CN114613698A - Positioning device, semiconductor processing device and positioning method - Google Patents
Positioning device, semiconductor processing device and positioning method Download PDFInfo
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- CN114613698A CN114613698A CN202210226247.XA CN202210226247A CN114613698A CN 114613698 A CN114613698 A CN 114613698A CN 202210226247 A CN202210226247 A CN 202210226247A CN 114613698 A CN114613698 A CN 114613698A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The present invention relates to a positioning device, a semiconductor processing device and a positioning method, wherein the positioning device comprises: a first scale comprising a connection structure for connecting the first scale with a semiconductor processing apparatus, wherein the semiconductor processing apparatus comprises a plurality of processing units; a second scale arranged to slide or rotate relative to the first scale; a positioning slider arranged to slide along the second scale for aligning one machining unit from the plurality of machining units and deriving coordinates of the aligned machining unit from a position of the positioning slider relative to the second scale and the first scale. By using the positioning device, the semiconductor processing device and the positioning method, the processing unit can be quickly and accurately positioned.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a positioning device, a semiconductor processing device and a positioning method.
Background
The statements herein merely provide background information related to the present disclosure and may not necessarily constitute prior art.
In semiconductor manufacturing processes, an array of multiple process units is often used to process a die (also referred to as a wafer). For example, in Rapid Thermal Processing (RTP) processes, arrays of hundreds of lamps (lamps) are often used to heat the wafer. Each light may have a corresponding number to identify. When a damaged lamp is replaced, it is necessary to find the damaged lamp from among hundreds of lamps. As the number of lamps increases, the efficiency of positioning the lamps gradually decreases. And because the arrangement of the lamps is dense, the arrangement of the lamps is not necessarily regular or uniform, and a certain error rate exists only through the preset numbers or drawings for positioning.
Disclosure of Invention
The invention aims to provide a novel positioning device, a semiconductor processing device and a positioning method, and aims to improve the positioning accuracy and the positioning efficiency when a processing unit in the semiconductor processing device is maintained and replaced in the semiconductor manufacturing and processing, and save the time for equipment maintenance.
The purpose of the invention is realized by adopting the following technical scheme. According to the positioning device provided by the invention, the positioning device comprises: a first scale comprising a connection structure for connecting the first scale with a semiconductor processing apparatus, wherein the semiconductor processing apparatus comprises a plurality of processing units; a second scale arranged to slide or rotate relative to the first scale; and a positioning slider arranged to slide along the second scale for aligning one of the plurality of machining units and obtaining coordinates of the aligned machining unit from a position of the positioning slider relative to the second scale and the first scale.
The object of the invention can be further achieved by the following technical measures.
In the positioning device, the first scale is an annular scale; the first scale is provided with a first scale used for angle measurement; the second scale is a linear scale, at least one of two ends of the linear scale in the length direction is in contact with the annular scale, and the linear scale is arranged to rotate in the annular scale; the second scale has a second scale for measuring along a length direction of the linear scale.
In the positioning device, the first ruler is one or two first linear rulers, the second ruler is a second linear ruler, one end of the second linear ruler is slidably connected with the first linear ruler, or the second linear ruler is slidably connected between the two first linear rulers, and the second linear ruler is configured to slide along the length direction of the first linear ruler; the first linear scale is provided with a first scale mark, and the first scale mark is used for measuring along the length direction of the first linear scale; the second linear scale has a second scale for measuring in a length direction of the second linear scale.
In the positioning device, a contact end of one of the first scale and the second scale, which is used for contacting with the other scale, has a boss; the other of the first scale and the second scale has a first part and a second part which are arranged in parallel in the thickness direction, and a space for accommodating the boss is formed between the first part and the second part so as to form a track for the second scale to rotate in the first scale or a track for the second scale to slide along the first scale; the contact end of the first part and/or the second part, which is in contact with the scale with the boss, abuts against the shoulder of the boss to stop the movement of the second scale along the length direction of the second scale.
The positioning device of the foregoing, wherein the positioning slider has a through hole for selecting one processing unit from the plurality of processing units through the through hole. Optionally, the size of the through hole is substantially the same as the size of the processing unit.
In the aforementioned positioning device, the second scale has a hollow structure, the positioning slider is embedded in the hollow structure, and a sliding track of the positioning slider is formed; the width of the opening of the hollow structure is not smaller than the size of the through hole of the positioning sliding block.
The aforementioned positioning device, wherein the device further comprises: a second scale locking member for stopping sliding or rotation of the second scale with respect to the first scale to lock the second scale with the first scale; and/or, a positioning slider locking member for stopping sliding of the positioning slider along the second scale to lock the positioning slider with the second scale.
In an embodiment, the connecting structure of the first scale is specifically configured to detachably and fixedly connect the first scale to a semiconductor processing apparatus; the connecting structure of the first scale comprises a clamping structure, a clamping structure and/or a magnetic attraction structure.
The aforementioned positioning device, wherein the angular resolution of the annular scale is not lower than 0.01 °, and the resolution of the radius measurement position of the linear scale is not lower than 0.05 mm; the linear scale is of a hollow structure with the opening width of 5-50 mm, and the positioning slide block is provided with a through hole with the diameter of 5-50 mm.
The purpose of the invention is realized by adopting the following technical scheme. The semiconductor processing device provided by the invention comprises any one of the positioning devices.
The purpose of the invention is realized by adopting the following technical scheme. The positioning method provided by the invention mainly comprises the following steps: any one of the positioning devices is close to a semiconductor processing device, and the first scale is connected with the semiconductor processing device by using a connecting structure of the first scale of the positioning device, wherein the semiconductor processing device comprises a plurality of processing units; and sliding or rotating a second scale of the positioning device, sliding a positioning slide block of the positioning device to align one processing unit from the plurality of processing units, and obtaining the coordinates of the aligned processing unit according to the position of the positioning slide block relative to the second scale and the first scale.
The purpose of the invention is realized by adopting the following technical scheme. The positioning method provided by the invention mainly comprises the following steps: acquiring a target coordinate of a target processing unit; any one of the positioning devices is close to a semiconductor processing device, and the first scale is connected with the semiconductor processing device by using a connecting structure of the first scale of the positioning device, wherein the semiconductor processing device comprises a plurality of processing units; sliding or rotating a second scale of the positioning device, and sliding a positioning slide block of the positioning device to move the positioning slide block to a position corresponding to the target coordinates; and taking the processing unit aligned with the positioning slide block as the target processing unit.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By the technical scheme, the positioning device, the semiconductor processing device and the positioning method provided by the invention at least have the following advantages and beneficial effects:
1. the invention provides a device for quickly and accurately positioning a processing unit (such as a lamp), which greatly saves the maintenance time of equipment and improves the maintenance efficiency;
2. the positioning device can greatly improve the positioning accuracy of the processing unit, and a unique target can be positioned in a plane double-coordinate mode, so that the error positioning caused by the positioning by only using numbers or drawings is avoided;
3. the efficiency of processing unit location has been improved by a wide margin, has saved and has seeked the Time of numbering when the quantity of processing unit reaches a certain extent more, has shortened the required Time MTTR (mean Time tip repair) of equipment on-line maintenance.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of a positioning device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a lamp array configuration of a semiconductor manufacturing process facility;
FIG. 3 is a schematic view of a positioning device coupled to a lamp array structure in accordance with one embodiment of the present invention;
fig. 4 is a partially enlarged schematic view at a in fig. 3.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be given of specific embodiments, structures, features and effects of the positioning device, the semiconductor processing device and the positioning method according to the present invention with reference to the accompanying drawings and preferred embodiments.
It is noted that semiconductor processing apparatuses (also referred to as semiconductor manufacturing apparatuses, or simply semiconductor apparatuses) referred to in the present invention include, but are not limited to, apparatuses used in a Rapid Thermal Processing (RTP) process.
Fig. 1 is a schematic perspective view of a positioning device according to an embodiment of the present invention. Fig. 2 is a schematic diagram of a lamp array configuration of a semiconductor manufacturing process tool. Fig. 3 is a schematic perspective view of a positioning device connected to a lamp array structure according to an embodiment of the present invention. Fig. 4 is a partially enlarged schematic view at a in fig. 3.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the positioning apparatus of the present invention mainly includes: a first scale 101, a second scale 102 and a positioning slider 103.
Wherein the first scale 101 comprises one or more connection structures 104. The connection structure 104 is used to connect the first scale 101 to a semiconductor processing apparatus.
Wherein the semiconductor processing tool comprises a plurality of processing units (also referred to as semiconductor processing units), which may be referred to as an array of processing units or simply as an array. The processing unit may be, but is not limited to, a lamp (lamp). Specifically, a lamp array may be formed by a plurality of lamps. Alternatively, as shown in fig. 2, the semiconductor processing apparatus is an apparatus used in a Rapid Thermal Processing (RTP) process, and has a heating structure that mainly includes a heating lamp 201 and a base 202 of the heating lamp.
Wherein the second scale 102 is arranged to slide or rotate relative to the first scale 101. For example, the second scale 102 may be caused to slide or rotate relative to the first scale 101 by a manually applied force.
Wherein the positioning slider 103 is arranged to slide along the second scale 102 for aligning one processing unit from a plurality of processing units of the semiconductor processing apparatus and obtaining coordinates of the aligned processing unit based on the position of the positioning slider 103 relative to the second scale 102 and the first scale 101. Wherein, optionally, the positioning slider 103 can be made to slide along the second scale 102 by manually applied force. The position of the positioning slider 103 with respect to the second scale 102 and the first scale 101 may be the position of the positioning slider 103 with respect to the second scale 102 and the position of the second scale 102 with respect to the first scale 101.
Optionally, the first scale 101 and the second scale 102 both have scales. Specifically, the first scale 101 has a first scale, and the second scale 102 has a second scale, which are respectively used for measuring coordinates of a first dimension and a second dimension, so as to measure two-dimensional plane coordinates. Alternatively, the scales on the scale can be scales of international standard units (length, angle and the like) which are uniformly distributed; alternatively, the scale on the scale need not be a scale in international standard units, and may be a scale that is preset only to identify the positions of a plurality of machining units, respectively, for example.
It should be noted that the present invention is not limited to the arrangement of the processing unit array, and may be rectangular, hexagonal or triangular, or even irregular, besides the circular arrangement of the lamp array shown in fig. 2. In addition, the distribution position of each processing unit in the processing unit array is not limited in the invention, and the processing units can be uniformly distributed or not. In addition, the present invention does not limit the number of processing units in the array.
By utilizing the positioning device provided by the invention, one processing unit can be accurately positioned from the processing unit array.
In some embodiments of the invention, the first scale 101 is an annular scale. The first scale 101 has a first scale, which is used for angle measurement. Alternatively, the annular scale may be clipped to the base 202 of the lamp. Also, the second scale 102 is a linear scale, at least one of both ends of which in the length direction is in contact with the annular scale, and the linear scale is configured to rotate within the annular scale. Optionally, the linear scale is embedded in the annular scale. The second scale 102 has a second scale for measuring along the length of the linear scale. Note that the scale does not have to be spread over the entire scale, but may be spread over only a part of the scale, for example, in the linear scale shown in fig. 1, since it is for measuring a radius, the scale may be provided only on half of the linear scale in the length direction, and the sliding range of the positioning slider 103 may also be half of the linear scale and not necessarily the entire linear scale.
In an alternative example, as shown in fig. 1, both ends of the linear scale in the length direction are in contact with, e.g., abutting, the annular scale so that the linear scale can rotate around the center of the annular scale within the annular scale; alternatively, in another alternative example (not shown in the figure), one end of the linear scale is rotatably provided on the annular scale, the one end is not called as a fixed end, and the other end of the linear scale is a free end, so that the linear scale can rotate around the fixed end in the annular scale.
It should be noted that the first scale 101 and the second scale 102 are not limited to be annular and linear scales. For example, in some embodiments of the invention, the first scale 101 is one or two first linear scales and the second scale 102 is a second linear scale (not shown). One end and first linear scale sliding connection, or second linear scale sliding connection between two first linear scales of second linear scale, second linear scale is set up to slide along the length direction of first linear scale. The first linear scale has a first scale for measuring in a length direction of the first linear scale. The second linear scale has a second scale for measuring in a length direction of the second linear scale. Optionally, the first linear scale and the second linear scale are perpendicular to each other.
In some embodiments of the invention, the contact end of one of the first and second scales 101, 102 for contacting the other scale has a boss (also referred to as a boss or male portion); and the other of the first scale 101 and the second scale 102 has a first portion and a second portion arranged in parallel in the thickness direction. A space for accommodating the boss is formed between the first portion and the second portion to form a track in which the second scale 102 rotates within the first scale 101 or a track in which the second scale 102 slides along the first scale 101.
Furthermore, the boss is provided with a convex end and shoulders at two sides of the convex end; the contact end of the aforementioned first and/or second part that contacts the scale having the aforementioned boss abuts against the shoulder of the aforementioned boss to stop the movement of the second scale 102 along its length. In the case of the annular scale, the linear scale, this restricts the movement of the linear scale to only sliding or rotating relative to the annular scale; in the example where the first and second scales 101 and 102 are both linear scales, this restricts the movement of the second linear scale to only sliding in the longitudinal direction of the first linear scale.
Specifically, as an optional example, an annular boss is provided on an inner side (an end close to a circle center direction) of the annular scale, the linear scale includes two sheet-like portions which are connected by a bolt to form the linear scale, a groove for accommodating the annular boss of the annular scale is formed between the two sheet-like portions and at least at two ends close to a length direction, and the linear scale can rotate in the annular scale by cooperation of the annular boss and the groove; the terminal surface at least one slice part of sharp scale along length direction's both ends is inconsistent with the shoulder surface of the annular boss of annular scale to backstop sharp scale along its length direction's removal, optional, can set up the terminal surface at the both ends of sharp scale into with annular scale contact position matched with arc. As another alternative example, the linear scale is of an integral structure, the linear scale has bosses at both ends in the length direction, the annular scale includes two sheet-like portions, the two sheet-like portions are connected by bolts to form the annular scale, a groove for accommodating the boss of the linear scale is formed between the two sheet-like portions and at least on the inner side (the end close to the circle center direction) of the annular scale, and the linear scale can rotate in the annular scale by the cooperation of the boss and the groove; the end surface of the inner side of at least one sheet part of the annular boss is abutted against the shoulder surface of the linear scale so as to stop the linear scale from moving along the length direction of the linear scale.
In some embodiments of the invention, the positioning slide 103 has a through hole for selecting one processing unit from the plurality of processing units through the through hole. Optionally, the size of the through hole is substantially the same as the size of the processing unit. The size of the through hole is substantially the same as that of the processing unit, which means that the size of the through hole matches with that of the processing unit, and is generally basically the same, but the size of the through hole can be slightly larger than that of the processing unit. Specifically, one machining unit may be selected from a plurality of machining units by looking through the through hole, and if one complete (or substantially complete) machining unit appears in the through hole of the positioning slider 103, it indicates that the positioning slider 103 is aligned with the machining unit. Alternatively, the shape of the through hole of the positioning slider 103 matches the shape of the machining unit. For example, in an example where the processing unit is a lamp, the through-hole of the positioning slider 103 may be a circular through-hole.
In some embodiments of the present invention, the second scale 102 has a hollow structure, and a positioning slider 103 is embedded therein, and is formed as a sliding track of the positioning slider 103.
Note that the second scale 102 can stop at least in a preset position range of the first scale 101, and generally at any position of the first scale 101, during sliding or rotation relative to the first scale 101; the positioning slider 103 can stop at least in a preset position range of the second scale 102, and can stop at any position of the second scale 102 during sliding along the second scale 102. It may be stopped by manual force or by providing it with a fixing structure such as a clamping structure. Specifically, in some embodiments of the present invention, the positioning device of the present invention further comprises: one or both of the second scale lock 105, the positioning slide lock.
The second scale lock 105 is configured to stop sliding or rotation of the second scale 102 with respect to the first scale 101 to lock the second scale 102 with the first scale 101. Specifically, the second scale lock member 105 has a locked state and a released state, and when the second scale lock member 105 is in the released state, the second scale 102 can slide or rotate with respect to the first scale 101, and when the second scale lock member 105 is in the locked state, the second scale 102 and the first scale 101 are locked to each other and cannot slide or rotate relative to each other.
Wherein the positioning slider lock is configured to stop sliding of the positioning slider 103 along the second scale 102 to lock the positioning slider 103 with the second scale 102. Specifically, the positioning slider lock has a locked state and a released state, and when the positioning slider lock is in the released state, the positioning slider 103 can slide with respect to the second scale 102, and when the positioning slider lock is in the locked state, the positioning slider 103 and the second scale 102 are locked to each other and cannot slide relative to each other.
As a specific example, the second scale locking member 105 and the positioning slider locking member may include a fixed pin, or may be lockable structures such as a magnet, a screw, and a clip. The fixing pin can be used for locking and can also be used as a rotating and sliding handle.
In some embodiments of the invention, the connection structure 104 of the first scale 101 is specifically configured to: the first scale 101 is detachably fixed to the semiconductor processing apparatus. Optionally, the connecting structure 104 of the first scale 101 includes but is not limited to: a snap-fit structure, a clamping structure and/or a magnetic attraction structure. Note that a plurality of types of connection structures 104 may be used at the same time to fix the first scale 101 to the semiconductor apparatus. Generally, the connecting structure 104 of the first scale 101 is used to connect the first scale 101 to the base 202 of the semiconductor processing apparatus, and optionally, since the positioning device is used to position the heating lamp in some examples, the connecting structure 104 can be used to detachably fix the first scale 101 to the heating structure, for example, detachably fixed to the base 202 of the heating structure.
Optionally, the connection structure 104 has a locked state and a released state, and during the process of connecting the positioning device with the semiconductor processing equipment, the connection structure 104 is kept in the released state and the positioning device is close to the semiconductor processing equipment to a preset position, and then the connection structure 104 is switched to the locked state, so as to stably connect the positioning device with the semiconductor processing equipment; in separating the positioning apparatus from the semiconductor processing apparatus, the connection structure 104 is first switched from the locked state to the released state, and then the positioning apparatus may be separated from the semiconductor processing apparatus.
As an alternative specific example, in the example where the first scale 101 is an annular scale and the second scale 102 is a linear scale, the connecting structure 104 of the annular scale includes device positioning openings and clips, and the clips may be members tightly clamped by screws or the like, and one of the screw positioning openings may be selected to be the initial 0 ° of the annular scale.
Alternatively, the accuracy of the scale needs to be such that all machining units can be distinguished, so that different machining units have different coordinates.
Optionally, in an example where the processing unit is a lamp, the angular resolution of the annular scale is not less than 0.01 °. Optionally, the resolution of the radius measurement position of the linear scale is not lower than 0.05 mm.
Alternatively, in the example where the processing unit is a lamp, the diameter of the through hole of the positioning slider 103 is substantially equal to the diameter of the lamp, and is generally slightly larger than the diameter of the lamp. Optionally, the positioning slider 103 has a through hole with a diameter of 5 to 50 mm. Optionally, the width of the opening of the hollow structure of the linear scale is not less than the diameter of the through hole of the positioning slider 103. Alternatively, the aforementioned linear scale has a hollow structure with an opening width of 5 to 50 mm. Alternatively, the length of the opening of the hollow structure of the linear scale is at least half of the distance from the center of the annular scale to the lamp farthest from the center, and generally the opening length is substantially equivalent to the length of the linear scale (the opening length is generally slightly smaller than the length of the linear scale) to form a slide rail of the positioning slider 103.
Alternatively, the materials of the first scale 101, the second scale 102, and the positioning slider 103 include, but are not limited to, metals, ceramics, plastics, and other hard materials.
Referring to fig. 1 to 4, an embodiment of the present invention further provides a semiconductor processing apparatus including the positioning apparatus in any one of the above embodiments.
The embodiment of the invention also provides a positioning method, which mainly comprises the following steps:
in step S11, the positioning device is brought close to the semiconductor processing apparatus, and the first scale 101 is connected to the semiconductor processing apparatus by the connection structure 104 of the first scale 101 of the positioning device. Wherein the semiconductor processing apparatus comprises a plurality of processing units, for example comprising a lamp array formed by a plurality of lamps.
Step S12, sliding or rotating the second scale 102 of the positioning device and sliding the positioning slider 103 of the positioning device to align one processing unit from a plurality of processing units, obtains the coordinates of the aligned processing unit from the position of the positioning slider 103 relative to the second scale 102 and the first scale 101.
Specifically, the second scale 102 of the positioning device may be slid or rotated, and the second scale 102 may be stopped at the first position of the first scale 101, and the positioning slider 103 of the positioning device may be slid, and the positioning slider 103 may be stopped at the second position of the second scale 102, so that the coordinates of the aligned machining unit may be obtained from the scales corresponding to the first position and the second position.
With the foregoing embodiments of the positioning method of the present invention, the coordinates of a single machining unit in the array of machining units can be obtained.
The embodiment of the invention also provides another positioning method, which mainly comprises the following steps:
in step S21, target coordinates of a target processing unit (e.g., a target lamp) are acquired.
In step S22, the positioning device is brought close to the semiconductor processing apparatus, and the first scale 101 is connected to the semiconductor processing apparatus by the connection structure 104 of the first scale 101 of the positioning device. Wherein the semiconductor processing apparatus comprises a plurality of processing units, for example comprising a lamp array formed by a plurality of lamps.
In step S23, the second scale 102 of the positioning device is slid or rotated, and the positioning slider 103 of the positioning device is slid to move the positioning slider 103 to a position corresponding to the target coordinates.
In step S24, the machining unit aligned with the positioning slider 103 is set as a target machining unit.
Alternatively, the target coordinates acquired in the foregoing step S21 may include a target first-dimension coordinate and a target second-dimension coordinate. In step S23, the target processing unit may be found by sliding or rotating the second scale 102 of the positioning device and sliding the positioning slider 103 of the positioning device, moving the second scale 102 to a position corresponding to the target first-dimension coordinate, and moving the positioning slider 103 to a position corresponding to the target second-dimension coordinate.
Alternatively, in an example where the first scale 101 is an annular scale and the second scale 102 is a rectilinear scale, the target first-dimension coordinate is an angle and the target first-dimension coordinate is a radius. Clamping the device on a base 202 of the lamp by taking the positioning opening of the device as a reference, rotating the linear scale to find a corresponding angle, and fixing the linear scale by using a linear scale fixing pin; then, the positioning slide block 103 is slid along the linear scale to find the corresponding lamp.
With the foregoing embodiments of the positioning method of the present invention, when the coordinates of the machining units are known, the corresponding machining units can be found from the machining unit array.
It should be noted that, in this embodiment, the positioning method of the present invention may further include confirming the position of each processing unit in advance, and storing the relevant information in the software system, as shown in table 1, where ID information (number) of the processing unit and the corresponding coordinate information are stored.
The positioning method of the present invention may be used to replace and repair a faulty machining unit, and specifically, the step S21 of the positioning method of the present invention may include: when a certain processing unit in the processing unit array fails, for example, a sensor signal determines that the certain processing unit fails and obtains an ID (serial number) of the failed processing unit, a target coordinate corresponding to the ID of the failed processing unit is found by using a pre-made table, and the target coordinate is displayed by a software system interface, so that a target coordinate of the target processing unit is obtained; the target processing unit is then positioned using the positioning apparatus of the present invention according to the aforementioned steps S22 to S24 of the positioning method of the present invention, so that the replacement and repair of the failed processing unit are subsequently performed.
Table 1
| Number of lamps | Coordinate (theta, R) |
| 1 | (0.00,0.00) |
| 2 | (20.00,10.00) |
| 3 | (20.00,50.00) |
| …… | |
| 179 | (120.00,30.00) |
| 180 | (180.00,30.00) |
| 181 | (270.00,60.00) |
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A positioning device, the device comprising:
a first scale comprising a connection structure for connecting the first scale with a semiconductor processing apparatus, wherein the semiconductor processing apparatus comprises a plurality of processing units;
a second scale arranged to slide or rotate relative to the first scale;
a positioning slider arranged to slide along the second scale for aligning one machining unit from the plurality of machining units and deriving coordinates of the aligned machining unit from a position of the positioning slider relative to the second scale and the first scale.
2. The positioning device of claim 1, wherein:
the first scale is an annular scale; the first scale is provided with a first scale, and the first scale is used for angle measurement;
the second scale is a linear scale, at least one of two ends of the linear scale in the length direction is in contact with the annular scale, and the linear scale is arranged to rotate in the annular scale; the second scale has a second scale for measuring along a length direction of the linear scale.
3. The positioning device of claim 1, wherein:
the first ruler is one or two first linear rulers, the second ruler is a second linear ruler, one end of the second linear ruler is in sliding connection with the first linear ruler or the second linear ruler is in sliding connection between the two first linear rulers, and the second linear ruler is arranged to slide along the length direction of the first linear ruler;
the first linear scale is provided with a first scale, and the first scale is used for measuring along the length direction of the first linear scale; the second linear scale has a second scale for measuring in a length direction of the second linear scale.
4. The positioning device according to claim 2 or 3, wherein:
the contact end of one scale in the first scale and the second scale, which is used for being in contact with the other scale, is provided with a boss;
the other of the first scale and the second scale has a first part and a second part which are arranged in parallel in the thickness direction, and a space for accommodating the boss is formed between the first part and the second part so as to form a track for the second scale to rotate in the first scale or a track for the second scale to slide along the first scale;
the contact end of the first part and/or the second part, which is in contact with the scale with the boss, abuts against the shoulder of the boss to stop the movement of the second scale along the length direction of the second scale.
5. The positioning device of claim 1, wherein:
the positioning slider has a through hole for selecting one processing unit from a plurality of processing units through the through hole.
6. The positioning device of claim 5, wherein:
the second scale is of a hollow structure, is embedded with the positioning slide block and forms a sliding track of the positioning slide block; the width of the opening of the hollow structure is not smaller than the size of the through hole of the positioning sliding block.
7. The positioning device of claim 1, further comprising:
a second scale locking member for stopping sliding or rotation of the second scale with respect to the first scale to lock the second scale with the first scale; and/or the presence of a gas in the gas,
and the positioning slide block locking piece is used for stopping the sliding of the positioning slide block along the second scale so as to lock the positioning slide block and the second scale.
8. The positioning device of claim 1, wherein:
the connecting structure of the first scale is specifically used for detachably and fixedly connecting the first scale to semiconductor processing equipment;
the connecting structure of the first scale comprises a clamping structure, a clamping structure and/or a magnetic attraction structure.
9. The positioning device of claim 2, wherein:
the angular resolution of the annular scale is not lower than 0.01 degrees, and the resolution of the radius measuring position of the linear scale is not lower than 0.05 mm;
the linear scale is of a hollow structure with the opening width of 5-50 mm, and the positioning slide block is provided with a through hole with the diameter of 5-50 mm.
10. A semiconductor processing apparatus, characterized in that it comprises a positioning device according to any one of claims 1 to 9.
11. A method of positioning, the method comprising:
bringing the positioning device of any one of claims 1 to 9 close to a semiconductor processing apparatus, and connecting a first scale of the positioning device to the semiconductor processing apparatus by using a connecting structure of the first scale, wherein the semiconductor processing apparatus includes a plurality of processing units;
and sliding or rotating a second scale of the positioning device, sliding a positioning slide block of the positioning device to align one processing unit from the plurality of processing units, and obtaining the coordinates of the aligned processing unit according to the position of the positioning slide block relative to the second scale and the first scale.
12. A method of positioning, the method comprising:
acquiring a target coordinate of a target processing unit;
bringing the positioning device of any one of claims 1 to 9 close to a semiconductor processing apparatus, and connecting a first scale of the positioning device to the semiconductor processing apparatus by using a connecting structure of the first scale, wherein the semiconductor processing apparatus includes a plurality of processing units;
sliding or rotating a second scale of the positioning device, and sliding a positioning slide block of the positioning device to move the positioning slide block to a position corresponding to the target coordinates;
and taking the processing unit aligned with the positioning slide block as the target processing unit.
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| CN202210226247.XA CN114613698B (en) | 2022-03-09 | 2022-03-09 | Positioning device, semiconductor processing device and positioning method |
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| CN114613698B (en) | 2022-11-01 |
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