CN114466516A - Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board - Google Patents
Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board Download PDFInfo
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- CN114466516A CN114466516A CN202210103434.9A CN202210103434A CN114466516A CN 114466516 A CN114466516 A CN 114466516A CN 202210103434 A CN202210103434 A CN 202210103434A CN 114466516 A CN114466516 A CN 114466516A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 77
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 9
- 238000001039 wet etching Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- 230000002335 preservative effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board. The manufacturing method of the vehicle-mounted flexible board comprises the following steps: dividing a design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different processes; respectively manufacturing according to the sub-design modules to form a plurality of sub-finished product modules; connecting a plurality of the sub-finished product modules. According to the invention, the design module of the vehicle-mounted flexible circuit board is divided into the plurality of sub-design modules, so that the module with the longer circuit and the module with the shorter circuit on the vehicle-mounted flexible circuit board can be divided, the module with the longer circuit can be suitable for being manufactured by a dry-method die cutting process, the circuit module with the shorter circuit can be manufactured by a wet-method etching process, and after each sub-finished product module is manufactured, the plurality of sub-finished product modules are connected together to form a whole vehicle-mounted flexible circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board.
Background
The connection of batteries in electric vehicles generally uses a flexible circuit board (called a flexible board for short), the vehicle-mounted flexible circuit board connected with the batteries has a long circuit (as long as more than 1.5 m), the line width/line distance of a battery lead is large (generally more than 0.6 mm), but the line width/line distance of a fuse on the flexible board (generally less than 0.2mm) is smaller and shorter. These characteristics lead to that when the conventional wet etching process for the circuit board is used for manufacturing the circuit, besides the special manufacturing equipment and process are needed to adapt to the long circuit, the quality of the line width/line distance and the control of the yield are difficult, so that the circuit forming process of the vehicle-mounted flexible circuit board is the core and pain point of the whole manufacturing process.
Disclosure of Invention
In order to solve the above technical problems, a main object of the present invention is to provide a method for manufacturing a vehicle-mounted flexible board and a vehicle-mounted flexible board, which are used to solve the problem that the conventional method for manufacturing a flexible board cannot meet the manufacturing requirements of a flexible board with both long and short circuits.
In order to achieve the purpose, the invention provides a manufacturing method of a vehicle-mounted flexible board, which comprises the following steps:
dividing a design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different processes;
respectively manufacturing according to the sub-design modules to form a plurality of sub-finished product modules;
connecting a plurality of the sub-finished modules.
Optionally, the plurality of sub-design modules include a first sub-design module, a second sub-design module, and a third sub-design module, wherein the processes of the first sub-design module, the second sub-design module, and the third sub-design module are all configured differently.
Optionally, the first sub-design module includes a main flexible printed circuit board module, the second sub-design module includes a fuse flexible printed circuit board module, and the third sub-design module includes a sensor flexible printed circuit board module.
Optionally, the manufacturing according to the plurality of sub-design modules respectively to form a plurality of sub-finished product modules specifically includes the following steps:
the main flexible circuit board adopts a dry-method die-cutting process, the fuse flexible circuit board adopts a wet-method etching process, and the process of the sensor flexible circuit board comprises a wet-method etching process and an SMT processing process.
Optionally, the dividing the design module of the vehicle-mounted flexible printed circuit board into a plurality of sub-design modules according to different manufacturing processes specifically includes the following steps:
and dividing a module with the line width or the line distance smaller than a preset value during manufacturing in the vehicle-mounted flexible board into a second sub-design module, dividing a module which needs SMT during manufacturing into a third sub-design module, and taking the rest modules as first sub-design modules.
Optionally, the dividing the design module of the vehicle-mounted flexible printed circuit board into a plurality of sub-design modules according to different manufacturing processes specifically includes the following steps:
according to different processes, a design module of the vehicle-mounted flexible board is divided into a plurality of sub-design modules, and a bonding pad for connection and an alignment mark are arranged at the division position of the plurality of sub-design modules.
Alternatively, the alignment marks may be provided as concentric circles or crosses.
Optionally, at least two alignment marks are arranged on the alignment mark, and the at least two alignment marks are arranged in a straight line, or at least two alignment marks are arranged in a diagonal line.
Optionally, the connecting the plurality of sub-finished product modules specifically includes the following steps:
and the plurality of sub-finished product modules are connected in an assembling welding, hot-pressing tin-melting welding or pressing mode.
The invention also provides a vehicle-mounted flexible board which is processed and manufactured by the manufacturing method of the vehicle-mounted flexible board.
The technical scheme provided by the invention has the following beneficial effects:
the invention provides a manufacturing method of a vehicle-mounted flexible board, which comprises the following steps: dividing a design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different processes; respectively manufacturing according to the sub-design modules to form a plurality of sub-finished product modules; connecting a plurality of the sub-finished modules. The design module of the vehicle-mounted flexible circuit board is divided into the plurality of sub-design modules, so that the module with longer circuit and the module with shorter circuit on the vehicle-mounted flexible circuit board can be divided, the module with longer circuit and larger line width can be suitable for dry-process die cutting process to manufacture, the circuit is shorter, and the circuit module with small line width can be manufactured through wet etching process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a manufacturing method of a vehicle-mounted flexible board according to an embodiment of the present invention;
FIG. 2 is a schematic partial structural diagram of an embodiment of a design module of a vehicle-mounted flexible board according to the present invention;
FIG. 3 is a schematic structural diagram of the first sub-design module shown in FIG. 2;
FIG. 4 is a schematic structural diagram of the third sub-design module shown in FIG. 2;
FIG. 5 is a schematic structural diagram of the first sub-design module and the third sub-design module of FIGS. 3 and 4 after being connected;
FIG. 6 is a schematic partial structural diagram of another embodiment of a design module of a vehicle-mounted flexible board according to the present invention;
FIG. 7 is a schematic structural diagram of the first sub-design module of FIG. 6;
FIG. 8 is a schematic structural diagram of the second sub-design module of FIG. 6;
fig. 9 is a schematic structural diagram of the first sub-design module and the second sub-design module in fig. 7 and 8 after being connected.
The reference numbers illustrate:
100-a design module of a vehicle-mounted flexible board; 100' -restructuring the vehicle-mounted flexible board; 1-a first sub-design module; 2-a second sub-design module; 3-a third sub-design module; 4-a pad; 5-alignment mark.
The object of the present invention, its functional characteristics and advantageous effects will be further described with reference to the following embodiments and drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indication is involved in the embodiment of the present invention, the directional indication is only used for explaining the relative positional relationship, the motion situation, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The connection of batteries in electric vehicles generally uses a flexible circuit board (called a flexible board for short), the vehicle-mounted flexible circuit board connected with the batteries has a long circuit (as long as more than 1.5 m), the line width/line distance of a battery lead is large (generally more than 0.6 mm), but the line width/line distance of a fuse on the flexible board (generally less than 0.2mm) is smaller and shorter. These characteristics lead to the difficulty in controlling the quality and yield of the line width/line distance when the circuit is manufactured by using the conventional wet etching process for the circuit board, in addition to the need for specially manufactured equipment and process to adapt to long circuits, so that the circuit forming process for the vehicle-mounted flexible circuit board is the core and pain point of the whole manufacturing process. In view of the above, the invention provides a method for manufacturing a vehicle-mounted flexible board and the vehicle-mounted flexible board.
As shown in fig. 1, the invention provides a method for manufacturing a vehicle-mounted flexible board, which comprises the following steps:
s100, dividing the design module 100 of the vehicle-mounted flexible board into a plurality of sub-design modules according to different manufacturing processes;
s200, respectively manufacturing according to the plurality of sub-design modules to form a plurality of sub-finished product modules;
and S300, connecting a plurality of the sub-finished product modules.
According to the manufacturing method of the vehicle-mounted flexible board, the design module 100 of the vehicle-mounted flexible board is divided into the plurality of sub-design modules, so that the module with the longer circuit and the larger line width and the module with the shorter circuit and the smaller line width on the vehicle-mounted flexible board can be divided, the module with the longer circuit and the larger line width can be manufactured by a dry die cutting process, the circuit module with the shorter circuit and the smaller line width can be manufactured by a wet etching process, and after the sub-finished product modules are manufactured, the plurality of sub-finished product modules are connected to form the whole vehicle-mounted flexible board.
Further, as shown in fig. 3 and 4, and fig. 7 and 8, the plurality of sub-design modules in S100 include a first sub-design module 1, a second sub-design module 2, and a third sub-design module 3, wherein the processes of the first sub-design module 1, the second sub-design module 2, and the third sub-design module 3 are all arranged differently, so that when the vehicle-mounted flexible board includes a plurality of types of circuit structures, different circuit structures can be respectively separated, and then each module is manufactured through different processes separately, so as to simplify the manufacturing process of the entire vehicle-mounted flexible board. And the second sub-design module and the third sub-design module can be jointed for operation, a plurality of second sub-design modules and a plurality of third sub-design modules are processed and manufactured simultaneously, and the plurality of second sub-design modules and the plurality of third sub-design modules can be respectively matched with different first sub-design modules, so that the production efficiency of the wet etching process is matched with the production efficiency of dry die cutting, and the overall processing efficiency is improved.
Further, the first sub-design module 1 includes a main flexible printed circuit board module, the second sub-design module 2 includes a fuse flexible printed circuit board module, and the third sub-design module 3 includes a sensor flexible printed circuit board module.
As shown in fig. 3 and 7, since the main flexible printed circuit board module of the vehicle-mounted flexible printed circuit includes a circuit structure with a longer and wider circuit, and a line width is generally greater than 0.6mm, the main flexible printed circuit board can be subjected to a dry die cutting process, specifically:
1) acid cleaning, namely firstly cleaning the surface of the copper foil for manufacturing the main flexible circuit board, or adopting chemical cleaning;
2) die cutting, namely cutting the main flexible circuit board by adopting hobbing cutter die cutting equipment, wherein the hobbing cutter die cutting equipment is the existing technology and can produce the circuit board with the line width of more than 0.6 mm;
3) attaching a protective film, automatically attaching the protective film by adopting a clamp or a machine, and attaching by adopting a pre-attaching machine after attaching to prevent the protective film from moving before attaching; the cutting positions of the plurality of sub-design modules are provided with bonding pads so as to facilitate the connection of a plurality of subsequent sub-finished product modules, and before the protective film is attached, openings of the bonding pads can be punched by using a die;
4) pressing and closing the protective film, and pressing and curing the upper protective film by adopting a quick press, wherein the protective film can be pressed by a quick press with a customized large platform, and can also be pressed by a normal commercial pressing machine for multiple times in a stepping manner;
5) performing surface treatment, namely performing gold immersion or an Organic Solderability Preservative (OSP) process on a bonding pad of the main body, so that the bonding pad can be conveniently welded or pressed in the subsequent process;
6) and (5) inspecting the appearance and the function, and waiting for assembly of the qualified main flexible circuit board.
The dry-method die-cutting main flexible circuit board has better production efficiency than the wet-method etching process. However, the line width capability of the dry-method die-cutting line process is lower than that of the wet-method etching process
As shown in fig. 6, since the fuse flexible printed circuit includes a short circuit structure with a small line width, generally the line width is less than 0.2mm, which exceeds the limit of the dry die cutting process, the fuse flexible printed circuit can be processed by a wet etching process of a single-layer flexible printed circuit, specifically:
1) chemical cleaning, cleaning the pollution on the surface of the copper foil, and also adopting acid cleaning;
2) forming a circuit, namely sticking a dry film on the surface of the copper foil, exposing and removing the film to manufacture and form a circuit structure of the fuse flexible board;
3) attaching the protective film, automatically attaching the protective film by adopting a clamp or a machine, and attaching the protective film by adopting a pre-attaching machine under false pressure after attaching to prevent the protective film from moving before pressing; the cutting positions of the sub-design modules are provided with bonding pads so as to facilitate the connection of a plurality of subsequent sub-finished product modules, and before the protective film is attached, the bonding pads are punched by using a die;
4) pressing the protective film, and pressing and curing the protective film by adopting a quick press;
5) performing surface treatment, namely performing gold immersion or an Organic Solderability Preservative (OSP) process on a bonding pad of the main body, so that the bonding pad can be conveniently welded or pressed in the subsequent process;
6) punching the flexible board into single pieces;
7) carrying out appearance and function inspection, and waiting for the next process for the qualified flexible board;
8) and (4) using an automatic braider or any other mode to make the single fuse flexible plate qualified by inspection into a material belt package.
When the wet etching process is adopted, the flexible circuit board of the fuse can be jointed, and a plurality of modules are processed and manufactured simultaneously, so that the overall processing efficiency can be effectively improved.
As shown in fig. 4, since the sensor flexible printed circuit board includes a sensor, the sensor is generally attached to the sensor flexible printed circuit board by using an SMT method, and therefore, the process of the sensor flexible printed circuit board includes a wet etching process and an SMT processing process, and the wet etching process of the sensor flexible printed circuit board generally adopts a pure copper foil and a single-sided double-contact process, specifically:
1) acid cleaning, namely cleaning the surface of copper foil for manufacturing the flexible circuit board of the sensor, or adopting chemical cleaning;
2) sticking and pressing a lower protective film, automatically sticking an upper protective film by adopting a clamp or a machine, and sticking by adopting a pre-sticking machine after sticking to prevent the protective film from moving before pressing;
2.1 before the protective film is attached, firstly, punching a bonding pad opening by using a die;
2.2, pressing the protective film, and pressing and curing the protective film by adopting a quick press;
3) forming a circuit, adhering and pressing a dry film on the normal double sides, exposing, developing, etching and removing the film to manufacture and form a sensor flexible circuit board structure;
4) sticking and pressing the protective film, automatically sticking the protective film by adopting a clamp or a machine, and sticking the protective film by adopting a pre-sticking machine after sticking to prevent the protective film from moving before pressing;
4.1 before the protective film is attached, firstly, punching a bonding pad opening by using a die;
4.2, pressing the protective film, and pressing and curing the protective film by adopting a quick press;
5) performing surface treatment, namely performing gold immersion or an Organic Solderability Preservative (OSP) process on the bonding pad of the main body, so that the bonding pad can be conveniently welded or pressed in the subsequent process;
6) the SMT method comprises the steps of performing normal assembly process of SMT, printing solder paste on a sensor flexible plate, attaching a temperature sensor, performing reflow soldering, and soldering the temperature sensor and the sensor flexible plate together;
7) attaching and reinforcing, wherein the reinforcing is fixed on the sensor flexible plate by using methods such as thermosensitive adhesive or glue and the like;
8) dispensing, namely fixing the sensor by using glue to prevent the sensor element from falling off;
9) inspecting appearance and function, and punching and cutting qualified flexible plates into single pieces;
10) the single piece fuse flexible board is made into a tape package using an automatic taping machine or any other means.
The specific partitioning principle of the design module 100 of the vehicle-mounted flexible board is as follows: dividing a module with the line width or the line distance smaller than a preset value when the vehicle-mounted flexible board is manufactured into second sub-design modules 2, wherein the preset value is 0.5-0.8 mm, preferably the preset value is 0.6mm, when the line width or the line distance of the flexible board module is larger than or equal to 0.6mm, processing the flexible board module by adopting a dry-method die-cutting process, and when the line width or the line distance of the flexible board module is smaller than 0.6mm, processing the flexible board module by adopting a wet-method etching process; and dividing the module needing SMT in manufacturing into a third sub-design module 3, wherein the rest modules are the first sub-design module 1. Therefore, each sub-design module can be processed in a processing mode more suitable for the sub-design module, the quality of the processed finished product is higher, and the efficiency is higher.
As shown in fig. 2 to 5, the original vehicle-mounted flexible board design module 100 includes a first sub-design module 1 and a third sub-design module 3, the original vehicle-mounted flexible board is divided into the first sub-design module 1 and the third sub-design module 3, the first sub-product module is manufactured according to the first sub-design module 1, the third sub-product module is manufactured according to the third sub-design module 3, and then the first sub-product module and the third sub-product module are connected together to form the vehicle-mounted flexible board 100' after being recombined as shown in fig. 5. Specifically, as shown in fig. 2 to 4, the design module of the vehicle-mounted flexible board in fig. 2 is provided with two pads 4, after the design module is divided into the main flexible printed circuit board and the sensor flexible printed circuit board, the two pads 4 on the left side of the sensor flexible printed circuit board in fig. 4 correspond to the two pads 4 of the design module of the original vehicle-mounted flexible board and are used for connecting the sensor, the two upper and lower pads 4 in the main flexible printed circuit board in fig. 3 are used for connecting with the two sensor pads 4 on the upper and lower sides of the right side in fig. 4, and the sensor can be ensured to normally work by connecting the pads 4 into a conductive circuit.
Similarly, as shown in fig. 6 to 9, the original vehicle-mounted flexible board design module 100 includes a first sub-design module 1 and a second sub-design module 2, the original vehicle-mounted flexible board is divided into a first sub-design module 1 and a second sub-design module 2, after the first sub-design module 1 is made into a first sub-finished product module, and after the second sub-design module 2 is made into a second sub-finished product module, the first sub-finished product module and the second sub-finished product module can be connected together to form a recombined vehicle-mounted flexible board 100' as shown in fig. 9. Specifically, as shown in fig. 6 to 9, the two left and right pads 4 of the main flexible wiring board in fig. 7 are used to connect with the two left and right pads 4 of the fuse flexible wiring board in fig. 8, and the fuse is ensured to work normally by connecting the respective pads 4 into a conductive line.
Likewise, the second and third sub-product modules may be combined with the first sub-product module to form the vehicle-mounted flexible panel 100'.
After a plurality of sub-finished product modules are manufactured, for better connecting each sub-finished product module to form a whole, when the design module 100 of the vehicle-mounted flexible board is divided into a plurality of sub-design modules, a bonding pad 4 and an alignment mark 5 for connection can be arranged at the division position of the plurality of sub-design modules, the bonding pad 4 for connection ensures that the two sub-modules can be connected into a conducting circuit, the alignment mark 5 ensures that the connection bonding pads 4 of the two sub-modules are aligned accurately, so that the plurality of sub-finished product modules can be aligned quickly and accurately, and the connection is also more efficient.
Further, the shape of the alignment marks 5 is not particularly limited, for example, the alignment marks 5 may be concentric circles or a cross, so that alignment is more convenient when every two sub-finished modules are connected.
Moreover, the number of the alignment marks 5 is at least two, and the at least two alignment marks 5 are arranged in a straight line, or the at least two alignment marks 5 are arranged in a diagonal line, so that alignment is more stable.
Furthermore, a plurality of the sub-finished product modules can be connected in an assembling welding mode, a hot-pressing tin-melting welding mode or a pressing mode, and the assembling is simple.
In addition, the invention further provides a vehicle-mounted flexible plate which is processed and manufactured by the vehicle-mounted flexible plate manufacturing method.
The vehicle-mounted flexible board is more convenient to manufacture, the vehicle-mounted flexible board is divided into a plurality of sub-finished product modules to be processed, the sub-finished product modules can be manufactured respectively and simultaneously, the manufacturing speed is higher, the quality of manufactured finished products of the vehicle-mounted flexible board is higher, special processing equipment is not needed, and the manufacturing cost can be effectively saved.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the vehicle-mounted flexible board is characterized by comprising the following steps:
dividing a design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different manufacturing procedures;
respectively manufacturing according to the sub-design modules to form a plurality of sub-finished product modules;
connecting a plurality of the sub-finished modules.
2. The method of claim 1, wherein the plurality of sub-design modules comprises a first sub-design module, a second sub-design module, and a third sub-design module, and wherein the processes of the first sub-design module, the second sub-design module, and the third sub-design module are different.
3. The method of claim 1, wherein the first sub-design module comprises a main flexible printed circuit board module, the second sub-design module comprises a fuse flexible printed circuit board module, and the third sub-design module comprises a sensor flexible printed circuit board module.
4. The method for manufacturing the vehicle-mounted flexible board according to claim 3, wherein the sub-design modules are manufactured respectively according to a plurality of sub-design modules to form a plurality of sub-finished modules, and the method specifically comprises the following steps:
the main flexible circuit board adopts a dry-method die-cutting process, the fuse flexible circuit board adopts a wet-method etching process, and the process of the sensor flexible circuit board comprises a wet-method etching process and an SMT processing process.
5. The method for manufacturing a vehicle-mounted flexible board according to claim 1, wherein the step of dividing the design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different processes comprises the following steps:
and dividing a module with the line width or the line distance smaller than a preset value during manufacturing in the vehicle-mounted flexible board into a second sub-design module, dividing a module which needs SMT during manufacturing into a third sub-design module, and taking the rest modules as first sub-design modules.
6. The method for manufacturing a vehicle-mounted flexible board according to claim 1, wherein the step of dividing the design module of the vehicle-mounted flexible board into a plurality of sub-design modules according to different processes comprises the following steps:
according to different processes, a design module of the vehicle-mounted flexible board is divided into a plurality of sub-design modules, and a bonding pad for connection and an alignment mark are arranged at the division position of the plurality of sub-design modules.
7. The method for manufacturing the vehicle-mounted flexible board according to claim 6, wherein the alignment marks are arranged as concentric circles or crosses.
8. The manufacturing method of the vehicle-mounted flexible board according to claim 6, wherein at least two alignment marks are provided, at least two alignment marks are arranged in a straight line, or at least two alignment marks are arranged in a diagonal line.
9. The method for manufacturing a vehicle-mounted flexible board according to claim 1, wherein the step of connecting a plurality of the sub-finished modules specifically comprises the following steps:
and the plurality of sub-finished product modules are connected in an assembling welding, hot-pressing tin-melting welding or pressing mode.
10. A vehicle-mounted flexible board, characterized in that the vehicle-mounted flexible board is manufactured by the method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210103434.9A CN114466516B (en) | 2022-01-27 | 2022-01-27 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210103434.9A CN114466516B (en) | 2022-01-27 | 2022-01-27 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
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| CN114466516B CN114466516B (en) | 2024-03-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101218A (en) * | 2001-09-21 | 2003-04-04 | Hitachi Chem Co Ltd | Method for manufacturing printed circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN209015200U (en) * | 2018-11-16 | 2019-06-21 | 苏州昭舜物联科技有限公司 | A kind of substrate can natural degradation completely RFID label tag |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101218A (en) * | 2001-09-21 | 2003-04-04 | Hitachi Chem Co Ltd | Method for manufacturing printed circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN209015200U (en) * | 2018-11-16 | 2019-06-21 | 苏州昭舜物联科技有限公司 | A kind of substrate can natural degradation completely RFID label tag |
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| CN114466516B (en) | 2024-03-12 |
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