CN114667504A - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
CN114667504A
CN114667504A CN202080002427.9A CN202080002427A CN114667504A CN 114667504 A CN114667504 A CN 114667504A CN 202080002427 A CN202080002427 A CN 202080002427A CN 114667504 A CN114667504 A CN 114667504A
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China
Prior art keywords
pin
test
sub
power supply
power
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Pending
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CN202080002427.9A
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English (en)
Inventor
周宏军
杜丽丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN114667504A publication Critical patent/CN114667504A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/30—Arrangements for executing machine instructions, e.g. instruction decode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06155—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示基板及其制备方法、显示装置，显示基板包括显示区和周边区，周边区包括位于显示区至少一侧的电路板引脚区和测试引脚区。显示基板还包括：多个子像素以及与多个子像素电连接的第一电源线；至少一个第一绑定电源引脚，位于电路板引脚区，与第一电源线电连接，被配置为在显示阶段向多个子像素传输第一电源信号；第二电源线，位于周边区且围绕显示区；至少一个第二绑定电源引脚，位于电路板引脚区，与第二电源线电连接，被配置为在显示阶段向多个子像素传输第二电源信号；至少一个测试电源引脚，位于测试引脚区，电连接至第一电源线和第二电源线中的至少一个，被配置为在测试阶段向多个子像素传输第一电源信号和第二电源信号中的至少之一。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN202080002427.9A 2020-10-22 2020-10-22 显示基板及其制备方法、显示装置 Pending CN114667504A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/122895 WO2022082631A1 (zh) 2020-10-22 2020-10-22 显示基板及其制备方法、显示装置

Publications (1)

Publication Number Publication Date
CN114667504A true CN114667504A (zh) 2022-06-24

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ID=81291395

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CN202080002427.9A Pending CN114667504A (zh) 2020-10-22 2020-10-22 显示基板及其制备方法、显示装置

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Country Link
US (1) US20220320241A1 (zh)
CN (1) CN114667504A (zh)
WO (1) WO2022082631A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024114073A1 (zh) * 2022-11-29 2024-06-06 京东方科技集团股份有限公司 显示基板及显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220059284A (ko) * 2020-11-02 2022-05-10 엘지디스플레이 주식회사 표시 장치
CN116129826B (zh) * 2023-02-17 2024-07-02 上海天马微电子有限公司 显示面板和显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100671640B1 (ko) * 2004-06-24 2007-01-18 삼성에스디아이 주식회사 박막 트랜지스터 어레이 기판과 이를 이용한 표시장치와그의 제조방법
KR100781379B1 (ko) * 2007-01-30 2007-11-30 안재일 프로브장치
KR102183494B1 (ko) * 2014-08-21 2020-11-27 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102415752B1 (ko) * 2015-03-24 2022-07-01 삼성디스플레이 주식회사 표시 장치
KR20180030286A (ko) * 2016-09-12 2018-03-22 삼성디스플레이 주식회사 테스트부를 갖는 표시장치
KR102397900B1 (ko) * 2016-12-08 2022-05-13 삼성디스플레이 주식회사 표시 장치
KR20210014263A (ko) * 2019-07-29 2021-02-09 삼성디스플레이 주식회사 표시 장치
KR20210036444A (ko) * 2019-09-25 2021-04-05 삼성디스플레이 주식회사 표시 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024114073A1 (zh) * 2022-11-29 2024-06-06 京东方科技集团股份有限公司 显示基板及显示装置

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WO2022082631A1 (zh) 2022-04-28
US20220320241A1 (en) 2022-10-06

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