CN114543571A - Evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer - Google Patents
Evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer Download PDFInfo
- Publication number
- CN114543571A CN114543571A CN202210167812.XA CN202210167812A CN114543571A CN 114543571 A CN114543571 A CN 114543571A CN 202210167812 A CN202210167812 A CN 202210167812A CN 114543571 A CN114543571 A CN 114543571A
- Authority
- CN
- China
- Prior art keywords
- boiling
- heat transfer
- composite structure
- evaporation
- longitudinal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009835 boiling Methods 0.000 title claims abstract description 93
- 238000012546 transfer Methods 0.000 title claims abstract description 75
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 238000002309 gasification Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 5
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 abstract description 12
- 230000008020 evaporation Effects 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000000926 separation method Methods 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 5
- 230000003111 delayed effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000006911 nucleation Effects 0.000 description 5
- 238000010899 nucleation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, and relates to the technical field of enhanced boiling heat transfer. The invention relates to an evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, which comprises a heating substrate and a plurality of heat conduction micro-columns arranged on the substrate, wherein the upper ends of the heat conduction micro-columns are combined with a porous capillary wick to form a composite structure, and small bubbles evaporated and discharged by the porous capillary wick are utilized to increase the gasification core of a bottom boiling area, so that the boiling starting point is reduced, the flow field disturbance is enhanced, the boiling heat transfer of a bottom liquid area is enhanced, and in addition, the increase of the heat transfer area in the longitudinal direction is realized. The lower surface of the porous capillary core is provided with the bulge, so that small bubbles can be separated from a superheated fluid working medium region at the bottom more easily, the stable separation of the bubbles is accelerated, the phenomenon that the region between the heating surface and the lower surface of the capillary core is directly boiled to form an air film is delayed, and the phase change heat transfer is enhanced by the cooperation of porous evaporation and boiling.
Description
Technical Field
The invention relates to the technical field of enhanced boiling heat transfer, in particular to an evaporation-boiling longitudinal coexisting composite structure for enhanced boiling heat transfer.
Background
Due to the development characteristics of miniaturization and high integration of microelectronic devices, the microelectronic devices also put higher requirements on efficient heat dissipation modes. At present, boiling heat transfer is used as an efficient energy transfer mode along with gas-liquid phase change, has the characteristics of small heat transfer temperature difference, large heat flow density and the like, and becomes an important technical means for solving the problem.
At present, a great deal of research shows that the porous medium has a higher specific surface area and a stronger capillary suction capacity, and when the porous medium is directly applied to boiling heat transfer, a pore structure in a porous structure can not only expand the heat transfer area, but also provide a great amount of nucleation holes for boiling, and the porous medium is a common enhanced boiling heat transfer surface. Heat transfer is typically enhanced by direct boiling within a thin porous structure of large pore size, while evaporative heat transfer from the surface occurs primarily with a thick porous structure of small pore size. Therefore, when the prepared porous capillary wick is used for carrying out evaporation heat transfer and is combined with boiling heat transfer existing outside to form a new composite heat transfer structure, the boiling heat transfer process is expected to be further enhanced. There are related patent proposals for enhanced boiling heat transfer structures, such as patent publications nos.: CN110842202A, published 2020, 02, 28, the name of the invention creation is: the application discloses a free particle/porous medium composite reinforced boiling structure and a preparation method thereof, wherein a plurality of cavities are distributed in a porous matrix structure, and free particles capable of moving are dispersed in the cavities. The application divides bubble nucleation and liquid supply into zones to prevent bubble combination and reduce liquid reflux resistance based on the activation of nucleation points and the enhancement of liquid supply from a liquid suction core to the nucleation points in the boiling heat transfer process; meanwhile, the collision of free particles in the boiling process is utilized to strengthen heat conduction, micro-layer evaporation and convection heat transfer in the working fluid, so that bubbles are easy to nucleate, the growth rate is high, the separation frequency is high, and the strengthened boiling heat transfer is realized. However, there is a need for improvement in this application, in which the porous structure and the channels together occupy the heating surface, and a part of the phase change heat transfer area is sacrificed while enhancing heat transfer.
In summary, how to increase the heat transfer area in a limited space by using a porous medium in the process of enhancing boiling heat transfer, and to achieve continuous boiling heat transfer, and to ensure the rapid growth and detachment of nucleation bubbles, is a problem that needs to be improved in the prior art.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention aims to provide an evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer.A heating substrate introduces heat into a porous capillary core through a heat conduction micro-column, and increases a gasification core of a bottom boiling region of the porous capillary core by using small bubbles evaporated and discharged by the porous capillary core, so that a boiling starting point is reduced, flow field disturbance is enhanced, and boiling heat transfer of a liquid region at the bottom is enhanced; in addition, the heat transfer area is increased in the longitudinal direction, and the reduction of the input heat flow density caused by the direct heating area expansion is avoided.
2. Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer comprises a heating substrate which is horizontally arranged, wherein a porous capillary core is fixedly arranged on the upper surface of the heating substrate through vertically arranged heat-conducting micro-columns, and an overheated fluid working medium region is formed between the vertically arranged heat-conducting micro-columns; the contact part of the lower part of the porous capillary wick and the heat-conducting micro-column forms a gasification core, the boiling of an overheated fluid working medium area existing between the heating substrate and the porous capillary wick is more sufficient, and small bubbles discharged by the porous capillary wick through evaporation are increased, so that the gasification core of the boiling area at the bottom of the porous capillary wick is increased, the boiling starting point is reduced, the flow field disturbance is enhanced, and the boiling heat transfer of a liquid area at the bottom is enhanced; under the heating of the superheated fluid working medium, the heat is converted into boiling heat transfer, small bubbles grow to a certain size to form bubbles, and the bubbles are separated from the bottom of the porous capillary core along the bubble separation direction. The heating substrate guides heat into the porous capillary core through the heat conduction micro-column, so that the heat transfer area is increased in the longitudinal direction, and the reduction of the input heat flow density caused by the direct heating area expansion is avoided.
According to the further technical scheme, the lower portion of the porous capillary core is provided with the protrusion, the contact area of the protrusion and the heat conduction micro-column forms the gasification core, the lower surface of the porous capillary core is in the protrusion shape, the gasification core continuously grows into bubbles along with the evaporation process, then the gasification core can be separated from the lower surface of the porous capillary core more easily, boiling heat transfer is carried out in the superheated fluid working medium area, and the situation of coexistence of longitudinal boiling evaporation is achieved.
According to a further technical scheme, the axial section of the heat-conducting micro-column is cylindrical, rectangular, square, trapezoid, rhombus, drop-shaped or oval, so that the shape of the heat-conducting micro-column is correspondingly changed according to the structure and size of heat dissipation required, and different occasions are met.
In a further technical scheme, the heat conduction micro-column is made of high heat conduction materials, and copper, aluminum or gold and the like are selected.
According to a further technical scheme, the porous capillary core is a low-thermal-conductivity material, and the thermal conductivity coefficient is not higher than 10W/(m.K).
According to the further technical scheme, the lower surface of the heat conduction micro-column is bonded with the heating substrate, and then the heat conduction micro-column is vertically formed on the upper surface of the heating substrate through a deep picosecond laser etching method.
According to the further technical scheme, the upper surface of the heat conduction micro-column is connected with the lower surface of the porous capillary core through a sintering method to form a composite structure, the composite structure forms a stable gas-liquid channel through porous suction liquid supply of the porous capillary core and gaps of the heat conduction micro-column, so that stable separation of bubbles along the bubble separation direction is accelerated, the occurrence of gas films formed by direct boiling in the area between the heating surface and the lower surface of the porous capillary core is delayed, the porous evaporation-boiling synergistic enhanced phase change heat transfer is realized, the composite structure is simple to manufacture, wide in applicability and low in production cost, the requirements under different boiling heat transfer conditions can be met, the heat transfer area of the integral structure is expanded in a limited space, and the heat transfer performance and the critical heat flux density are improved.
According to a further technical scheme, the composite structure is vertically provided with a plurality of groups on the upper surface of the heating substrate.
According to a further technical scheme, the heat conduction micro-columns are uniformly distributed on the surface of the heating substrate at intervals in an array mode.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
(1) according to the evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, heat is transferred to the capillary core through the heat conducting micro-columns by the heating substrate, the lower surface of the porous capillary core is heated and evaporated to generate steam, small bubbles formed by exhausting multiple holes of the steam provide a gasification core capable of enhancing boiling heat transfer for a superheated fluid working medium between the lower surface of the porous capillary core and the heating substrate, and meanwhile, the exhausted small bubbles enhance disturbance on a bottom flow field, so that the boiling heat transfer effect is further enhanced;
(2) according to the evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, the lower surface of the porous capillary core is in a convex shape, so that small bubbles generated by a gasification core generated by evaporation on the lower surface of the porous capillary core can be more easily separated from a superheated fluid working medium region at the bottom, further boiling in the superheated fluid working medium region is realized, boiling evaporation longitudinally coexists, the heat transfer area is expanded in a limited space by the integral structure, and the heat transfer performance and the critical heat flow density are improved;
(3) according to the evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, the axial section of the heat-conducting microcolumn is cylindrical, rectangular, square, trapezoidal, rhombic, drop-shaped or elliptical, so that the shape of the heat-conducting microcolumn is correspondingly changed according to the structure and size of heat dissipation required, and different occasions are met;
(4) according to the evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, the upper surface of the heat conduction microcolumn is connected with the lower surface of the porous capillary core through a sintering method to form the composite structure, and the channels formed among the composite structure units are combined with the porous capillary core to suck working media, so that a stable gas-liquid flow channel is formed in the boiling heat transfer process, the phase change heat transfer performance is favorably improved, the composite structure is simple to manufacture, wide in applicability and low in production cost, and the requirements under different boiling heat transfer conditions can be met.
Drawings
FIG. 1 is a schematic structural diagram of an operating state of an evaporative boiling longitudinal coexisting composite structure of the present invention;
FIG. 2 is a longitudinal cross-sectional view of an evaporative boiling longitudinal coexistence composite structure according to the present invention;
FIG. 3 is a top view of an evaporative boiling longitudinal coexisting composite structure of the present invention.
In the figure: 1-heating the substrate; 2-heat conducting microcolumns; 3-porous wick; 4-a superheated fluid working medium region; 5-gasification core; 6-air bubbles; 7-bubble detachment direction; 31-bump.
Detailed Description
For a further understanding of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.
Example 1
The evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer of the embodiment comprises a horizontally arranged heating substrate 1, wherein a porous capillary wick 3 is fixedly arranged on the upper surface of the heating substrate 1 through a vertically arranged heat conduction micro-column 2, a protrusion 31 is arranged on the lower surface of the porous capillary wick 3, an overheated fluid working medium region 4 is arranged between the heating substrate 1 and the porous capillary wick 3, the upper surface of the heat conduction micro-column 2 is connected with the lower surface of the porous capillary wick 3 through a sintering method to form a composite structure, and a channel is formed between the composite structures.
The heat-conducting micro-column 2 in the composite structure is made of materials with high heat conductivity coefficient, copper, aluminum or gold and the like, and the axial section of the heat-conducting micro-column 2 can be selected from a cylinder, a rectangle, a square, a trapezoid, a rhombus, a water drop shape or an ellipse; the porous capillary core 3 is prepared by a die sintering method, wherein the capillary core with lower thermal conductivity is selected as the porous capillary core 3, the thermal conductivity coefficient is not higher than 10W/(m.K), and the lower surface of the porous capillary core 3 is convex; the heat conduction micro-column 2 is bonded with the substrate 1 by adopting high heat conduction material, and a high heat conduction material micro-column structure is constructed on the surface of the substrate 1 by a deep picosecond laser etching method.
Further, as shown in fig. 3, a plurality of groups are vertically arranged on the upper surface of the heating substrate 1.
Furthermore, the heat conducting micro-pillars 2 are uniformly distributed at intervals in an array form on the surface of the heating substrate 1.
In this embodiment, as shown in fig. 1, when the heating substrate 1 is heated, the entire fluid working medium region 5 is heated, the heat-conducting microcolumns 2 transfer heat to the porous capillary wick 3, the heat is mainly evaporated on the lower surface of the porous capillary wick 3 to form steam, and along with the evaporation process, the steam generated by the porous capillary wick 3 is discharged to form small bubbles to serve as the gasification core 5 of the superheated fluid at the bottom, so that the boiling starting point is reduced, the disturbance of the flow field is enhanced, and the boiling heat transfer of the liquid region at the bottom is enhanced; under the heating of the superheated fluid working medium, the heat is converted into boiling heat transfer, small bubbles grow to a certain size to form bubbles 6, and the bubbles are separated from the bottom of the porous capillary core 3 along a bubble separation direction 7. The small bubbles then continue to grow in the superheated fluid working medium region 4 and are then discharged from the channels between the composite structures. The mechanism of the composite structure for enhancing boiling heat transfer is that due to the existence of a heat transfer boundary provided by the heat conduction micro-column 2 with high heat conductivity and the porous capillary wick 3, heat transferred by the heating substrate 1 can reach the porous capillary wick 3 through the heat conduction micro-column 2, and because the porous capillary wick 3 has low heat conductivity and large thickness, the capillary evaporation phenomenon can be generated only on the lower surface of the porous capillary wick 3 in contact with the heat conduction micro-column 2, so that a gasification core 5 is provided for boiling heat transfer, the superheat degree of an overheated fluid working medium region 4 is reduced, and the boiling heat transfer effect is enhanced.
Meanwhile, the heating substrate 1 guides heat into the porous capillary core 3 through the heat conduction micro-columns 2, so that the heat transfer area is increased in the longitudinal direction, and the reduction of the input heat flow density caused by the direct heating area expansion is avoided. Because the lower surface of the porous capillary core 3 is the bulge 31, the gasification core 5 continuously grows along with the evaporation process, and then the gasification core can be separated from the lower surface of the porous capillary core 3 to carry out boiling heat transfer in the superheated fluid working medium region 4, thereby realizing the coexistence of longitudinal boiling evaporation; the disturbance of the surrounding flow field is enhanced through the suction effect of the porous capillary core 3, so that bubbles in the superheated fluid working medium region 5 can be discharged from a channel between the composite structures in time, an air film cannot be filled between the heating substrate 1 and the porous capillary core 3, the phenomenon of heat transfer deterioration is avoided, the bubbles are separated in time, the circulating flow of the surrounding working medium is accelerated, and the integral boiling heat transfer effect is enhanced.
The present invention and its embodiments have been described above schematically, without limitation, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (9)
1. An evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer, comprising: the device comprises a heating substrate (1) which is horizontally arranged, wherein a porous capillary core (3) is fixedly arranged on the upper surface of the heating substrate (1) through vertically arranged heat-conducting micro-columns (2), and an overheated fluid working medium area (4) is formed between the vertically arranged heat-conducting micro-columns (2); the contact part of the lower part of the porous capillary core (3) and the heat conduction micro-column (2) forms a gasification core (5).
2. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 1, wherein: the porous capillary core (3) is provided with a bulge (31) at the lower part, and a gasification core (5) is formed in the contact area of the bulge (31) and the heat conduction micro-column (2).
3. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 2, wherein: the axial section of the heat conduction micro-column (2) is cylindrical or rectangular or square or trapezoid or rhombus or drop-shaped or oval.
4. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 3, wherein: the heat conduction micro-column (2) is made of high heat conduction material.
5. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 2, wherein: the porous capillary core (3) is a low-thermal-conductivity material, and the thermal conductivity coefficient is not higher than 10W/(m.K).
6. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 4, wherein: the lower surface of the heat-conducting micro-column (2) is bonded with the heating substrate (1), and then the heat-conducting micro-column (2) is vertically formed on the upper surface of the heating substrate (1) through a deep picosecond laser etching method.
7. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as claimed in any one of claims 1 to 6 wherein: the upper surface of the heat conduction micro-column (2) is connected with the lower surface of the porous capillary core (3) through a sintering method to form a composite structure.
8. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 7, wherein: the composite structure is characterized in that a plurality of groups are vertically arranged on the upper surface of the heating substrate (1).
9. An evaporation-boiling longitudinal coexistent composite structure for enhanced boiling heat transfer as recited in claim 8, wherein: the heat conduction micro-columns (2) are uniformly distributed at intervals in an array form on the surface of the heating substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210167812.XA CN114543571B (en) | 2022-02-23 | 2022-02-23 | Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210167812.XA CN114543571B (en) | 2022-02-23 | 2022-02-23 | Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114543571A true CN114543571A (en) | 2022-05-27 |
| CN114543571B CN114543571B (en) | 2024-05-17 |
Family
ID=81677032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210167812.XA Active CN114543571B (en) | 2022-02-23 | 2022-02-23 | Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114543571B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200803A (en) * | 2013-03-20 | 2013-07-10 | 西安交通大学 | Loop heat pipe cooling device with pool boiling function |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN110542337A (en) * | 2019-08-29 | 2019-12-06 | 华北电力大学 | 3D printing porous capillary core ultrathin flat heat pipe and printing method |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN114023710A (en) * | 2021-12-03 | 2022-02-08 | 安徽工业大学 | Composite micro-column-porous surface structure for enhancing boiling heat transfer |
-
2022
- 2022-02-23 CN CN202210167812.XA patent/CN114543571B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200803A (en) * | 2013-03-20 | 2013-07-10 | 西安交通大学 | Loop heat pipe cooling device with pool boiling function |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN110542337A (en) * | 2019-08-29 | 2019-12-06 | 华北电力大学 | 3D printing porous capillary core ultrathin flat heat pipe and printing method |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN114023710A (en) * | 2021-12-03 | 2022-02-08 | 安徽工业大学 | Composite micro-column-porous surface structure for enhancing boiling heat transfer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114543571B (en) | 2024-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10727156B2 (en) | Heat spreader with high heat flux and high thermal conductivity | |
| CN100495692C (en) | Capillary pump cooler with micro-groove wing structure and its manufacturing method | |
| US10820454B2 (en) | Vapor chamber heat spreaders with engineered vapor and liquid flow paths | |
| CN106376214B (en) | Slim temperature-uniforming plate | |
| CN104634148B (en) | A kind of nanostructured flat-plate heat pipe | |
| TW201240587A (en) | Vapor chamber | |
| CN114023710A (en) | Composite micro-column-porous surface structure for enhancing boiling heat transfer | |
| CN100413063C (en) | Heat pipe and manufacturing method thereof | |
| CN1849049A (en) | Flat column shape thermal tube | |
| CN104676545A (en) | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system | |
| CN111076587A (en) | Impact jet flow array phase change cooling device combined with foam metal | |
| JP5765045B2 (en) | Loop heat pipe and manufacturing method thereof | |
| CN110828404A (en) | Micro-channel vapor chamber with recess structure | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| US20220099382A1 (en) | Boiling enhancement device | |
| US20220196337A1 (en) | Heat dissipation device | |
| CN113624050B (en) | High-efficiency high-reliability flat heat pipe | |
| CN113915594A (en) | Radiator with double-phase change cavity | |
| CN114543571A (en) | Evaporation-boiling longitudinal coexisting composite structure for enhancing boiling heat transfer | |
| CN214502177U (en) | Ultra-thin type temperature-uniforming plate element with two-phase unidirectional flow | |
| CN113053840B (en) | Bionic double-loop three-dimensional micro-channel heat dissipation device | |
| CN216311772U (en) | Composite micro-column-porous surface structure for enhancing boiling heat transfer | |
| CN204513305U (en) | Heat sink, heat abstractor and LED bay light cooling system | |
| Nujukambari et al. | A Review: New Designs of Heat Sinks for Flow Boiling Cooling | |
| TWI335412B (en) | Heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |