CN114556538A - Electronic component handling apparatus - Google Patents

Electronic component handling apparatus Download PDF

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Publication number
CN114556538A
CN114556538A CN202080070534.5A CN202080070534A CN114556538A CN 114556538 A CN114556538 A CN 114556538A CN 202080070534 A CN202080070534 A CN 202080070534A CN 114556538 A CN114556538 A CN 114556538A
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CN
China
Prior art keywords
suction
electronic component
unit
area
sheet
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080070534.5A
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Chinese (zh)
Inventor
大场一矢
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Publication of CN114556538A publication Critical patent/CN114556538A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The electronic component handling device includes: a sheet holding section for holding a sheet having an adhesive surface to which an electronic component is adhered; a plurality of adsorption parts arranged along a circular track passing through the adsorption region; a rotating part for holding the plurality of adsorption parts; a rotation driving unit for rotating the rotation unit; a push-out portion for pushing out the sheet toward the adsorption region; a sheet position adjusting section for changing the position of the sheet holding section in a direction along the sticking surface; and a push-out position adjusting part for changing the position of the push-out part along the direction of the sticking surface.

Description

Electronic component handling apparatus
Technical Field
The present disclosure relates to a processing apparatus for electronic components.
Background
Patent document 1 discloses an electronic component mounting method in which a suction nozzle and a push rod are moved so that the center of a chip, the center of the suction nozzle for sucking the chip, and the center of the push rod for pushing out the chip toward the suction nozzle side coincide with each other.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2009-044044
Disclosure of Invention
The present disclosure relates to a simplified and effective device for aligning the position of an electronic component, the position of a suction portion for picking up the electronic component, and the position of a push-out portion for pushing out the electronic component to the suction portion side.
An electronic component handling apparatus according to an aspect of the present disclosure includes: a sheet holding section for holding a sheet having an adhesive surface to which an electronic component is adhered; a plurality of suction portions arranged along a circular orbit passing through a suction region where the electronic component is sandwiched between the sheet and the suction portions; a rotating part for holding the plurality of adsorption parts; a rotation driving unit that rotates the rotation unit around a rotation shaft fixed along a central axis of the circular orbit; a push-out portion arranged to sandwich the sheet with the electronic component and push out the sheet toward the suction region; a sheet position adjusting portion for changing the position of the sheet holding portion in a direction along the sticking surface; and a push-out position adjusting part for changing the position of the push-out part along the direction of the sticking surface.
Drawings
Fig. 1 is a plan view schematically showing an electronic component handling apparatus.
Fig. 2 is a side view of the pickup.
Fig. 3 is a sectional view taken along the line III-III in fig. 2.
Fig. 4 is a sectional view taken along line IV-IV in fig. 3.
Fig. 5 is a block diagram illustrating the structure of functional aspects of the controller by way of example.
Fig. 6 is a block diagram showing by way of example the hardware configuration of the controller.
Fig. 7 is a flowchart illustrating a calibration flow by way of example.
Fig. 8 is a flowchart illustrating a pickup flow by way of example.
Fig. 9 is a flowchart illustrating a handover procedure by way of example.
Fig. 10 is a flowchart illustrating a flow of shooting of electronic components by way of example.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same function are denoted by the same reference numerals, and redundant description thereof is omitted.
[ treatment device ]
The electronic component processing apparatus 1 of the present embodiment is a so-called wafer sorter (die sorter), which transports an electronic component W formed in a preceding step such as dicing, and performs processing such as appearance inspection, electrical characteristic inspection, and marking on the electronic component W, and then packages the electronic component W on a carrier tape, a storage tube (container tube), and the like. As shown in fig. 1 and 2, the processing apparatus 1 includes: a conveyance device 10, a plurality of processing units 20, and a controller 200.
The transport apparatus 10 transports the electronic component W along the circular track CR 1. The electronic component W to be conveyed has two main surfaces Wa, Wb parallel to each other. The conveyance device 10 includes: a turntable 11, a plurality of holding sections 12, a rotation driving section 13, and a plurality of elevation driving sections 18. The turntable 11 is provided to be rotatable about a vertical rotation axis Ax 1. The plurality of holding portions 12 are arranged at equal intervals along a circumference centered on the rotation axis Ax1, and are fixed to the turntable 11. The plurality of holding portions 12 hold the electronic components W, respectively. The holding portion 12 may hold the electronic component W by any means. Specific examples of a method of holding the electronic component W include vacuum adsorption, electrostatic adsorption, and gripping. For example, the holding portion 12 vacuum-adsorbs one of the main surfaces Wa and Wb (for example, the main surface Wa) from one side in a direction orthogonal to the turntable 11 (a direction parallel to the rotation axis Ax 1).
As an example, the holding portion 12 includes: a suction nozzle 15, a holder 16, and a spring 17. The suction nozzle 15 vacuum-sucks the main surface Wa of the electronic component W from above. For example, the suction nozzle 15 is arranged in a perpendicular manner to the turntable 11, and a lower end portion of the suction nozzle 15 is opened vertically downward. The holder 16 is fixed to the outer periphery of the turntable 11 and holds the suction nozzle 15 so as to be movable up and down. The spring 17 resists the descent of the suction nozzle 15 by its elastic force. When a downward external force is applied to the upper end portion of the suction nozzle 15, the spring 17 is elastically deformed as the suction nozzle 15 descends. When the downward external force to the upper end portion of the suction nozzle 15 is removed, the spring 17 is elastically restored to push the suction nozzle 15 back to the height before the descent.
The rotation driving unit 13 uses, for example, an electric motor as a power source, and rotates the turntable 11 around the rotation axis Ax1 by direct driving without a gear. Thereby, the plurality of holding portions 12 move around the horizontal circular orbit CR1 centered on the rotation axis Ax 1. The swing drive portion 13 is controlled to repeat the rotation and stop of the turntable 11 at the same pitch as the angular pitch of the adjacent holding portions 12 from each other (the angular pitch around the rotation axis Ax 1). Hereinafter, the plurality of positions at which the plurality of holding portions 12 are arranged when the rotary drive portion 13 stops the turntable 11 are referred to as "plurality of stop positions SP 1".
The plurality of elevation driving units 18 individually elevate and lower the suction nozzles 15 of the plurality of holding units 12. The plurality of elevation driving units 18 are fixed above the plurality of stop positions SP1 so as not to rotate together with the turntable 11. The elevation driving unit 18 applies a downward force to the upper end portion of the suction nozzle 15 with the holding unit 12 positioned below the holding unit, for example, by using an electric motor, an air cylinder, or the like as a power source. Thereby, the suction nozzle 15 is lowered. When the elevation driving portion 18 releases the state in which the downward force is applied to the upper end portion of the suction nozzle 15, the suction nozzle 15 is elevated to the height before the descent by the elastic force of the spring 17.
The plurality of processing units 20 are provided so as to correspond to the plurality of stop positions SP1, respectively. The processing unit 20 may not necessarily be provided at all the stop positions SP 1. Each processing unit 20 performs a predetermined process on the electronic component W placed at the stop position SP1 (the stop position SP1 corresponding to the processing unit 20). The "processing" herein includes any action of changing the state of the electronic component W. For example, the electronic component W is subjected to marking or the like, the electronic component W is held in the holding portion 12, and the electronic component W released from the holding portion 12 is collected and handled. The correction of the holding position of the electronic component W by the holding portion 12 also belongs to "processing". Further, since the state in which the inspection data is unknown is changed to the state in which the inspection data is known, an arbitrary inspection performed on the electronic component W also belongs to "processing".
As a specific example of the processing unit 20, the pickup unit 100 can be cited. The pickup unit 100 picks up the electronic component W from the wafer adhesive sheet, conveys the electronic component W to the vicinity of an arbitrary stop position SP1, and delivers the electronic component W to the holding unit 12 at the stop position SP 1. Other examples of the processing unit 20 include a position correcting unit, an appearance inspecting unit, an electrical characteristic inspecting unit, a marking unit, a good product recovering unit, and a defective product recovering unit. The position correcting section corrects the holding position of the electronic component W by the holding section 12. The appearance inspection unit inspects the appearance of the electronic component W based on the captured image of the electronic component W. The electrical characteristic inspection section inspects electrical characteristics of the electronic component W. Specific examples of the electrical characteristics include resistance between terminals, capacitance, and the like. The marking portion marks the electronic component W by laser marking or the like. The good product recovery unit stores the electronic components W, which have not been inspected in all the tests, in a carrier tape, a tray, or the like. The defective product collection unit collects the electronic component W in which an abnormality has occurred in any inspection into a box or the like.
The structure of the pickup unit 100 will be described below. As shown in fig. 2, the pickup 100 includes: a sheet holding portion 110, a sheet position adjusting portion 120, a rotary pickup 130(rotary pickup up), an ejector 150, and an ejector position adjusting portion 160.
The sheet holding portion 110 holds a sheet having an adhesive surface to which the electronic component W is adhered. A specific example of the sheet is a wafer adhesive sheet 91 to which an electronic component W is attached. The wafer adhesive sheet 91 has an adhesive surface 93 to which the semiconductor wafer is adhered. The semiconductor wafer is bonded to the bonding surface 93 in a state of being diced into a plurality of electronic components W (e.g., semiconductor chips) by dicing. The main surface Wa of the electronic component W is bonded to the bonding surface 93. A ring frame 92 may be attached to the peripheral edge of the wafer adhesive sheet 91. In this case, the sheet holding portion 110 may also be configured to hold the ring frame 92. The sheet holding portion 110 holds the ring frame 92 around the conveying device 10 so that the adhesive surface 93 stands upright and faces the rotation axis Ax 1.
The sheet position adjusting portion 120 changes the position of the sheet holding portion 110 in the direction along the sticking surface 93. For example, the sheet position adjusting portion 120 changes the position of the sheet holding portion 110 in two directions in the direction along the attachment surface 93. As an example, the sheet position adjusting portion 120 includes: a first driving unit 121 and a second driving unit 122. The first driving unit 121 displaces the ring frame 92 in the vertical direction along the attachment surface 93 using, for example, an electric motor or the like as a power source. The second driving unit 122 displaces the ring frame 92 in the horizontal direction along the attachment surface 93 using, for example, an electric motor or the like as a power source.
The rotary pickup 130 picks up the electronic components W one by one from the wafer adhesive sheet 91 held by the sheet holding portion 110, and conveys them to the holding portion 12. The rotary pickup 130 is arranged between the rotation shaft Ax1 and the sheet holding portion 110 below the turntable 11.
For example, the rotary pickup 130 has: a plurality of suction units 131, a rotation unit 132, and a rotation driving unit 133. The plurality of suction portions 131 are arranged along the circular orbit CR 2. The circular rail CR2 is disposed such that the electronic component W on the adhesive surface 93 is located between the circular rail CR2 and the wafer adhesive sheet 91. The pickup object electronic component W of the rotary pickup 130 is located between the suction area a1 and the wafer adhesive sheet 91. In other words, the suction area a1 and the wafer adhesive sheet 91 form a position for arranging the pickup-target electronic component W. The circular track CR2 lies along a vertical plane that includes the axis of rotation Ax 1. The plane is perpendicular to the adhesive surface 93 held by the sheet holding portion 110. The plurality of suction portions 131 may be arranged at equal intervals along the circular orbit CR2 (at equal angular intervals about the rotation axis Ax 1). Fig. 2 illustrates a case where four suction portions 131 are arranged at a 90 ° pitch, but the number of suction portions 131 is not limited to four.
Circular track CR2 also passes through interface area a 2. In other words, the handover area a2 is aligned with the suction area a1 along the circular track CR 2. The intersection area a2 is located at the uppermost portion of the circular track CR 2. The position of the delivery area a2 coincides with the stop position SP1 corresponding to the pickup 100. Hereinafter, the stop position SP1 is referred to as a "stop position for handover SP 1". The rotary pickup 130 delivers the electronic component W from the suction portion 131 located in the delivery area a2 to the holding portion 12. In other words, the transport apparatus 10 acquires the electronic component W from any one of the suction portions 131 in the transfer area a2 and transports the electronic component W. For example, the transport device 10 sucks the electronic component W in the delivery area a2 by the holding portion 12 disposed at the stop position SP1 for delivery.
The plurality of suction portions 131 may be arranged such that when any one of the suction portions 131 is located in the suction area a1, another suction portion 131 is located in the passing area a 2. For example, the interval (angular distance) between the adjacent suction portions 131 and the interval (angular distance) between the suction area a1 and the delivery area a2 are aligned around the center of the circular orbit CR 2.
Each of the suction portions 131 sucks the pickup object electronic component W. The suction portion 131 may suck the electronic component W by any method. Specific examples of the method of attracting the electronic component W include vacuum attraction, electrostatic attraction, and the like. For example, the suction unit 131 has a suction nozzle 134. The suction nozzle 134 is opened radially outward of the circular orbit CR2, and vacuum-sucks the main surface Wb of the electronic component W.
The turning part 132 holds the plurality of suction parts 131. The pivot driving unit 133 pivots the pivot unit 132 about a rotary shaft Ax2 fixed to be along the center axis of the circular orbit CR 2. The rotation driving unit 133 rotates the rotation unit 132 around the rotation axis Ax2 by direct drive without a gear, using, for example, an electric motor as a power source. The swing drive unit 133 is fixed around the rotation shaft Ax1 so that the rotation shaft Ax2 is not displaced with respect to the rotation shaft Ax 1.
The rotary pickup 130 may further have a plurality of buffers 135. The plurality of buffer units 135 are respectively interposed between the swing driving unit 133 and the plurality of suction units 131. The buffer portions 135 respectively cause the suction portions 131 (the suction portions 131 corresponding to the buffer portions 135) to retreat in response to an inward external force (an external force toward the rotation axis Ax 2) acting on the suction portions 131. The backward movement here means a displacement toward the rotation axis Ax 2. The buffer 135 has a spring 136. The spring 136 resists the retreat of the suction nozzle 134 by its elastic force. When an inward external force is applied to the suction nozzle 134, the spring 136 elastically deforms in response to the backward movement of the suction nozzle 134, and when the inward external force disappears, the spring returns to push the suction nozzle 134 back to the position before the backward movement.
The ejector 150 is disposed such that the wafer tack sheet 91 is located between the ejector 150 and the pickup-target electronic component W. The ejector 150 ejects the wafer adhesive sheet 91 and the electronic component W to be picked up toward the suction area a 1. The ejector 150 has an ejector pin 151 protruding toward the back surface 94 of the wafer adhesive sheet 91 (the back surface of the adhesive surface 93). The ejector pins 151 extend along a line (hereinafter, referred to as "ejection line") 152 perpendicular to the adhesive surface 93 and the back surface 94. The ejector 150 moves forward or backward the ejector pin 151 along the ejector line 152 using, for example, an electric motor as a power source.
The push-out position adjusting section 160 changes the position of the push-out section 150 in a direction along the attachment surface 93 (a direction along a surface parallel to the attachment surface 93). For example, the push-out position adjusting portion 160 changes the position of the push-out portion 150 in two directions in the direction along the attachment surface 93. For example, the ejection position adjusting unit 160 includes a first driving unit 161 and a second driving unit 162. The first driving unit 161 uses, for example, an electric motor or the like as a power source, and vertically displaces the ejecting unit 150 along a plane parallel to the attachment surface 93. The second driving unit 162 displaces the push-out unit 150 in the horizontal direction along a plane parallel to the attachment surface 93 using, for example, an electric motor or the like as a power source.
The pickup 100 may further have a first photographing part 170. The circular orbit CR2 also passes through the first imaging region A3 that is the object of the first imaging section 170. In other words, the first photographing region A3 is juxtaposed to the adsorption region a1 along the circular track CR 2. The first imaging unit 170 is arranged to image the first imaging area A3 from the outer peripheral side of the circular orbit CR2, and to image the electronic component W or the suction unit 131 located in the first imaging area A3. For example, the first imaging unit 170 includes a camera 171. The camera 171 includes an imaging element such as a ccd (charge Coupled device) image sensor or a cmos (complementary Metal Oxide semiconductor) image sensor, and a lens for imaging an image on the imaging element. The camera 171 is disposed such that the first photographing region a3 is located between the camera 171 and the rotational axis Ax 2. The lens of the camera 171 faces the first photographing region a 3. In fig. 2, the first photographing region a3 is located at the lowermost portion of the circular orbit CR 2.
The pickup part 100 may further have a second photographing part 180. The second imaging unit 180 images the suction area a1 from the inner peripheral side of the circular orbit CR 2. The photographing from the inner circumference side means that an optical path from the suction area a1 to an imaging position of a photographed image of the second photographing part 180 passes through a viewpoint located at the inner circumference of the circular orbit CR 2. The imaging position of the captured image of the second capturing section 180 may not necessarily be located on the inner periphery of the circular orbit CR 2.
In order to provide the viewpoint for imaging the adsorption region a1 on the inner circumference of the circular orbit CR2, the revolving unit 132 may include: a cavity portion formed in the center of the circular track CR 2; and a window portion provided between the adjacent suction portions 131 and guiding light from the outside of the turning portion 132 to the cavity portion. For example, as shown in fig. 3 and 4, the turning part 132 includes: a cylindrical portion 137, a rotating plate 138, and a plurality of window portions 139. The cylindrical portion 137 forms a cavity portion 141 surrounding the rotation shaft Ax2, and holds the plurality of suction portions 131. The cylindrical portion 137 has a cylindrical shape, and the central axis thereof coincides with the rotation axis Ax 2. Hereinafter, one of the two ends of the cylindrical portion 137 on the side of the rotation driving portion 133 is referred to as a "driving end", and the end on the opposite side of the rotation driving portion 133 is referred to as an "open end". The rotation plate 138 is connected to the rotation driving portion 133 so as to close the driving end of the cylindrical portion 137. The plurality of window portions 139 are formed in the cylindrical portion 137 and are alternately arranged with the plurality of suction portions 131. In other words, the windows 139 are formed between the adjacent suction portions 131. The window 139 is, for example, a through hole, and guides light from the outside of the cylindrical portion 137 to the cavity 141.
The second imaging unit 180 images the adsorption region a1 from the cavity 141 through the window 139. For example, the second imaging unit 180 includes a mirror 181 and a camera 182. The reflecting mirror 181 is provided in the cavity portion 141. The mirror 181 reflects the light guided from the side of the suction region a1 to the cavity 141 toward the open end side of the cylindrical portion 137 through the window portion 139. The reflecting mirror 181 may be any member having a reflecting surface for reflecting the light toward the open end side of the cylindrical portion 137. The reflecting mirror 181 may be a plate-like reflecting mirror, or may be a prism arranged and disposed so that one surface thereof becomes the reflecting surface. The camera 182 photographs the adsorption area a1 via the mirror 181. For example, the camera 182 includes an image pickup device such as a CCD image sensor or a CMOS image sensor, and a lens for forming an image on the image pickup device. The camera 182 is disposed outside the cavity portion 141 such that the lens faces the open end of the cylindrical portion 137. Therefore, the light reflected toward the open end side by the mirror 181 enters the lens of the camera 182. In this way, the mirror 181 is provided in the cavity 141, and an optical path is formed through the viewpoint located on the inner periphery of the circular orbit CR 2. The cameras 182 may be arranged in any manner as long as images via viewpoints located on the inner periphery of the circular orbit CR2 can be captured. For example, the camera 182 may be disposed within the cavity portion 141 or may be disposed outside the circular track CR 2.
The controller 200 is configured to perform: the turning portion 132 is intermittently turned by the turning drive portion 133 in such a manner that the plurality of suction portions 131 are sequentially arranged in the suction area a 1. Further, the controller 200 is configured to perform: each time any one of the suction portions 131 among the plurality of suction portions 131 is arranged in the suction area a1, the sheet position adjusting portion 120 is controlled so that the position of the electronic component W is aligned with the position of the suction portion 131, and the ejection position adjusting portion 160 is controlled so that the position of the ejection portion 150 is aligned with the position of the suction portion 131.
For example, as shown in fig. 5, the controller 200 has, as a functional configuration (hereinafter, referred to as "functional module"): a rotation control unit 211, a first imaging control unit 212, a reference position calculation unit 213, a second imaging control unit 214, a component position calculation unit 215, a third imaging control unit 216, a push-out position calculation unit 217, a position information storage unit 218, a fourth imaging control unit 219, a positioning control unit 221, an adsorption control unit 222, a delivery control unit 223, and a conveyance control unit 224. Hereinafter, each functional block will be described. The process of executing each functional block corresponds to the process executed by the controller 200.
The swing control portion 211 intermittently swings the swing portion 132 by the swing driving portion 133 in such a manner that the plurality of suction portions 131 are sequentially arranged in the suction area a 1. The intermittent rotation means that the rotation and the stop are repeated. For example, the rotation control unit 211 intermittently rotates the rotation unit 132 by the rotation driving unit 133 at the same pitch as the angular pitch between adjacent suction units 131, starting from the state where any suction unit 131 is disposed in the suction area a 1. The rotation controller 211 rotates the rotation unit 132 in a direction (clockwise direction in fig. 2) in which each suction unit 131 sequentially passes through the suction area a1, the first imaging area A3, and the delivery area a 2.
The first imaging control unit 212 causes the first imaging unit 170 to acquire an image of the suction portion 131 in the first imaging area A3 in a state where any of the plurality of suction portions 131 is located in the first imaging area A3 without holding the electronic component W.
The reference position calculation unit 213 calculates the position where the suction unit 131 is disposed in the suction area a1, based on the image of the suction unit 131 (hereinafter, simply referred to as "image of the suction unit 131") acquired by the first imaging control unit 212 by the first imaging unit 170. The reference position calculation unit 213 calculates the position of the suction unit 131 in the first imaging area a3 (hereinafter referred to as "the actual position of the suction unit 131") from the image of the suction unit 131. Thereafter, the reference position calculation unit 213 calculates an error in the actual position of the suction unit 131 with reference to the designed position of the suction unit 131 in the first imaging area a3 (hereinafter referred to as "ideal position of the suction unit 131"). Thereafter, reference position calculation unit 213 adds the error to the designed position of suction unit 131 in suction area a1 to calculate the position of suction unit 131 in suction area a 1. For example, the reference position calculating unit 213 calculates the position of the suction unit 131 in two directions along the attachment surface 93 (along a plane parallel to the attachment surface 93). As an example, the reference position calculation unit 213 calculates the positions of the suction unit 131 in the vertical direction and the horizontal direction on a plane parallel to the attachment surface 93. The position of the suction portion 131 may be any position of the suction portion 131. For example, the position of the suction portion 131 is the center position of the suction nozzle 134.
The second imaging control unit 214 causes the second imaging unit 180 to capture an image of the electronic component W to be picked up in a state where the electronic component W is positioned between the suction area a1 and the wafer adhesive sheet 91. For example, the second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the suction area a1 through the window 139 at a timing when the window 139 is positioned between the cavity 141 and the suction area a 1. Thereby, the image of the pickup object electronic component W is acquired by the second imaging section 180 via the suction area a 1.
The component position calculating unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by causing the second imaging unit 180 to capture the image. For example, the component position calculating section 215 calculates the position of the electronic component W in two directions along the bonding surface 93. As an example, the component position calculating section 215 calculates the positions of the electronic component W in the vertical direction and the horizontal direction on the attachment surface 93. The position of the electronic component W may be any position of the electronic component W. The position of the electronic component W is, for example, the center position of the electronic component W.
The third imaging control unit 216 causes the second imaging unit 180 to capture an image of the ejection unit 150 through the suction area a1 in a state where the wafer adhesive sheet 91 is not positioned between the second imaging unit 180 and the ejection unit 150.
The top-out position calculating section 217 calculates the position of the top-out section 150 from the image of the top-out section 150 acquired by the second imaging section 180 by the third imaging control section 216. For example, the pushed-out position calculating section 217 calculates the position of the pushed-out portion 150 in two directions along the attachment surface 93 (along a plane parallel to the attachment surface 93). As an example, the push-out position calculating section 217 calculates the positions of the push-out section 150 in the vertical direction and the horizontal direction on the plane parallel to the attachment surface 93. The position of the ejector 150 may be any position of the ejector 150. For example, the position of the ejector 150 is the center position of the ejector pin 151.
The position information storage unit 218 stores the position calculated by the reference position calculation unit 213 and the position calculated by the ejection position calculation unit 217 for each adsorption unit 131.
The fourth photographing control part 219 causes the first photographing part 170 to acquire an image of the electronic component W in the first photographing region A3 in a state where any one of the plurality of suction parts 131 holds the electronic component W and is located in the first photographing region A3. The image captured by the fourth imaging control unit 219 is used for appearance inspection or the like of the main surface Wa of the electronic component W.
Each time any one of the suction portions 131 is arranged in the suction area a1, the alignment control portion 221 controls the sheet position adjusting portion 120 so that the position of the pickup-target electronic component W is aligned with the position of the suction portion 131, and controls the ejection position adjusting portion 160 so that the position of the ejection portion 150 is aligned with the position of the suction portion 131. For example, the alignment control unit 221 controls the sheet position adjustment unit 120 so that the center position of the electronic component W to be picked up is aligned with the center position of the suction nozzle 134 in the direction along the adhesive surface 93, based on the position calculated by the reference position calculation unit 213 and the position calculated by the component position calculation unit 215. The alignment control unit 221 controls the ejection position adjusting unit 160 so that the center position of the ejection pin 151 is aligned with the center position of the suction nozzle 134 in the direction along the attachment surface 93, based on the position calculated by the reference position calculating unit 213 and the position calculated by the ejection position calculating unit 217.
The suction controller 222 controls the ejector 150 so as to push out the electronic component W to the suction area a1 by the ejector pin 151 in a state where the position of the pickup target electronic component W and the position of the ejector 150 are aligned with the position of the suction portion 131 of the suction area a1, and controls the rotary pickup 130 so as to suck the electronic component W by the suction portion 131 of the suction area a 1. Then, the suction control unit 222 controls the ejector 150 to retract the ejector pin 151 in a state where the pickup target electronic component W is sucked by the suction unit 131. Thereby, the electronic component W is left in the suction area a1 and the wafer tack tape 91 is returned to the original position.
The delivery controller 223 controls the rotary pickup 130 to release the electronic component W in the delivery area a2 and controls the transport device 10 to acquire the electronic component W in the delivery area a2, in a state where any of the plurality of suction units 131 holds the electronic component W and is located in the delivery area a 2.
For example, at the transfer stop position SP1, the transfer controller 223 lowers the holding unit 12 by the elevation drive unit 18 to contact the electronic component W in the transfer area a2, sucks the electronic component W by the holding unit 12, and raises the holding unit 12 by the elevation drive unit 18 to the height before the lowering. The delivery controller 223 releases the suction of the electronic component W by the suction unit 131 in the delivery area a2 before the holding unit 12 that has sucked the electronic component W in the delivery area a2 starts to ascend.
The conveyance controller 224 controls the conveyance device 10 to convey the electronic component W acquired in the delivery area a2 along the circular track CR 1. For example, after the holding unit 12 that has sucked the electronic component W in the delivery area a2 has completed its ascent, the conveyance controller 224 rotates the turntable 11 by the rotation driver 13.
Fig. 6 is a block diagram illustrating a hardware configuration of the controller 200 by way of example. As shown in fig. 6, the controller 200 has a circuit 290. The circuit 290 includes: one or more processors 291, memory 292, storage 293, and input-output ports 294. The storage device 293 has a storage medium readable by a computer, such as a hard disk or a nonvolatile semiconductor memory. The storage device 293 stores a program for causing the controller 200 to execute: the turning portion 132 is intermittently turned around by the turning drive portion 133 in such a manner that the plurality of suction portions 131 are sequentially arranged in the suction area a 1; and controlling the sheet position adjusting portion 120 so that the position of the electronic component W is aligned with the position of the suction portion 131 and controlling the eject position adjusting portion 160 so that the position of the eject portion 150 is aligned with the position of the suction portion 131 every time any one of the plurality of suction portions 131 is arranged in the suction area a 1. For example, the storage device 293 stores a program for causing the controller 200 to constitute each functional module described above.
The memory 292 temporarily stores programs loaded from the storage device 293 and operation results of the processor 291. The processor 291 causes the controller 200 to constitute each functional block by executing the above-described program in cooperation with the memory 292. The input/output port 294 inputs/outputs electric signals to/from the rotation driving unit 133, the sheet position adjusting unit 120, the ejection position adjusting unit 160, the ejection unit 150, the suction unit 131, the holding unit 12, the elevation driving unit 18, the rotation driving unit 13, and the like, in accordance with a command from the processor 291. The circuit 290 is not necessarily limited to the functions configured by the program. For example, Circuit 290 may constitute at least a portion of a function of a dedicated logic Circuit or an Application Specific Integrated Circuit (ASIC) Integrated with a dedicated logic Circuit.
[ control flow of processing apparatus ]
Next, as an example of a processing method of the electronic component, a description will be given of a control flow executed by the controller 200 being divided into a calibration flow, a pickup flow, a delivery flow, and an imaging flow of the electronic component.
(calibration procedure)
The calibration flow is a control flow for acquiring and storing the positional information of each suction portion 131 and the positional information of the ejection portion 150 in the suction area a1 before the electronic component W is picked up by the pickup portion 100. For example, as shown in fig. 7, the controller 200 first performs steps S01, S02, S03, S04, S05. In step S01, the rotation control unit 211 causes the rotation driving unit 133 to start rotation of the rotation unit 132. In step S02, the first photographing control part 212 waits for the suction part 131 not holding the electronic component W to be arranged in the first photographing region A3. In step S03, the first imaging control unit 212 causes the first imaging unit 170 to acquire an image of the suction unit 131 in the first imaging area A3. In step S04, the reference position calculation unit 213 calculates the position at which the suction unit 131 is disposed in the suction area a1 from the image of the suction unit 131 acquired by the first imaging control unit 212 by the first imaging unit 170, and records the calculated position in the position information storage unit 218. In step S05, the first imaging control unit 212 checks whether or not the positions at which the suction sections 131 are arranged in the suction area a1 are calculated and recorded for all the suction sections 131.
If it is determined in step S05 that the position of the suction unit 131 has not been calculated yet, the controller 200 returns the process to step S02, and performs the image pickup of the next suction unit 131, the position calculation, and the recording.
When it is determined in step S05 that calculation and recording of the positions of all the suction units 131 are completed, the controller 200 executes steps S06, S07, S08, and S09. In step S06, the third imaging control unit 216 waits until the second imaging unit 180 can image the ejection unit 150. For example, the third photographing control section 216 waits for the window section 139 to be disposed between the cavity section 141 and the suction area a 1. In step S07, the third imaging control unit 216 causes the second imaging unit 180 to acquire an image of the ejection unit 150. In step S08, the ejected position calculating section 217 calculates the position of the ejected portion 150 from the image of the ejected portion 150 acquired by the third imaging control section 216 by the second imaging section 180, and records the calculated position in the position information storage section 218. In step S09, the rotation control unit 211 causes the rotation driving unit 133 to stop the rotation of the rotation unit 132. At this point, the calibration procedure is complete.
(pickup procedure)
The pickup flow is a control flow for causing the pickup unit 100 to sequentially execute pickup of the electronic components W from the wafer tack sheet 91. For example, as shown in fig. 8, the controller 200 first performs steps S11, S12, S13, S14, S15. In step S11, the rotation control unit 211 causes the rotation driving unit 133 to start rotation of the rotation unit 132. In step S12, the alignment control section 221 moves the sheet holding section 110 by the sheet position adjustment section 120 so that the pickup-target electronic component W is arranged between the suction area a1 and the wafer tacky sheet 91. In step S13, the second imaging control unit 214 waits until the second imaging unit 180 can image the pickup object electronic component W. For example, the second photographing control part 214 waits for the window part 139 to be arranged between the cavity part 141 and the suction area a 1. In step S14, the second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the pickup object electronic component W. In step S15, the component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by the second imaging unit 180.
Next, the controller 200 executes steps S16, S17, S18. In step S16, the registration control unit 221 starts: the sheet position adjusting portion 120 is controlled so as to align the position of the pickup object electronic component W with the position at which the next suction portion 131 is arranged in the suction area a1 (hereinafter, referred to as "the position of the next suction portion 131"); and controlling the ejection position adjusting portion 160 so that the position of the ejection portion 150 is aligned with the position of the next adsorption portion 131. For example, the alignment control unit 221 reads the position of the next suction unit 131 and the position of the ejection unit 150 from the position information storage unit 218. The alignment control unit 221 controls the sheet position adjustment unit 120 so that the position of the electronic component W is aligned with the position of the next suction unit 131, based on the position of the next suction unit 131 read from the position information storage unit 218 and the position of the electronic component W calculated by the component position calculation unit 215. The alignment control unit 221 controls the ejection position adjusting unit 160 so that the position of the ejection portion 150 is aligned with the position of the next suction portion 131, based on the position of the next suction portion 131 read from the position information storage unit 218 and the position of the ejection portion 150 read from the position information storage unit 218.
In step S17, the suction control part 222 waits for the next suction part 131 to be arranged in the suction area a 1. In step S18, the suction control part 222 waits for the position of the pickup-target electronic component W and the position of the ejector 150 to be aligned with the position of the next suction part 131.
Next, the controller 200 executes steps S21, S22, S23. In step S21, the suction controller 222 controls the ejector 150 to push out the electronic component W to the suction area a1 by the ejector pins 151. In step S22, suction controller 222 causes suction unit 131 in suction area a1 to suck electronic component W pushed out to suction area a 1. In step S23, the suction control unit 222 retracts the ejector pins 151. Thereby, the electronic component W is left in the suction area a1 and the wafer tack tape 91 is returned to the original position. Thereafter, the controller 200 returns the process to step S12. Thereafter, the steps S12 to S23 are repeated, whereby the plurality of electronic components W of the wafer adhesive sheet 91 are sequentially picked up by the pickup unit 100.
(Handover procedure)
The delivery flow is a control flow for causing the transport device 10 and the pickup unit 100 to execute delivery of the electronic component W in the delivery area a 2. For example, as shown in fig. 9, the controller 200 performs steps S31, S32, S33, S34, S35. In step S31, the passing controller 223 waits for the suction unit 131 that has sucked the electronic component W to be placed in the passing area a 2. In step S32, the delivery controller 223 lowers the holding unit 12 by the elevation drive unit 18 to contact the electronic component W in the delivery area a2 at the delivery stop position SP 1. In step S33, the delivery controller 223 causes the holding unit 12 to suck the electronic component W in the delivery area a2 and releases the suction of the electronic component W by the suction unit 131 in the delivery area a 2. In step S34, the delivery controller 223 causes the elevation drive unit 18 to raise the holding unit 12, which has sucked the electronic component W in the delivery area a2, to the height before lowering. In step S35, the conveyance controller 224 rotates the turntable 11 by one pitch by the rotation driver 13. Thus, the electronic component W sucked by the holding portion 12 in the delivery area a2 is conveyed, and the next holding portion 12 is placed at the stop position SP1 for delivery. Thereafter, the controller 200 returns the process to step S31. Thereafter, the transfer of the electronic component W in the transfer area a2 is repeated.
(shooting flow of electronic parts)
The electronic component capturing flow is a control flow for causing the first capturing unit 170 to sequentially capture images of the electronic components W in the first capturing area a 3. For example, as shown in fig. 10, the controller 200 performs steps S41, S42. In step S41, the fourth photographing control part 219 waits for the suction part 131, which has sucked the electronic component W, to be arranged in the first photographing region A3. In step S42, the fourth photographing control part 219 causes the first photographing part 170 to acquire an image of the electronic component W in the first photographing region A3. Thereafter, the controller 200 returns the process to step S41. After that, the photographing of the electronic component W in the first photographing region a3 is repeated. As described above, the image of the electronic component W is used for appearance inspection or the like of the main surface Wa of the electronic component W.
As described above, the processing apparatus 1 includes: a sheet holding section 110 for holding a wafer adhesive sheet 91 having an adhesive surface 93 to which an electronic component W is adhered; a plurality of suction portions 131 arranged along a circular track CR2 passing through a suction area a1 between the wafer adhesive sheet 91 and the electronic component W; a turning part 132 that holds the plurality of suction parts 131; a rotation driving unit 133 that rotates the rotation unit 132 around a rotation axis Ax2 fixed along the center axis of the circular orbit CR 2; a push-out portion 150 arranged to sandwich the wafer adhesive sheet 91 with the electronic component W and pushing out the wafer adhesive sheet 91 toward the suction area a 1; a sheet position adjusting portion 120 that changes the position of the sheet holding portion 110 in a direction along the sticking surface 93; and a push-out position adjusting part 160 for changing the position of the push-out part 150 along the direction of the sticking surface 93.
According to the processing apparatus 1, the positions of the electronic component W and the ejector 150 can be changed according to the individual difference in the position of each suction portion 131, and the positions of the suction portion 131, the electronic component W, and the ejector 150 can be aligned. This can suppress a pickup failure due to a positional deviation among the suction portion 131, the electronic component W, and the ejection portion 150. Here, when the position of the suction unit 131 is changed to align the three positions, the configuration of the suction unit 131 of the suction area a1 needs to be changed in addition to the configuration (the rotation unit 132 and the rotation driving unit 133) of the suction area a1, which complicates the apparatus configuration. On the other hand, the processing apparatus 1 that changes the positions of the electronic component W and the ejector 150 is effective for simplifying the structure for aligning the positions of the three.
The processing apparatus 1 may further include a first imaging unit 170 arranged to image the first imaging region A3 aligned with the adsorption region a1 along the circular orbit CR2 from the outer peripheral side of the circular orbit CR 2. In this case, the first imaging unit 170 can be used in common for grasping the appearance of the electronic component W held by the suction unit 131 and for grasping the position of the suction unit 131. Therefore, simplification of the device structure is more effective.
The processing apparatus 1 may further include a second imaging unit 180 that images the suction area a1 from the inner peripheral side of the circular orbit CR 2. In this case, the positioning can be performed based on the position of the electronic component W (photographed) viewed from the suction portion 131 side, which is a reference for aligning the three positions. Therefore, the positioning is effective for higher accuracy.
The processing apparatus 1 may further include: a rotation control unit 211 that intermittently rotates the rotation unit 132 by the rotation driving unit 133 so as to sequentially dispose the plurality of suction units 131 in the suction area a 1; and an alignment control unit 221 configured to control the sheet position adjusting unit 120 so that the position of the electronic component W is aligned with the position of the suction portion 131 and control the ejection position adjusting unit 160 so that the position of the ejection unit 150 is aligned with the position of the suction portion 131 every time any one of the plurality of suction portions 131 is disposed in the suction area a 1. In this case, the positions of the three can be automatically aligned according to the individual difference in the position of each suction portion 131.
The processing apparatus 1 may further include a transfer apparatus 10 for obtaining an electronic component W from any one of the suction units 131 and transferring the electronic component W in a transfer area a2 aligned with the suction area a1 along the circular track CR2, wherein the plurality of suction units 131 are arranged such that when any one of the suction units 131 is located in the suction area a1, the other suction unit 131 is located in the transfer area a 2. In this case, the suction of the electronic component W in the suction area a1 and the transfer of the electronic component W in the transfer area a2 are performed at least partially at the same time by using a configuration in which the positions of the three parts can be aligned without displacing the suction portion 131, and the processing time can be shortened.
The embodiments have been described above, but the present invention is not necessarily limited to the above embodiments, and various modifications can be made within a scope not departing from the gist thereof.
According to the present disclosure, there is provided a simplified and effective device of a structure for aligning the position of an electronic component, the position of a suction portion that picks up the electronic component, and the position of a push-out portion that pushes out the electronic component to the suction portion side.
It should be noted that the present application is proposed according to japanese patent application (japanese patent application 2019-187451), which is filed on 11/10/2019, and the contents of which are incorporated herein by reference.
Description of reference numerals:
1: a processing device; w: an electronic component; 10: a conveying device; 110: a sheet holding portion; 120: a sheet position adjusting section; 150: a push-out part; 160: an ejection position adjusting section; 91: wafer adhesive sheet; 93: a sticking surface; 131: an adsorption part; 132: a turning part; 133: a rotation driving section; a1: an adsorption region; CR 2: a circular track; a2: a handover area; ax 2: a rotating shaft; 170: a first imaging unit; a3: a first shooting area; 180: a second imaging unit; 139: a window section; 141: a cavity portion; 211: a rotation control unit; 221: an alignment control part.

Claims (5)

1. An electronic component handling apparatus includes:
a sheet holding section for holding a sheet having an adhesive surface to which an electronic component is adhered;
a plurality of adsorption parts arranged along a circular track passing through the adsorption region;
a rotating part for holding the plurality of adsorption parts;
a rotation driving unit configured to rotate the rotation unit around a rotation shaft fixed along a central axis of the circular orbit;
a push-out portion that pushes out the sheet toward the suction area;
a sheet position adjusting section that changes a position of the sheet holding section in a direction along the sticking surface; and
a push-out position adjusting part for changing the position of the push-out part along the direction of the sticking surface,
the suction area is arranged such that the electronic component is located between the suction area and the sheet,
the ejector is arranged such that the sheet is located between the ejector and the electronic component.
2. The electronic component handling apparatus according to claim 1, further comprising a first imaging unit,
the first imaging section is configured to image a first imaging region from an outer peripheral side of the circular orbit,
the first shooting area is arranged side by side with the adsorption area along the circular track.
3. The electronic component handling apparatus according to claim 1 or 2, further comprising a second imaging unit,
the second imaging unit is configured to image the suction area from an inner peripheral side of the circular orbit.
4. The electronic component handling apparatus according to any one of claims 1 to 3, further comprising:
a rotation control unit that intermittently rotates the rotation unit by the rotation driving unit so that the plurality of suction units are sequentially arranged in the suction area; and
and an alignment control unit that controls the sheet position adjustment unit so that the position of the electronic component is aligned with the position of the suction unit and controls the ejection position adjustment unit so that the position of the ejection unit is aligned with the position of the suction unit, each time any one of the plurality of suction units is disposed in the suction area.
5. The electronic component handling apparatus according to any one of claims 1 to 3, further comprising:
a transfer device that picks up the electronic component from any one of the plurality of suction units in a cross-over area that is aligned with the suction area along the circular orbit and transfers the electronic component,
the plurality of suction portions are arranged such that when any one of the suction portions is located in the suction area, another suction portion is located in the handover area.
CN202080070534.5A 2019-10-11 2020-10-05 Electronic component handling apparatus Pending CN114556538A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-187451 2019-10-11
JP2019187451A JP6872261B2 (en) 2019-10-11 2019-10-11 Electronic component processing equipment
PCT/JP2020/037743 WO2021070782A1 (en) 2019-10-11 2020-10-05 Electronic component processing device

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WO (1) WO2021070782A1 (en)

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