-02-01 2013-08-14 上海宏测半导体科技有限公司 Three-degree-of-freedom control platform
CN103760386A (en) * 2014-01-06 2014-04-30 北京航空航天大学 Universal clamp device for circuit testing
CN107728044A (en) * 2017-11-24 2018-02-23 广东菲柯特电子科技有限公司 Double-sided circuit board testing device
CN207571263U (en) * 2017-11-24 2018-07-03 广东菲柯特电子科技有限公司 Double-sided circuit board testing device
CN207832961U (en) * 2018-01-24 2018-09-07 安徽锐能科技有限公司 test device for PCB
CN215005725U (en) * 2021-05-31 2021-12-03 南京宏泰半导体科技有限公司 Manual lifting device of semiconductor test equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
温汝贤: "印制电路板裸板测试***的选择", 《印制电路信息》 *

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Application publication date: 20220628