CN114543571B - Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer - Google Patents
Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer Download PDFInfo
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- CN114543571B CN114543571B CN202210167812.XA CN202210167812A CN114543571B CN 114543571 B CN114543571 B CN 114543571B CN 202210167812 A CN202210167812 A CN 202210167812A CN 114543571 B CN114543571 B CN 114543571B
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- 238000009835 boiling Methods 0.000 title claims abstract description 89
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 238000002309 gasification Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 5
- 238000010329 laser etching Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 abstract description 16
- 230000008020 evaporation Effects 0.000 abstract description 16
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000000926 separation method Methods 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 5
- 230000003111 delayed effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000006911 nucleation Effects 0.000 description 4
- 238000010899 nucleation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, and relates to the technical field of enhancing boiling heat transfer. The invention relates to an evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, which comprises a heating substrate and a plurality of heat conduction microcolumns arranged on the substrate, wherein the upper ends of the heat conduction microcolumns are combined with a porous capillary core to form a composite structure, small bubbles evaporated and discharged by the porous capillary core are utilized to increase the gasification core of a boiling region at the bottom of the composite structure, so that the boiling starting point is reduced, the flow field disturbance is enhanced, the boiling heat transfer of a liquid region at the bottom is enhanced, and the increase of the heat transfer area in the longitudinal direction is realized. The lower surface of the porous capillary core is provided with the bulges, so that small bubbles are easier to separate from an overheated fluid working medium area entering the bottom, stable separation of the bubbles is quickened, the occurrence of a gas film formed by directly boiling in the area between the heating surface and the lower surface of the capillary core is delayed, and the phase change heat transfer is cooperatively enhanced by porous evaporation and boiling.
Description
Technical Field
The invention relates to the technical field of enhanced boiling heat transfer, in particular to an evaporation-boiling longitudinal coexistence composite structure for enhanced boiling heat transfer.
Background
Because of the miniaturization and high integration development characteristics of microelectronic devices, high requirements are also put on efficient heat dissipation modes. At present, boiling heat transfer is used as a high-efficiency energy transfer mode accompanied by gas-liquid phase change, has the characteristics of small heat transfer temperature difference, large heat flow density and the like, and becomes an important technical means for solving the problem.
Currently, a great deal of research shows that the porous medium has higher specific surface area and stronger capillary suction capacity, and when the porous medium is directly applied to boiling heat transfer, the pore structure in the porous medium can not only expand the heat transfer area, but also provide a great deal of nucleation cavities for boiling, thereby being a common enhanced boiling heat transfer surface. Heat transfer is generally enhanced by direct boiling in the interior of a thin porous structure of large pore size, whereas surface evaporation heat transfer occurs mainly with a thick porous structure of small pore size. Therefore, when the prepared porous capillary wick is used for evaporation heat transfer and combined with boiling heat transfer existing outside to form a new composite heat transfer structure, the boiling heat transfer process is expected to be further enhanced. Related patent schemes for enhancing boiling heat transfer structures are disclosed in the prior art, for example, patent publication nos.: CN110842202a, 28 days of publication 2020, 02, the invention is named: a free particle/porous medium composite reinforced boiling structure and a preparation method thereof are disclosed, the application discloses a free particle/porous medium composite reinforced boiling structure and a preparation method thereof, a plurality of cavities are distributed in a porous matrix structure, and movable free particles are dispersed in the cavities. The application is characterized in that bubbles are nucleated and supplied to liquid are partitioned to prevent the bubbles from being combined and reduce the reflux resistance of the liquid based on the characteristic that the nucleation points are activated in the boiling heat transfer process and the liquid is supplied to the nucleation points by the liquid suction cores; and meanwhile, the heat conduction, microlayer evaporation and convection heat transfer in the working fluid are enhanced by utilizing the collision of free particles in the boiling process, so that bubbles are easy to nucleate, the growth rate is high, and the separation frequency is high, thereby realizing the enhanced boiling heat transfer. However, there is also a need for improvement in this application where the porous structure and channels together occupy the heating surface, sacrificing a portion of the phase change heat transfer area while enhancing heat transfer.
In summary, how to increase the heat transfer area in a limited space in the process of enhancing boiling heat transfer by using the porous medium, so as to realize continuous boiling heat transfer and ensure the rapid growth and detachment of nucleation bubbles is a place to be improved in the prior art.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention aims to provide an evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, wherein a heating substrate guides heat into a porous capillary core through a heat conduction microcolumn, and small bubbles discharged by evaporation of the porous capillary core are utilized to increase a gasification core of a boiling region at the bottom of the heating substrate, so that a boiling starting point is reduced, flow field disturbance is enhanced, and boiling heat transfer of a liquid region at the bottom is enhanced; in addition, the heat transfer area is increased longitudinally, and the reduction of the input heat flow density caused by the direct expansion of the heating area is avoided.
2. Technical proposal
In order to achieve the above purpose, the technical scheme provided by the invention is as follows:
The evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer comprises a horizontally arranged heating substrate, wherein a porous capillary core is fixedly arranged on the upper surface of the heating substrate through vertically arranged heat conduction microcolumns, and an overheated fluid working medium area is formed between the vertically arranged heat conduction microcolumns; the contact part of the lower part of the porous capillary core and the heat conduction microcolumn forms a gasification core, boiling of a superheated fluid working medium area existing between the heating substrate and the porous capillary core is more sufficient, and small bubbles discharged by evaporation of the porous capillary core are increased, so that the gasification core of a boiling area at the bottom of the porous capillary core is increased, the boiling starting point is reduced, flow field disturbance is enhanced, and boiling heat transfer of a liquid area at the bottom is enhanced; under the heating of the overheat fluid working medium, the overheat fluid working medium is converted into boiling heat transfer, and small bubbles grow to a certain size so as to form bubbles, and the bubbles are separated from the bottom of the porous capillary core along the separation direction of the bubbles. The heating substrate guides heat into the porous capillary core through the heat conduction microcolumns, so that the heat transfer area is increased longitudinally, and the reduction of the input heat flow density caused by direct heating area expansion is avoided.
According to the technical scheme, the lower part of the porous capillary core is provided with the bulge, the bulge and the heat conduction microcolumn contact area form the gasification core, and as the lower surface of the porous capillary core is in a bulge shape, the gasification core continuously grows into bubbles along with the evaporation process, and then the bubbles are easier to separate from the lower surface of the porous capillary core, boiling heat transfer is carried out in a superheated fluid working medium area, and the coexistence of longitudinal boiling evaporation is realized.
According to a further technical scheme, the shape of the axial section of the heat conduction micro-column is cylindrical, rectangular, square, trapezoid, diamond, water drop or oval, so that the shape of the heat conduction micro-column is correspondingly changed according to the structure and the size of heat dissipation required, and different occasions are met.
According to a further technical scheme, the heat conduction microcolumn is made of high heat conduction materials, and copper, aluminum or gold and the like are selected.
According to a further technical scheme, the porous capillary core is made of a low-heat-conductivity material, and the heat conductivity coefficient is not higher than 10W/(m.K).
According to the further technical scheme, the lower surface of the heat conduction micro-column is adhered to the heating substrate, and then the heat conduction micro-column is vertically formed on the upper surface of the heating substrate through a deep picosecond laser etching method.
According to the technical scheme, the upper surface of the heat conduction microcolumn is connected with the lower surface of the porous capillary core through a sintering method to form a composite structure, the composite structure forms a stable gas-liquid channel through porous suction liquid supply of the porous capillary core and gaps of the heat conduction microcolumn, so that bubbles are accelerated to be separated stably along the separation direction of the bubbles, the occurrence of a gas film formed by direct boiling of a region between a heating surface and the lower surface of the porous capillary core is delayed, the cooperative enhanced phase change heat transfer of porous evaporation-boiling is realized, the composite structure is simple to manufacture, wide in applicability and low in production cost, the requirements under different boiling heat transfer conditions can be met, the heat transfer area of the whole structure is expanded in a limited space, and the heat transfer performance and critical heat flow density are improved.
According to a further technical scheme, the composite structure is characterized in that a plurality of groups are vertically arranged on the upper surface of the heating substrate.
According to a further technical scheme, the heat conduction micropillars are uniformly distributed on the surface of the heating substrate at intervals in an array mode.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
(1) According to the evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, heat is transferred to the capillary core through the heat conduction microcolumns by the heating substrate, steam is generated by heating and evaporation of the lower surface of the porous capillary core, small bubbles formed by the steam discharging porous provide a gasification core capable of enhancing boiling heat transfer for a superheated fluid working medium between the lower surface of the porous capillary core and the heating substrate, and meanwhile, disturbance on a bottom flow field is enhanced by the discharged small bubbles, so that boiling heat exchange effect is further enhanced;
(2) According to the evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, the lower surface of the porous capillary core is convex, so that small bubbles generated by a gasification core generated by evaporation on the lower surface of the porous capillary core are more easily separated from an overheated fluid working medium area at the bottom, boiling in the overheated fluid working medium area is further realized, boiling evaporation longitudinally coexist, the heat transfer area is expanded in a limited space by the integral structure, and the heat transfer performance and critical heat flow density are improved;
(3) The invention relates to an evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, wherein the axial section shape of a heat conduction microcolumn is cylindrical or rectangular or square or trapezoidal or diamond or drop-shaped or oval, so that the shape of the heat conduction microcolumn is correspondingly changed according to the structure and the size of heat dissipation required, thereby meeting different occasions;
(4) The evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer is characterized in that the upper surface of the heat conduction microcolumn is connected with the lower surface of the porous capillary core through a sintering method to form a composite structure, channels formed among composite structure units are combined with the porous capillary core to suck working media, so that a stable gas-liquid flow channel is formed in the boiling heat transfer process, the improvement of phase change heat transfer performance is facilitated, and the composite structure is simple to manufacture, wide in applicability and low in production cost, and can meet the requirements under different boiling heat transfer conditions.
Drawings
FIG. 1 is a schematic structural view of an evaporation boiling longitudinal coexistence composite structure according to the present invention;
FIG. 2 is a longitudinal cross-sectional view of the vapor boiling longitudinal coexistence composite structure according to the present invention;
fig. 3 is a top view of the evaporative boiling longitudinal coexistence composite structure according to the present invention.
In the figure: 1-heating a substrate; 2-a thermally conductive microcolumn; 3-a porous capillary wick; 4-an overheated fluid working fluid zone; 5-gasification core; 6-bubbling; 7-bubble detachment direction; 31-bump.
Detailed Description
For a further understanding of the present invention, the invention is described in detail with reference to the drawings.
Example 1
The evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer is shown in fig. 2, and comprises a heating substrate 1 arranged horizontally, wherein a porous capillary core 3 is fixedly arranged on the upper surface of the heating substrate 1 through a heat conduction microcolumn 2 arranged vertically, a protrusion 31 is arranged on the lower surface of the porous capillary core 3, an overheated fluid working medium region 4 exists between the heating substrate 1 and the porous capillary core 3, the upper surface of the heat conduction microcolumn 2 is connected with the lower surface of the porous capillary core 3 through a sintering method, so that a composite structure is formed, and channels are formed between the composite structures.
The heat conduction microcolumn 2 in the composite structure is made of high heat conduction coefficient materials, copper, aluminum or gold and the like are selected, and the axial section shape of the heat conduction microcolumn 2 can be selected from cylindrical shape, rectangular shape, square shape, trapezoid shape, diamond shape, water drop shape or oval shape; the porous capillary core 3 is selected from capillary cores with low heat conductivity, the heat conductivity coefficient is not higher than 10W/(m.K), the lower surface of the porous capillary core 3 is convex, and the porous capillary core is prepared by a die sintering method; the heat conduction microcolumn 2 is formed by bonding a high heat conduction material with the substrate 1 and constructing a microcolumn structure of the high heat conduction material on the surface of the substrate 1 by a deep picosecond laser etching method.
Further, as shown in fig. 3, the composite structure is vertically provided with a plurality of groups on the upper surface of the heating substrate 1.
Further, the heat conducting micropillars 2 are uniformly distributed at intervals in an array on the surface of the heating substrate 1.
In this embodiment, as shown in fig. 1, when the heating substrate 1 is heated, the whole fluid working medium area 5 is heated, the heat conduction microcolumn 2 transfers heat to the porous capillary core 3, the heat is mainly evaporated on the lower surface of the porous capillary core 3 to form steam, and as the evaporation process proceeds, the steam generated by the porous capillary core 3 is discharged to form small bubbles to serve as the gasification core 5 of the bottom superheated fluid, so as to reduce the boiling starting point, strengthen the flow field disturbance, and strengthen the boiling heat transfer of the bottom liquid area; under the heating of the overheated fluid working medium, the overheated fluid working medium is converted into boiling heat transfer, and small bubbles grow to a certain size so as to form bubbles 6, and are separated from the bottom of the porous capillary core 3 along the bubble separation direction 7. The small bubbles then continue to grow in the superheated fluid working substance region 4 and then exit the channels between the composite structures. The mechanism of the composite structure for enhancing boiling heat transfer is that heat transferred by the heating substrate 1 can reach the porous capillary core 3 through the heat conduction microcolumn 2 due to the heat transfer boundary provided by the heat conduction microcolumn 2 with high heat conductivity and the porous capillary core 3, and capillary evaporation phenomenon can only be generated on the lower surface of the porous capillary core 3 contacted with the heat conduction microcolumn 2 because the porous capillary core 3 has lower heat conductivity and larger thickness, so that a gasification core 5 is provided for boiling heat transfer, the superheat degree of a superheated fluid working medium region 4 is reduced, and the boiling heat transfer effect is enhanced.
Meanwhile, the heating substrate 1 guides heat into the porous capillary core 3 through the heat conduction microcolumn 2, so that the heat transfer area is increased longitudinally, and the reduction of the input heat flow density caused by direct heating area expansion is avoided. As the lower surface of the porous capillary core 3 is provided with the bulges 31, the gasification core 5 is continuously grown along with the evaporation process, and then is separated from the lower surface of the porous capillary core 3, boiling heat transfer is carried out in the overheated fluid working medium area 4, and the coexistence of longitudinal boiling evaporation is realized; through the suction effect of the porous capillary core 3, the disturbance of the surrounding flow field is enhanced, so that bubbles in the overheated fluid working medium area 5 can be timely discharged from a channel between the composite structures, and an air film can not appear between the heating substrate 1 and the porous capillary core 3 to fill the bubbles, so that the phenomenon of heat transfer deterioration is avoided, the timely separation of the bubbles also accelerates the circulating flow of the surrounding working medium, and the integral boiling heat transfer effect is enhanced.
The invention and its embodiments have been described above by way of illustration and not limitation, and the invention is illustrated in the accompanying drawings and described in the drawings in which the actual structure is not limited thereto. Therefore, if one of ordinary skill in the art is informed by this disclosure, the structural mode and the embodiments similar to the technical scheme are not creatively designed without departing from the gist of the present invention.
Claims (6)
1. An evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer, which is characterized in that: the device comprises a heating substrate (1) which is horizontally arranged, wherein a porous capillary core (3) is fixedly arranged on the upper surface of the heating substrate (1) through heat conduction microcolumns (2) which are vertically arranged, and an overheated fluid working medium region (4) is formed between the heat conduction microcolumns (2) which are vertically arranged; the lower part of the porous capillary core (3) and the contact part of the heat conduction microcolumn (2) form a gasification core (5); the lower part of the porous capillary core (3) is provided with a bulge (31), and a gasification core (5) is formed in a contact area of the bulge (31) and the heat conduction microcolumn (2); the heat conduction microcolumn (2) is made of high heat conduction material; the porous capillary core (3) is made of a low heat conductivity material, and the heat conductivity coefficient is not higher than 10W/(m.K).
2. An evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer according to claim 1, wherein: the heat conduction microcolumn (2) is cylindrical, rectangular, square, trapezoid, rhombus, water drop or oval in axial section.
3. An evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer according to claim 1, wherein: the lower surface of the heat conduction microcolumn (2) is adhered to the heating substrate (1), and then the heat conduction microcolumn (2) is vertically formed on the upper surface of the heating substrate (1) through a deep picosecond laser etching method.
4. A vapor-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer according to any of claims 1 to 3, wherein: the upper surface of the heat conduction microcolumn (2) is connected with the lower surface of the porous capillary core (3) through a sintering method to form a composite structure.
5. An evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer according to claim 4, wherein: the composite structure is characterized in that a plurality of groups of the composite structure are vertically arranged on the upper surface of the heating substrate (1).
6. An evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer according to claim 5, wherein: the heat conduction microcolumns (2) are uniformly distributed on the surface of the heating substrate (1) at intervals in an array mode.
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|---|---|---|---|---|
| CN103200803A (en) * | 2013-03-20 | 2013-07-10 | 西安交通大学 | Loop heat pipe cooling device with pool boiling function |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN110542337A (en) * | 2019-08-29 | 2019-12-06 | 华北电力大学 | 3D printing porous capillary core ultrathin flat heat pipe and printing method |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN114023710A (en) * | 2021-12-03 | 2022-02-08 | 安徽工业大学 | Composite micro-column-porous surface structure for enhancing boiling heat transfer |
-
2022
- 2022-02-23 CN CN202210167812.XA patent/CN114543571B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200803A (en) * | 2013-03-20 | 2013-07-10 | 西安交通大学 | Loop heat pipe cooling device with pool boiling function |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN110542337A (en) * | 2019-08-29 | 2019-12-06 | 华北电力大学 | 3D printing porous capillary core ultrathin flat heat pipe and printing method |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN114023710A (en) * | 2021-12-03 | 2022-02-08 | 安徽工业大学 | Composite micro-column-porous surface structure for enhancing boiling heat transfer |
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