CN114535864A - 一种延长助焊剂活性的催化剂 - Google Patents
一种延长助焊剂活性的催化剂 Download PDFInfo
- Publication number
- CN114535864A CN114535864A CN202011333821.9A CN202011333821A CN114535864A CN 114535864 A CN114535864 A CN 114535864A CN 202011333821 A CN202011333821 A CN 202011333821A CN 114535864 A CN114535864 A CN 114535864A
- Authority
- CN
- China
- Prior art keywords
- acid
- catalyst
- activity
- soldering flux
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 23
- 230000000694 effects Effects 0.000 title claims abstract description 21
- 238000005476 soldering Methods 0.000 title claims abstract description 15
- 239000003054 catalyst Substances 0.000 title claims abstract description 12
- 239000004094 surface-active agent Substances 0.000 claims abstract description 18
- 150000007524 organic acids Chemical class 0.000 claims abstract description 14
- 239000012190 activator Substances 0.000 claims abstract description 10
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 6
- 150000002367 halogens Chemical class 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 9
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 6
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 239000001630 malic acid Substances 0.000 claims description 3
- 235000011090 malic acid Nutrition 0.000 claims description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 7
- 125000005313 fatty acid group Chemical group 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000003213 activating effect Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- -1 halogen ions Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011090 solid board Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明提供一种延长助焊剂活性的催化剂，包括表面活性剂、有机酸活化剂，所述表面活性剂包括卤素、脂肪酸族，所述有机酸活化剂由有机酸二元酸或芳香酸中的一种或几种组成，此催化剂使焊接工程中，助焊剂的活性增强且效果时效长。
Description
技术领域
本发明主要涉及半导体先进材料领域，尤其涉及一种延长助焊剂活性的催化剂。
背景技术
倒装焊接工程时，现有的焊接需要在220～250℃条件下，助焊剂才会发挥作用，助焊剂长期裸漏在外，活性慢慢降低，且品质危险系数极高。到能够延长助焊剂活性的催化剂，并评价调试出最佳的添加比例。助焊剂的使用寿命从22H延长至40H，实现了量产水准，通过新型催化剂的添加，延长助焊剂的活性，从而大幅延长倒装焊接工程的使用寿命。
发明内容
针对现有技术的上述缺陷，本发明提供一种锂电池电极头粗糙化加工并裁切至设定长度的设备，包括。
优选的，。
本发明的有益效果：
此催化剂使焊接工程中，助焊剂的活性增强且效果时效长。
具体实施方式
下面结合对本实用进行详细描述，本部分的描述仅是示范性和解释性，不应对本发明的保护范围有任何的限制作用。
一种延长助焊剂活性的催化剂，包括表面活性剂、有机酸活化剂，所述表面活性剂包括卤素、脂肪酸族，所述有机酸活化剂由有机酸二元酸或芳香酸中的一种或几种组成。
本实施例中优选的，所述有机酸活化剂为丁二酸，戊二酸，衣康酸，邻羟基苯甲酸，葵二酸，庚二酸、苹果酸、琥珀酸的一种或几种组成。
本实施例中优选的，所述表面活性剂包括氯化物。
加强助焊剂的活性。活性强到足以在极短的时间内去除铜脚表面的氧化层，但应该保证焊接过程中的蒸汽不至于引起管脚后续腐蚀； 2.加强助焊剂的松香或树脂含量。保证了高温焊接下的良好载体效能；3.加强表面活性，保证浸润效果。
表面活性剂：含卤素的表面活性剂活性强，助焊能力高，但因卤素离子很难清洗干净，离子残留度高，卤素元素(主要是氯化物)有强腐蚀性，故不适合用作免洗助焊剂的原料，不含卤素的表面活性剂，活性稍有弱，但离子残留少。表面活性剂主要是脂肪酸族或芳香族的非离子型表面活性剂，其主要功能是减小焊料与引线脚金属两者接触时产生的表面张力，增强表面润湿力，增强有机酸活化剂的渗透力，也可起发泡剂的作用
有机酸活化剂：由有机酸二元酸或芳香酸中的一种或几种组成，如丁二酸，戊二酸，衣康酸，邻羟基苯甲酸，葵二酸，庚二酸、苹果酸、琥珀酸等.其主要功能是除去引线脚上的氧化物和熔融焊料表面的氧化物，是助焊剂的关键成分之一。
焊锡不会爬升(透锡)的原因,主要体现在浸润性方面,目前的无铅焊剂中,松香是必须的,但是添加量每一家各不相同,活化剂及表面活性剂也是不完全一样的,在高温下分解的先后和速度都是会影响焊接效果的。焊剂的整个工作过程,板子浸涂焊剂后,有一部分活化剂开始工作,表面活性剂能够让焊剂在整个板面完全浸润,而不会像滴到桌面上的水一样呈现球状,这是因为表面活性剂消除了焊剂在PCB板面的表面张力,使他充分流动起来,然后在预热区时,助焊剂中的一部分活化剂开始活化,并逐渐消解,此时板面的氧化层也已经有所去除, 还有一部分活化剂在确保去除后的铜箔表面再氧化时起到了关键作用,他们可以在220度左右保持良好的活化状态,预热区时表面活性剂没有太多分解,到了波峰时,当锡液与固态的板面及元件管脚接触时,锡液表面仍然会有一定的表面张力,此时表面活性剂又开始第二轮的工作,它们将表面活性的作用发挥到极致,让锡液流动起来,在焊盘表面充分浸润,并形成焊点。
以上所述的本发明实施方式，并不构成对本发明保护范围的限定。任何在本发明的精神和原则之内所作的修改、等同替换和改进等，均应包含在本发明的权利要求保护范围之内。
Claims (3)
1.一种延长助焊剂活性的催化剂，其特征在于，包括表面活性剂、有机酸活化剂，所述表面活性剂包括卤素、脂肪酸族，所述有机酸活化剂由有机酸二元酸或芳香酸中的一种或几种组成。
2.根据权利要求1所述的催化剂，其特征在于：所述有机酸活化剂为丁二酸，戊二酸，衣康酸，邻羟基苯甲酸，葵二酸，庚二酸、苹果酸、琥珀酸的一种或几种组成。
3.根据权利要求2所述的催化剂，其特征在于：所述表面活性剂包括氯化物。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011333821.9A CN114535864A (zh) | 2020-11-25 | 2020-11-25 | 一种延长助焊剂活性的催化剂 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011333821.9A CN114535864A (zh) | 2020-11-25 | 2020-11-25 | 一种延长助焊剂活性的催化剂 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114535864A true CN114535864A (zh) | 2022-05-27 |
Family
ID=81660480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011333821.9A Pending CN114535864A (zh) | 2020-11-25 | 2020-11-25 | 一种延长助焊剂活性的催化剂 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114535864A (zh) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2405957A1 (en) * | 2000-04-13 | 2001-11-22 | Fry's Metals, Inc. D.B.A. Alpha Metals, Inc. | Soldering flux with cationic surfactant |
| CN101412166A (zh) * | 2008-11-28 | 2009-04-22 | 廖龙根 | 一种无卤助焊剂 |
| CN101733589A (zh) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | 一种无铅焊料用无卤素免清洗助焊剂 |
| CN103128461A (zh) * | 2011-11-23 | 2013-06-05 | 郴州金箭焊料有限公司 | 一种无铅焊锡丝用助焊剂 |
| CN103801857A (zh) * | 2012-11-06 | 2014-05-21 | 西北机器有限公司 | 一种免清洗助焊剂及其制备方法 |
| CN107097019A (zh) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | 一种有机免洗助焊剂 |
| CN108620770A (zh) * | 2018-05-08 | 2018-10-09 | 丹凤县荣毅电子有限公司 | 一种免洗助焊剂及其制备方法 |
-
2020
- 2020-11-25 CN CN202011333821.9A patent/CN114535864A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2405957A1 (en) * | 2000-04-13 | 2001-11-22 | Fry's Metals, Inc. D.B.A. Alpha Metals, Inc. | Soldering flux with cationic surfactant |
| CN101412166A (zh) * | 2008-11-28 | 2009-04-22 | 廖龙根 | 一种无卤助焊剂 |
| CN101733589A (zh) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | 一种无铅焊料用无卤素免清洗助焊剂 |
| CN103128461A (zh) * | 2011-11-23 | 2013-06-05 | 郴州金箭焊料有限公司 | 一种无铅焊锡丝用助焊剂 |
| CN103801857A (zh) * | 2012-11-06 | 2014-05-21 | 西北机器有限公司 | 一种免清洗助焊剂及其制备方法 |
| CN107097019A (zh) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | 一种有机免洗助焊剂 |
| CN108620770A (zh) * | 2018-05-08 | 2018-10-09 | 丹凤县荣毅电子有限公司 | 一种免洗助焊剂及其制备方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8907475B2 (en) | Pb-free solder-connected structure | |
| KR101105075B1 (ko) | 수지 비함유성 용제가 포함된 납땜용 페이스트 | |
| KR100373420B1 (ko) | 비-세정 플럭스의 활동도 증가를 위한 조성물 | |
| CN107088716B (zh) | 一种环保低温无残留锡膏及其制备方法 | |
| US20060183270A1 (en) | Tools and methods for forming conductive bumps on microelectronic elements | |
| KR100567611B1 (ko) | 무전해 도금에 의해 니켈 코팅된 표면에 사용되는 땜납 | |
| US7740713B2 (en) | Flux composition and techniques for use thereof | |
| KR20110032492A (ko) | 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법 | |
| CN113441865B (zh) | 一种高活性的无铅锡膏及其制备方法 | |
| JP4211828B2 (ja) | 実装構造体 | |
| JP3400408B2 (ja) | フリップチップ実装方法 | |
| CN114535864A (zh) | 一种延长助焊剂活性的催化剂 | |
| JP2001274539A (ja) | 電子デバイス搭載プリント配線板の電極接合方法 | |
| JPWO2006134891A1 (ja) | モジュール基板のはんだ付け方法 | |
| TW201607992A (zh) | 助焊劑組成物 | |
| JP4081073B2 (ja) | はんだ付け方法 | |
| CN110842395A (zh) | 无卤素球栅阵列倒装芯片助焊膏及该助焊膏制作工艺 | |
| JP2001358458A (ja) | Ｐｂフリーはんだ接続を有する電子機器 | |
| TWI839955B (zh) | 銦鉍合金作為焊料之用途 | |
| JP2004006818A (ja) | リフロー法とソルダペースト | |
| JP3460442B2 (ja) | 鉛フリーはんだ及びそれを用いた実装品 | |
| KR100460957B1 (ko) | 무연 합금 솔더의 솔더링 플럭스 | |
| JPH0679772B2 (ja) | 制御された酸化能力を有する雰囲気を使用するコーティング被覆／接合方法 | |
| JPH04357899A (ja) | 予備半田層付き回路基板の製造方法 | |
| CN116748734A (zh) | 水溶性激光焊锡膏及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220527 |
|
| RJ01 | Rejection of invention patent application after publication |