CN115122273A - Device for replacing processing unit of semiconductor processing equipment - Google Patents
Device for replacing processing unit of semiconductor processing equipment Download PDFInfo
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- CN115122273A CN115122273A CN202210866810.XA CN202210866810A CN115122273A CN 115122273 A CN115122273 A CN 115122273A CN 202210866810 A CN202210866810 A CN 202210866810A CN 115122273 A CN115122273 A CN 115122273A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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Abstract
The present application relates to a replacement device for a processing unit of a semiconductor processing apparatus including a plurality of processing units, the replacement device including: the positioning mechanism and the pick-and-place mechanism; the positioning mechanism comprises a first scale, a second scale and a positioning slide block; the picking and placing mechanism comprises a slideway, a supporting piece and a picking and placing clamp; the slide way is fixedly connected with the positioning slide block of the positioning mechanism, and the slide way is provided with a position close to the processing unit and a position far away from the processing unit; the support is used for supporting the picking and placing clamp and is arranged to move along the slide way; the picking and placing clamp is used for clamping the processing unit and is arranged to move along the slide way along with the supporting piece so as to be close to or far away from the processing unit. By using the replacing device of the processing unit of the semiconductor processing equipment, the processing unit can be replaced quickly and accurately.
Description
Technical Field
The present application relates to the field of semiconductor technology, and more particularly, to a device for replacing a processing unit of a semiconductor processing apparatus.
Background
The statements herein merely provide background information related to the present application and may not necessarily constitute prior art.
In semiconductor manufacturing processes, an array of multiple process units is often used to process a die (also referred to as a wafer). For example, in Rapid Thermal Processing (RTP), an array of hundreds of heat lamps is often used to heat the wafer. Each light may have a corresponding number to identify. When a damaged lamp is replaced, it is necessary to find the damaged lamp from among hundreds of lamps. As the number of lamps increases, the efficiency of positioning the lamps gradually decreases. And because the arrangement of the lamps is dense, the arrangement of the lamps is not necessarily regular or even, a certain error rate exists only by the preset numbers or drawings for positioning, if the lamps are only identified by naked eyes and replaced by hands, the replacement efficiency is low, and the pollution probability to mechanical parts is increased.
Disclosure of Invention
The invention aims to provide a novel replacing device for a processing unit of semiconductor processing equipment, and aims to improve the accuracy and efficiency of maintaining and replacing the processing unit in the semiconductor processing equipment in the semiconductor manufacturing process.
The purpose of the application is realized by adopting the following technical scheme. According to an apparatus for replacing a processing unit of a semiconductor processing apparatus proposed in the present application, the semiconductor processing apparatus includes a plurality of processing units; the replacement device includes: the positioning mechanism and the pick-and-place mechanism; the positioning mechanism comprises a first scale, a second scale and a positioning slide block; the first scale comprises a connecting structure for connecting the first scale with semiconductor processing equipment; the second scale is arranged to slide or rotate relative to the first scale; the positioning slide block is arranged to slide along the second scale and is used for aligning one processing unit from the plurality of processing units and obtaining the coordinates of the aligned processing unit according to the position of the positioning slide block relative to the second scale and the first scale; the picking and placing mechanism comprises a slideway, a supporting piece and a picking and placing clamp; the slide way is fixedly connected with the positioning slide block of the positioning mechanism, and the slide way is provided with a position close to the processing unit and a position far away from the processing unit; the support is used for supporting the picking and placing clamp and is arranged to move along the slide way; the picking and placing clamp is used for clamping the processing unit and is arranged to move along the slide way along with the supporting piece so as to be close to or far away from the processing unit.
The object of the present application can be further achieved by the following technical measures.
In some optional examples, the positioning slider has a through hole, the size of the through hole of the positioning slider is larger than that of the pick-and-place clamp, and the pick-and-place clamp has a position aligned with the through hole so that the pick-and-place clamp can take and place the processing unit through the through hole of the positioning slider.
In some optional examples, the pick and place mechanism further comprises a rotating shaft fixed to the support, and the pick and place clamp is configured to rotate around the rotating shaft.
In some alternative examples, the slideway and/or the support is provided with a first position maintaining portion for maintaining the support at a target position during movement of the support along the slideway; and/or the rotating shaft and/or the taking and placing clamp are/is provided with a second position holding part which is used for holding the taking and placing clamp at a target angle in the process that the taking and placing clamp rotates around the rotating shaft; and/or one end of the slide way, which is far away from the processing unit, is provided with a yielding groove.
In some alternative examples, the size and shape of the part of the pick-and-place clamp for contacting the processing unit are matched with the size and shape of the processing unit.
In some optional examples, the second scale has a hollow structure, is embedded with the positioning slide block, and is formed as a sliding track of the positioning slide block; the width of the opening of the hollow structure is not smaller than the size of the through hole of the positioning sliding block.
In some alternative examples, the first scale is an annular scale; the first scale is provided with a first scale, and the first scale is used for angle measurement; the second scale is a linear scale, at least one of two ends of the linear scale in the length direction is in contact with the annular scale, and the linear scale is arranged to rotate in the annular scale; the second scale has a second scale for measuring along a length direction of the linear scale.
In some optional examples, the first scale is one or two first linear scales, the second scale is a second linear scale, one end of the second linear scale is slidably connected with the first linear scale, or the second linear scale is slidably connected between the two first linear scales, and the second linear scale is configured to slide along the length direction of the first linear scale; the first linear scale is provided with a first scale, and the first scale is used for measuring along the length direction of the first linear scale; the second linear scale has a second scale for measuring along a length direction of the second linear scale.
In some optional examples, the contact end of one of the first scale and the second scale for contacting the other scale has a boss; the other of the first scale and the second scale has a first part and a second part which are arranged in parallel in the thickness direction, and a space for accommodating the boss is formed between the first part and the second part so as to form a track for the second scale to rotate in the first scale or a track for the second scale to slide along the first scale; the contact end of the first part and/or the second part, which is in contact with the scale with the boss, abuts against the shoulder of the boss to stop the movement of the second scale along the length direction of the second scale.
In some optional examples, the positioning mechanism further comprises: a second scale locking member for stopping sliding or rotation of the second scale with respect to the first scale to lock the second scale with the first scale; and/or, a positioning slider locking piece for stopping the sliding of the positioning slider along the second scale to lock the positioning slider with the second scale.
Compared with the prior art, the method has obvious advantages and beneficial effects. By means of the technical scheme, the replacing device of the processing unit of the semiconductor processing equipment at least has the following advantages and beneficial effects:
1. the application provides a device for quickly and accurately positioning and replacing a processing unit (for example, a heating lamp) of semiconductor processing equipment, which can save the maintenance time of the semiconductor processing equipment such as rapid thermal processing equipment, improve the accuracy and replacement efficiency of the semiconductor processing equipment when the processing unit is maintained and replaced, and avoid the pollution to other parts such as mechanical parts of the semiconductor processing equipment in the replacement process;
2. the replacing device can greatly improve the accuracy of positioning the processing unit, a unique target can be positioned in a plane double-coordinate mode, and the error positioning caused by the positioning by only using a serial number or a drawing is avoided;
3. the positioning efficiency of the processing units is greatly improved, the Time for searching numbers when the number of the processing units is more than a certain degree is saved, and the Time MTTR (mean Time tip repair) required for replacing the processing units on an equipment line is shortened.
The foregoing description is only an overview of the technical solutions of the present application, and in order to make the technical means of the present application more clearly understood, the present application can be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present application more clearly understood, the following preferred embodiments are specifically illustrated below, and the detailed description is given in conjunction with the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a lamp array configuration of a semiconductor manufacturing process apparatus;
FIG. 2 is a schematic view of a positioning mechanism of an exchange device of a process unit of a semiconductor process facility according to one embodiment of the present application;
FIG. 3 is a schematic view of a changing apparatus coupled to a lamp array structure according to one embodiment of the present application;
FIG. 4 is an enlarged partial schematic view at A in FIG. 3;
fig. 5 is a schematic view of a pick and place mechanism of an exchange device of a process unit of a semiconductor process facility according to an embodiment of the present application;
fig. 6 and 7 are schematic views of a gripping and processing unit using a replacing apparatus according to an embodiment of the present application.
Detailed Description
To further illustrate the technical means and effects adopted by the present application to achieve the predetermined objects, the following detailed description will be given for the specific implementation, structure, features and effects of the replacement device of the processing unit of the semiconductor processing equipment according to the present application with reference to the accompanying drawings and preferred embodiments.
Note that, as shown in fig. 1, a semiconductor processing apparatus (also referred to as a semiconductor manufacturing apparatus or simply a semiconductor apparatus) referred to in the present application includes a plurality of processing units 301 (also referred to as semiconductor processing units), and these processing units 301 may be referred to as an array of processing units or simply an array. The processing unit 301 includes, but is not limited to, a lamp (lamp). In some alternative embodiments, the semiconductor processing tool is a tool used in a Rapid Thermal Processing (RTP) process having a heating structure that generally includes a heating lamp and a base 302 of the heating lamp. Alternatively, the semiconductor processing apparatus of the present application may be a semiconductor nitridation apparatus, including but not limited to a DPN (decoupled plasma nitridation) apparatus, a PNA (post plasma nitridation annealing) apparatus, and the like. It should be noted that fig. 1 is a schematic illustration only, and the present application does not limit the shape and size of a single processing unit 301 of a semiconductor processing apparatus, nor the pattern of an array formed by a plurality of processing units 301.
Referring to fig. 2, 3, 4, 5, 6 and 7, the replacing device of the processing unit of the semiconductor processing equipment of the present application mainly includes: a positioning mechanism and a pick-and-place mechanism.
Wherein, this positioning mechanism mainly includes: a first scale 101, a second scale 102 and a positioning slider 103.
Wherein the first scale 101 comprises one or more connection structures 104. The connection structure 104 is used to connect the first scale 101 to a semiconductor processing apparatus.
Wherein the second scale 102 is arranged to slide or rotate relative to the first scale 101. For example, the second scale 102 may be caused to slide or rotate relative to the first scale 101 by a manually applied force.
Wherein the positioning slider 103 is arranged to slide along the second scale 102 for aligning one processing unit 301 from a plurality of processing units 301 of the semiconductor processing apparatus and obtaining coordinates of the aligned processing unit 301 from the position of the positioning slider 103 relative to the second scale 102 and the first scale 101. Wherein optionally the positioning slider 103 can be made to slide along the second scale 102 by manually applied force. The position of the positioning slider 103 relative to the second scale 102 and the first scale 101 may be the position of the positioning slider 103 relative to the second scale 102 and the position of the second scale 102 relative to the first scale 101.
Optionally, the first scale 101 and the second scale 102 each have a scale. Specifically, the first scale 101 has a first scale, and the second scale 102 has a second scale, which are respectively used for measuring coordinates of a first dimension and a second dimension, so as to measure two-dimensional plane coordinates. Alternatively, the scale on the scale may be a scale of uniformly distributed international standard units (length, angle, etc.); alternatively, the scale on the scale need not be a scale in international standard units, and may be, for example, a scale that is preset only to identify the positions of the plurality of processing units 301, respectively.
It should be noted that the present application is not limited to the arrangement of the processing unit array, and the processing unit array may be rectangular, hexagonal or triangular, or may even be irregularly shaped, besides the circularly arranged array shown in fig. 1. In addition, the distribution position of each processing unit 301 in the processing unit array is not limited in the present application, and may be uniformly distributed or not. In addition, the present application also does not limit the number of processing units 301 in the array.
Referring to fig. 5, 6 and 7, the pick-and-place mechanism mainly includes a slide 201, a support 202 and a pick-and-place clip 203.
The slideway 201 is fixedly connected with a positioning slide block 103 of the positioning mechanism. The chute 201 has a position close to the processing unit 301 and a position far from the processing unit 301. For example, in an example where the processing unit 301 is a heating lamp, the chute 201 may be perpendicular to the plane of the heating lamp.
The support 202 is used to support the pick-and-place clamp 203. The support 202 is arranged to be movable along the slideway 201.
The pick-and-place clamp 203 is used for clamping the processing unit 301, and the pick-and-place clamp 203 is arranged to move along the slide 201 along the support member 202 so as to be close to or far away from the processing unit 301.
By using the replacing device of the processing unit of the semiconductor processing equipment, one processing unit 301 can be accurately positioned from the processing unit array, and the processing unit 301 can be replaced.
In some embodiments of the present application, the pick and place mechanism of the exchange device further comprises a rotating shaft 204. The rotating shaft 204 is fixed to the support 202 of the pick and place mechanism. And the pick-and-place clamp 203 of the pick-and-place mechanism is arranged to rotate around the rotation shaft 204.
It should be noted that, in order to facilitate the rotation of the pick-and-place clamp 203 around the rotation axis 204, a corresponding abdicating structure may be provided on the corresponding components. In some specific examples, as shown in fig. 6 and 7, an offset groove may be provided at an end of the chute 201 away from the processing unit 301 so as not to hinder the rotation of the pick-and-place clamp 203. Further, a structure for stopping the rotation of the pick-and-place clamp 203 may be provided at an end of the slide 201 close to the processing unit 301, for example, a flat plate structure may be adopted instead of providing a relief groove at an end of the slide 201 close to the processing unit 301, so that when the pick-and-place clamp 203 is close to the processing unit 301, the rotation of the pick-and-place clamp 203 can be limited.
In some embodiments of the present application, the runway 201 and/or the support 202 of the pick and place mechanism is provided with a first position holder for holding the support 202 in a target position during movement of the support 202 along the runway 201.
In some embodiments of the present application, the rotation axis 204 of the pick and place mechanism and/or the pick and place clamp 203 is provided with a second position maintaining portion for maintaining the pick and place clamp 203 at the target position during the rotation of the pick and place clamp 203 around the rotation axis 204.
It should be noted that the present application does not limit the specific structure of the first position maintaining part and the second position maintaining part, including but not limited to: shell fragment and recess, shell fragment and through-hole, arch and recess, magnetism inhale piece etc.. For example, taking the first position maintaining part as an example, a magnetic member may be disposed on the top of the sliding channel 201 to magnetically fix the pick-and-place clamp 203 on the top of the sliding channel 201 when the pick-and-place clamp 203 is not used, or a plurality of recesses may be disposed on the sliding channel 201, and corresponding protrusions may be disposed on corresponding positions of the supporting member 202, so that the supporting member 202 may be maintained in the recesses during sliding along the sliding channel 201, and may be separated from the recesses and continue to slide when a large force is applied.
It should be noted that multiple types of first position holding portions and multiple types of second position holding portions may be provided at the same time, for example, a magnetic member is provided on the top of the slide 201, and multiple recesses are provided on the slide 201, and corresponding protrusions are provided at corresponding positions on the support member 202.
Note that, the aforementioned slide 201 and/or the support 202 having the first position holding portion means that the first position holding portion may be provided only on the slide 201, only on the support 202, or mutually engaged first position holding portions may be provided on the slide 201 and the support 202. The aforementioned rotation shaft 204 and/or the pick-and-place clamp 203 having the second position maintaining portion means that the second position maintaining portion may be provided only on the rotation shaft 204, only on the pick-and-place clamp 203, or the rotation shaft 204 and the pick-and-place clamp 203 may be provided with the second position maintaining portion which is engaged with each other.
In some embodiments of the present application, the size and shape of the portion of the pick-and-place clamp 203 that is used to contact the processing unit 301 matches the size and shape of the processing unit 301. Taking the processing unit 301 as a heating lamp as an example, the size and shape of the portion of the pick-and-place holder 203 for contacting the heating lamp match the size and shape of the heating lamp. It should be noted that the application is not limited to the specific structure and contact manner of the contact portion of the pick-and-place clamp 203 with the processing unit 301. For example, the pick-and-place clamp 203 may contact the processing unit 301 by surface contact or point contact.
It should be noted that the pick-and-place clamp 203 can move up and down along the slide 201, and the pick-and-place clamp 203 and/or the slide 201 can also be used as a handle for positioning the slide 103 in the process of positioning the target processing unit 301 from the plurality of processing units 301 by using the positioning mechanism.
In some examples, the access clip 203 includes a body portion and a clip portion. The material of the body portion of the access clip 203 includes, but is not limited to, any hard material such as metal, ceramic, plastic, etc. The gripping portion of the pick-and-place gripper 203 is adapted to contact the processing unit 301. The shape and size of the clamping portion are related to the shape and size of the processing unit 301. For example, the shape of the clamping portion includes, but is not limited to, a cylinder, and its inner diameter may range in size from 5 to 50 mm. The material of the portion of the clamping portion contacting the processing unit 301, for example, the material of the inner wall of the clamping portion, includes but is not limited to rubber, silicon gel, and any material with a certain elasticity, so as to avoid damage to the processing unit 301.
Note that the present application does not limit the specific structure of the pick-and-place clamp 203, and for example, the pick-and-place clamp 203 is not limited to the scissor clamp in the drawings, but may be any mechanism capable of clamping the processing unit 301.
In some examples, the material of the slide 201 includes, but is not limited to, metal, ceramic, plastic, and any hard material, and the height of the slide 201 may be configured according to the size of the processing unit 301 and the semiconductor processing equipment, for example, the height of the slide 201 may be not less than 50 mm.
In some embodiments of the present application, the first scale 101 is an annular scale. The first scale 101 has a first scale, which is used for angle measurement. Alternatively, the annular scale may be clamped to the base 302 of the processing unit 301. The second scale 102 is a linear scale, at least one of both ends of which in the longitudinal direction is in contact with the annular scale, and the linear scale is configured to rotate within the annular scale. Optionally, the linear scale is embedded within the annular scale. The second scale 102 has a second scale for measuring along the length of the linear scale. Note that the scale does not have to be spread over the entire scale, but may be spread over only a part of the scale, for example, in the linear scale shown in fig. 2, since it is for measuring a radius, the scale may be provided only on half of the linear scale in the length direction, and the sliding range of the positioning slider 103 may also be half of the linear scale and not necessarily the entire linear scale.
In an alternative example, as shown in fig. 2, both ends of the linear scale in the length direction are in contact with, e.g., abutting, the annular scale so that the linear scale can rotate around the center of the annular scale within the annular scale; alternatively, in another alternative example (not shown in the figure), one end of the linear scale is rotatably provided on the annular scale, the one end is not called as a fixed end, and the other end of the linear scale is a free end, so that the linear scale can rotate around the fixed end in the annular scale.
Note that the first scale 101 and the second scale 102 are not limited to be annular and linear scales. For example, in some embodiments of the present application, the first scale 101 is one or two first linear scales, and the second scale 102 is a second linear scale (not shown). One end and first linear scale sliding connection, or second linear scale sliding connection between two first linear scales of second linear scale, second linear scale is set up to slide along the length direction of first linear scale. The first linear scale has a first scale for measuring in a length direction of the first linear scale. The second linear scale has a second scale for measuring in a length direction of the second linear scale. Optionally, the first linear scale and the second linear scale are perpendicular to each other.
In some embodiments of the present application, the contact end of one of the first and second scales 101, 102 for contacting the other scale has a boss (also referred to as a boss or a male portion); and the other of the first scale 101 and the second scale 102 has a first portion and a second portion arranged in parallel in the thickness direction. A space for accommodating the boss is formed between the first portion and the second portion to form a track in which the second scale 102 rotates within the first scale 101 or a track in which the second scale 102 slides along the first scale 101.
Furthermore, the boss is provided with a convex end and shoulders at two sides of the convex end; the contact end of the aforementioned first and/or second part that contacts the scale having the aforementioned boss abuts against the shoulder of the aforementioned boss to stop the movement of the second scale 102 along its length. In the case of the annular scale, the linear scale, this restricts the movement of the linear scale to only sliding or rotating relative to the annular scale; in the example where the first and second scales 101 and 102 are both linear scales, this restricts the movement of the second linear scale to only sliding in the longitudinal direction of the first linear scale.
Specifically, as an optional example, the inner side (the end close to the direction of the circle center) of the annular scale is provided with an annular boss, the linear scale comprises two sheet parts which are connected by a bolt to form the linear scale, a groove for accommodating the annular boss of the annular scale is formed between the two sheet parts and at least at two ends close to the length direction, and the linear scale can rotate in the annular scale through the matching of the annular boss and the groove; the terminal surface at least one slice part of sharp scale along length direction's both ends is inconsistent with the shoulder surface of the annular boss of annular scale to backstop sharp scale along its length direction's removal, optionally, can set up the terminal surface at the both ends of sharp scale into with annular scale contact position matched with arc. As another alternative example, the linear scale is of an integral structure, the linear scale has bosses at both ends in the length direction, the annular scale includes two sheet-like portions, the two sheet-like portions are connected by bolts to form the annular scale, a groove for accommodating the boss of the linear scale is formed between the two sheet-like portions and at least on the inner side (the end close to the circle center direction) of the annular scale, and the linear scale can rotate in the annular scale by the cooperation of the boss and the groove; the end face of the inner side of at least one sheet part of the annular boss is abutted against the shoulder surface of the linear scale so as to stop the linear scale from moving along the length direction of the linear scale.
In some embodiments of the present application, the positioning slider 103 has a through hole through which one processing unit 301 can be selected from the plurality of processing units 301.
Alternatively, the size of the through hole is not smaller than the size of the processing unit 301. Specifically, one processing unit 301 may be selected from the plurality of processing units 301 by viewing the processing unit 301 through the through hole, and if one complete (or substantially complete) processing unit 301 appears in the through hole of the positioning slider 103, it indicates that the positioning slider 103 is aligned with the processing unit 301. Alternatively, the shape of the through hole of the positioning slider 103 matches the shape of the processing unit 301. For example, in an example where the processing unit 301 is a lamp, the through-hole of the positioning slider 103 may be a circular through-hole.
Alternatively, the size of the through hole of the positioning slider 103 may be larger than the size of the pick-and-place clamp 203, and, as shown in fig. 5 and 6, the pick-and-place clamp 203 has a position aligned with the through hole so that the pick-and-place clamp 203 can take and place the processing unit 301 through the through hole of the positioning slider 103.
In some embodiments of the present application, the second scale 102 has a hollow structure, and a positioning slider 103 is embedded in the hollow structure, and is formed as a sliding track of the positioning slider 103.
Note that the second scale 102 can stop at least in a preset position range of the first scale 101, and can generally stop at any position of the first scale 101 during sliding or rotating with respect to the first scale 101; the positioning slider 103 can stop at least in a preset position range of the second scale 102, and can stop at any position of the second scale 102 during sliding along the second scale 102. It may be stopped by manual force or by providing it with a fixed structure such as a clamping structure. Specifically, in some embodiments of the present application, the positioning mechanism in the exchange device of the processing unit of the semiconductor processing apparatus of the present application further comprises: one or both of the second scale lock 105, the positioning slide lock.
The second scale lock 105 is configured to stop sliding or rotation of the second scale 102 with respect to the first scale 101 to lock the second scale 102 with the first scale 101. Specifically, the second scale lock member 105 has a locked state and a released state, and when the second scale lock member 105 is in the released state, the second scale 102 can slide or rotate with respect to the first scale 101, and when the second scale lock member 105 is in the locked state, the second scale 102 and the first scale 101 are locked to each other and cannot slide or rotate relative to each other.
Wherein the positioning slider lock is configured to stop sliding of the positioning slider 103 along the second scale 102 to lock the positioning slider 103 with the second scale 102. Specifically, the positioning slider lock has a locked state and a released state, and when the positioning slider lock is in the released state, the positioning slider 103 can slide with respect to the second scale 102, and when the positioning slider lock is in the locked state, the positioning slider 103 and the second scale 102 are locked to each other and cannot slide relative to each other.
As a specific example, the second scale lock 105 and the positioning slide lock may comprise fixed pins, or may alternatively be lockable structures such as magnets, screws, clips, and the like. The fixing pin can be used for locking and can also be used as a rotating and sliding handle.
In some embodiments of the present application, the connection structure 104 of the first scale 101 is specifically configured to: the first scale 101 is detachably fixed to the semiconductor processing apparatus. Optionally, the connecting structure 104 of the first scale 101 includes, but is not limited to: a snap fit structure, a clamping structure and/or a magnetic attraction structure. Note that a plurality of types of connection structures 104 may be used at the same time to fix the first scale 101 to the semiconductor apparatus. Generally, the connecting structure 104 of the first scale 101 is used for connecting the first scale 101 to the base 302 of the semiconductor processing apparatus, alternatively, since in some examples the replacing device of the present application is used for temporarily replacing the processing unit 301, the connecting structure 104 can be used for detachably and fixedly connecting the first scale 101 with the semiconductor processing apparatus, for example, detachably and fixedly connected to the base 302 of the heating structure of the semiconductor processing apparatus.
Optionally, the connecting structure 104 has a locking state and a releasing state, and during the process of connecting the positioning mechanism of the exchange device of the present application with the semiconductor processing equipment, the connecting structure 104 is kept in the releasing state and the positioning mechanism is close to the semiconductor processing equipment to a preset position, and then the connecting structure 104 is switched to the locking state, so as to stably connect the positioning mechanism with the semiconductor processing equipment; in separating the positioning mechanism from the semiconductor processing apparatus, the connecting structure 104 is first switched from the locked state to the released state, and then the positioning mechanism can be separated from the semiconductor processing apparatus.
As an optional specific example, in the case that the first scale 101 is an annular scale and the second scale 102 is a linear scale, the connecting structure 104 of the annular scale includes device positioning openings and clips, the clips can be members tightly clamped by screws or the like, and one of the screw positioning openings can be selected to be 0 ° of the start of the annular scale.
Alternatively, the accuracy of the scale needs to be able to resolve all of the machining units 301 so that different machining units 301 have different coordinates.
Alternatively, in some specific examples where the processing unit 301 is a lamp, the angular resolution of the aforementioned annular scale is not lower than 0.01 °. Optionally, the resolution of the radius measurement position of the aforementioned linear scale is not less than 0.05 mm.
Alternatively, in some specific examples where the processing unit 301 is a lamp, the diameter of the through hole of the positioning slider 103 is substantially equal to the diameter of the lamp, and is generally slightly larger than the diameter of the lamp. Optionally, the aforementioned positioning slider 103 has a through hole with a diameter of 5 to 50 mm. Alternatively, the opening width of the hollow structure of the aforementioned linear scale is not smaller than the diameter of the through hole of the positioning slider 103. Optionally, the linear scale has a hollow structure with an opening width of 5 to 50 mm. Alternatively, the length of the opening of the hollow structure of the linear scale is at least half of the distance from the center of the annular scale to the lamp farthest from the center, and generally the opening length is substantially equivalent to the length of the linear scale (the opening length is generally slightly smaller than the length of the linear scale) to form a slide rail of the positioning slider 103.
Alternatively, the materials of the first scale 101, the second scale 102, and the positioning slider 103 include, but are not limited to, metals, ceramics, plastics, and other hard materials.
Embodiments of the present application also provide a positioning method, which mainly includes the following steps S11-S12 for positioning a target heating lamp during replacement.
In step S11, one of the replacing devices described above is brought close to the semiconductor processing apparatus, and the first scale 101 of the replacing device is connected to the semiconductor processing apparatus by the connecting structure 104 of the first scale 101. Wherein the semiconductor processing apparatus comprises a plurality of processing units 301, for example comprising a lamp array formed by a plurality of lamps.
In step S12, the second scale 102 of the exchange device is slid or rotated, and the positioning slider 103 of the exchange device is slid to align one processing unit 301 from the plurality of processing units 301, and the coordinates of the aligned processing unit 301 are obtained from the positions of the positioning slider 103 with respect to the second scale 102 and the first scale 101.
Specifically, the second scale 102 of the exchange device may be slid or rotated and the second scale 102 may be stopped at the first position of the first scale 101, and the positioning slider 103 of the exchange device may be slid and the positioning slider 103 may be stopped at the second position of the second scale 102, so that the coordinates of the aligned machining unit 301 may be obtained from the scales corresponding to the first position and the second position.
With the foregoing embodiments of the positioning method of the present application, the coordinates of a single machining unit 301 in the array of machining units can be obtained.
Embodiments of the present application also provide another positioning method, which mainly includes the following steps S21-S24 for positioning the processing unit 301 during the replacement process.
In step S21, target coordinates of the target processing unit 301 (e.g., target lamp) are acquired.
In step S22, one of the replacing devices described above is brought close to the semiconductor processing apparatus, and the first scale 101 of the replacing device is connected to the semiconductor processing apparatus by the connecting structure 104 of the first scale 101. Wherein the semiconductor processing apparatus comprises a plurality of processing units 301, for example comprising a lamp array formed by a plurality of lamps.
In step S23, the second scale 102 of the exchange device is slid or rotated, and the positioning slider 103 of the exchange device is slid to move the positioning slider 103 to a position corresponding to the target coordinates.
In step S24, the processing unit 301 aligned with the positioning slider 103 is set as the target processing unit 301.
Alternatively, the target coordinates acquired in the foregoing step S21 may include a target first-dimension coordinate and a target second-dimension coordinate. In step S23, the target processing unit 301 can be found by sliding or rotating the second scale 102 of the replacing device and sliding the positioning slider 103 of the replacing device, moving the second scale 102 to a position corresponding to the target first-dimension coordinate, and moving the positioning slider 103 to a position corresponding to the target second-dimension coordinate.
Alternatively, in an example where the first scale 101 is an annular scale and the second scale 102 is a rectilinear scale, the target first-dimension coordinate is an angle and the target first-dimension coordinate is a radius. Clamping the device on the base 302 by taking the positioning opening of the device as a reference, rotating the linear scale to find a corresponding angle, and fixing the linear scale by using a linear scale fixing pin; then, the corresponding processing unit 301 can be found by sliding the positioning slide block 103 along the linear scale.
With the foregoing embodiments of the positioning method of the present application, it is possible to find the corresponding processing unit 301 from the processing unit array while knowing the coordinates of the processing unit 301.
Embodiments of the present application also provide a method of replacing a processing unit, which is applicable to a replacement device of a processing unit of a semiconductor processing apparatus exemplified in the present application, the replacement method mainly including the following steps S31-S34 for taking out the processing unit 301 during the replacement process.
In step S31, the target processing unit 301 is positioned from the plurality of processing units 301 of the semiconductor processing apparatus by using the positioning mechanism in the changer proposed in the present application, and the positioning slider 103 is aligned with the target processing unit 301. Specifically, the target machining unit 301 may be positioned using the aforementioned steps S21-S24.
In step S32, as shown in fig. 5, the pick-and-place holder 203 in the changer is rotated to a position facing the target processing unit 301.
In step S33, as shown in fig. 6, the pick-and-place clamp 203 is moved close to the processing unit 301 along the slide 201, specifically, the pick-and-place clamp 203 may be moved downward into the base 302, and the pick-and-place clamp 203 is used to clamp the target processing unit 301.
In step S34, the pick-and-place holder 203 holding the target processing unit 301 is moved away from the base 302 along the slide 201 to pick out the target processing unit 301 from the plurality of processing units 301, and then, as shown in fig. 7, the pick-and-place holder 203 is rotated along the rotation axis 204 to be substantially parallel to the base 302 of the processing unit 301, and finally, the target processing unit 301 is separated from the pick-and-place holder 203.
Embodiments of the present application also provide a method of replacing a processing unit, which is applicable to a replacement device of a processing unit of a semiconductor processing apparatus exemplified in the present application, the method of replacing mainly including the following steps S41-S44 for placing the processing unit at a target coordinate position in an array of processing units during replacement.
In step S41, a target coordinate position is located from the processing unit array of the semiconductor processing apparatus by using the positioning mechanism in the changer proposed in the present application, and the positioning slider 103 is aligned with the target coordinate position. Specifically, the target coordinate position may be located using the aforementioned steps S21-S24.
In step S42, the pick-and-place clamp 203 in the replacing device is placed at a position of the slide 201 away from the base 302, the pick-and-place clamp 203 is rotated along the rotating shaft 204 to be substantially parallel to the base 302, and the target processing unit 301 is clamped.
In step S43, the pick-and-place clamp 203 is rotated to the target coordinate position.
In step S44, the pick-and-place clamp 203 is moved along the slide 201 to approach the target coordinate position, specifically, the pick-and-place clamp 203 may be moved downward into the base 302, so as to place the target processing unit 301 at the target coordinate position.
With the foregoing embodiments of the method of replacing a processing unit of the present application, it is possible to quickly and accurately replace the processing unit 301 located at the target coordinates from the processing unit array when the processing unit 301 needs to be replaced, for example, when the processing unit 301 is damaged.
It should be noted that, in this embodiment, the replacing method of the present application may further include confirming the position of each processing unit 301 in advance, and storing the relevant information in the software system, as shown in table 1, where ID information (number) of the processing unit 301 and the corresponding coordinate information are stored.
The replacement and maintenance of the faulty machining unit 301 can be performed by using the replacement method of the present application, and specifically, the aforementioned step S21 of the replacement method of the present application may include: when a certain processing unit 301 in the processing unit array fails, for example, it is determined through a sensor signal that the certain processing unit 301 fails and obtains an ID (serial number) of the failed processing unit 301, a target coordinate corresponding to the ID of the failed processing unit 301 is found by using a pre-made table, and the target coordinate is displayed by a software system interface, so that a target coordinate of the target processing unit 301 is obtained; the target processing unit 301 is then positioned by the replacement device of the present application according to the aforementioned steps S22 to S24 of the replacement method of the present application for subsequent replacement and repair of the malfunctioning processing unit 301.
Table 1
| Numbering of processing units | Coordinate (theta, R) |
| 1 | (0.00,0.00) |
| 2 | (20.00,10.00) |
| 3 | (20.00,50.00) |
| …… | …… |
| 179 | (120.00,30.00) |
| 180 | (180.00,30.00) |
| 181 | (270.00,60.00) |
Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.
Claims (10)
1. An exchange device of a processing unit of a semiconductor processing apparatus including a plurality of processing units, characterized by comprising: the positioning mechanism and the pick-and-place mechanism;
the positioning mechanism comprises a first scale, a second scale and a positioning slide block; the first scale comprises a connecting structure for connecting the first scale with semiconductor processing equipment; the second scale is arranged to slide or rotate relative to the first scale; the positioning slide block is arranged to slide along the second scale and is used for aligning one processing unit from the plurality of processing units and obtaining the coordinates of the aligned processing unit according to the position of the positioning slide block relative to the second scale and the first scale;
the picking and placing mechanism comprises a slideway, a supporting piece and a picking and placing clamp; the slide way is fixedly connected with the positioning slide block of the positioning mechanism, and the slide way is provided with a position close to the processing unit and a position far away from the processing unit; the support is used for supporting the picking and placing clamp and is arranged to move along the slide way; the pick-and-place clamp is used for clamping the processing unit and is arranged to move along the slide way along with the supporting piece so as to be close to or far away from the processing unit.
2. The changing device according to claim 1, wherein:
the positioning slide block is provided with a through hole, the size of the through hole of the positioning slide block is larger than that of the picking and placing clamp, and the picking and placing clamp is provided with a position aligned with the through hole so that the picking and placing clamp can penetrate through the through hole of the positioning slide block to pick and place the processing unit.
3. The changing device according to claim 1, wherein:
the pick-and-place mechanism further comprises a rotating shaft, the rotating shaft is fixed to the supporting piece, and the pick-and-place clamp is arranged to rotate around the rotating shaft.
4. The changing device according to claim 1 or 3, wherein:
the slideway and/or the support is provided with a first position holding part for holding the support at a target position during the movement of the support along the slideway; and/or
The rotating shaft and/or the taking and placing clamp are/is provided with a second position holding part which is used for holding the taking and placing clamp at a target angle in the process that the taking and placing clamp rotates around the rotating shaft; and/or
And one end of the slide way, which is far away from the processing unit, is provided with a yielding groove.
5. The changing device according to claim 1, wherein:
the size and the shape of the part of the pick-and-place clamp, which is used for being in contact with the processing unit, are matched with those of the processing unit.
6. The changing device according to claim 2, wherein:
the second scale is of a hollow structure, is embedded with the positioning slide block and forms a sliding track of the positioning slide block; the width of the opening of the hollow structure is not smaller than the size of the through hole of the positioning sliding block.
7. The changing device of claim 1, wherein:
the first scale is an annular scale; the first scale is provided with a first scale, and the first scale is used for angle measurement;
the second scale is a linear scale, at least one of two ends of the linear scale in the length direction is in contact with the annular scale, and the linear scale is arranged to rotate in the annular scale; the second scale has a second scale for measuring along a length direction of the linear scale.
8. The changing device according to claim 1, wherein:
the first ruler is one or two first linear rulers, the second ruler is a second linear ruler, one end of the second linear ruler is in sliding connection with the first linear ruler or the second linear ruler is in sliding connection between the two first linear rulers, and the second linear ruler is arranged to slide along the length direction of the first linear ruler;
the first linear scale is provided with a first scale mark, and the first scale mark is used for measuring along the length direction of the first linear scale; the second linear scale has a second scale for measuring in a length direction of the second linear scale.
9. The changing device according to claim 7 or 8, wherein:
the contact end of one scale in the first scale and the second scale, which is used for being in contact with the other scale, is provided with a boss;
the other of the first scale and the second scale has a first part and a second part which are arranged in parallel in the thickness direction, and a space for accommodating the boss is formed between the first part and the second part so as to form a track for the second scale to rotate in the first scale or a track for the second scale to slide along the first scale;
the contact end of the first part and/or the second part, which is in contact with the scale with the boss, abuts against the shoulder of the boss to stop the movement of the second scale along the length direction of the second scale.
10. The changing device of claim 1, wherein the positioning mechanism further comprises:
a second scale locking member for stopping sliding or rotation of the second scale with respect to the first scale to lock the second scale with the first scale; and/or the presence of a gas in the gas,
and the positioning slide block locking piece is used for stopping the sliding of the positioning slide block along the second scale so as to lock the positioning slide block and the second scale.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866810.XA CN115122273A (en) | 2022-07-22 | 2022-07-22 | Device for replacing processing unit of semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866810.XA CN115122273A (en) | 2022-07-22 | 2022-07-22 | Device for replacing processing unit of semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN115122273A true CN115122273A (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210866810.XA Pending CN115122273A (en) | 2022-07-22 | 2022-07-22 | Device for replacing processing unit of semiconductor processing equipment |
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| CN (1) | CN115122273A (en) |
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| CN114613698A (en) * | 2022-03-09 | 2022-06-10 | 盛吉盛半导体科技(北京)有限公司 | Positioning device, semiconductor processing device and positioning method |
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| CN109176585A (en) * | 2018-10-23 | 2019-01-11 | 杭州鼎盛科技仪器有限公司 | Tubbing for narrow passage automatically grabs the device of commutation |
| CN209425438U (en) * | 2019-08-19 | 2019-09-24 | 湖南生物机电职业技术学院 | A kind of material-feeding and fetching manipulator |
| CN212385498U (en) * | 2020-05-18 | 2021-01-22 | 珠海泰坦新动力电子有限公司 | Battery grabbing device |
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