CN206194702U - Device of bulb among quick equipment for heat treatment of supplementary change wafer - Google Patents

Device of bulb among quick equipment for heat treatment of supplementary change wafer Download PDF

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Publication number
CN206194702U
CN206194702U CN201621136819.1U CN201621136819U CN206194702U CN 206194702 U CN206194702 U CN 206194702U CN 201621136819 U CN201621136819 U CN 201621136819U CN 206194702 U CN206194702 U CN 206194702U
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CN
China
Prior art keywords
bulb
rapid thermal
processing equipment
thermal processing
flat board
Prior art date
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Active
Application number
CN201621136819.1U
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Chinese (zh)
Inventor
范子敬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Xinxin Semiconductor Manufacturing Co Ltd
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Wuhan Xinxin Semiconductor Manufacturing Co Ltd
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Priority to CN201621136819.1U priority Critical patent/CN206194702U/en
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Abstract

The utility model relates to a device of bulb among quick equipment for heat treatment of supplementary change wafer is equipped with the reaction cavity among the quick equipment for heat treatment of wafer, it installs a plurality of bulbs of production of heat to distribute in the reaction cavity, including dull and stereotyped cover, dull and stereotyped cover with the shape and the big or small phase -match of reaction cavity, be equipped with a plurality of round holes on the dull and stereotyped cover, the number of round hole with the number of bulb is the same, and is a plurality of the round hole is in the position that distributes on the dull and stereotyped cover is respectively with a plurality of the bulb is in the position one -to -one that distributes in the reaction cavity, and arbitrary adjacent two distance between the round hole is with corresponding two distance between the bulb equals. The utility model discloses can make things convenient for and swift searching goes out the bulb that bad bulb is more renewed, and maintenance of equipment efficiency improves greatly, and it provides certain contribution to increase the productivity for the production line.

Description

A kind of device for aiding in changing bulb in wafer rapid thermal processing equipment
Technical field
The utility model is related to the device for aiding in more changing the bulb, and in particular to one kind auxiliary is changed wafer rapid thermal treatment and set The device of standby middle bulb.
Background technology
In current 300mm semiconductor crystal wafer production technologies, there are a kind of board referred to as fast heat treatment device, this equipment Mainly it is heated to certain process temperatures aborning to wafer, produces the reaction cavity of high temperature to include 409 bulbs, leads to Cross and produce heat to bulb power-up is luminous, be then applied on the surface of wafer, the height of temperature is controlled by temperature detecting probe Temperature controller is fed back to, then the bulb in corresponding region is given by the timely distribution power of bulb driver, so that whole wafer The temperature on surface reaches unanimously, the setting process temperatures required for meeting making technology.
It is well known that bulb is consumptive material, there is certain service life, need to change when bulb bad when, often will be from One or several bad bulbs for out more renewing are found out in numerous bulbs, normal operating process is by lamp envelope design The correspondence position of drawing goes for the corresponding position of reaction cavity, like this wastes time and easily sees wrong position, based on this Kind of puzzlement, it is necessary to develop a kind of instrument not only facilitated and efficiently search out bad bulb aid in more the bulb that renews.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of auxiliary and changes lamp in wafer rapid thermal processing equipment The device of bubble, tool not only facilitated but also efficiently search out bad bulb and more the bulb that renews.
The technical scheme that the utility model solves above-mentioned technical problem is as follows:One kind auxiliary is changed wafer rapid thermal treatment and is set The device of standby middle bulb, is provided with reaction cavity in wafer rapid thermal processing equipment, distributing installation has generation in the reaction cavity Multiple bulbs of heat, including flat board cover, the flat board cover match with the shapes and sizes of the reaction cavity, described Flat board cover is provided with multiple circular holes, and the number of the circular hole is identical with the number of the bulb, and multiple circular holes are described The position that the position being distributed on flat board cover is distributed with multiple bulbs in the reaction cavity respectively corresponds, and appoints The distance between two neighboring described circular hole of anticipating is equal with the distance between two corresponding bulbs.
The beneficial effects of the utility model are:A kind of auxiliary of the utility model changes bulb in wafer rapid thermal processing equipment Device design one with reaction cavity 1:1 device mould, goes for reaction chamber corresponding by the correspondence position of device mould Position, so conveniently can efficiently search out the new bulb of bad replacing bulb again, and maintenance of equipment efficiency is greatly improved, to life Producing line increases production capacity and provides certain contribution.
On the basis of above-mentioned technical proposal, the utility model can also do following improvement.
Further, the flat board cover is circular configuration, and is made up of transparent plastic material.
Beneficial effect using above-mentioned further scheme is:Flat board cover is made up of transparent material, facilitates observing response chamber Bulb in body, fast and easy finds bad bulb.
Further, the thickness of the flat board cover is 3mm.
Further, the radius of the flat board cover is 300~500mm.
Further, the radius of the flat board cover is 400mm.
Further, the number scope of the bulb is 300~500.
Further, the number scope of the circle is 300~500.
Further, the bulb is provided with 409.
Further, the circular hole is provided with 409.
Brief description of the drawings
Fig. 1 is the structural representation of reaction cavity in wafer rapid thermal processing equipment in the prior art;
Fig. 2 is the structural representation of the device that a kind of auxiliary of the utility model changes bulb in wafer rapid thermal processing equipment Figure.
In accompanying drawing, the list of parts representated by each label is as follows:
1st, reaction cavity, 2, bulb, 3, flat board cover, 4, circular hole.
Specific embodiment
Principle of the present utility model and feature are described below in conjunction with accompanying drawing, example is served only for explaining this practicality It is new, it is not intended to limit scope of the present utility model.
As shown in figure 1, reaction cavity 1 is provided with the prior art, in wafer rapid thermal processing equipment, the reaction cavity 1 Middle distributing installation has the multiple bulbs 2 for producing heat, 409 bulbs 2 is provided with this specific embodiment, when one of those Or several bulbs 2 bad whens needs to be changed, one is often found out from numerous bulbs 2 or several bad go out Come the bulb 2 for more renewing, normal operating process is that to go for reaction cavity 1 by the correspondence position of lamp envelope design drawing corresponding Position, like this wastes time and easily sees wrong position.
The utility model proposes the specific embodiment of following scheme to solve drawbacks described above:
As shown in Fig. 2 a kind of device for aiding in changing bulb in wafer rapid thermal processing equipment, including flat board cover 3, institute State flat board cover 3 to match with the shapes and sizes of the reaction cavity 1, the flat board cover 3 is provided with multiple circular holes 4, institute The number for stating circular hole 4 is identical with the number of the bulb 2, the position that multiple circular holes 4 are distributed on the flat board cover 3 point The position not being distributed in the reaction cavity 1 with multiple bulbs 2 corresponds, and two circular holes 4 of arbitrary neighborhood The distance between it is equal with the distance between two corresponding bulbs 2.That is the utility model is a kind of aids in more The device for changing bulb in wafer rapid thermal processing equipment is 1 designed as model with reaction cavity 1:1 mould.
Specifically:The flat board cover is made up of transparent plastic material;The thickness of the flat board cover 3 is 3mm;It is described flat The radius of plate cover 3 is 300~500mm, it is preferred that the radius of the flat board cover 3 is 400mm;The bulb 2 Number scope is 300~500;The number scope of the circular hole 4 is 300~500;It is provided with based on the bulb 2 in reaction cavity 1 409, the circular hole 4 also is provided with 409, and each circular hole represents a bulb.
When there is bulb 2 to damage in reaction cavity 1, flat board cover 3 is located on reaction cavity 1, each equal position of bulb 2 In corresponding circular hole 4, then make the electrified light emitting of bulb 2, by observing the bright dark situation of bulb 2 in circular hole 4, mark damage Bulb 2 corresponding to circular hole 4 position, then power off bulb 2, according to circular hole 4 mark position, can be easily and efficiently Search out bad bulb 2 and the bulb 2 for more renewing.
A kind of auxiliary of the utility model changes wafer rapid thermal processing equipment and conveniently can efficiently search out bad lamp again The bulb that bubble more renews, maintenance of equipment efficiency is greatly improved, and increasing production capacity to production line provides certain contribution.
Preferred embodiment of the present utility model is the foregoing is only, is not used to limit the utility model, it is all in this practicality Within new spirit and principle, any modification, equivalent substitution and improvements made etc. should be included in guarantor of the present utility model Within the scope of shield.

Claims (9)

1. a kind of device for aiding in changing bulb in wafer rapid thermal processing equipment, is provided with reaction in wafer rapid thermal processing equipment Cavity (1), distributing installation has the multiple bulbs (2) for producing heat in the reaction cavity (1), it is characterised in that:Including flat board Cover (3), the flat board cover (3) matches with the shapes and sizes of the reaction cavity (1), on the flat board cover (3) Multiple circular holes (4) are provided with, the number of the circular hole (4) is identical with the number of the bulb (2), multiple circular holes (4) are in institute State the position one that the position being distributed on flat board cover (3) is distributed with multiple bulbs (2) in the reaction cavity (1) respectively The distance between one correspondence, and the distance between the circular hole (4) of arbitrary neighborhood two and two corresponding bulbs (2) It is equal.
2. a kind of auxiliary according to claim 1 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The flat board cover (3) is circular configuration, and is made up of transparent plastic material.
3. a kind of auxiliary according to claim 2 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The thickness of the flat board cover (3) is 3mm.
4. a kind of auxiliary according to Claims 2 or 3 changes the device of bulb in wafer rapid thermal processing equipment, its feature It is:The radius of the flat board cover (3) is 300~500mm.
5. a kind of auxiliary according to claim 4 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The number scope of the bulb (2) is 300~500.
6. a kind of auxiliary according to claim 5 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The number scope of the circular hole (4) is 300~500.
7. a kind of auxiliary according to claim 6 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The radius of the flat board cover (3) is 400mm.
8. a kind of auxiliary according to claim 7 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The bulb (2) is provided with 409.
9. a kind of auxiliary according to claim 8 changes the device of bulb in wafer rapid thermal processing equipment, and its feature exists In:The circular hole (4) is provided with 409.
CN201621136819.1U 2016-10-19 2016-10-19 Device of bulb among quick equipment for heat treatment of supplementary change wafer Active CN206194702U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621136819.1U CN206194702U (en) 2016-10-19 2016-10-19 Device of bulb among quick equipment for heat treatment of supplementary change wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621136819.1U CN206194702U (en) 2016-10-19 2016-10-19 Device of bulb among quick equipment for heat treatment of supplementary change wafer

Publications (1)

Publication Number Publication Date
CN206194702U true CN206194702U (en) 2017-05-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621136819.1U Active CN206194702U (en) 2016-10-19 2016-10-19 Device of bulb among quick equipment for heat treatment of supplementary change wafer

Country Status (1)

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CN (1) CN206194702U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613698A (en) * 2022-03-09 2022-06-10 盛吉盛半导体科技(北京)有限公司 Positioning device, semiconductor processing device and positioning method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613698A (en) * 2022-03-09 2022-06-10 盛吉盛半导体科技(北京)有限公司 Positioning device, semiconductor processing device and positioning method

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