CN1145810C - Method of manufacturing optical film chip and optical film chip intermediate body - Google Patents

Method of manufacturing optical film chip and optical film chip intermediate body Download PDF

Info

Publication number
CN1145810C
CN1145810C CNB981066224A CN98106622A CN1145810C CN 1145810 C CN1145810 C CN 1145810C CN B981066224 A CNB981066224 A CN B981066224A CN 98106622 A CN98106622 A CN 98106622A CN 1145810 C CN1145810 C CN 1145810C
Authority
CN
China
Prior art keywords
film
mentioned
band
optical film
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB981066224A
Other languages
Chinese (zh)
Other versions
CN1196489A (en
Inventor
竹本常二
安
能木直安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of CN1196489A publication Critical patent/CN1196489A/en
Application granted granted Critical
Publication of CN1145810C publication Critical patent/CN1145810C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Polarising Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

A method for producing an optical film chip is provided which comprises the steps of (i) cutting an optical strip film into an optical film chip intermediate and (ii) cutting the optical film chip intermediate into a plurality of optical film chip, wherein the optical strip film is cut into the optical film chip intermediate having a shape of trapezoid so that the cutting is conducted along the first standard direction at a predetermined angle from an optic axis of the strip film as well as along the second standard direction perpendicular to the first standard direction. The optical film chip intermediate is also provided.

Description

The manufacture method of optical film chip and optical film chip intermediate
The present invention relates to be applicable to the manufacture method and the optical film chip intermediate of the optical film chip of liquid crystal indicator etc.
For example generally be used for liquid crystal indicator (calling LCD in the following text) with the optical thin film headed by polarizing film and the phase-contrast film.Such optical thin film needs to install among the LCD with the accurately consistent state of its optic axis and the design load of the LCD that becomes target.Here, so-called optic axis is an absorption axes when polarizing film, is the leading axle of phase lag axle or phase place when phase-contrast film.
For example, in the light that vibrates on the direction of 360 degree, polarizing film only makes along the light of fixed-direction vibration and passes through, the light that vibrates on the blocking direction in addition.For example in the LCD that uses this polarizing film, utilize the orientation of polarizing film and liquid crystal material molecules to control passing through of light and blocking.
In the LCD with the liquid crystal molecule twisted arrangement, picture color is black or white during according to applied voltage, is divided into positive common-black type and positive normally white.
In positive common-black type, shown in Fig. 5 a, for example when the torsion angle of liquid crystal molecule 51 is 90 °, the direction (below the direction of this absorption axes of polarizing film and the phase lag axle of phase-contrast film or the direction of the leading axle of phase place being designated as the optic axis direction in the lump) of absorption axes of 2 polarizing film 52a, 52b of both sides that is arranged on liquid crystal molecule 51 is parallel.Thereby the polarizing film 52a by a side, the light that advances along reversing of liquid crystal molecule are by the opposing party's polarizing film 52b blocking.Thereby with polarizing film 52b side during as the picture side, picture is for black.
On the other hand, in positive normally white, shown in Fig. 5 (b), be arranged on the polarization direction quadrature of 2 polarizing film 53a, 53b of the both sides of liquid crystal molecule 51.Thereby, also pass through the opposing party's polarizing film 53b by a side polarizing film 53a, the light that advances along reversing of liquid crystal molecule.Thereby with polarizing film 53b side during as the picture side, picture is white.
Like this, when in LCD, using, need the torsional direction setting shaft direction of pressing liquid crystal molecule with the optical thin film headed by the above-mentioned polarizing film.Thereby the direction of principal axis of these optical thin films need be by the torsional direction of liquid crystal molecule to for example long side direction (bearing of trend) of these optical thin films certain special angle θ that only tilts.
As shown in Figure 6, usually, optical thin film is at first made as banded optical thin film (first band-like film 31), by cutting off this first band-like film 31, uses as the optical film chip LCD that can pack into.At this moment, direction of principal axis SD 0Consistent with for example long side direction (bearing of trend) of first band-like film 31.
Therefore, for obtaining to direction of principal axis SD 0Optical film chip with prescribed direction as shown in Figure 6, at first cuts off above-mentioned first band-like film 31, as the optical film chip intermediate, obtains rectangular second band-like film 32.And, cut off this second band-like film 32, obtain having a plurality of optical film chips (for example rectangular optical thin film chip) of desirable size and shape.
At this moment, be rectangular second band-like film 32 that obtains representing by A, B, C, D among the figure, above-mentioned first band-like film 31 cuts off (being divided into two parts) along the long side direction of above-mentioned first band-like film 31, simultaneously, along the direction vertical (below be designated as short side direction), cut off with Rack with this long side direction.Also have, the short side direction both end sides of above-mentioned first band-like film 31 should fixedly make the performance unanimity of the optical film chip of gained, along the long side direction of above-mentioned first band-like film 31, only cuts off Rack at short side direction.
For example, the mounting table 11 (with reference to figure 7) at above-mentioned second band-like film 32 use 1200mm angles (wherein, the effective dimensions that available cut-out tooth is cut off is as 1140mm) time, if the effective width of above-mentioned first band-like film 31 (at the available width of the short side direction of first band-like film 31) is 1000mm, for example can cut into | A 1B 1| (refer to A 1B 1Between length, below identical)=| C 1D 1|=500mm, | A 1C 1|=| B 1D 1| the size of=1000mm.
Then, as shown in Figure 7, for obtaining optical film chip, above-mentioned second band-like film 32 is positioned on the mounting table 11, the edge is to axial SD 0The first reference direction SD with a certain certain party tropism 1Cut off with Rack, simultaneously, the edge is to this first reference direction SD 1The second vertical reference direction SD 2Cut off with Rack.As a result, obtained by with the first reference direction SD 1The a pair of opposite side that parallels and with the second reference direction SD 2The optical film chip (rectangular film 33) of for example rectangle that a pair of opposite side that parallels constitutes.
Each limit and the direction of principal axis SD of above-mentioned second band-like film 32 are described here, 0, the first reference direction SD 1And the second reference direction SD 2Relation.
In above-mentioned first band-like film 31, its direction of principal axis SD 0Parallel with the long side direction of this first band-like film 31, vertical with short side direction.Thereby, the limit A of above-mentioned second band-like film 32 1C 1And limit B 1D 1With direction of principal axis SD 0Parallel, limit A 1B 1And limit C 1D 1With direction of principal axis SD 0Vertically.Further, above-mentioned direction of principal axis SD 0To the first reference direction SD 1Tilt angle theta, so, limit A 1C 1And limit B 1D 1To the first reference direction SD 1Tilt angle theta.And, the above-mentioned second reference direction SD 2With the first reference direction SD 1Vertically.
Thereby, for cutting off above-mentioned second band-like film 32, when being positioned in above-mentioned second band-like film 32 on the mounting table 11, the state mounting that this second band-like film 32 tilts by angle θ with each limit of above-mentioned second band-like film 32 is so that the above-mentioned first reference direction SD 1Or the second reference direction SD 2Parallel with the cut-out tooth of not shown shearing device.
Thereby, second band-like film 32 of above-mentioned size is positioned in when cutting off on the mounting table 11 at above-mentioned 1200mm angle, if once cut off and can cut off two optical film chip intermediates (second band-like film), for example single treatment operation (will be to the optical film chip intermediate of mounting on the mounting table 11 along the first reference direction SD 1With the operation of Rack cut-out with along the second reference direction SD 2Operate as single treatment with the operation that Rack cuts off) just can cut off 500mm * 1000mm * 2 (sheet)=1.0m 2Second band-like film 32.
Yet, cut off above-mentioned first band-like film 31 at long side direction and short side direction along first band-like film 31, in case obtain rectangular second band-like film 32 back, when this second band-like film 32 is made the rectangular film 33 with desired size (method 1), as shown in Figure 7, end material 34 grades (among the figure with screened representation) that all can not form the rectangular film 33 of prescribed level along all limits of the periphery of second band-like film 32 produce with zigzag by above-mentioned angle θ.Therefore, end material 34 grades have been wasted.
Therefore, a kind of end material 34 grades that can reduce above-mentioned optical thin film of expectation, improve the manufacture method of the optical film chip of chamfering efficiency.
So the inventor etc. have studied the chamfering efficiency that can improve above-mentioned optical film chip, have cut off first band-like film, obtaining having the method (method 2) of the optical film chip of desirable size and shape from this second band-like film manufacturing behind second band-like film of parallelogram as the optical thin film intermediate.
In this case, at first, as shown in Figure 8, along long side direction (the direction of principal axis SD of this first band-like film 41 0) cut off (being divided into two parts) first band-like film 41, simultaneously, the edge is to above-mentioned direction of principal axis SD 0The first reference direction SD with certain specific directionality 1Cut off with Rack, in the shop drawings by with direction of principal axis SD 0The a pair of opposite side A that parallels 2C 2, B 2D 2With with the first reference direction SD 1The a pair of opposite side A that parallels 2B 2, C 2D 2Second band-like film 42 of the parallelogram shape that consists of.Also have, usually, the long side direction both end sides of above-mentioned first band-like film 41 should be fixed as the performance unanimity of the optical film chip that makes gained, along the long side direction of above-mentioned first band-like film 41, only cuts off Rack at short side direction.
The mounting table 11 of using above-mentioned 1200mm angle at above-mentioned second band-like film 42 (wherein, the effective dimensions that available cut-out tooth is cut off is as 1140mm) time, if the effective width of above-mentioned first band-like film 41 (at the available width of the short side direction of first band-like film 41) is 1000mm, for example can be cut to and makes | A 2C 2|=| B 2D 2|=650mm, limit A 2B 2With limit C 2D 2Between distance be 460mm, limit A 2C 2With limit B 2D 2Between distance be 500mm,＜A 2C 2D 2(limit A 2C 2With limit C 2D 2Angulation) reaches＜A 2B 2D 2(limit A 2B 2With limit B 2D 2Angulation) be that θ is about 45 degree.
Then, as shown in Figure 9, for obtaining optical film chip, above-mentioned second band-like film 42 is positioned on the mounting table 11, along the above-mentioned first reference direction SD 1Cut off with Rack, simultaneously, the edge is to this first reference direction SD 1The second vertical reference direction SD 2Cut off with Rack.As a result, obtained by with the first reference direction SD 1The a pair of opposite side that parallels and with the second reference direction SD 2The optical film chip (rectangular film 43) of for example rectangle that a pair of opposite side that parallels constitutes.
Each limit and the direction of principal axis SD of above-mentioned second band-like film 42 are described here, 0, the first reference direction SD 1And the second reference direction SD 2Relation.
In above-mentioned first band-like film 41, its direction of principal axis SD oParallel with the long side direction of this first band-like film 41.Thereby, the limit A of above-mentioned second band-like film 42 2C 2And limit B 2D 2With direction of principal axis SD 0Parallel.Also have, with the first reference direction SD 1The limit A that parallels 2B 2And limit C 2D 2To direction of principal axis SD oTilt angle theta.Further, because the above-mentioned second reference direction SD 2With the first reference direction SD 1Vertically, thus with limit A 2B 2And limit C 2D 2Vertically.
Thereby, for cutting off above-mentioned second band-like film 42, when being positioned in above-mentioned second band-like film 42 on the mounting table 11, with limit A 2B 2And limit C 2D 2The parallel mounting of above-mentioned cut-out tooth is made the above-mentioned first reference direction SD 1Parallel with the cut-out tooth of not shown shearing device.Also have, with limit A 2B 2And limit C 2D 2With the vertical mounting of above-mentioned cut-out tooth, make the second reference direction SD 2Parallel with above-mentioned cut-out tooth.
When using said method 2, as shown in Figure 9, in the periphery of second band-like film 42, only at opposed two limit (limit A 2C 2, B 2D 2) on can not form the rectangular film 43 of prescribed level end material 44 grades (among the figure with screened representation) produce with zigzag by above-mentioned angle θ.
Thereby, compare the less wastage of said method 2 with the method 1 that on all limits of the periphery of second band-like film 32, produces end material 34 grades.
Yet, although comparing waste with method 1, said method 2 lacks, in the periphery of second band-like film 32 or on two limits, produce end materials 44 etc., and very sufficient method also is difficult to say so.
And, when said method 2 cuts off on second band-like film 42 with above-mentioned size is positioned in the mounting table 11 at above-mentioned 1200mm angle, if once cut off and to cut off 2 optical film chip intermediates (second band-like film 42), just can be to two local mounting second band-like films 42 on above-mentioned mounting table 11, the single treatment operation can only be cut off 500mm * 460mm * 4 (sheet)=0.92m 2Second band-like film 42.
Also have, the inventor etc. the further result of research show that there are problem as follows in said method 1 and method 2.
Namely, said method 1 and method 2 are all being cut off second band-like film 32 or second band-like film 42 when obtaining rectangular film 33 or rectangular film 43, from where begin to cut off can improve chamfering efficiency must be according to above-mentioned angle θ and rectangular film 33,43 situations such as size, for example simulate cut-out with computer at every turn, set the normal place of beginning off-position according to this result.Thereby, be difficult to say the operating efficiency height of method of stating 1 and method 2.
Also have, second band-like film 32 or second band-like film 42 made by said method 1 or method 2 are cutting off these second band- like films 32,42 o'clock or with their packings, when dispatching from the factory, are all having the easy problem that within and without is obscured.Like this, the within and without of second band- like film 32,42 is done inverse time, because the direction of principal axis upset, so, use rectangular film 33,43 by these second band-like film, 32,42 gained, for example will cause the problem that the LCD function is undesired and can not show.
Thereby, for preventing obscuring in second band- like film 32,42 the table, need careful note and show in affirmation, also have the problem of operation reduction.
Also have, when carrying out above-mentioned second band- like film 32,42 packing, such as Figure 10 and shown in Figure 11, the central authorities of the container 21 that consists of at the corrugation paperboard with prescribed level etc., for example make second band- like film 32,42 exterior side up, can utilize the not shown method that separates to be divided into several layers and to come stacked.Also have, distolateral in container 21 is provided with the promising not shown dividing plate that prevents that the limit from move these optical film chips and container 21 contact edges.
Yet, in the time will packing with second band- like film 32,42 of said method 1 and method 2 gained with said method, because center of gravity is 1 point (cornerwise mid point of optical film chip intermediate), so the sheet number of second band- like film 32,42 that 1 layer of energy is stacked is restricted naturally.That is, when carrying out packing of second band- like film 32,42 with containers 21 such as corrugation paperboards, if center of gravity is 1 point, bad stability, sagging in the generation of the end of above-mentioned second band- like film 32,42, probably damage this second band-like film 32,42.Thereby, thus, also be difficult to by said method with by the good work of second band- like film 32,42 of this method gained.
The present invention is for addressing the above problem motion, and its purpose is to provide the manufacture method of the optical film chip of chamfering efficiency and good work.Also have, other purpose of the present invention is to provide the optical film chip intermediate of chamfering efficiency and good work.
Promptly, at first first, the invention provides the manufacture method of optical film chip, banded optical thin film is cut off the back as the optical film chip intermediate, further cut off the optical film chip that this optical film chip intermediate is made a plurality of optical film chips, it comprises following operation: first reference direction that has prescribed direction along the optic axis direction to this optical thin film cuts off banded optical thin film, simultaneously along the second vertical reference direction of above-mentioned first reference direction is cut off the optical film chip intermediate that banded optical thin film is made trapezoidal shape.
And, second, the manufacture method of optical film chip is provided, comprise following operation: the limit that will parallel with above-mentioned second reference direction cuts off above-mentioned optical film chip intermediate as normal place along second reference direction, the limit that will parallel with above-mentioned first reference direction cuts off above-mentioned optical film chip intermediate as normal place along first reference direction simultaneously.
According to above-mentioned first structure, the optical thin film that cuts off above-mentioned band shape along first reference direction that the optic axis direction of this optical thin film is had prescribed direction, along the second vertical reference direction of above-mentioned first reference direction is cut off, can access the optical film chip intermediate of trapezoidal shape simultaneously with a pair of opposite side that parallels with first reference direction and the limit that parallels with above-mentioned second reference direction.
Therefore, when cutting off above-mentioned optical film chip intermediate, need not resemble have earlier by the directivity of the optical axis direction of above-mentioned first reference direction and the situations such as size of optical film chip are set the normal place that begins to cut off by simulation at every turn, shown in of the present invention second constitutes, always can begin to cut off from fixing normal place, so, good work.
Also have, the words of first or second structure according to the present invention, above-mentioned optical film chip intermediate body is trapezoidal shape, when obtaining optical film chip from this optical film chip intermediate body, can prevent the outside of this optical film chip intermediate body and obscuring of the inside, even and obscure also can make easily the same outside and inside.Therefore, press said structure, can have than earlier and more improve operation.
Further, by the present invention first or second structure, can be than the end material that reduces in the waste that produces when optical film chip intermediate body obtains optical film chip be arranged earlier, so chamfering efficiency is also outstanding than what have earlier.
The 3rd, further, the invention provides the optical film chip intermediate that trapezoidal shape forms, have a pair of opposite side that parallels with first reference direction that the optic axis direction is had prescribed direction and reach and the limit that the second vertical reference direction of above-mentioned first reference direction is paralleled.
The present invention provides the optical film chip intermediate of trapezoidal shape especially, have a pair of opposite side that parallels with first reference direction that the optic axis direction is had prescribed direction, with to the vertical limit of this a pair of opposite side and other limits that parallel with the optic axis direction.
According to above-mentioned the 3rd structure, above-mentioned optical film chip intermediate forms trapezoidal shape, has a pair of opposite side that parallels with first reference direction that the optic axis direction is had prescribed direction; With with the limit that the second vertical reference direction of above-mentioned first reference direction is paralleled, promptly to the vertical limit of above-mentioned a pair of opposite side, so, when the optical film chip that obtains, need not resemble have earlier by the situations such as size of axial directivity of the optics of above-mentioned first reference direction and optical film chip are set the normal place that begins to cut off by emulation at every turn, always can begin to cut off from fixing normal place.
And, because above-mentioned optical film chip intermediate body outside is different with the shape of the inside, so, such as in harvesting, dispatch from the factory or optical film chip when making etc., the obscuring of outside can preventing and the inside, though obscure also can make easily the same outside and inside.
Further, above-mentioned optical film chip intermediate forms above-mentioned trapezoidal shape, load centre point loses partially, when packing, the base towards opposite packing, can be processed into center of gravity two for harvesting or dispatch from the factory etc., so, can carry out security packing, can prevent saggingly, the size that does not increase the container that is used to pack just can increase Packing Unit (stacked number).
Thereby from the above, the operation of above-mentioned optical film chip intermediate is also outstanding than what have earlier.
Also have, above-mentioned optical film chip intermediate can be reduced in end material that produced, waste when this optical film chip intermediate obtains optical film chip, so chamfering efficiency is also outstanding.
Fig. 1 is the key diagram of the cutting-off method of, banded optical thin film when banded optical thin film make optical film chip intermediate relevant with the manufacture method of the optical film chip of embodiments of the invention 1;
Fig. 2 is the outline elevation of structure of the polarizing film of expression embodiments of the invention 1;
Fig. 3 is the key diagram of the cutting-off method of the optical film chip intermediate when the optical film chip intermediate of embodiments of the invention 1 is made optical film chip;
The general view of the packaged configuration when Fig. 4 is the optical film chip intermediate of expression packing embodiments of the invention 1;
Fig. 5 (a) is the oblique view of schematic configuration of the positive common-black type liquid crystal indicator of expression TN mode, and Fig. 5 (b) is the oblique view of schematic configuration of the positive normally white liquid crystal indicator of expression TN mode;
Fig. 6 is the key diagram of the cutting-off method of, banded optical thin film when banded optical thin film make optical film chip intermediate relevant with the manufacture method that optical film chip is arranged earlier;
Fig. 7 is the key diagram of the cutting-off method of the optical film chip intermediate when optical film chip intermediate shown in Figure 6 is made optical film chip;
Fig. 8 is the key diagram of the cutting-off method of, banded optical thin film when from banded optical thin film making optical film chip intermediate body relevant with the manufacture method of the optical film chip of usefulness relatively;
Fig. 9 is the key diagram of the cutting-off method of the optical film chip intermediate when optical film chip intermediate shown in Figure 8 is made optical film chip;
The general view of the packaged configuration when Figure 10 is expression packing optical film chip intermediate shown in Figure 6;
The general view of the packaged configuration when Figure 11 is expression packing optical film chip intermediate shown in Figure 8.
Have again, among the figure, symbol 1 expression first band-like film (banded optical thin film), 2 expression second band-like films (optical film chip intermediate), 3 expression rectangular film (optical film chip), 4 expression end materials, 11 expression mounting tables, 21 expression containers.
Below, not according to Fig. 1 to Fig. 4 one embodiment of the present of invention are described.
In the present embodiment, for example shown in Figure 1, optical thin film is at first made as first band-like film 1 of banded optical thin film, cuts off this first band-like film, 1 back as the optical film chip intermediate, further this optical film chip intermediate is cut off the back and uses as optical film chip.The direction of the optic axis of above-mentioned first band-like film 1 (direction of principal axis) SD 0Consistent with the long side direction of for example bearing of trend of this first band-like film 1.
Use the structure of first band-like film 1 to illustrate that the basic structure of above-mentioned optical film chip is as follows.When above-mentioned first band-like film 1 is polarizing film; as shown in Figure 2; this first band-like film 1 by PVA (polyvinyl alcohol (PVA)) the film 1a of two TAC (tri acetyl cellulose) film 1b clamping polariscope of fiber-like film, is the film that adhesive linkage 1d is set in the outside of a side TAC film 1b for example.Also have, because the light of PVA (polyvinyl alcohol) film 1a blocking outside the light of fixed-direction vibration, so, pigment contained.
Also have, when above-mentioned first band-like film 1 was phase-contrast film, first band-like film 1 for example was the film that is made of polycarbonate resinoid and polyethers sodium salicylate.
On above-mentioned first band-like film 1, both can adhesive linkage be set at its single face or two faces, also can be thereon bonding stripping film again.Also have, also can be on single face or two faces bondingly prevent abrasive protective film.
When for example in LCD, using these optical film chips etc., need to press the torsional direction setting shaft direction SD of liquid crystal molecule 0, the direction of principal axis SD of optical film chip 0Need for example long side direction of optical film chip to be had specific directivity by the torsional direction of liquid crystal molecule etc.
In the present embodiment, above-mentioned direction of principal axis SD 0Be the optical film chip that obtains Yu have prescribed direction, as shown in Figure 1, at first cut off above-mentioned first band-like film 1,, obtain second band-like film 2 of trapezoidal shape as the optical film chip intermediate.And, cut off this second band-like film 2, be optical film chip (formed film) and obtain a plurality of rectangular film 3 grades (with reference to figure 3) as the optical thin film of end article.
At this moment, for obtaining above-mentioned second band-like film 2, along the direction of principal axis SD to this first band-like film 1 0The first reference direction SD that prescribed direction (being predetermined angular θ) arranged 1Cut off above-mentioned first band-like film 1 with Rack, simultaneously to the above-mentioned first reference direction SD 1Along the second vertical reference direction SD 2Cut off.Also have, the long side direction both end sides of above-mentioned first band-like film 1 should be fixed as the performance unanimity of the optical film chip that makes gained, along the long side direction of above-mentioned first band-like film 1, only cuts off Rack at short side direction.Thus, above-mentioned the 1st band-like film 1 is cut to and has and the above-mentioned first reference direction SD 1The a pair of opposite side that parallels, with the above-mentioned second reference direction SD 2The limit that parallels (to the vertical limit of this a pair of opposite side) and with above-mentioned optic axis SD 0The trapezoidal shape on the limit that parallels (other limits that parallel with the optic axis direction).
At present embodiment, by above-mentioned first band-like film 1 is divided into two parts, it is passed through by the above-mentioned first reference direction SD among Fig. 1 1The regional A that encloses of cut-out line 3E 3F 3C 3The center (by A 3E 3F 3C 3Cornerwise mid point of the parallelogram of expression), two and the above-mentioned first reference direction SD have been formed 1The regional A that encloses of cut-out line 3E 3F 3C 3Identical shaped is trapezoidal.Thus, can access the second identical shaped band-like film 2, so, for example, can cut off this second band-like film 2 of multi-disc cutting off second band-like film 2 when obtaining a plurality of rectangular film 3 grades.Also have, when receiving and keeping this second band-like film, 2 limits packing on the limit, also need not judge each size, the operating efficiency height.
In the present embodiment, the order of cutting off above-mentioned first band-like film 1 is namely carried out along the first reference direction SD 1Cut-out (cut off 1), along the second reference direction SD 2Cut-out (cut off 2), along long side direction (the direction of principal axis SD of first band-like film 1 0) the order of cut-out (cut off 3) be not particularly limited.
For example, can be to cut off 2 after (1) cuts off 1 successively, cut off 3, can be to cut off 3 after (2) cut off 2 successively, cut off 1, can be to cut off 1 after (3) cut off 3 successively, cut off 2, also can be to cut off 2 after (4) cut off 3 successively, cut off 1.In addition, also can carry out with above-mentioned cut-out 1-3 while of appropriate combination or interlock.Cut off above-mentioned first band-like film 1 order can by the performance of cutting machine and breaks etc. suitably be set at make most effective.
Also have, after cutting off 1, cut off 2 o'clock, for example also can cut off multi-disc by the band-like film that cuts off 1 gained (for example, among the figure by A 3E 3F 3C 3The optical thin film of the parallelogram of expression).Further, after cutting off 2, cut off 1 o'clock, make cut-out 2 and cut off 1 interlock, utilize 2 pairs of first band-like films of cut-out to make a plurality of slits, according to cutting off 1 with the two ends, slit of this cut-out 2 are consistent, can high efficient production multi-disc second band-like film 2.
For second band-like film 2 is cut into a plurality of rectangular film 3, can set the size of above-mentioned second band-like film 2 by the size of the mounting table 11 (with reference to Fig. 3) of mounting, further, exactly can be by the size that is used for the size of cut-out tooth that second band-like film 2 cuts into the not shown shearing device of a plurality of rectangular film 3 is set above-mentioned second band-like film 2.And, further, consider that preferably the size of desirable optical film chip is set.For example, use the mounting table 11 at 1200mm angle (wherein, can be by cutting off effective dimensions that tooth cuts off as 1140mm) time, if the effective width of above-mentioned first band-like film 1 (available width on the short side direction of first band-like film 1) is the words of 1000mm, also can be by the size of desirable rectangular film 3, but when obtaining optical film chip as this rectangular film 3, above-mentioned second band-like film 2 for example can cut off | A 3B 3|=457mm, | C 3D 3|=957mm, | B 3D 3|=500mm,＜A 3C 3D 3(with limit A 3C 3With limit C 3D 3Angulation) be that θ is about 45 degree (condition 1).
Also have, if the effective width of above-mentioned first band-like film 1 is 1200mm, then above-mentioned second band-like film 2 for example can be cut to | A 3B 3|=634mm, | C 3D 3|=1134mm, | B 3D 3|=500mm,＜A 3C 3D 3Be that θ is about 45 degree (condition 2).
Then, as shown in Figure 3, for obtaining rectangular film 3, above-mentioned second band-like film 2 is positioned on the mounting table 11, along the above-mentioned first reference direction SD 1Cut off with Rack, simultaneously along the above-mentioned second reference direction SD 2Cut off with Rack.As a result, obtain by with the first reference direction SD 1The a pair of opposite side that parallels and with the second reference direction SD 2The rectangular film 3 that a pair of opposite side that parallels constitutes.Also have, according to purposes, the size of above-mentioned rectangular film 3 suitably is set at desirable size.
Each limit and the direction of principal axis SD of above-mentioned second band-like film 2 are described here, 0, the first reference direction SD 1And the second reference direction SD 2Relation.
In above-mentioned first band-like film 1, its direction of principal axis SD 0Parallel with the long side direction of this first band-like film 1, with the limit A of second band-like film 2 3C 3Parallel.With the first reference direction SD 1The limit A of the second parallel band-like film 2 3B 3And limit C 3D 3To direction of principal axis SD 0Tilt angle theta.The limit A of second band-like film 2 3B 3And limit C 3D 3Parallel with above-mentioned first reference direction, with the second reference direction SD 2Vertically.The limit B of second band-like film 2 3D 3With the second reference direction SD 2Parallel.
Thereby, for cutting off above-mentioned second band-like film 2, when being positioned in above-mentioned second band-like film 2 on the mounting table 11, with limit A 3B 3With limit C 3D 3To the parallel mounting of above-mentioned cut-out tooth, make the above-mentioned first reference direction SD 1Cut-out tooth to not shown shearing device is parallel.Also have, with limit B 3D 3To the parallel mounting of above-mentioned cut-out tooth, make the above-mentioned second reference direction SD 2Parallel to not shown cut-out tooth.Even in this case, carry out the above-mentioned first reference direction SD 1Cut-out and the above-mentioned second reference direction SD 2The order of cut-out also be not particularly limited.
Thus, for obtaining rectangular film 3, with the above-mentioned first reference direction SD 1During above-mentioned second band-like film 2 of parallel cut-out, then can with the first reference direction SD of above-mentioned second band-like film 2 1The A while being that parallels 3B 3Or limit C 3D 3Begin to cut off as the normal place that begins to cut off.Also have, with the above-mentioned second reference direction SD 2During above-mentioned second band-like film 2 of parallel cut-out, can with the second reference direction SD of above-mentioned second band-like film 2 2The B while being that parallels 3D 3Begin to cut off as the normal place that begins to cut off.
Therefore, according to said method of the present invention, above-mentioned second band-like film 2 is by having and the above-mentioned first reference direction SD 1The a pair of opposite side that parallels and with the above-mentioned second reference direction SD 2The trapezoidal shape on the limit that parallels constitutes, so, when cutting off above-mentioned second band-like film 2, be to improve chamfering efficiency, do not need to resemble and set the beginning off-position by simulation by the size of rectangular film 3 and angle θ etc. having earlier at every turn, always can begin to cut off from fixing position.Thereby operating efficiency increases substantially.
Also have, according to said method of the present invention, with the above-mentioned first reference direction SD of above-mentioned second band-like film 2 1The limit A that parallels 3D 3And limit C 3D 3With with the above-mentioned second reference direction SD 2The limit B that parallels 3D 3On do not produce the end material of the rectangular film 3 that can not form prescribed level, so, the A while only having that end material 4 grades (screened representation among the figure) produce 3C 3A limit.Thereby, according to the present invention, and to compare earlier, the waste of end material 4 grades is few, can improve chamfering efficiency.
And, according to said method of the present invention, to be that mounting table 11 that second band-like film 2 of first band-like film, 1 gained of 1000mm is positioned in above-mentioned 1200mm angle is when cutting off from effective width, if once cut off and just can cut off 2 optical film chip intermediates (second band-like film 2), then second band-like film 2 can be positioned in two places of above-mentioned mounting table 11, so, is first band-like film 1 of 1000mm when making above-mentioned second band-like film 2 by above-mentioned condition 1 from effective width, and the single treatment operation just can be cut off (457mm+957mm)/2 * 500mm * 4 (sheet)=1.414m 2Second band-like film 2.
Also having, is being first band-like film 1 of 1200mm when making above-mentioned second band-like film 2 according to above-mentioned condition 2 from effective width, and the single treatment operation just can be cut off (634mm+1134mm)/2 * 500mm * 4 (sheet)=1.768m 2Second band-like film 2.
Thereby, as stated above, can more effectively utilize the area of mounting table 11, it is big that the area of optical film chip intermediate that can mounting on the mounting table 11 becomes, so the area of second band-like film 2 that the single treatment operation can be cut off can be than the raising that has earlier.Thereby, owing to can improve the throughput rate of time per unit, so, operation can be improved.
Also have, so-called single treatment operation refers to that optical film chip intermediate body to mounting on mounting table 11 is along the first reference direction SD 1The operation of cutting off with Rack and along the second reference direction SD 2The operation of cutting off with Rack.
In the present embodiment, cut off optical thin film along first reference direction that this optic axis direction is had prescribed direction, but its directivity is stipulated by above-mentioned angle θ.If with this angle θ be set at second band-like film 2 in echelon shape angle preferably in the scopes of 40 degree～89.5 degree or 90.5 degree～140 degree, particularly preferably be set in the scopes of 40 degree-89 degree or 91 degree-140 degree, then with the direction of optic axis as limit A 3C 3With visual just easily identification, and can access than there being earlier method more obviously to improve the effect of chamfering efficiency and operation etc.At above-mentioned angle θ is 90 when spending, and above-mentioned second band-like film 2 is not a trapezoidal shape, when having method relatively earlier, can not bring into play the effect that improves chamfering efficiency and operation etc.Usually, when in LCD etc., using polarizing film, angle θ can be by the settings such as torsional direction of liquid crystal molecule, for example, in the LCD of twisted nematic (TN) mode and thin film transistor (TFT) (TFT) mode, generally be set in the scope about 42～48 degree, at the LCD of STN Super TN (STN) mode, generally be set in the scope of 30～150 degree, and, when phase-contrast film, no matter be the TN mode, the TFT mode still is the LCD of STN mode, generally all can be set in the scope of 30 degree-50 degree, even in the present embodiment, at above-mentioned second band-like film 2 is in the trapezoidal shape, also can adopt the angle θ in this scope.
As mentioned above, in the present embodiment, cut off banded optical thin film and make optical film chip intermediate body, further cut off this optical film chip intermediate body when making a plurality of optical film chip afterwards, along the direction of principal axis SD to this first band-like film 1 0The first reference direction SD with prescribed direction 1Cut-out is as first band-like film 1 of above-mentioned banded optical thin film, simultaneously along to the above-mentioned first reference direction SD 1The second vertical reference direction SD 2Cut off second band-like film 2 of making trapezoidal shape.And, by will with the above-mentioned second reference direction SD of this second band-like film 2 2The limit that parallels as normal place along this second reference direction SD 2Cut off above-mentioned second band-like film 2, simultaneously will with the above-mentioned first reference direction SD 1The limit that parallels is as normal place, obtain rectangular film 3 (optical film chip) with the parallel cut-out of first reference direction.
By said method of the present invention, along the above-mentioned first reference direction SD 1With the second reference direction SD 2Cut off above-mentioned first band-like film 1, can obtain the optical thin film intermediate of trapezoidal shape, the optical thin film intermediate of trapezoidal shape have with to direction of principal axis SD 0The first reference direction SD with prescribed direction 1The a pair of opposite side that parallels (that is a pair of opposite side that, optic axis is had predetermined angular θ) and with to the above-mentioned first reference direction SD 1The second vertical reference direction SD 2The limit that parallels (that is, to the vertical limit of this a pair of opposite side).In above-mentioned optical film chip intermediate, the opposing party's limit is parallel with above-mentioned optic axis direction.
Therefore, when cutting off second band-like film 2 of above-mentioned optical film chip intermediate body, need not resemble have earlier basis to the above-mentioned first reference direction SD 1The axial directionality of optics (angle θ) and the size of rectangular film 3 etc. set the normal place that begins to cut off by simulation at every turn, always can begin from certain normal place to cut off.
Further, because the end material 4 that the said method ratio has method to be reduced in earlier to be produced when second band-like film 2 obtains rectangular film 3 etc., so chamfering efficiency is also than the height that has earlier.
Also have, above-mentioned second band-like film 2 forms trapezoidal shapes, and the outside has different shapes with the inside, has and to direction of principal axis SD 0The first reference direction SD with prescribed direction 1The a pair of opposite side that parallels and with to the above-mentioned first reference direction SD 1The second vertical reference direction SD 2The limit that parallels.Therefore, when this second band-like film 2 obtains rectangular film 3, above-mentioned second band-like film 2 can prevent from the outside and the inside of this second band-like film 2 are obscured, though obscure also can make easily the same outside and inside.And, because another side and the optic axis direction SD of above-mentioned band-like film 2 0Parallel, so, with the visual direction that just can confirm easily optic axis.
Also have, because the opposing party's of above-mentioned second band-like film 2 limit and direction of principal axis SD 0Parallel, so just can confirm easily direction of principal axis SD with visual 0
Also have, like this, in the present invention, above-mentioned second band-like film 2 has different shapes with the inside outside.Not only in the manufacturing process of rectangular film 3 when obtaining rectangular film 3 and cut off above-mentioned second band-like film 2, and for example in its harvesting or when dispatching from the factory etc., can both prevent that outside and the inside from obscuring.
Further, in the present invention, above-mentioned second band-like film 2 forms above-mentioned trapezoidal shape, and load centre point loses partially.Therefore, when harvesting, above-mentioned second band-like film 2 of packing, can utilize laminating method to make center of gravity is two, so, can prevent that the end is sagging, comparable have earlier that to carry out safer property stacked.
When for example stating second band-like film 2 on the packaging, as shown in Figure 4, on this second band-like film 2 in the container 21 that is made of the corrugation paperboard with prescribed level etc. with for example outside one side of this second band-like film 2 was, by not shown separating, fractional layer was stacked.Also have, distolateral in said vesse 21 is provided with and is used to the not shown dividing plate that prevents that optical thin film limit and container 21 contact edges from moving, and above-mentioned second band-like film 2 does not directly contact with container 21.
In this case, with the above-mentioned first reference direction SD 1The limit A that parallels 3B 3, C 3D 3And and the above-mentioned second reference direction SD 2The limit B that parallels 3C 3Relative with each sidepiece of container 21, above-mentioned second band-like film 2 can carry out (that is, every one deck being changed limit C with the base of above-mentioned second band-like film 2 is towards the opposite 3D 3The position) packing, second band-like film 2 that do not overturn, and do not increase the size of container 21, the spaces of effectively utilizing in the container 21 just can be stacked with second band-like film 2.And, in this case, can change the position of center of gravity to each layer, so the center of gravity that can make the second stacked band-like film 2 is two.Therefore, since can prevent sagging, carry out layer of security superimposition packing, so can increase the number of plies of second band-like film 2 that can be stacked.Thereby the size that does not increase container 21 just can increase Packing Unit (stacked number).
Also have, in said vesse 21, the several decisions such as intensity of the sheet of second band-like film 2 that one deck can be stacked according to this container 21, but the sheet number that the optical film chip intermediate is arranged earlier that for example one deck can be stacked is about 20, then can stacked 25-30 sheet.
Like this, can have than earlier according to the manufacture method of optical film chip of the present invention and further improve chamfering efficiency and operation.Also have, be used to obtain the structure of the optical film chip intermediate of the present invention of above-mentioned optical film chip, the optical film chip intermediate than chamfering efficiency that has earlier and good work can be provided.
Also has, in the present embodiment, use the rectangular optical thin film chip as optical film chip, but the shape of optical film chip of the present invention then is not limited thereto, also can be by with the first reference direction SD 1The a pair of opposite side that parallels and with the second reference direction SD 2The square that a pair of opposite side that parallels consists of.
Below, as above-mentioned optical film chip is example with the polarizing film, with reference to Fig. 3, Fig. 7, Fig. 9, illustrate with the optical film chip intermediate that uses present embodiment, use the optical film chip intermediate of said method 1, chamfering efficiency relevant, when using these optical film chip intermediates to make optical film chips and operating efficiency carry out each result relatively when using the optical film chip intermediate of said method 2.
Also have, estimate above-mentioned chamfering efficiency with the ratio yield rate (%) of the unit area of the total area of polarizing film chip and polarizing film chip intermediate.Also have, to said method 1 and method 2, carry out chamfering by simulation and calculate, make the highest cut-out of productive rate.
Also have, estimate above-mentioned operation with the output (sheet number) of the polarizing film chip of gained in the single treatment operation.
As shearing device, adopt and obtain the wild made NS-1200 type of making, the size of mounting table 11 is that 1200mm * 1200mm, effective dimensions are 1140mm.At this moment, when being positioned in polarizing film chip intermediate on the above-mentioned mounting table 11, carry out mounting, so the polarizing film chip intermediate that the single treatment operation can be handled is as follows according to the effective dimensions that the cut-out tooth by shearing device can cut off.Also have, just can process two polarizing film chip intermediates by once cutting off.Also have, with the first reference direction SD 1With direction of principal axis SD 0Angulation θ (angle of inclination) is set at 45 degree.
When the polarizing film chip intermediate that can process with method 1 uses effective width as the banded polarizing film (first band-like film) of 1000mm, | A 1B 1|=| C 1D 1|=500mm, | A 1C 1|=| B 1D 1| the polarizing film chip intermediate of=1000mm (with reference to Fig. 7) size (below be denoted as intermediate A) is 2.
When the polarizing film chip intermediate that can process with method 2 uses effective width as the banded polarizing film (first band-like film) of 1000mm, | A 2C 2|=| B 2D 2|=650mm, limit A 2B 2And C 2D 2Between distance be 400mm, limit A 2C 2With limit B 2D 2Between distance be 500mm,＜A 2C 2D 2=＜A 2B 2D 2Polarizing film dag intermediate (below be denoted as intermediate B) of=45 degree (with reference to Fig. 9) sizes is 4.
When the polarizing film chip intermediate that can process with the method for present embodiment uses effective width as the banded polarizing film (first band-like film) of 1000mm, | A 3B 3|=457mm, | C 3D 3|=957mm, | B 3D 3|=500mm,＜A 3C 3D 3Polarizing film chip intermediate (below be denoted as intermediate 2) of=45 degree (with reference to Fig. 3) sizes is 4.
Also have, when the polarizing film chip intermediate that can process with the method for present embodiment uses effective width as the banded polarizing film (first band-like film) of 1200mm, | A 3B 3|=634mm, | C 3D 3|=1134mm, | B 3D 3|=500mm,＜A 3C 3D 3Polarizing film chip intermediate (below be denoted as intermediate D) of=45 degree (with reference to Fig. 3) sizes is 4.
Table 1 show when using above-mentioned each method yield rate and from the combination of the sheet number (chamfering sheet number) of the polarizing film chip of the area of every polarizing film chip 1 and suitable polarizing film chip intermediate gained.
Also have, the size of the polarizing film chip of manufacturing is as follows respectively.
Sample 1 99mm * 14mm
Sample 2 105mm * 27mm
Sample 3 62mm * 17.5mm
Sample 4 34.1mm * 14.5mm
Sample 5 79.0mm * 15.39mm
Table 1
The polarizing film chip The kind of the intermediate that uses
Intermediate A Intermediate B Intermediate C Intermediate D
Sample number Area (※ 1) Sheet number (※ 2) Productive rate (%) Sheet number (※ 2) Productive rate (%) Sheet number (※ 2) Productive rate (%) Sheet number (※ 2) Productive rate (%)
1 13.9 276 76.5 124 74.7 223 87.4 290 90.9
2 28.4 128 72.6 56 69.0 108 86.6 140 ?89.7
3 10.9 379 82.2 168 79.3 293 89.9 376 ?92.3
4 4.9 893 88.3 407 87.5 673 94.1 851 95.2
5 12.2 324 78.8 148 78.2 264 90.8 329 90.5
Area (the cm of unit of ※ 1 every polarizing film chip 2)
The chamfering sheet number (unit sheet) of ※ 2 polarizing film core faces
Also have, table 2 shows output and the breaks when using above-mentioned each method.So-called breaks refer in the single treatment operation along the first reference direction SD 1The number of times that cuts off and along the second reference direction SD 2The total number of times of the number of times that cuts off.
Table 2
Sample (※ 3) The intermediate of handling
Intermediate A * 2 slice Intermediate B * 4 slice Intermediate C * 4 slice Intermediate D * 4 slice
Breaks Output (sheet) Breaks Output (sheet) Breaks Output (sheet) Breaks Output (sheet)
1 74 552 75 496 82 892 84 1160
2 43 256 42 224 47 432 49 560
3 72 758 67 672 73 1172 76 1504
4 100 1786 91 1628 98 2692 194 3404
5 74 648 70 592 81 1056 83 1316
※ 3 polarizing film chip sample numberings (corresponding with table 1)
Further, table 3 shows the said method 1 when using the method for present embodiment and the chamfering improvement rate and the operation property improvement rate of method 2, promptly shows when using above-mentioned intermediate C or intermediate D or chamfering improvement rate and operation property improvement rate when using intermediate A or intermediate B.Also have, chamfering improvement rate and operation property improvement rate utilize following formula to calculate.
Chamfering improvement rate=(productive rate when using the present embodiment method)-(productive rate when using method 1 or method 2)
Operation property improvement rate=(output when using this implementation method)/(output when using method 1 or method 2) * 100-100
Table 3
Chamfering improvement rate (%) Operation property improvement rate (%)
The kind of the intermediate that uses Intermediate C Intermediate D Intermediate C Intermediate D Intermediate C Intermediate D Intermediate C Intermediate D
The kind of the intermediate of contrast Intermediate A Intermediate B Intermediate A Intermediate B
Sample (※ 3) 1 +10.9 +14.4 +12.7 +16.2 +62 +80 +80 +134
2 +14.0 +17.1 +17.6 +20.7 +69 +119 +93 +1?50
3 +7.7 +10.1 +10.6 +13.0 +55 +98 +74 +124
4 +5.8 +6.9 +6.6 +7.7 +51 +91 +65 +109
5 +12.0 +11.7 +12.6 +12.3 +63 +103 +78 +122
※ 3 polarizing film chip sample numberings (corresponding with table 1)
See clearly from the result of above-mentioned table 1-table 3, if use method of the present invention, with said method 1 (method is arranged earlier) and method 2 ratios, can improve chamfering efficiency and operating efficiency.
Also have, the effective area of first band-like film and the area of desirable optical film chip are more big, and effect of the present invention just can be more high.For example, area is less than 5cm 2The chamfering improvement rate of miniature optical thin film chip be within+10%, but area surpasses 10cm 2The chamfering improvement rate of compact optical thin film chip be+10%+20% about, the chamfering rate increases substantially.Also has each throughput rate raising+50%-+100% that cuts off.
Further, when using the method for present embodiment, because off-position is certain, calculate so need not simulate the chamfering of cut-out, and, tentative calculation formula tentative calculation chamfering number also can be utilized.
Also have, no matter the result of above-mentioned table 1-table 3 is the size of polarizing film chip and use the intermediate (result of above-mentioned intermediate A-D) of formed objects.Thereby, if (interval on the limit that will parallel with first reference direction (was limit A originally 2B 2With limit C 2D 2The interval or | B 3D 3|) be set at suitable interval), relevant above-mentioned intermediate B-D is although can make and the above-mentioned first reference direction SD 1Do not produce the end material on the limit that parallels, but in The above results, according to the size of polarizing film chip, produce banded end material along the limit that parallels with first reference direction with same widths.Therefore, at above-mentioned intermediate B-D, only with limit that above-mentioned first reference direction parallels on the efficient such as chamfering efficiency, operating efficiency, chamfering improvement rate and operation property improvement rate of the end material that produces reduce.
Yet in fact, the interval of preferably setting respectively the limit that parallels with first reference direction according to the size of polarizing film chip (is limit A 2B 2With limit C 2D 2The interval or | B 3D 3|), so, with the first reference direction SD of above-mentioned intermediate B-D 1Do not produce the end material on the limit that parallels, even or produce seldom yet.Therefore, the chamfering efficiency of above-mentioned intermediate B-D, operating efficiency, chamfering improvement rate and operation property improvement rate etc. significantly become big.
Thereby, consider the premises, we can say that the chamfering efficiency of intermediate A and operating efficiency are minimum, then, with the order of intermediate B, intermediate C, intermediate D, it is big that chamfering efficiency and operating efficiency etc. become.
Result when showing optical thin film above and being polarizing film, but when optical thin film is phase-contrast film, also can carry out same operation.
As above, in the present invention, the manufacture method of first optical film chip is that banded optical thin film is cut off the back as the optical film chip intermediate, cut off the manufacture method that this optical film chip intermediate is made the optical film chip of a plurality of optical film chips again, comprises following operation: first reference direction that has a prescribed direction along the optic axis direction to this optical thin film cuts off banded optical thin film, simultaneously along the second vertical reference direction of above-mentioned first reference direction is cut off the optical film chip intermediate that banded optical thin film is made trapezoidal shape.
As mentioned above, the manufacture method of second optical film chip of the present invention comprises following operation: the limit that will parallel with above-mentioned second reference direction cuts off above-mentioned optical film chip intermediate as normal place along second reference direction, and the limit that will parallel with above-mentioned first reference direction cuts off the optical film chip intermediate as normal place along first reference direction simultaneously.
Press said structure, when cutting off above-mentioned optical film chip intermediate body, need not resemble have earlier basis the size of the axial directionality of the optics of above-mentioned first reference direction and optical film chip etc. is set the normal place that begins to cut off by simulation at every turn, can always begin to cut off from certain normal place.
Also having, is trapezoidal shape when obtaining optical film chip from this optical film chip intermediate body by above-mentioned optical film chip intermediate body, can prevent that the outside of this optical film chip intermediate body and the inside from obscuring, though obscure also can make easily the same outside and inside.
Further, can more reduce the end material that when above-mentioned optical film chip intermediate body obtains optical film chip, produces than having earlier.Thereby by the present invention, having can be than the effect that more improves chamfering efficiency and operation is arranged earlier.
In addition, as mentioned above, optical film chip intermediate of the present invention forms trapezoidal shape, has a pair of opposite side that parallels with first reference direction that the optic axis direction is had prescribed direction and the limit that parallels with second reference direction vertical with above-mentioned first reference direction.
Further, optical film chip intermediate of the present invention forms trapezoidal, have a pair of opposite side that parallels with first reference direction that the optic axis direction is had prescribed direction, with the vertical limit of this a pair of opposite side and other limits that parallel with the optic axis direction.
By these formations, above-mentioned optical film chip intermediate is when obtaining optical film chip, need not resemble and set the normal place that begins to cut off by simulation according to the size of axial directivity of the optics of above-mentioned first reference direction and optical film chip etc. having earlier at every turn, can always begin to cut off from the certain standard position.
And above-mentioned optical film chip intermediate body is because the shape of outside and the inside is different, so, such as in harvesting, dispatch from the factory or optical film chip when making etc., can prevent that outside and the inside from obscuring, though obscure also can make easily the same outside and inside.
Further, above-mentioned optical film chip intermediate forms above-mentioned trapezoidal shape, load centre point loses partially, when the packing of receiving and keeping or dispatching from the factory, by with the base towards packing conversely, can make center of gravity become two, thus can the layer of security superimposition packing, prevent saggingly, do not increase the container size that is used to pack and just can increase Packing Unit (stacked number).
Also have, above-mentioned optical film chip intermediate body can reduce the end material that produces when this optical film chip intermediate body obtains optical film chip.Thereby the effect of operation of above-mentioned optical film chip intermediate and chamfering efficiency has outstanding than earlier.

Claims (4)

1. the manufacture method of an optical film chip, banded optical thin film is cut off the back as the optical film chip intermediate, further cut off this optical film chip intermediate and make a plurality of optical film chips, it is characterized in that, comprise following operation: first reference direction that has inclination predetermined angular (θ) along the optic axis direction to this optical thin film cuts off banded optical thin film, while along the second vertical reference direction of above-mentioned first reference direction is cut off the optical film chip intermediate that banded optical thin film is made trapezoidal shape.
2. the manufacture method of optical film chip as claimed in claim 1, it is characterized in that, comprise following operation: the limit that will parallel with second reference direction is as normal place, along second reference direction cut-out optical film chip intermediate, and the limit that will parallel with first reference direction is as normal place, along first reference direction cut-out optical film chip intermediate simultaneously.
3. optical film chip intermediate, it is characterized in that: form trapezoidal shape, have a pair of opposite side that parallels with first reference direction that the optic axis direction is had inclination predetermined angular (θ) and with the limit that the second vertical reference direction of above-mentioned first reference direction is paralleled.
4. as claim 3 optical film chip intermediate, it is characterized in that: also have other limits that parallel with the optic axis direction.
CNB981066224A 1997-04-16 1998-04-15 Method of manufacturing optical film chip and optical film chip intermediate body Expired - Lifetime CN1145810C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP99322/97 1997-04-16
JP99322/1997 1997-04-16
JP9932297 1997-04-16

Publications (2)

Publication Number Publication Date
CN1196489A CN1196489A (en) 1998-10-21
CN1145810C true CN1145810C (en) 2004-04-14

Family

ID=14244410

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB981066224A Expired - Lifetime CN1145810C (en) 1997-04-16 1998-04-15 Method of manufacturing optical film chip and optical film chip intermediate body

Country Status (3)

Country Link
KR (1) KR100481750B1 (en)
CN (1) CN1145810C (en)
TW (1) TW473619B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311425B2 (en) * 2011-11-11 2013-10-09 住友化学株式会社 Optical film chip cutting device and optical film chip cutting method
JP6146921B2 (en) * 2014-12-02 2017-06-14 日東電工株式会社 Optical film manufacturing method and manufacturing apparatus
JP7018711B2 (en) * 2017-02-28 2022-02-14 住友化学株式会社 Method for manufacturing polarizing plate
KR20230155296A (en) 2022-05-03 2023-11-10 신희정 Eco folding lotus lantern and its manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59214807A (en) * 1983-05-20 1984-12-04 Arisawa Seisakusho:Kk Cutting method of polarizing plate
JPH03182701A (en) * 1989-12-13 1991-08-08 Nippon Kayaku Co Ltd Stretched film and its formation
JPH06289221A (en) * 1993-03-31 1994-10-18 Arisawa Mfg Co Ltd Production of elliptically polarizing plate
JP3206850B2 (en) * 1993-04-15 2001-09-10 日本合成化学工業株式会社 Manufacturing method of elliptically polarizing plate

Also Published As

Publication number Publication date
KR100481750B1 (en) 2005-09-02
KR19980081373A (en) 1998-11-25
TW473619B (en) 2002-01-21
CN1196489A (en) 1998-10-21

Similar Documents

Publication Publication Date Title
CN1120385C (en) Reflective liquid crystal display device
CN1265939C (en) Grinding stage for liquid crystal board and grinding machine using the stage
JP5823677B2 (en) Film end face processing cutter, processing machine including the same, and film end face processing method
CN1132046C (en) Substrate binding method and device, and method for mfg. LCD
CN1159616C (en) Reflection-type liquid crystal display device
CN1868696A (en) Laminate-cutting method, cutting device, and laminate-cutting pedestal
CN1882858A (en) Circular polarization plate, vertically-aligned liquid crystal display panel and manufacturing method thereof
CN1437047A (en) Apparatus for cutting liquid crystal displaying screen and method for operating cutting with the same apparatus
CN1924429A (en) Method for manufacturing backlight and backlight
CN1854859A (en) Backlight unit and liquid crystal display having the same
CN1766700A (en) Liquid crystal display device
CN1671048A (en) Elastic surface acoustic wave device and process for fabricating the same
CN100335948C (en) Apparatus for cutting a liquid crystal display panel and method thereof
CN1947041A (en) Optical member, method of manufacturing the same, and image display device applying the same
CN1640597A (en) Cutting method and cutting apparatus for layered sheet, layered sheet, optical element and image display
CN1145810C (en) Method of manufacturing optical film chip and optical film chip intermediate body
CN1291267C (en) Method for producing LCD panel
CN1274143A (en) Liquid crystal displaying component, back reflecting mechanism and liquid crystal displaying device adopting same
CN1940602A (en) Optical lens and optical lens manufacturing method
CN1113270C (en) Mfg. method for optical film overlapped chip and optical film overlapped intermediate thereof
CN1918489A (en) Optical filter and method of manufacturing optical filter
CN1212918C (en) Method for stretching polymer film, polarization diaphragm and method for making said polarization diaphragm, polarizer, double refraction diaphragm and liquid-crystal display device
CN1138172C (en) Method for producing three layer laminated optical film
KR102377120B1 (en) Sheet material unit, cutting device for sheet material unit, and producing method and processing method for sheet material unit
US7166487B2 (en) Manufacturing method of optical devices

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20040414

CX01 Expiry of patent term