CN216113505U - High-power LED lamp strip - Google Patents
High-power LED lamp strip Download PDFInfo
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- CN216113505U CN216113505U CN202122463031.9U CN202122463031U CN216113505U CN 216113505 U CN216113505 U CN 216113505U CN 202122463031 U CN202122463031 U CN 202122463031U CN 216113505 U CN216113505 U CN 216113505U
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Abstract
The utility model discloses a high-power LED lamp strip which comprises a first circuit layer, an insulating layer and a second circuit layer which are sequentially attached, wherein: a third circuit layer is arranged outside the second circuit layer, an adhesive layer is arranged between the third circuit layer and the second circuit layer for adhesion, and the second circuit layer and the third circuit layer have a thickening effect and are kept in conduction along the length direction; the utility model aims to provide a circuit board which is set to be a three-layer or more than three-layer circuit layer structure, the circuit layer needing thick copper is divided into two thinner circuit layers, one of the two circuit layers is made of aluminum foil, the sum of the electrical effects of the two circuit layers is achieved, the electrical effect of a single circuit layer is achieved, and the effects of saving material cost and reducing manufacturing difficulty are achieved.
Description
Technical Field
The utility model relates to an LED circuit board, in particular to a high-power LED lamp strip.
Background
The traditional LED lamp strip product is not only a flexible LED lamp strip or a rigid LED lamp strip, but also a single-sided circuit board or a double-sided circuit board, and the product is required to be connected for more than 3 meters, and some products are required to be connected for more than 20 meters, 50 meters and even more than 100 meters. The longer the product requirement is, generally speaking, the larger the voltage drop is, the worse the consistency of the brightness of the head end and the tail end of the product is, in order to solve the problem, the traditional process is to thicken the copper of the circuit board, according to the requirement of the product, the copper thickness of the high-power LED lamp strip must be set to be more than 100 micrometers, and the high power and the length extension can be achieved, but the maximum value of the once etching depth of the copper in the traditional circuit board etching process is 70 micrometers, if the maximum value exceeds the thickness, the copper must be etched twice or more, and the pattern is reshaped, so that the conditions of double use of materials, deviation of the pattern, weakening of adhesive force and the like are inevitably caused. The manufacturing cost is greatly increased, and the quality of the product is greatly discounted! In addition to the electroplating process, which is a highly contaminated process, the cost of consumables and the purchase and use costs of various devices such as an exposure machine, a developing machine, a tin plating device, a tin stripping device are more than two to three times of the total manufacturing cost of the etching process, so that the processing process is not considered!
Besides, the difficulty in manufacturing the circuit layer and the insulating protection layer of the circuit board are also big problems, and the circuit board is protected by adopting the solder resist ink to perform insulating protection and a line gap with the thickness of more than 70 microns of copper, and the circuit board can be filled with the solder resist ink by applying the solder resist ink for two to three times. If the PI protective film or the PET protective film of the flexible circuit board is adopted, the wire gap of the copper thick circuit board with the thickness of more than 70 microns is formed, air must be in the middle of the wire gap and cannot be removed, and the wire gap is inevitably formed when the PI protective film or the PET protective film is mounted.
Specific examples are as follows: for example: customers require to manufacture a circuit board of the ultra-long LED lamp strip with the front surface copper being 50 microns and the back surface copper being 140 microns, and the traditional circuit board manufacturing process comprises the following steps:
the first electroplating and etching process includes the steps of selecting copper foil with 50 micron size on two sides, drilling through hole, electroplating to thicken, sticking dry film, exposing, developing, etching for the first time, demolding, sticking dry film, blasting, developing, etching for the second time, demolding, welding preventing and machining, and inspecting circuit board.
The second electroplating circuit pattern thickening process comprises the following manufacturing process:
selecting a base material of a copper foil with two sides of 50 micrometers → drilling a through hole → copper deposition → first electroplating → dry film pasting → exposure → development → second thickening electroplating → electric tin → film removing → etching → tin removing → solder resisting processing → finished product of the quality control circuit board.
The third method for mutually etching the blind hole plate comprises the following manufacturing processes:
selecting an insulating film with double-sided adhesive → a copper foil with 50 microns of front surface coating → a through hole drilling → a copper foil with 140 microns of back surface coating → a press-synthesized substrate → a dry film pasting → explosion → development → first etching → film removing → dry film pasting → exposure → development → second etching → film removing → solder resisting processing → finished product of the quality control circuit board.
In the first blind hole plate direct etching process, although the circuit board with the structure disclosed by the utility model also adopts an etching process, the circuit board does not need to adopt an electroplating process with serious pollution. The materials used by the ink are common etching-resistant ink, and dry films and developing liquid medicines which are higher in use cost and more difficult to treat in the environment are not needed. In addition, the traditional circuit board process adopts two times of etching, and then a four-sided dry film is needed, so that the material consumption is high, the processing cost is high, and the quality difficulty is high.
Meanwhile, as is well known, aluminum metal is very easy to oxidize, is easy to corrode under acid and alkali conditions, and cannot be directly used for mounting electronic components and soldering on the surface of aluminum. The double-sided integrated circuit board is provided with electronic components, and has another important function of conducting two layers of integrated circuits, and based on the reasons that aluminum is very easy to oxidize and is very easy to corrode by acid and alkali, the conducting methods such as an electroplating conducting method, a through silver conducting method, a through copper conducting method, a through carbon conducting method, a through tin welding conducting method and the like which are well known in the prior art can not safely and effectively conduct a double-sided circuit board with a double-sided aluminum structure or a double-sided aluminum-copper structure. Particularly, when the common soldering is adopted, irregular tin stacks are formed on the surface of the circuit board, and effective soldering conduction cannot be realized.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-power LED lamp strip aiming at the defects in the prior art. The circuit board is set to be a structure with three or more than three circuit layers, the circuit layer needing thick copper is divided into two thinner circuit layers, and the transmission effect of a single circuit layer with the sum of the thicknesses of copper foils of the two circuit layers is achieved. Simultaneously, solve the technical problem that aluminium can not the soldering when realizing the mixed conducting material circuit board that copper product and aluminium mix, realize that copper product and aluminum product can effectively the tin cream switch on, guarantee the tin cream simultaneously and form complete heap high state.
The technical scheme of the utility model is as follows: the utility model provides a high-power LED lamp area, includes first circuit layer, insulating layer, the second circuit layer of laminating in proper order, wherein: and a third circuit layer is arranged outside the second circuit layer, an adhesive layer is arranged between the third circuit layer and the second circuit layer for adhesion, and the second circuit layer and the third circuit layer mutually play a thickening role and keep conduction along the length direction.
According to the utility model adopting the technical scheme, the circuit board is set to be of a three-layer or more than three-layer circuit layer structure, the second circuit layer is also provided with the third circuit layer for thickening the second circuit layer, the circuit layer needing thick copper is divided into two thinner circuit layers, the sum of the electrical effects of the two circuit layers is achieved, the electrical effect of a single circuit layer is achieved, and the effects of saving material cost and reducing manufacturing difficulty are achieved.
In the high-power LED lamp strip, the second circuit layer and the third circuit layer are arranged uninterruptedly along the length direction. Through setting up along the incessant second circuit layer and the third circuit layer that sets up of length direction, realize the technological effect of the thickening effect of playing each other.
In the high-power LED strip, the first circuit layer, the second circuit layer and the third circuit layer are all copper foils, or one of the second circuit layer and the third circuit layer is an aluminum foil. The first circuit layer, the second circuit layer and the third circuit layer of the circuit board are all made of copper foil generally, and meanwhile, aluminum foil can be selected to be used as one of the second circuit layer and the third circuit layer, so that copper material and aluminum material are effectively combined and conducted, good heat conduction effect is achieved by utilizing the heat dissipation characteristic of the aluminum material while the copper material and the aluminum material are effectively conducted, and the circuit board has the technical effects of being safe, effectively transmitting signals, conducting heat, dissipating heat and prolonging the service life of electronic components. The technical effect of saving cost is realized under the condition of not influencing the quality and the efficacy of the product.
In the high-power LED lamp strip, the electronic element is attached to the first circuit layer. And mounting and conducting the electronic element through the positive and negative electrode combination of the first circuit layer.
In the high-power LED lamp strip, the second circuit layer and the third circuit layer are conducted in a soldering tin conduction mode, a laser welding conduction mode or an ultrasonic welding conduction mode.
In the high-power LED lamp strip, the adhesive layer is a conductive or non-conductive pure adhesive film or an insulating film with an adhesive on both sides.
When the conduction mode of the second circuit layer and the third circuit layer is that soldering tin is conducted, the conducting hole penetrating through the first circuit layer, the insulating layer, the second circuit layer and the adhesive layer is arranged at the corresponding position of the lamp strip, and solder paste is applied to the conducting hole to conduct the first circuit layer, the second circuit layer and the third circuit layer. First circuit layer, second circuit layer and third circuit layer are switched on simultaneously through the tin cream, realize second circuit layer and third circuit layer and play the thickening effect each other and keep the technological effect who switches on along length direction.
In the high-power LED lamp strip, the through hole penetrating through the first circuit layer and the insulating layer in the same position is larger than the through hole penetrating through the second circuit layer and the adhesive layer. Through the via hole that forms first circuit layer and insulating layer is greater than the via hole that passes second circuit layer and adhesive layer, realizes that whole via hole is the horn mouth, strengthens connecting the face when soldering through connection and guarantees the conduction effect.
When the high-power LED lamp strip is conducted through soldering tin, the first circuit layer, the second circuit layer and the third circuit layer apply solder paste when the electronic elements are pasted and conducted after passing through a soldering furnace.
When the first circuit layer and the third circuit layer are made of copper foils and the second circuit layer is made of aluminum foils, metal strips or metal sheets capable of being combined with tin soldering are arranged at the conducting holes and are subjected to tin soldering to form high-stacking conducting tin stacks. The metal bar or the metal sheet reduces the repulsion of the aluminum foil and the tin soldering, and helps the tin paste to form a complete high-stacking state conduction tin stack on the plate surface, so that the technical effect that the tin soldering conduction is not influenced when the aluminum foil replaces the copper foil and the tin soldering is adopted is realized. The technical problem that the aluminum cannot be soldered is solved when the mixed conductive material circuit board with the mixed copper material and the mixed aluminum is realized, the copper material and the aluminum material can be effectively soldered and conducted, and meanwhile, the complete stacking state of the solder paste is ensured. After tin welding, tin bodies in the conducting holes form tin piles on the surface of the first circuit layer board, effective welding conduction is formed on the surface of the third circuit layer board, and the aluminum foil layer of the second circuit layer is clamped and arranged in the first circuit layer board through riveting heads at two ends to achieve an effective conduction state. The technical problems that aluminum cannot be soldered and the aluminum material of the first circuit layer and the third circuit layer and the aluminum material of the second circuit layer can be effectively soldered and conducted are solved, and the technical effect that the aluminum cannot be soldered and the aluminum material of the first circuit layer and the third circuit layer falls off after being soldered is achieved. Simultaneously, effectively combine to switch on through copper product and aluminum product, realize that copper product and aluminum product can effectively switch on simultaneously through utilizing the realization of aluminum product heat radiation characteristic to have good heat conduction effect, have safety, transmission signal and heat conduction, heat dissipation effectively and let electronic components's the longer technological effect of life. The technical effect of saving cost is realized under the condition of not influencing the quality and the efficacy of the product.
Above-mentioned high-power LED lamp area, when first circuit layer and second circuit layer are the copper foil, third circuit layer is the aluminium foil, the adhesive layer at the via hole position corresponds sets up the through-hole, and second circuit layer and third circuit layer adopt laser welding or ultrasonic welding to form the solder joint and connect and switch on earlier. Through the through holes correspondingly arranged on the adhesive layers between the second circuit layer and the third circuit layer at the positions of the through holes, the technical effect that the second circuit layer and the third circuit layer are firstly conducted at the positions of the through holes by adopting laser welding or ultrasonic welding is achieved, and then solder paste is applied to the through holes from the first circuit layer to the second circuit layer to conduct the first circuit layer, the second circuit layer and the third circuit layer. Through copper product and aluminum product effective combination switch on, realize that copper product and aluminum product can effectively switch on simultaneously through utilizing the realization of aluminum product heat radiation characteristic to have good heat conduction effect, have safety, transmission signal and heat conduction effectively, heat dissipation and the longer technological effect of life who lets electronic components. The technical effect of saving cost is realized under the condition of not influencing the quality and the efficacy of the product.
According to the high-power LED lamp strip, the metal strip or the metal sheet is horizontally arranged on the via hole. The metal strip or the metal sheet is horizontally arranged on the through hole, so that the solder paste is helped to form a horizontal complete stacking state on the board surface.
Compared with the prior art, the product adopts common low-cost materials in a three-layer structure, separately processes the third circuit layer and the first and second circuit layers, and simply combines the three circuit layers after respective processing is finished, so that the product has the advantages of low material consumption, single processing combination, low product guarantee difficulty and great improvement of one-time yield. The die cutting process is a full-automatic integrated equipment processing process, only a die needs to be set, no printing ink, chemical products, water and waste gas are needed to be discharged, the consistency of the products is better, and the yield is higher.
Drawings
The utility model will be further described in detail with reference to examples of embodiments shown in the drawings to which, however, the utility model is not restricted.
FIG. 1 is a schematic cross-sectional view of a first embodiment of the present invention before completing a first conduction and a second conduction;
FIG. 2 is a schematic cross-sectional view of a completed through package in accordance with an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a second embodiment of the present invention after the package is completed;
FIG. 4 is a cross-sectional view of a three-pass package according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a completed triple-pass package in accordance with an embodiment of the present invention;
Detailed Description
As shown in fig. 1 to 5, a high-power LED lamp strip includes a first circuit layer 1, an insulating layer 2, and a second circuit layer 3, which are sequentially attached to each other, a third circuit layer 5 is further disposed outside the second circuit layer 3, an adhesive layer 4 is disposed therebetween for adhesion, and the second circuit layer 3 and the third circuit layer 5 perform a thickening function with each other and keep conducting along a length direction.
The second line layer 3 and the third line layer 5 are arranged uninterruptedly along the length direction.
The first circuit layer 1, the second circuit layer 3 and the third circuit layer 5 are all copper foils, or one of the second circuit layer 3 and the third circuit layer 5 is an aluminum foil.
The electronic component is attached to the first circuit layer 1.
The conduction mode of the second circuit layer 3 and the third circuit layer 5 is soldering tin conduction, laser welding conduction or ultrasonic welding conduction.
The adhesive layer 4 is a conductive or non-conductive pure adhesive film or an insulating film with adhesive on both sides.
When the conduction mode of the second circuit layer 3 and the third circuit layer 5 is the soldering tin conduction, the corresponding position of the lamp strip is provided with the conduction hole 6 which penetrates through the first circuit layer 1, the insulating layer 2, the second circuit layer 3 and the adhesive layer 4, and solder paste is applied to the conduction hole 6 to conduct the first circuit layer 1, the second circuit layer 3 and the third circuit layer 5.
The via hole through the first line layer 1 and the insulating layer 2 in the same position is larger than the via hole through the second line layer 3 and the adhesive layer 4.
When the soldering tin is conducted, the first circuit layer 1, the second circuit layer 3 and the third circuit layer 5 are applied with the soldering paste when the electronic components are pasted, and the first circuit layer, the second circuit layer and the third circuit layer are conducted after passing through the soldering furnace.
When the first and third circuit layers 1 and 5 are copper foils and the second circuit layer 3 is an aluminum foil, a metal bar or sheet 7 capable of being bonded by soldering is provided at the via hole 6, and a tin stack 8 is formed in a raised state when soldering is conducted.
When the first circuit layer 1 and the second circuit layer 3 are copper foils and the third circuit layer 5 is an aluminum foil, the adhesive layer 4 at the position of the through hole is correspondingly provided with a through hole, and the second circuit layer 3 and the third circuit layer 5 are firstly conducted by laser welding or ultrasonic welding.
A metal strip or sheet 7 is horizontally disposed over the via 6.
As shown in fig. 1 and fig. 2, in the first embodiment: first circuit layer 1, second circuit layer 3 and third circuit layer 5 all adopt the copper foil, first circuit layer 1, insulating layer 2, set up conducting hole 6 on second circuit layer 3 and the 4 relevant positions of adhesive layer, laminate first circuit layer 1 in proper order, insulating layer 2, second circuit layer 3, behind adhesive layer 4 and the third circuit layer 5, form first circuit layer 1 and lead to the conducting hole 6 on the third circuit layer 5, apply the tin cream and switch on first circuit layer 1 on conducting hole 6, second circuit layer 3 and third circuit layer 5, first circuit layer 1 and third circuit layer 5 are equipped with protective layer 9 outward.
As shown in fig. 1 and 3, the second embodiment: the first circuit layer 1 and the third circuit layer 5 both adopt copper foils, the second circuit layer 3 adopts aluminum foils, the corresponding positions of the first circuit layer 1, the insulating layer 2, the second circuit layer 3 and the adhesive layer 4 are provided with a via hole 6, wherein the adhesive layer 4 is a pure adhesive film, after the first circuit layer 1, the insulating layer 2, the second circuit layer 3, the adhesive layer 4 and the third circuit layer 5 are sequentially attached, the via hole 6 from the first circuit layer 1 to the third circuit layer 5 is formed, when the via hole 6 is applied with tin paste to conduct the first circuit layer 1, the second circuit layer 3 and the third circuit layer 5, a metal strip or a metal sheet 7 which can be combined with tin soldering is arranged at the via hole 6 to conduct tin soldering, and a protective layer 9 is arranged outside the first circuit layer 1 and the third circuit layer 5.
As shown in fig. 4 and 5, the third embodiment: first circuit layer 1 and second circuit layer 3 all adopt the copper foil, third circuit layer 5 adopts the aluminium foil, first circuit layer 1, set up conducting hole 6 on insulating layer 2 and the 4 relevant positions of adhesive layer, laminate first circuit layer 1 in proper order, insulating layer 2, second circuit layer 3, behind adhesive layer 4 and the third circuit layer 5, form first circuit layer 1 and lead to conducting hole 6 on the second circuit layer 3, second circuit layer 3 is relative with the through-hole that the third circuit layer 5 passes through adhesive layer 4, adopt laser welding or ultrasonic bonding to make second circuit layer 3 and third circuit layer 5 switch on earlier, apply the tin cream and switch on conducting hole 6 and switch on first circuit layer 1, second circuit layer 3 and third circuit layer 5, first circuit layer 1 and third circuit layer 5 are equipped with protective layer 9 outward.
As shown in fig. 1 and 3, the second embodiment has the following specific processing steps:
And 2, printing a first circuit layer on the copper surface of the base material according to the design requirement, and etching to prepare the first circuit layer for later use.
And 3, drilling a positioning hole on the semi-finished product material manufactured in the step 2, and drilling a through hole of the first circuit layer 1 and the insulating layer 2 according to design data by adopting a CNC drilling machine tool, wherein the through hole is a 6.2 mm-2.3 mm groove-shaped hole.
And 4, taking materials according to the design requirements of the second circuit layer 3, attaching the materials to an acid-resistant and alkali-resistant protective film, printing a circuit pattern of the second circuit layer 3, and etching for later use, wherein the second circuit layer of the embodiment is made of 70-micron pure aluminum foil.
And 5, attaching the second circuit layer manufactured in the step 4 to the adhesive film surface of the base material with the first circuit layer 1 and the conducting hole 6 manufactured in the step 3, and pressing and shaping the adhesive film surface by a fast press, wherein the pressing conditions of the fast press are as follows: the temperature is 180 ℃, the pressure is 120 kg, the prepressing is carried out for 15 seconds, and then the pressing is carried out for 80 seconds.
And 6, removing the acid-resistant and alkali-resistant protective film on the second circuit layer 3, and sticking an adhesive layer 4 (a pure adhesive film) on the exposed aluminum foil surface, wherein the pure adhesive film of the embodiment adopts an epoxy non-conductive adhesive film (commercially available in the market), and the thickness of the adhesive film is 25 micrometers.
And 7, positioning by using the positioning hole punched in the step 3 on the base material, and drilling a through hole of the second circuit layer 3 and the adhesive layer 4 (a pure glue film) on the semi-finished product after the step 6 by adopting a CNC drilling machine tool, wherein the through hole of the second circuit layer 3 and the adhesive layer 4 (the pure glue film) drilled in the step is smaller than the through hole of the first circuit layer 1 and the insulating layer 2 drilled in the step 3, the through hole drilled in the embodiment is three in-line through holes with the diameter of 1.3mm and the interval of 0.55mm, and is arranged in the middle of the through hole of the first circuit layer 1 and the insulating layer 4 drilled in the step 3.
And 8, taking 70-micrometer copper foil, covering the copper foil on the PI covering film, curing at 150 ℃ for 60min, printing ink on the copper foil according to a designed pattern, etching and the like to manufacture a third circuit layer 5.
And 9, pasting the copper surface of the third circuit layer 5 manufactured in the step 8 to the surface of the semi-finished pure rubber film manufactured in the step 7, and performing press molding by a fast press, wherein the press molding conditions are as follows: the temperature is 180 ℃, the pressure is 120 kg, the prepressing is carried out for 15 seconds, and then the pressing is carried out for 80 seconds.
And 10, manufacturing a front protective layer according to the design, attaching the front protective layer to the copper surface of the first circuit layer 2 of the semi-finished product manufactured in the step 9, and pressing and molding the front protective layer and the copper surface by a pressing machine, wherein the back protective layer of the circuit board is finished in the step 8.
And 11, carrying out anti-oxidation treatment on the semi-finished product printed with the characters in the step 10, and punching and forming to finish the circuit board part of the embodiment.
Step 12, manufacturing a steel mesh for printing the solder paste, and applying the solder paste on the manufactured circuit board, wherein the steel mesh with the thickness of 0.15mm is adopted in the embodiment, and the electronic element bonding pad adopts the following steps of 1: 1.1, and the window of the via hole adopts a ratio of 1: the ratio of 1.2 is stated.
And step 13, pasting electronic elements (lamp beads) on the circuit board printed with the solder paste, pasting metal strips or metal sheets 7 at the positions of the through holes 6, pasting the metal strips or the metal sheets 7 by using an automatic chip mounter after manual pasting or braiding, adopting copper strips with the diameter of 0.5mm and the length of 5.5mm in the embodiment, enabling the middle position to be positioned on the surface of the solder paste at the positions of the through holes 6, and completing pasting through reflow soldering.
And step 14, after the semi-finished product pasted with the electronic element and the metal strip is initially measured, connecting the semi-finished product end to form a 20-meter strip-shaped strip and connecting a wire end, so that the 20-meter high-power LED lamp strip is finished.
The utility model discloses a functional data detection table:
| length of | Rated voltage | Lamp bead/meter | Electric current | Total power | Head end voltage | Tail end voltage | Pressure drop |
| 20m | 24V | 120 | 5.53A | 135 watt | 23.8V | 20.5V | 3.3V |
| 10 m | 24V | 120 | 3.72A | 92W | 23.8V | 22.8V | 1.0V |
According to the measurement results, the 20-meter long high-power lamp strip for the 24V 120 lamp can reach the current of 5.53A and the total power of 135 watts, and the tail end voltage drop is controlled within 3.3V, so that the result is satisfactory.
Synthesize the preparation flow of this embodiment and see that do not need electroplating, do not need chemical materials such as costly dry film, do not need repeated preparation, 140 microns that will be thicker back line split into two thinner (70 microns) circuit layers to bond together through the pure glued membrane, form after the tin soldering and reach 140 microns, the high-power LED lamp area product of gross thickness, and change second circuit layer into the aluminium foil preparation, still greatly reduced the use cost of material when having reduced the preparation degree of difficulty.
In summary, the actual samples of the present invention are prepared according to the description and the drawings, and after a plurality of usage tests, the effect of the usage tests proves that the present invention can achieve the expected purpose, and the practical value is undoubted. The above examples are provided only for the convenience of illustration of the present invention and are not intended to limit the present invention in any way, for example, copper clad aluminum foil may be used in this patent as equivalent to pure copper foil. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the utility model.
Claims (12)
1. The utility model provides a high-power LED lamp area, includes first circuit layer (1), insulating layer (2), second circuit layer (3) of laminating in proper order, its characterized in that: the second circuit layer (3) is also provided with a third circuit layer (5) outside, an adhesive layer (4) is arranged between the third circuit layer and the third circuit layer for adhesion, and the second circuit layer (3) and the third circuit layer (5) have a thickening effect mutually and keep conduction along the length direction.
2. A high power LED strip according to claim 1, wherein: the second circuit layer (3) and the third circuit layer (5) are arranged uninterruptedly along the length direction.
3. A high power LED strip according to claim 1, wherein: the first circuit layer (1), the second circuit layer (3) and the third circuit layer (5) are all copper foils, or one of the second circuit layer (3) and the third circuit layer (5) is an aluminum foil.
4. A high power LED strip according to claim 1, wherein: the electronic element is attached to the first circuit layer (1).
5. A high power LED strip according to claim 1 or 3, wherein: the conduction mode of the second circuit layer (3) and the third circuit layer (5) is soldering tin conduction, laser welding conduction or ultrasonic welding conduction.
6. A high power LED strip according to claim 1, wherein: the adhesive layer (4) is a conductive or non-conductive pure adhesive film or an insulating film with adhesive on both sides.
7. A high power LED strip according to claim 5, wherein: when the conduction mode of the second circuit layer (3) and the third circuit layer (5) is conducted by soldering tin, a conduction hole (6) penetrating through the first circuit layer (1), the insulating layer (2), the second circuit layer (3) and the adhesive layer (4) is arranged at the corresponding position of the lamp strip, and solder paste is applied to the conduction hole (6) to conduct the first circuit layer (1), the second circuit layer (3) and the third circuit layer (5).
8. A high power LED strip according to claim 7, wherein: the via hole passing through the first circuit layer (1) and the insulating layer (2) in the same position is larger than the via hole passing through the second circuit layer (3) and the adhesive layer (4).
9. A high power LED strip according to claim 5, 7 or 8, wherein: when the soldering tin is conducted, the first circuit layer (1), the second circuit layer (3) and the third circuit layer (5) are applied with solder paste when the electronic elements are pasted and conducted after passing through a soldering furnace.
10. A high power LED strip according to claim 5, 7 or 8, wherein: when the first circuit layer (1) and the third circuit layer (5) are copper foils and the second circuit layer (3) is an aluminum foil, metal strips or metal sheets (7) capable of being combined with soldering are arranged at the through holes (6), and a tin stack (8) in a stack shape is formed when the soldering is conducted.
11. A high power LED strip according to claim 5, 7 or 8, wherein: when the first circuit layer (1) and the second circuit layer (3) are made of copper foil and the third circuit layer (5) is made of aluminum foil, the adhesive layer (4) at the position of the through hole is correspondingly provided with a through hole, and the second circuit layer (3) and the third circuit layer (5) are welded by laser welding or ultrasonic welding to form a welding spot which is firstly conducted.
12. A high power LED strip according to claim 10, wherein: the metal strip or the metal sheet (7) is horizontally arranged on the through hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122463031.9U CN216113505U (en) | 2021-10-12 | 2021-10-12 | High-power LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122463031.9U CN216113505U (en) | 2021-10-12 | 2021-10-12 | High-power LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216113505U true CN216113505U (en) | 2022-03-22 |
Family
ID=80692327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122463031.9U Active CN216113505U (en) | 2021-10-12 | 2021-10-12 | High-power LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216113505U (en) |
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2021
- 2021-10-12 CN CN202122463031.9U patent/CN216113505U/en active Active
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