CN110752176A - Conveying mechanism, electronic component manufacturing device and electronic component manufacturing method - Google Patents

Conveying mechanism, electronic component manufacturing device and electronic component manufacturing method Download PDF

Info

Publication number
CN110752176A
CN110752176A CN201910625588.2A CN201910625588A CN110752176A CN 110752176 A CN110752176 A CN 110752176A CN 201910625588 A CN201910625588 A CN 201910625588A CN 110752176 A CN110752176 A CN 110752176A
Authority
CN
China
Prior art keywords
camera
optical mark
conveyed
image
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910625588.2A
Other languages
Chinese (zh)
Other versions
CN110752176B (en
Inventor
片冈昌一
深井元树
今井一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN110752176A publication Critical patent/CN110752176A/en
Application granted granted Critical
Publication of CN110752176B publication Critical patent/CN110752176B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention provides a conveying mechanism, an electronic component manufacturing device and an electronic component manufacturing method, wherein the conveying mechanism comprises: a holding mechanism configured to be movable while holding an object to be conveyed; a light source; an optical mark forming part capable of forming an optical mark optically; a first camera including a first imaging element configured to be able to image the optical mark and a transport target portion of the transported object; a second camera including a second imaging element configured to be capable of imaging a conveyed object and an optical mark, the conveyed object being held by the holding mechanism; and a calculation means configured to be able to correct the moving distance of the object to be conveyed to the conveyance target portion based on the amount of relative positional displacement between the first camera and the second camera.

Description

Conveying mechanism, electronic component manufacturing device and electronic component manufacturing method
Technical Field
The present disclosure relates to a conveying mechanism, an electronic component manufacturing apparatus, and an electronic component manufacturing method.
Background
Patent document 1 (japanese patent laid-open No. h 7-7028) describes a chip bonding (chipbonding) apparatus including: a first recognition camera for recognizing the position of the substrate; a second recognition camera for recognizing the position of the semiconductor chip; and a correction mechanism for setting the reference positions of the first recognition camera and the second recognition camera.
In the chip bonding apparatus described in patent document 1, the reference positions of the first recognition camera and the second recognition camera are set as follows. First, a rod (rod) of the correcting mechanism is extended to bring a target (target) to a predetermined position and stop the target, and the target is provided with a specific mark of a cross pattern at the same position on both front and back surfaces. The stop position of the target is set as follows: the center intersection of the specific mark reaches below the center of the second recognition camera.
Next, the first recognition camera is moved so that the center intersection of the specific mark, i.e., the cross pattern, is located at the center of the first recognition camera. Thus, the center of the first recognition camera, the center of the second recognition camera, and the center intersection of the specific mark are located on the same axis. The X-axis position and the Y-axis position at this time are recorded in the storage device as reference positions of the first recognition camera, the second recognition camera, and the target.
Then, after the chip bonding is performed a predetermined number of times or after a predetermined time has elapsed, the relative shift amount of the first recognition camera with respect to the reference position and the relative shift amount of the second recognition camera with respect to the reference position are detected. Based on these detected relative offsets, the relative offsets of the first recognition camera and the second recognition camera are calculated. The positional relationship between the substrate and the semiconductor chip is corrected by considering the calculated relative shift amount as a correction amount, and chip bonding is restarted.
Disclosure of Invention
However, in the chip bonding apparatus described in patent document 1, in setting the reference positions of the first recognition camera and the second recognition camera, a movement space including a correction mechanism for the rod and the target must be provided in the apparatus, and therefore, there is a problem that the apparatus is large in size.
In the die bonding apparatus described in patent document 1, the correction mechanism must be mounted on the apparatus, which also has a problem of complicating the structure of the apparatus.
According to embodiments disclosed herein, there may be provided a handling mechanism comprising: a holding mechanism configured to be movable while holding an object to be conveyed; a light source; an optical mark forming section capable of optically forming an optical mark in an optical path of light emitted from the light source; a first camera including a first imaging element configured to be able to image the optical mark and a transport target portion of the transported object; a second camera including a second imaging element configured to be capable of imaging a conveyed object and an optical mark, the conveyed object being held by the holding mechanism; and a calculation means configured to be able to correct the moving distance of the object to be conveyed to the conveyance target portion based on the amount of relative positional displacement between the first camera and the second camera.
According to embodiments disclosed herein, there may be provided a handling mechanism comprising: a holding mechanism configured to be movable while holding an object to be conveyed; a light source; an optical mark forming section capable of optically forming an optical mark in an optical path of light emitted from the light source; a face provided with a non-optical marking; a first camera including a first imaging element configured to be able to image a transport target portion and a non-optical mark of an object to be transported; a second camera including a second imaging element configured to be capable of imaging a conveyed object and an optical mark, the conveyed object being held by the holding mechanism; a third camera including a third image pickup device configured to be capable of picking up an optical mark and a non-optical mark; and a calculation means capable of correcting the moving distance of the object to be conveyed to the conveyance target portion based on the amount of relative positional displacement between the first camera and the second camera.
According to the embodiments disclosed herein, there may be provided an electronic parts manufacturing apparatus including the conveying mechanism.
According to embodiments disclosed herein, there may be provided a method of manufacturing an electronic part, including the steps of: a step of holding the conveyed object by a holding mechanism; a step of optically forming an optical mark; a step of photographing the optical mark by using a first image pickup element of a first camera; a step of photographing the optical mark by using a second image pickup element of a second camera; a step of imaging a conveyed object by a second imaging element, the conveyed object being held by a holding mechanism; a step of imaging a transport target portion of a transported object by using a first imaging element; calculating a relative position offset between the first camera and the second camera; correcting the moving distance of the conveyed object to the conveying target part based on the relative position offset; and a step of placing the object to be conveyed on the conveyance target portion.
According to embodiments disclosed herein, there may be provided a method of manufacturing an electronic part, including the steps of: a step of holding the conveyed object by a holding mechanism; a step of optically forming an optical mark; a step of photographing a non-optical mark by using a first image pickup element of a first camera; a step of photographing the optical mark by using a second image pickup element of a second camera; a step of imaging the non-optical mark by a third imaging element of a third camera attached to the holding mechanism; a step of imaging a conveyed object held by a holding mechanism by a second imaging element; a step of imaging a transport target portion of a transported object by using a first imaging element; calculating a relative position offset between the first camera and the second camera; correcting a moving distance of the object to be conveyed to the conveyance target portion based on the relative positional displacement amount; and a step of placing the object to be conveyed on the conveyance target portion.
According to the embodiments disclosed herein, it is possible to provide a conveying mechanism, an electronic component manufacturing apparatus, and an electronic component manufacturing method, which can suppress an increase in size of the apparatus and a complication of the structure of the apparatus.
These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description, which is to be read in connection with the accompanying drawings.
Drawings
Fig. 1 is a schematic plan view of an electronic component manufacturing apparatus according to embodiment 1.
Fig. 2 is a schematic side view illustrating an example of the operation of the substrate supply mechanism a.
Fig. 3 is a schematic side view illustrating an example of the operation of the substrate supply mechanism a.
Fig. 4 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B.
Fig. 5 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B.
Fig. 6 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B.
Fig. 7 is a schematic side view illustrating an example of the operation of the washing mechanism C.
Fig. 8 is a schematic side view illustrating an example of the operation of the washing mechanism C.
Fig. 9 is a schematic side view illustrating an example of the operation of the conveyance mechanism D.
Fig. 10 is a schematic side view illustrating an example of the operation of the conveyance mechanism D.
Fig. 11 is a schematic side view illustrating an example of the operation of the conveyance mechanism D.
Fig. 12 is a schematic side view illustrating an example of the operation of the conveyance mechanism D.
Fig. 13 is a schematic side view illustrating an example of the operation of the conveyance mechanism D.
Fig. 14 is a schematic side view illustrating an example of an operation of holding the semiconductor package by the holding mechanism.
Fig. 15 is a schematic cross-sectional view illustrating another example of the operation of the holding mechanism holding the semiconductor package.
Fig. 16 is a schematic side view illustrating an example of an operation of the second image pickup element to pick up an image of the semiconductor package held by the holding mechanism from the Z-axis direction downward.
Fig. 17 is a schematic side view illustrating an example of an operation of the first image pickup element to photograph the opening of the arrangement member from above in the Z-axis direction.
Fig. 18 is a schematic cross-sectional view illustrating an example of an operation of performing the position alignment of the semiconductor package.
Fig. 19 is a schematic cross-sectional view illustrating an example of an operation of performing the arrangement of the semiconductor package.
Fig. 20 is a schematic partial perspective side view illustrating an example of an operation of the first image pickup device to pick up an image of an optically formed optical mark.
Fig. 21 is a schematic plan view of an example of an image of an optically formed optical mark captured by the first image pickup element.
Fig. 22 is a schematic partial perspective side view illustrating an example of an operation of the second image pickup device to pick up an image of an optically formed optical mark.
Fig. 23 is a schematic plan view of an example of an image of an optically formed optical mark captured by the second image pickup element.
Fig. 24(a) to 24(D) are schematic side views illustrating an example of the operation of the conveyance mechanism D.
Fig. 25 is a schematic plan view illustrating an example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2.
Fig. 26 is a schematic plan view illustrating an example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2.
Fig. 27 is a schematic plan view illustrating an example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2.
Fig. 28 is a schematic plan view illustrating an example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2.
Fig. 29 is a schematic plan view illustrating an example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2.
Fig. 30 is a schematic partial perspective side view of an example of a first camera of the electronic component manufacturing apparatus according to embodiment 3.
Fig. 31 is a schematic partial perspective side view of an example of a first camera of the electronic component manufacturing apparatus according to embodiment 3.
Fig. 32 is a schematic plan view of an example of an image of an optical marker captured by the first image pickup element of the first camera in the state shown in fig. 30.
Fig. 33 is a schematic plan view of an example of an image of a surface captured by the first image pickup element of the first camera in the state shown in fig. 31.
Fig. 34 is a schematic partial perspective side view of another example of the first camera of the electronic component manufacturing apparatus according to embodiment 3.
[ description of symbols ]
1: substrate loading part
2: substrate push-out member
3: base material
4: sealing resin
5: semiconductor package substrate
5 a: semiconductor package
6: package-placing loader
6 a: track
7: substrate supply table
8: cutting platform
8 a: rotating mechanism
8 b: alignment camera
9: rotating shaft
10: blade
11: washing water spraying component
12: air injection member
13: package unloader
14: turnover device
14 a: track
15: indexing platform
16: sponge roller
17: air injection member
18: camera for inspecting mark
19: camera for inspecting package
21: holding mechanism
21 a: holding head
22: platform
22 a: noodle
23: arrangement member
23 a: opening of the container
24: loading machine for configuration member
25: track
26: arrangement component loading part
27: arithmetic mechanism
31: first image pickup element
32: first light source
33: optical mark forming part
33 a: light transmission part
33 b: light shielding part
34: first lens
35: second lens
36: half mirror
37: optical sign
38: light (es)
39: bright part
40: dark part
41: second imaging element
42: third lens
43: fourth lens
44: reflecting mirror
45: illumination device
46: bright part
47: dark part
48: non-optical sign
51: third image pickup element
61: fastening screw
62: adapter
63: fastening screw
64: half mirror
65: second light source
71: adhesive layer (bonding layer)
72: sheet-like substrate
101. 201, 301: first camera
101 a: light incident part
102. 202: second camera
102 a: light incident part
103: coaxial cable
203: third phase machine
A: substrate supply mechanism
B: substrate cutting mechanism
C: washing mechanism
D: carrying mechanism
L1, L2, L3: distance between two adjacent plates
ΔX0: offset of relative position
ΔX1: amount of positional deviation
ΔX2: amount of positional deviation
P1X、P2X、P3X: position of
X, Y, Z: coordinate axis direction
Detailed Description
Hereinafter, embodiments will be described. In the drawings for describing the embodiments, the same reference numerals denote the same or corresponding parts.
< embodiment 1 >
Fig. 1 is a schematic plan view of an electronic component manufacturing apparatus according to embodiment 1. The electronic component manufacturing apparatus according to embodiment 1 shown in fig. 1 includes a substrate supply mechanism a, a substrate cutting mechanism B, a cleaning mechanism C, and a conveyance mechanism D.
As shown in fig. 1, the substrate supply mechanism a includes: a substrate loading unit 1 for loading a semiconductor package substrate 5; a substrate supply table 7 on which the semiconductor package substrate 5 taken out from the substrate loading unit 1 is placed; a package in loader (6) for holding the semiconductor package substrate 5 and supplying the same to the substrate cutting mechanism B; and a rail 6a for moving the package insertion loader 6 to the substrate cutting mechanism B.
Fig. 2 and 3 are schematic side views illustrating an example of the operation of the substrate supply mechanism a. The substrate supply mechanism a operates, for example, as follows. First, as shown in fig. 2, the semiconductor package substrate 5 loaded in the substrate loading section 1 is pushed out in the X-axis direction by the substrate pushing member 2 and placed on the substrate supply table 7. Next, the package loading machine 6 located above the semiconductor package substrate 5 in the Z-axis direction holds the semiconductor package substrate 5 on the substrate supply table 7. Next, as shown in fig. 1, the package loading loader 6 moves along the rails 6a in the X-axis direction to the substrate cutting mechanism B while holding the semiconductor package substrate 5. Then, as shown in fig. 3, the package loading loader 6 loads the semiconductor package substrate 5 on a dicing table (cut table)8 of the substrate cutting mechanism B located below in the Z-axis direction. This completes the operation of the substrate supply mechanism a.
The semiconductor package substrate 5 is a cut object that is finally cut and singulated into a plurality of semiconductor packages 5 a. The semiconductor package substrate 5 may include, for example: a base material including a substrate or a lead frame (lead frame); semiconductor chip-like parts mounted on a plurality of regions included in the base material, respectively; and a sealing resin formed so as to cover a plurality of regions included in the base material collectively. In embodiment 1, a case where a semiconductor package substrate 5 is used will be described as an example, and the semiconductor package substrate 5 includes a base material 3 on which a plurality of semiconductor chip-like components are mounted and a sealing resin 4.
As shown in fig. 1, the substrate cutting mechanism B includes: a dicing table 8 on which the semiconductor package substrate 5 before cutting or the semiconductor package 5a after cutting is placed; a rotating mechanism 8a for rotating the cutting table 8; a moving mechanism (not shown) for moving the cutting table 8 and the rotating mechanism 8 a; an alignment camera 8b for confirming the position of the semiconductor package substrate 5 on the dicing table 8; a spindle 9 including a blade (blade) for cutting the semiconductor package substrate 5; a washing water spraying member 11 for spraying washing water to the semiconductor package 5 a; and an air spraying member 12 for drying the washing water sprayed to the semiconductor packages 5 a.
Fig. 1 and 4 to 6 are schematic side views illustrating an example of the operation of the substrate cutting mechanism B. The substrate cutting mechanism B operates, for example, as follows. First, as shown in fig. 1, the dicing table 8 and the rotating mechanism 8a are moved in the Y-axis direction by a moving mechanism, not shown, and the semiconductor package substrate 5 before cutting is placed on the dicing table 8. At this time, the position of the semiconductor package substrate 5 on the dicing table 8 is confirmed by the alignment camera 8 b.
Next, as shown in fig. 1, the dicing table 8 and the rotating mechanism 8a on which the semiconductor package substrate 5 is placed are moved in the X-axis direction until the rotation axis 9, and the semiconductor package substrate 5 is rotated by the rotating mechanism 8 a. Next, as shown in fig. 4, the blade 10 is rotated by rotating the shaft 9, thereby cutting the semiconductor package substrate 5 on the dicing table 8. Thus, the semiconductor package substrate 5 is singulated to obtain a plurality of semiconductor packages 5 a. Each semiconductor package 5a may have, for example, the following structure: comprises a base material 3 on which semiconductor chip-like components are mounted, and a sealing resin 4 for covering the semiconductor chip-like components.
Next, as shown in fig. 5, the washing water is sprayed to the base material 3 side of the singulated semiconductor packages 5a on the dicing table 8 by the washing water spraying means 11. Next, as shown in fig. 6, the semiconductor package 5a is dried by blowing off the washing water sprayed to the substrate 3 side of the semiconductor package 5a by spraying air from the air spraying member 12. Then, the semiconductor packages 5a on the dicing table 8 are moved to the washing mechanism C. This completes the operation of the substrate cutting mechanism B.
As shown in fig. 1, the washing mechanism C includes: a package unloader (package unloader)13 for holding the semiconductor package 5 a; a sponge roller (sponge roller)16 for washing the sealing resin 4 side of the semiconductor package 5 a; and an air injection member 17 for drying the semiconductor package 5 a.
Fig. 1, 7, and 8 are schematic side views illustrating an example of the operation of the washing mechanism C. The washing means C is operated, for example, as described. First, as shown in fig. 7, the package unloader 13 holds the semiconductor package 5a and pulls up the semiconductor package from the dicing table 8 to above in the Z-axis direction. Next, as shown in fig. 1, the package unloader 13 moves the semiconductor package 5a in the X-axis direction to a position above the sponge roller 16 and the air injection member 17 in the Z-axis direction. Then, as shown in fig. 8, the sponge roller 16 washes the sealing resin 4 side of the semiconductor package 5a, and the air jetting member 17 jets air, thereby drying the semiconductor package 5 a. This completes the operation of the washing mechanism C.
As shown in fig. 1, the conveyance mechanism D includes: a mark inspection camera 18 for inspecting a mark printed on the sealing resin 4 of the semiconductor package 5 a; a package inspection camera 19 for inspecting the base material 3 of the semiconductor package 5 a; a flipper (14) for holding and inverting the semiconductor package 5 a; a rail 14a for the flipper 14 to move; an index table (index table)15 for placing the semiconductor package 5a which has been inverted by the inverter 14; and a moving mechanism (not shown) for moving the index table 15.
The carrying mechanism D further includes: a holding mechanism 21 for holding and conveying the semiconductor package 5 a; a placement member 23 for placing the semiconductor package 5 a; a platform 22 on which the placement member 23 is placed; a moving mechanism (not shown) for moving the stage 22; a placement member loader 24 for holding the placement member 23 on which the semiconductor package 5a is placed; a rail 25 for moving the configuration member loader 24; a placement member loading unit 26 for loading the placement member 23 on which the semiconductor package 5a is placed; and a computing mechanism 27 configured to be able to correct a relative movement amount from the semiconductor package 5a as a conveyed object to the opening 23a of the placement member 23 as a conveyance target portion, as will be described later.
In embodiment 1, as the holding mechanism 21, for example, a suction mechanism that sucks, holds, and conveys the semiconductor package 5a can be used. As the arrangement member 23, for example, an adhesion member including a support base such as a metal template (stent) provided with a plurality of openings 23a and a resin sheet on the support base can be used.
When an adsorption mechanism is used as the holding mechanism 21, an adsorption head may be used as a holding member for holding the semiconductor package 5 a. In this case, for example, the semiconductor package 5a can be sucked and held on the end face of the suction head provided with the opening by sucking the gas in the hollow suction head using a vacuum pump not shown.
As the resin sheet used for the adhesive member, for example, a sheet including a resin sheet-like base material and an adhesive layer (adhesive layer) including an adhesive applied to at least one surface of the sheet-like base material can be used. As the adhesive, for example, a pressure sensitive adhesive (pressure sensitive adhesive) can be used. As the resin sheet, for example, a resin sheet in which a silicone adhesive is applied to both surfaces of a polyimide film can be used. Here, in the resin sheet, an adhesive may be applied to at least the surface of the sheet-like base material on the side to which the semiconductor package 5a is attached to form an adhesive layer, but an adhesive may be applied to the surface of the sheet-like base material on the side to which the semiconductor package 5a is attached and the surface of the sheet-like base material on the opposite side to the side to which the semiconductor package 5a is attached to form an adhesive layer. As described above, since the adhesive layer (adhesive layer) is provided on at least the placement surface of the semiconductor package 5a of the resin sheet, the semiconductor package 5a can be adhered to the placement member 23 as the adhesive member.
An example of the operation of the conveyance mechanism D is illustrated below with reference to fig. 9 to 19 and fig. 24(a) to 24 (D). First, as shown in the schematic side view of fig. 9, the package unloader 13 holds the semiconductor package 5a, which is washed by the sponge roller 16 and dried by the air blowing member 17, and moves to the upper side in the Z-axis direction of the mark inspection camera 18. Next, the mark inspection camera 18 confirms whether or not the mark printed on the sealing resin 4 of the semiconductor package 5a is appropriate.
Next, as shown in the schematic side view of fig. 10, the package unloader 13 moves in the X-axis direction to move to the upper side of the flipper 14 in the Z-axis direction, and lowers the semiconductor package 5a in the Z-axis direction to place it on the flipper 14. Next, as shown in the schematic side view of fig. 11, the semiconductor package 5a is inverted by the rotation of the inverter 14. At this time, the flipper 14 holds the semiconductor package 5a such that the substrate 3 side of the semiconductor package 5a faces downward in the Z-axis direction.
Next, as shown in fig. 1, the inverter 14 moves along the rails 14a in the X-axis direction, and the semiconductor package 5a is conveyed to a position above the package inspection camera 19 in the Z-axis direction, as shown in the schematic side view of fig. 12. Next, the package inspection camera 19 inspects the base material 3 of the semiconductor package 5 a. In the case where the base material 3 is, for example, a substrate, the package inspection camera 19 inspects, for example, the position, number, and shape of solder balls. When the base material 3 is, for example, a lead frame, the package inspection camera 19 inspects, for example, the position, number, and shape of the leads. Next, as shown in fig. 1, the inverter 14 moves along the rails 14a in the X-axis direction to above the index table 15 in the Z-axis direction, and as shown in the schematic side view of fig. 13, the semiconductor package 5a is placed on the index table 15.
Next, as shown in fig. 1, the arithmetic mechanism 27 moves the index table 15 on which the semiconductor package 5a is mounted to the holding mechanism 21 side in the Y-axis direction, and moves the holding mechanism 21 to the index table 15 side in the X-axis direction. Thus, as shown in the schematic side view of fig. 14, the holding mechanism 21 is located above the semiconductor package 5a on the index table 15 in the Z-axis direction. A second camera 102 including a second imaging element 41 is disposed in the X-axis direction of the index table 15. The arrangement member 23 is disposed in the X-axis direction of the second camera 102. The first camera 101 including the first image pickup device 31 is attached to the holding mechanism 21. In embodiment 1, the placement member 23 is a sheet including a sheet-like base material 72 made of resin and an adhesive layer (adhesive layer) 71, and the adhesive layer (adhesive layer) 71 includes an adhesive applied to at least one surface of the sheet-like base material 72. The placement member 23 is provided with an opening 23a, and the opening 23a is a transport target portion in embodiment 1.
Next, as shown in the schematic side view of fig. 15, the arithmetic mechanism 27 moves the holding head 21a of the holding mechanism 21 downward in the Z-axis direction to cause the holding head 21a to hold the semiconductor package 5a, which is the object to be conveyed in embodiment 1. Then, as shown in fig. 14, the arithmetic mechanism 27 causes the holding head 21a to pull up the semiconductor package 5a to the Z-axis direction. For convenience of explanation, fig. 14 shows a case where the holding mechanism 21 holds only one semiconductor package 5a, but the present invention is not limited to this case, and a plurality of semiconductor packages 5a may be held at the same time as shown in fig. 15.
Next, as shown in the schematic side view of fig. 16, the arithmetic mechanism 27 moves the holding mechanism 21 holding the semiconductor package 5a in the X-axis direction from above in the Z-axis direction of the semiconductor package 5a toward above in the Z-axis direction of the placement member 23. At this time, for example, as shown in the schematic side view of fig. 16, the arithmetic mechanism 27 causes the second image pickup device 41 of the second camera 102 to take an image of the semiconductor package 5a held by the holding mechanism 21 from the Z-axis direction downward, and acquires an image of the semiconductor package 5 a. The arithmetic means 27 transmits data of the image of the semiconductor package 5a captured by the second imaging element 41 to the arithmetic means 27.
Next, as shown in the schematic side view of fig. 17, the arithmetic mechanism 27 moves the holding mechanism 21 further in the X-axis direction from above in the Z-axis direction of the first imaging element 41 toward above in the Z-axis direction of the placement member 23. Then, the arithmetic means 27 takes an image of the opening 23a from above in the Z-axis direction by, for example, causing the first image pickup device 31 of the first camera 101 attached to the holding means 21 to acquire an image of the opening 23 a. The arithmetic means 27 also transmits the data of the image of the opening 23a acquired by the first imaging device 31 to the arithmetic means 27.
Although the arithmetic means 27 has been described above as acquiring the image of the opening 23a by the first image pickup device 31 of the first camera 101 after acquiring the image of the semiconductor package 5a by the second image pickup device 41 of the second camera 102, the order of acquiring the images of the opening 23a by the first image pickup device 31 may be switched, and the image of the semiconductor package 5a may be acquired by the second image pickup device 41 after acquiring the image of the opening 23a by the first image pickup device 31.
Next, the calculation means 27 calculates the amount of positional displacement between the second camera 102 and the semiconductor package 5a based on the image of the semiconductor package 5a captured by the second image pickup device 41, and calculates the amount of positional displacement between the first camera 101 and the opening 23a based on the image of the opening 23a captured by the first image pickup device 31.
The calculation of the positional displacement amount between the second camera 102 and the semiconductor package 5a may be performed, for example, as follows: a distance in the X-axis direction, which is, for example, a first direction, between the center of the light incident portion of the second camera 102 and the center of the semiconductor package 5a, which is, for example, a second direction different from the first direction, is calculated, and the semiconductor package 5a is imaged downward from the Z-axis direction by the second imaging element 41.
The calculation of the positional displacement amount of the first camera 101 from the opening 23a can be performed, for example, as follows: the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident part of the first camera 101 and the center of the opening 23a, which is imaged by the first imaging element 31 from above in the Z-axis direction, are calculated.
Next, the calculation means 27 corrects the designed movement distances in the X-axis direction and the Y-axis direction from the semiconductor package 5a to the opening 23a, for example, by using the positional displacement amounts in the X-axis direction and the Y-axis direction between the second camera 102 and the semiconductor package 5a and the positional displacement amounts in the X-axis direction and the Y-axis direction between the first camera 101 and the opening 23a calculated as described above, and calculates the actual movement distances in the X-axis direction and the Y-axis direction. The designed movement distance of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction may be, for example, a calculated movement distance in the X-axis direction and the Y-axis direction, which is considered to be a movement distance necessary for accurately placing the center of the semiconductor package 5a as the object to be conveyed on the center of the opening 23a as the conveyance target portion. Instead of performing the correction using the movement distance in design, the movement distances of the semiconductor package 5a up to the opening 23a in the X-axis direction and the Y-axis direction may be corrected based on values measured in advance by the first camera 101 and the second camera 102 (for example, the movement distance from the center of the holding head 21a before holding the semiconductor package 5a to the center of the opening 23a, the movement distance calculated in the previous measurement, or the like).
Next, the calculation means 27 moves the semiconductor package 5a in the X-axis direction and the Y-axis direction by the movement distance calculated as described above in the X-axis direction and the Y-axis direction, respectively, through the holding means 21, and moves the semiconductor package to above the opening 23a in the Z-axis direction as shown in the schematic side view of fig. 18.
For example, when the semiconductor package 5a is a Ball Grid Array (BGA) semiconductor package and a Ball electrode (not shown) is provided on one surface of the semiconductor package 5a, the Ball electrode is provided near the periphery of the semiconductor package 5a, and the distance from the Ball electrode of the semiconductor package 5a to the periphery may be very short. In this case, since the ball electrodes must be accommodated in the opening 23a, and the entire short distance region from the ball electrodes to the peripheral edge of the semiconductor package 5a must be provided outside the opening 23a, a higher precision placement technique may be required.
Then, as shown in the schematic cross-sectional view of fig. 19, for example, the arithmetic means 27 lowers the semiconductor package 5a held by the holding head 21a to the lower side in the Z-axis direction so that the semiconductor package 5a is accommodated in the opening 23 a. This completes the conveyance of the semiconductor package 5a to the opening 23 a.
However, due to the temperature environment in which the electronic component manufacturing apparatus and the conveying mechanism D are used, variations in processing of the respective components, variations in assembly of the components, and the like, relative positional displacement may occur between the first camera 101 and the second camera 102. Therefore, in order to more accurately perform the positional alignment of the semiconductor package 5a with respect to the opening 23a, there is a case where the relative positional shift amount between the first camera 101 and the second camera 102 must be further considered.
An example of a method of calculating the amount of relative positional displacement between the first camera 101 and the second camera 102 in embodiment 1 will be described below with reference to fig. 20 to 23. First, as shown in the schematic side view of fig. 20, the arithmetic mechanism 27 moves the holding mechanism 21 to the upper side in the Z-axis direction of the stage 22 on which the arrangement member 23 is placed.
As shown in the schematic partial perspective side view of fig. 20, the first camera 101 is attached to the holding mechanism 21. The first camera 101 includes, for example, a first image pickup device 31, a first light source 32, an optical mark forming portion 33 including a light transmitting portion 33a and a light shielding portion 33b, a first lens 34 designed for a unit conjugate ratio, a second lens 35, and a half mirror (half mirror) 36. As the optical mark forming portion 33, for example, a member having a circular hole opened at the center thereof may be used. The unit conjugation ratio design is designed as follows: the light emitted from an object located at a finite position other than infinity is focused at another point by an optical system.
The computing mechanism 27 may cause the first light source 32 to emit light 38. Light 38 emitted from the first light source 32 passes through the optical mark forming portion 33, is reflected to the stage 22 side by the half mirror 36, and enters the surface 22a of the stage 22 through the first lens 34. At this time, the optical mark 37 is optically formed on the surface 22a of the stage 22 which becomes the optical path of the light 38.
The optical marker forming unit 33 is disposed movably in the first camera 101 along the optical path of the light 38 emitted from the first light source 32, for example. Therefore, by moving the optical marker forming unit 33 by the arithmetic mechanism 27, the first image pickup device 31 can pick up an image of the optical marker 37 in a state where the center of the optical marker 37 is focused, for example. In other words, by moving the optical marker forming unit 33, the focus adjustment (focusing) of the optical marker 37 can be performed.
The arithmetic means 27 captures an image of an optical mark 37 by the first imaging element 31 through the first lens 34, the half mirror 36, and the second lens 35, and acquires an image of the optical mark 37, the optical mark 37 being optically formed on the surface 22a of the stage 22. The arithmetic means 27 transmits the data of the image of the optical marker 37 acquired by the first image pickup device 31 to the arithmetic means 27. In the electronic component manufacturing apparatus according to embodiment 1, the optical system as the optical path of the light 38 includes the half mirror 36, the first lens 34, and the second lens 35.
Fig. 21 is a schematic plan view showing an example of an image of the optical marker 37 captured by the first image sensor 31. As shown in fig. 21, the optical mark 37 includes a light portion 39 and a dark portion 40. The bright portion 39 has a shape corresponding to the shape of the light transmitting portion 33a, and the light transmitting portion 33a is a portion through which the light 38 of the optical mark forming portion 33 is transmitted. The dark portion 40 has a shape corresponding to the shape of the light-shielding portion 33b, and the light-shielding portion 33b is a portion that shields the light 38 of the optical mark forming portion 33. By using the first lens 34 designed with a unit conjugate ratio, the boundary between the bright portion 39 and the dark portion 40 of the optical mark forming portion 33 can be made clear.
Then, the calculation means 27 calculates a first amount of positional deviation, which is a positional deviation amount between the first camera 101 and the optical mark 37, based on the image of the optical mark 37 captured by the first image pickup device 31. The calculation of the first positional offset amount of the first camera 101 and the optical marker 37 may be performed, for example, in the following manner: the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident portion 101a of the first camera 101 and the center of the optical marker 37, which is the image of the first image pickup device 31 from above in the Z-axis direction, are calculated.
Next, as shown in a partial perspective side view of fig. 22, the arithmetic mechanism 27 moves the holding mechanism 21 to which the first camera 101 is attached to the Z-axis direction upper side of the second camera 102. The second camera 102 includes, for example, a second image pickup device 41, a third lens 42, a fourth lens 43, a mirror (mirror)44, and an illumination 45.
Next, the arithmetic mechanism 27 causes the first light source 32 of the first camera 101 to emit light, and optically forms the optical marker 37 in the optical path between the first camera 101 and the second camera 102.
Next, as shown in fig. 22, the arithmetic means 27 causes the second image pickup device 41 of the second camera 102 to pick up an image of the optical mark 37 from the Z-axis direction downward.
That is, the light 38 emitted from the first light source 32 passes through the optical marker forming portion 33, is reflected to the second camera 102 side via the half mirror 36, passes through the first lens 34, and optically forms the optical marker 37. Then, the light 38 enters the mirror 44 from the light entrance portion 102a of the second camera 102, is reflected to the second image pickup device 41 side, passes through the fourth lens 43 and the third lens 42, and enters the second image pickup device 41. Thereby, the second image pickup device 41 picks up the image of the optical marker 37 from the Z-axis direction downward, and acquires the image of the optical marker 37, the optical marker 37 being optically formed in the optical path between the first camera 101 and the second camera 102. The arithmetic means 27 transmits the data of the image of the optical marker 37 acquired by the second imaging device 41 to the arithmetic means 27. In the electronic component manufacturing apparatus according to embodiment 1, the half mirror 36, the first lens 34, the reflecting mirror 44, the fourth lens 43, and the third lens 42 are provided as optical systems in the optical path of the light 38.
Fig. 23 is a schematic plan view showing an example of an image of the optical marker 37 captured by the second image sensor 41. As shown in fig. 23, the optical mark 37 includes a light portion 46 and a dark portion 47. The bright portion 46 has a shape corresponding to the shape of the light-transmitting portion 33a of the optical mark forming portion 33. The dark portion 47 has a shape corresponding to the shape of the light-shielding portion 33b of the optical mark forming portion 33.
Next, the calculation means 27 calculates a second amount of positional deviation, which is the amount of positional deviation between the second camera 102 and the optical marker 37, based on the image of the optical marker 37 captured by the second imaging device 41. The calculation of the second positional displacement amount of the second camera 102 and the optical marker 37 may be performed, for example, as follows: the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 imaged by the second imaging device 41 are calculated.
Next, the calculation means 27 calculates the amount of relative positional displacement between the first camera 101 and the second camera 102 based on the first amount of positional displacement between the first camera 101 and the optical marker 37 and the second amount of positional displacement between the second camera 102 and the optical marker 37.
When the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 imaged by the second imaging device 41 do not exist on the same axis extending in the Z-axis direction, it is preferable to move the first camera 101 so that these centers are on the same axis. In this case, since the second amount of positional displacement between the second camera 102 and the optical marker 37 can be set to zero, the amount of positional displacement between the first camera 101 and the second camera 102 calculated by the calculation means 27 can be made equal to the first amount of positional displacement between the first camera 101 and the optical marker 37. The position of the first camera 101 when the center of the light incident portion 102a of the second camera 102 and the center of the optical marker 37 are present on the same axis extending in the Z-axis direction as described above can be used as a temporary reference position to be described later for correcting the moving distance of the object to be conveyed to the conveyance target portion.
Fig. 24(a) shows an example of a state in which the first camera 101 and the second camera 102 are located at temporary reference positions. First, the arithmetic mechanism 27 moves the first camera 101 and the second camera 102 to temporary reference positions. The temporary reference position is, for example, a designed position in the X-axis direction when the center of the light incident portion 101a of the first camera 101 and the center of the light incident portion 102a of the second camera 102 are present on the same axis 103 extending in the Z-axis direction. In the provisional reference position of embodiment 1, actually, the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 are not located on the same axis 103 extending in the Z-axis direction, and the relative positional displacement amount in the X-axis direction of the first camera 101 and the second camera 102 calculated by the calculation means 27 is Δ X0. The position in the X-axis direction of the center of the light incident part 101a of the first camera 101 at the temporary reference position is defined as P1And (4) X. Also, in this example, the holding mechanism 21 has pulled up and held the semiconductor package 5a from the index table 15.
Next, as shown in fig. 24(b), the arithmetic mechanism 27 moves the first camera 101 by only the distance L1 in the X-axis direction from the temporary reference position. The distance L1 is, for example, a design distance in the X-axis direction from the temporary reference position to a design position in which the center of the light incident portion 102a of the second camera 102 and the center of the semiconductor package 5a at the center shown in fig. 24(b) are present on the same axis extending in the Z-axis direction. If the light incident part 1 of the first camera 101 at this time is set01a is P in the X-axis direction2X, then P2X＝P1The equation for X + L1 holds.
At this time, the second image pickup device 41 of the second camera 102 picks up the image of the semiconductor package 5a held by the holding mechanism 21 from the Z-axis direction downward. The data of the image of the semiconductor package 5a captured by the second imaging element 41 is sent to the arithmetic mechanism 27. Thus, the calculation means 27 can calculate the positional displacement amount Δ X in the X-axis direction between the center of the light incident portion 102a of the second camera 102 and the center of the semiconductor package 5a from the image of the semiconductor package 5a captured by the second imaging element 411. Thus, the arithmetic means 27 can grasp the actual center position of the semiconductor package 5a (object to be conveyed).
Next, as shown in fig. 24(c), the arithmetic means 27 moves the first camera 101 from the temporary reference position to a position of a distance L2 in the X-axis direction. The distance L2 is, for example, a design distance from the temporary reference position to a design position in the X-axis direction in which the center of the light incident portion 101a of the first camera 101 and the center of the opening 23a shown in fig. 24(c) are present on the same axis extending in the Z-axis direction. If the position of the center of the light incident part 101a of the first camera 101 in the X-axis direction at this time is P3X, then P3X＝P1The equation for X + L2 holds.
At this time, the first imaging element 31 of the first camera 101 images the opening 23a, which is an example of the object to be conveyed, that is, an example of the conveyance target portion of the semiconductor package 5a, from above in the Z-axis direction. The data of the image of the opening 23a captured by the first image pickup device 31 is sent to the arithmetic mechanism 27. Therefore, the calculation means 27 can calculate the amount of positional displacement Δ X in the X-axis direction between the center of the light incident part 101a of the first camera 101 and the center of the opening 23a from the image of the opening 23a captured by the first imaging device 312. In this way, the arithmetic means 27 can grasp the actual center position of the opening 23a (the transport target site).
Next, as shown in fig. 24(d), the arithmetic mechanism 27 moves the semiconductor package 5a from the temporary reference position to a position separated by only the distance L3 in the X-axis direction by the holding mechanism 21 to which the first camera 101 is attached.
Here, the calculation means 27 calculates the distance L3, for example, as follows. By adding the distance L1 to the distance L2, the designed movement distance L3' in the X-axis direction from the semiconductor package 5a as the object to be conveyed to the opening 23a at the temporary reference position is calculated (L1 + L2), and the opening 23a becomes the conveyance target portion. The designed movement distance L3' is, for example, a designed movement distance from the temporary reference position to a designed position in the X-axis direction in which the center of the semiconductor package 5a at the center shown in fig. 24(b) and the center of the opening 23a shown in fig. 24(c) are on the same axis extending in the Z-axis direction.
Then, the relative positional deviation amount Δ X calculated as above is used0Position deviation amount DeltaX1And a position deviation amount DeltaX2The designed movement distance L3' is corrected by adding or dividing, respectively. Thus, the actual moving distance L3 in the X-axis direction from the opening 23a of the semiconductor package 5a as the object to be conveyed, which is the target site for conveyance, to the temporary reference position in the X-axis direction can be calculated. In other words, the moving distance for moving the semiconductor package 5a (object to be conveyed) imaged by the second camera 102 to the opening 23a as the conveyance target portion can be calculated.
By moving the semiconductor package 5a to a position separated from the provisional reference position in the X-axis direction by the actual movement distance L3 calculated as described above, it is possible to achieve more accurate position alignment of the semiconductor package 5a as the object to be conveyed with respect to the opening 23a as the conveyance target portion in the X-axis direction. By performing the same operation as in the X-axis direction in the Y-axis direction, more accurate position alignment of the semiconductor package 5a with respect to the opening 23a in the Y-axis direction can be achieved. After the alignment as described above, by actually placing the semiconductor package 5a in the opening 23a, the semiconductor package 5a can be placed at a more accurate position of the opening 23 a. Further, the semiconductor packages 5a and the openings of the semiconductor packages and the placement member held by the holding mechanism other than the openings 23a may be processed in the same manner, so that the corresponding semiconductor packages are mounted at accurate positions.
Then, as shown in fig. 1, the stage 22 is moved in the Y-axis direction, and the placement member 23 in a state where the semiconductor packages 5a are placed in the plurality of openings 23a is moved to the placement member loader 24. The placement member loader 24 moves along the rail 25 in the X-axis direction while holding the placement member 23, and loads the placement member 23 on which the semiconductor packages 5a are mounted in the placement member loading unit 26. The above is a correction of the moving distance of the object to the transport target site based on the designed moving distance, position, and the like, but the present invention is not limited to this, and for example, the moving distance of the object to the transport target site may be corrected based on values measured in advance by the first camera 101 and the second camera 102 (for example, a measured position where the center of the light incident portion 101a of the first camera 101 and the center of the light incident portion 102a of the second camera 102 are present on the same axis extending in the Z-axis direction, a distance from the center of the holding head 21a before holding the semiconductor package 5a to the opening 23a, a position and a distance calculated in the previous measurement, and the like).
As described above, in the electronic component manufacturing apparatus according to embodiment 1, the optical mark 37 formed optically is used for the alignment of the semiconductor package 5a and the opening 23 a. Therefore, in the electronic component manufacturing apparatus according to embodiment 1, it is not necessary to provide a movement space of a jig such as a correction mechanism such as a rod or a target in a conveyance path of the object to be conveyed in the apparatus, and therefore, it is possible to suppress an increase in size of the apparatus. Further, in the electronic component manufacturing apparatus according to embodiment 1, since it is not necessary to attach a jig including a rod and a target correcting mechanism to the apparatus, complication of the structure of the apparatus can be suppressed.
< embodiment 2 >
The electronic component manufacturing apparatus according to embodiment 2 is characterized by including a third camera 203 including a third imaging device 51 in addition to the first camera 201 including the first imaging device 31 and the second camera 202 including the second imaging device 41. An example of the operation of the conveying mechanism of the electronic component manufacturing apparatus according to embodiment 2 will be described below with reference to schematic plan views of fig. 25 to 29.
Fig. 25 shows a basic configuration of a conveyance mechanism of the electronic component manufacturing apparatus according to embodiment 2. In addition to the first camera 201, a third camera 203 is attached to the holding mechanism 21. The holding mechanism 21 is movable in the X-axis direction as a first direction. The holding mechanism 21 includes a holding head 21a, and the holding head 21a is configured to hold the semiconductor package 5 a.
The second camera 202 is movable in the Y-axis direction as the second direction. The second camera 202 can be located coaxially with the third camera 203 extending in the Z-axis direction, but cannot be located coaxially with the first camera 201 extending in the Z-axis direction due to limitations of the apparatus. The stage 22 is movable only in the Y-axis direction, and a non-optical mark 48 is provided on the surface 22a of the stage 22 on the side where the placement member 23 is placed.
In embodiment 2, first, similarly to the first camera 101 of embodiment 1, the arithmetic mechanism 27 moves the third camera 203 to the upper side of the Z-axis direction of the stage 22 to form the optical mark 37 on the surface 22a of the stage 22. Next, the arithmetic means 27 causes the third imaging device 51 of the third camera 203 to capture an image of the optical mark 37, thereby acquiring an image of the optical mark 37. Subsequently, the arithmetic means 27 transmits the data of the image of the optical marker 37 acquired by the third image pickup device 51 to the arithmetic means 27. Then, the calculation means 27 calculates a first amount of positional deviation, which is the amount of positional deviation between the third camera 203 and the optical marker 37, based on the image of the optical marker 37 acquired by the third imaging device 51.
Next, as shown in fig. 26, the arithmetic mechanism 27 moves the third camera 203 in the X-axis direction and moves the second camera 202 in the Y-axis direction so that the third camera 203 is positioned above the second camera 202 in the Z-axis direction. In this case, the distance of movement of the third camera 203 in the X-axis direction and the distance of movement of the second camera 202 in the Y-axis direction may be designed such that the center of the light incident portion of the third camera 203 and the center of the light incident portion of the second camera 202 are present on the same axis extending in the Z-axis direction, for example.
Next, similarly to the first camera 101 and the second camera 102 of embodiment 1, the arithmetic means 27 optically forms the optical marker 37 on the optical path between the third camera 203 and the second camera 202, and causes the second imaging device 41 of the second camera 202 to capture the image of the optical marker 37 from the Z-axis direction downward, thereby acquiring data of the image of the optical marker 37. Subsequently, the arithmetic means 27 transmits the data of the image of the optical marker 37 acquired by the second imaging device 41 to the arithmetic means 27. Then, the calculation means 27 calculates a second positional displacement amount, which is a positional displacement amount between the second camera 202 and the optical marker 37, based on the image of the optical marker 37 acquired by the second imaging device 41.
The calculation means 27 calculates the first positional displacement amount and the second positional displacement amount, and thereby can specify the position of the third camera 203 in the X-axis direction and the actual position of the second camera 202 in the Y-axis direction when the center of the light incident part of the third camera 203 and the center of the light incident part of the second camera 202 are present at the same axial position extending in the Z-axis direction.
Next, as shown in fig. 27, the arithmetic mechanism 27 moves the stage 22 in the Y-axis direction and moves the first camera 201 in the X-axis direction so that the first camera 201 is positioned above the non-optical marker 48 in the Z-axis direction, the non-optical marker 48 being provided on the surface 22a of the stage 22. In this case, the distance of movement of the stage 22 in the Y-axis direction and the distance of movement of the first camera 201 in the X-axis direction may be, for example, a distance in design such that the center of the light incident portion of the first camera 201 and the center of the non-optical mark 48 provided on the surface 22a of the stage 22 are present on the same axis extending in the Z-axis direction.
Next, the arithmetic means 27 captures an image of the non-optical mark 48 from above in the Z-axis direction by the first image pickup device 31 of the first camera 201, thereby acquiring an image of the non-optical mark 48. Subsequently, the arithmetic means 27 transmits the data of the image of the non-optical marker 48 acquired by the first image pickup device 31 to the arithmetic means 27. Then, the arithmetic means 27 calculates a third displacement amount of the first camera 201 and the non-optical marker 48 based on the image of the non-optical marker 48 acquired by the first image pickup device 31. In other words, the calculation unit 27 calculates the position of the first camera 201 in the X-axis direction and the actual position of the stage 22 in the Y-axis direction, which are positions where the center of the light incident part of the first camera 201 and the center of the non-optical mark 48 are present on the same axis extending in the Z-axis direction, in the X-axis direction of the first camera 201 and the actual position of the stage 22 in the Y-axis direction.
Next, as shown in fig. 28, the arithmetic mechanism 27 moves the stage 22 in the Y-axis direction and moves the third camera 203 in the X-axis direction so that the third camera 203 is positioned above the non-optical marker 48 in the Z-axis direction, the non-optical marker 48 being provided on the surface 22a of the stage 22. In this case, the distance of movement of the stage 22 in the Y-axis direction and the distance of movement of the third camera 203 in the X-axis direction may be, for example, a design distance in which the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48 are present on the same axis extending in the Z-axis direction.
Next, the arithmetic means 27 captures the image of the non-optical mark 48 from the Z-axis direction upward by the third imaging device 51 of the third camera 203, thereby acquiring the image of the non-optical mark 48. Subsequently, the arithmetic means 27 transmits the data of the image of the non-optical mark 48 acquired by the third image pickup device 51 to the arithmetic means 27. Then, the arithmetic means 27 calculates the fourth positional displacement amount of the third camera 203 and the non-optical marker 48 from the image of the non-optical marker 48 acquired by the third imaging device 51. In other words, the calculation means 27 calculates the position of the third camera 203 in the X-axis direction and the actual position of the table 22 in the Y-axis direction, which are positions where the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48 are present on the same axis extending in the Z-axis direction.
The calculation means 27 can calculate the relative positional relationship between the first camera 201 and the third camera 203 based on the third positional displacement amount and the fourth positional displacement amount calculated as described above. For example, by acquiring the difference between the position of the first camera 201 in the X-axis direction and the position of the stage 22 in the Y-axis direction, and the position of the third camera 203 in the X-axis direction and the position of the stage 22 in the Y-axis direction, the arithmetic means 27 can calculate the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident part of the first camera 201 and the center of the light incident part of the third camera 203, the position in the X-axis direction of the first camera 201 and the position in the Y-axis direction of the stage 22 are such that the center of the light incident part of the first camera 201 and the center of the non-optical mark 48 are present on the same axis extending in the Z-axis direction, the position of the third camera 203 in the X-axis direction and the position of the stage 22 in the Y-axis direction are positions where the center of the light incident portion of the third camera 203 and the center of the non-optical marker 48 are present on the same axis extending in the Z-axis direction.
Further, when the calculation means 27 can calculate the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident part of the first camera 201 and the center of the light incident part of the third camera 203, the relative positional displacement amounts in the X-axis direction and the Y-axis direction with respect to the designed position between the center of the light incident part of the first camera 201 and the center of the light incident part of the second camera 202 can be calculated, respectively. That is, in embodiment 2, the arithmetic mechanism 27 can perform the positional alignment of the first camera 201 and the second camera 202 by performing the positional alignment of the second camera 202 and the third camera 203.
As described above, the calculation means 27 calculates the amounts of relative positional deviation in the X-axis direction and the Y-axis direction between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202, and then corrects the designed movement distances in the X-axis direction and the Y-axis direction between the semiconductor package 5a as the object to be conveyed and the opening 23a as the conveyance target portion, using the amounts of relative positional deviation. Thus, also in embodiment 2, more accurate alignment of the semiconductor package 5a with respect to the opening 23a can be performed.
As shown in fig. 29, the second image pickup device 41 of the second camera 202 can photograph the holding head 21a of the holding mechanism 21 from the Z-axis direction downward. This means that the second image pickup device 41 of the second camera 202 can photograph the semiconductor package 5a held by the holding head 21a of the holding mechanism 21 from the Z-axis direction downward. The first image pickup device 31 of the first camera 201 is configured to be able to photograph the opening 23a, which is a conveyance target portion of the object, together with the photographing non-optical mark 48 from above in the Z-axis direction.
Therefore, also in embodiment 2, in addition to the relative positional shift amounts in the X-axis direction and the Y-axis direction between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202, respectively, the positional shift amounts in the X-axis direction and the Y-axis direction between the center of the light incident portion of the second camera 202 and the center of the semiconductor package 5a, and the positional shift amounts in the X-axis direction and the Y-axis direction between the center of the light incident portion of the first camera 201 and the opening 23a, respectively, can be taken into consideration to correct the designed movement distances from the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction, respectively.
The description of embodiment 2 other than the above is the same as embodiment 1, and therefore, the description thereof is omitted.
< embodiment 3 >
The electronic component manufacturing apparatus according to embodiment 3 is characterized by the following aspects: a first camera 301 is included, said first camera 301 being represented in a schematic partial perspective side view in fig. 30 and 31. The first camera 301 according to embodiment 3 includes a second light source 65 in addition to the first light source 32.
When the electronic component manufacturing apparatus according to embodiment 3 is in the state of fig. 30, light is emitted from the first light source 32, while no light is emitted from the second light source 65. At this time, the optical mark 37 is formed by the light emitted from the first light source 32. Fig. 32 is a schematic plan view showing an example of an image of the optical marker 37 captured by the first image pickup device 31 of the first camera 301 at this time.
When the electronic component manufacturing apparatus according to embodiment 3 is in the state of fig. 31, light is not emitted from the first light source 32, and light is emitted from the second light source 65. At this time, only the light emitted from the second light source 65 and transmitted through the half mirror 64 is irradiated to the surface, and therefore the optical mark 37 is not formed, and only the irradiated surface is brightly irradiated. Fig. 33 is a schematic plan view showing an example of an image of a surface captured by the first image pickup device 31 of the first camera 301 at this time. When the electronic component manufacturing apparatus according to embodiment 3 is in the state of fig. 33, imaging can be performed with a wider field of view than in the case where the optical mark 37 is formed. That is, the state of fig. 30 is set when the camera needs to be aligned, and the state of fig. 31 is set when the camera shoots an opening or the like, whereby the opening or the like can be shot with a wide field of view. That is, in embodiment 3, the electronic component manufacturing apparatus can be used according to the situation by performing the steps including the step of switching the light source 32 including the optical mark forming portion 33 and the second light source 65 not including the optical mark forming portion 33.
Further, the optical mark forming portion 33 is disposed in the adapter (adapter)62 and the position thereof is fixed, but as shown in a schematic side perspective view of fig. 34, for example, the position of the adapter 62 can be changed to, for example, the Z-axis direction upward by loosening a set screw (set screw)63 that fixes the adapter 62, and the optical mark forming portion 33 can be moved. Further, the set screw 61 fixes the first light source 32 to the adapter 62.
The first camera 301 of the electronic component manufacturing apparatus according to embodiment 3 having the above-described configuration can be applied to either the first camera 101 according to embodiment 1 or the first camera 201 according to embodiment 2.
The description of embodiment 3 other than the above is the same as that of embodiment 1 or embodiment 2, and therefore, the description thereof is omitted.
In embodiments 1 to 3, the electronic component manufacturing apparatus is not limited to this, and may be, for example, a cutting apparatus.
While the embodiments of the present invention have been described, the embodiments disclosed herein are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims, and all changes that come within the meaning and range of equivalents to the embodiments are intended to be embraced therein.

Claims (18)

1. A handling mechanism, comprising:
a holding mechanism configured to be movable while holding an object to be conveyed;
a light source;
an optical mark forming section capable of optically forming an optical mark in an optical path of light emitted from the light source;
a first camera including a first imaging element configured to be able to image the optical mark and a transport target portion of the transported object;
a second camera including a second imaging element configured to be capable of imaging the conveyed object and the optical mark, the conveyed object being held by the holding mechanism; and
and a calculation means configured to be able to correct the moving distance of the object to be conveyed to the conveyance target portion based on the amount of relative positional displacement between the first camera and the second camera.
2. Handling mechanism according to claim 1,
the calculation means may calculate the relative positional displacement amount based on a first positional displacement amount between the first camera and the optical mark, which is calculated based on the image of the optical mark captured by the first imaging device, and a second positional displacement amount between the second camera and the optical mark, which is calculated based on the image of the optical mark captured by the second imaging device.
3. The handling mechanism of claim 2, further comprising:
a surface configured to be capable of optically forming the optical mark; and is
The first image pickup device picks up an image of the optical mark optically formed on the surface by picking up the image of the optical mark.
4. Handling mechanism according to claim 1,
the calculation means may correct the moving distance based on at least one of a position displacement amount of the second camera from the object to be conveyed, which is calculated based on the image of the object to be conveyed captured by the second imaging device, and a position displacement amount of the first camera from the object to be conveyed, which is calculated based on the image of the object to be conveyed captured by the first imaging device.
5. Handling mechanism according to claim 1,
the optical mark forming portion is configured to be movable.
6. Handling mechanism according to claim 1,
the optical mark forming part includes:
a light shielding portion configured to shield the light; and
and a light transmission section configured to transmit the light.
7. Handling mechanism according to claim 1,
an optical system is also included in the optical path.
8. Handling mechanism according to claim 1,
further comprising:
a second light source not including the optical mark forming part; and is
Using the light source and the second light source switchingly.
9. A handling mechanism, comprising:
a holding mechanism configured to be movable while holding an object to be conveyed;
a light source;
an optical mark forming section capable of optically forming an optical mark in an optical path of light emitted from the light source;
a face provided with a non-optical mark;
a first camera including a first imaging element configured to be able to image a transport target portion of the transported object and the non-optical mark;
a second camera including a second imaging element configured to be capable of imaging the conveyed object and the optical mark, the conveyed object being held by the holding mechanism;
a third camera including a third image pickup device configured to be capable of picking up an image of the optical mark and the non-optical mark; and
and a calculation means configured to be able to correct the moving distance of the object to be conveyed to the conveyance target portion based on the amount of relative positional displacement between the first camera and the second camera.
10. Handling mechanism according to claim 9,
the arithmetic mechanism is:
a first relative positional displacement amount between the second camera and the third camera can be calculated based on a first positional displacement amount between the third camera and the optical mark and a second positional displacement amount between the second camera and the optical mark, the first positional displacement amount between the third camera and the optical mark being calculated based on data of the image of the optical mark captured by the third imaging element, the second positional displacement amount between the second camera and the optical mark being calculated based on the image of the optical mark captured by the second imaging element,
the distance between the first camera and the third camera in a first direction and the distance between the first camera and the third camera in a second direction different from the first direction can be calculated based on the image of the non-optical mark captured by the first image capture device and the image of the non-optical mark captured by the third image capture device.
11. Handling mechanism according to claim 9,
the calculation means may correct the moving distance based on at least one of a position displacement amount of the second camera from the object to be conveyed, which is calculated based on the image of the object to be conveyed captured by the second imaging device, and a position displacement amount of the first camera from the object to be conveyed, which is calculated based on the image of the object to be conveyed captured by the first imaging device.
12. Handling mechanism according to claim 9,
the optical mark forming portion is configured to be movable.
13. Handling mechanism according to claim 9,
the optical mark forming part includes:
a light shielding portion configured to shield the light; and
and a light transmission section configured to transmit the light.
14. Handling mechanism according to claim 9,
an optical system is also included in the optical path.
15. Handling mechanism according to claim 9,
further comprising:
a second light source not including the optical mark forming part; and is
Using the light source and the second light source switchingly.
16. An electronic component manufacturing apparatus, comprising:
the handling mechanism of any of claims 1 to 15.
17. A method of manufacturing an electronic component, comprising the steps of:
a step of holding the conveyed object by a holding mechanism;
a step of optically forming an optical mark;
a step of photographing the optical mark with a first image pickup element of a first camera;
a step of photographing the optical mark with a second image pickup element of a second camera;
a step of imaging the object to be conveyed held by the holding mechanism by using the second imaging element;
a step of imaging a transport target portion of the transported object by using the first imaging element;
calculating a relative positional displacement amount between the first camera and the second camera;
correcting a moving distance of the object to be conveyed to the conveyance target portion based on the relative positional displacement amount; and
and a step of placing the object to be transported on the transport target portion.
18. A method of manufacturing an electronic component, comprising the steps of:
a step of holding the conveyed object by a holding mechanism;
a step of optically forming an optical mark;
a step of photographing a non-optical mark by using a first image pickup element of a first camera;
a step of photographing the optical mark with a second image pickup element of a second camera;
a step of imaging the non-optical mark by a third imaging element of a third camera attached to the holding mechanism;
a step of imaging the object to be conveyed held by the holding mechanism by using the second imaging element;
a step of imaging a transport target portion of the transported object by using the first imaging element;
calculating a relative positional displacement amount between the first camera and the second camera;
correcting a moving distance of the object to be conveyed to the conveyance target portion based on the relative positional displacement amount; and
and a step of placing the object to be transported on the transport target portion.
CN201910625588.2A 2018-07-23 2019-07-11 Conveying mechanism, electronic component manufacturing apparatus, and electronic component manufacturing method Active CN110752176B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018137520A JP6968762B2 (en) 2018-07-23 2018-07-23 Transport mechanism, electronic component manufacturing equipment, transport method and electronic component manufacturing method
JP2018-137520 2018-07-23

Publications (2)

Publication Number Publication Date
CN110752176A true CN110752176A (en) 2020-02-04
CN110752176B CN110752176B (en) 2023-09-29

Family

ID=69275780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910625588.2A Active CN110752176B (en) 2018-07-23 2019-07-11 Conveying mechanism, electronic component manufacturing apparatus, and electronic component manufacturing method

Country Status (4)

Country Link
JP (1) JP6968762B2 (en)
KR (1) KR20200011004A (en)
CN (1) CN110752176B (en)
TW (1) TWI702682B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023013000A (en) * 2021-07-15 2023-01-26 Ｔｏｗａ株式会社 Processing device and method for manufacturing processed product
JP2023039754A (en) * 2021-09-09 2023-03-22 Ｔｏｗａ株式会社 Maintenance method, and method for manufacturing electronic component
JP2023039753A (en) * 2021-09-09 2023-03-22 Ｔｏｗａ株式会社 Calibration method, and method for manufacturing electronic component
CN113921426B (en) * 2021-10-08 2022-08-30 江苏联康测控有限公司 Novel radio frequency chip packaging equipment

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878479A (en) * 1994-08-31 1996-03-22 Toshiba Corp Outer lead bonding machine and bonding method
JPH098104A (en) * 1995-06-21 1997-01-10 Toray Eng Co Ltd Calibrating method in chip bonding device
WO1999017599A1 (en) * 1997-09-30 1999-04-08 Siemens Aktiengesellschaft Method and device for recognizing the position of connections and/or edges of components
JP2003258497A (en) * 2002-03-01 2003-09-12 Yamaha Motor Co Ltd Member mounting unit
CN1489433A (en) * 2002-08-30 2004-04-14 ������������ʽ���� Element mounting method and its element mounting device
JP2006310480A (en) * 2005-04-27 2006-11-09 Toshiba Corp Apparatus and method for processing semiconductor device
JP2011023424A (en) * 2009-07-13 2011-02-03 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
JP2011061245A (en) * 2010-12-24 2011-03-24 Sony Corp Position adjusting device and position adjusting method
JP2011165865A (en) * 2010-02-09 2011-08-25 Yamaha Motor Co Ltd Component-mounting apparatus and component-mounting method
JP2013125866A (en) * 2011-12-14 2013-06-24 Alpha- Design Kk Component mounting method, device and program
US20160161553A1 (en) * 2014-12-05 2016-06-09 Tokyo Electron Limited Probe apparatus and probe method
CN106663636A (en) * 2014-05-07 2017-05-10 株式会社新川 Bonding apparatus and bonding method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780000B2 (en) * 1993-06-16 1998-07-23 澁谷工業株式会社 Semiconductor alignment equipment
KR101484348B1 (en) * 2007-08-10 2015-01-19 가부시키가이샤 니콘 Substrate bonding apparatus and substrate bonding method
TWI478272B (en) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
JP5342210B2 (en) * 2008-10-30 2013-11-13 三菱重工業株式会社 Alignment apparatus control apparatus and alignment method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878479A (en) * 1994-08-31 1996-03-22 Toshiba Corp Outer lead bonding machine and bonding method
JPH098104A (en) * 1995-06-21 1997-01-10 Toray Eng Co Ltd Calibrating method in chip bonding device
WO1999017599A1 (en) * 1997-09-30 1999-04-08 Siemens Aktiengesellschaft Method and device for recognizing the position of connections and/or edges of components
JP2003258497A (en) * 2002-03-01 2003-09-12 Yamaha Motor Co Ltd Member mounting unit
CN1489433A (en) * 2002-08-30 2004-04-14 ������������ʽ���� Element mounting method and its element mounting device
JP2006310480A (en) * 2005-04-27 2006-11-09 Toshiba Corp Apparatus and method for processing semiconductor device
JP2011023424A (en) * 2009-07-13 2011-02-03 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
JP2011165865A (en) * 2010-02-09 2011-08-25 Yamaha Motor Co Ltd Component-mounting apparatus and component-mounting method
JP2011061245A (en) * 2010-12-24 2011-03-24 Sony Corp Position adjusting device and position adjusting method
JP2013125866A (en) * 2011-12-14 2013-06-24 Alpha- Design Kk Component mounting method, device and program
CN106663636A (en) * 2014-05-07 2017-05-10 株式会社新川 Bonding apparatus and bonding method
US20160161553A1 (en) * 2014-12-05 2016-06-09 Tokyo Electron Limited Probe apparatus and probe method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王云峰: "IGBT全自动封装机工艺方法研究" *

Also Published As

Publication number Publication date
CN110752176B (en) 2023-09-29
KR20200011004A (en) 2020-01-31
TWI702682B (en) 2020-08-21
TW202008494A (en) 2020-02-16
JP2020017559A (en) 2020-01-30
JP6968762B2 (en) 2021-11-17

Similar Documents

Publication Publication Date Title
CN110752176B (en) Conveying mechanism, electronic component manufacturing apparatus, and electronic component manufacturing method
KR101506519B1 (en) Component mounting apparatus
JP5385794B2 (en) Chip mounting method and chip mounting apparatus
CN109906029B (en) Electronic component mounting device and electronic component mounting method
KR101605587B1 (en) Die bonder, bond head device thereof and method of adjusting collet position
JP6378053B2 (en) Component mounting machine and component mounting head
TWI516759B (en) Method of inspecting printed circuit board for semiconductor package
JP2012248728A (en) Die bonder and bonding method
KR101237056B1 (en) Method for Aligning Semiconductor Package Aggregate
CN112710675A (en) Electronic component handling apparatus
JP4999502B2 (en) Component transfer device and surface mounter
JP5975668B2 (en) Work conveying device, work conveying method, and method of manufacturing assembly parts
JP2017191888A (en) Component mounting machine and component mounting head
CN111725086B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
JP4421281B2 (en) Component recognition method, component recognition device, surface mounter, component test device, and board inspection device
CN212218482U (en) Mechanical arm calibration device of wafer transfer mechanism
CN112218517B (en) Mounting device
JP2001156498A (en) Method of detecting brought-back electronic component in surface-mounting machine
JP3815637B2 (en) Component mounting device
TWI841852B (en) Mounting device and mounting method
JP4260606B2 (en) Article recognition method, parts transfer method, article recognition apparatus, surface mounter equipped with the article recognition apparatus, parts testing apparatus, dispenser, mounting board inspection apparatus, and printed board inspection apparatus
JP3778676B2 (en) Component mounting device
WO2022185875A1 (en) Collet detection device, collet position correction device, bonding device, collet detection method, and collet position correction method
TWI729520B (en) Electronic assembly detecting system
TWI632838B (en) Pick-and-place soldering system for dual chip modules and method for assembling dual chip modules

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant