CN114434046A - Flux composition, solder composition, and method for manufacturing electronic substrate - Google Patents
Flux composition, solder composition, and method for manufacturing electronic substrate Download PDFInfo
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- CN114434046A CN114434046A CN202111282359.9A CN202111282359A CN114434046A CN 114434046 A CN114434046 A CN 114434046A CN 202111282359 A CN202111282359 A CN 202111282359A CN 114434046 A CN114434046 A CN 114434046A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The flux composition of the present invention is a flux composition containing (a) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an antioxidant, and is characterized in that: the component (D) contains (D1) a compound represented by the following structural formula (D1), and the amount of the component (D) is 4% by mass or more with respect to 100% by mass of the flux composition.
Description
Technical Field
The invention relates to a flux composition, a solder composition and a method for manufacturing an electronic substrate.
Background
The solder composition is a mixture obtained by mixing a flux composition (a composition containing a rosin-based resin, an activator, a solvent, and the like) and solder powder into a paste. In this solder composition, solderability such as solder meltability, a property that solder is easily spread by wetting (solder spreading by wetting), and the like are required. In order to satisfy these requirements, an activator and the like in a flux composition have been studied (for example, document 1 (japanese patent application laid-open No. 2013-169557)).
On the other hand, mobile terminals such as smartphones are being miniaturized and multi-functionalized. Electronic components used for these devices are also miniaturized. A small amount of solder composition is required to bond pads of a minute area of such an electronic component. In addition, solder compositions are also used for large substrates. When a solder composition is used for the large-sized substrate, it is necessary to extend the preheating time in the reflow process. In addition, in the case of a large substrate, the heat capacity is large, and it takes time to reach the preheating temperature, and as a result, the time for heating the substrate in the reflow furnace tends to be long. In such a case, an activator such as a low molecular weight organic acid is easily deactivated, and meltability in a minute area is reduced. On the other hand, when the amount of the activator is increased, a problem of copper corrosion is likely to occur. As described above, there is a need for a solder composition that can cope with miniaturization of electronic parts and also with large-sized substrates.
Disclosure of Invention
Technical problem to be solved by the invention
The purpose of the present invention is to provide a flux composition, a solder composition, and a method for manufacturing an electronic substrate, which have excellent meltability in a minute area and can suppress copper corrosion.
Means for solving the problems
According to one aspect of the present invention, there is provided a flux composition comprising (a) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an antioxidant, wherein the component (D) comprises (D1) a compound represented by the following structural formula (D1), and the amount of the component (D) is 4% by mass or more relative to 100% by mass of the flux composition,
in the flux composition according to one embodiment of the present invention, it is preferable that the component (D) further contains (D2) an antioxidant having a hindered phenol structure (excluding the component (D1)).
In the flux composition according to one embodiment of the present invention, the component (B) preferably contains an organic acid having 10 or more carbon atoms (B1), and the amount of the component (B1) is 8 to 20 mass% with respect to 100 mass% of the flux composition.
In the flux composition according to one embodiment of the present invention, the amount of (a) is preferably 30 mass% or more and 70 mass% or less with respect to 100 mass% of the flux composition.
In one embodiment of the present invention, there is provided a solder composition comprising the flux composition of one embodiment of the present invention and (E) solder powder.
In the solder composition according to one embodiment of the present invention, the solder alloy in the component (E) preferably contains at least 1 selected from the group consisting of tin, copper, zinc, silver, antimony, lead, indium, bismuth, nickel, gold, cobalt, and germanium.
In accordance with one aspect of the present invention, there is provided a method for manufacturing an electronic substrate soldered with a solder composition according to one aspect of the present invention, the method comprising: and a reflow step of disposing the electronic component on the solder composition and heating the electronic component in a reflow furnace, wherein the time for reaching the melting temperature in the reflow step is 330 seconds or more.
Effects of the invention
The flux composition, the solder composition, and the method for manufacturing an electronic substrate are capable of suppressing copper corrosion while having excellent meltability in a minute area.
Detailed Description
[ flux composition ]
First, a flux composition used in the present embodiment will be described. The flux composition used in the present embodiment is a component other than the solder powder in the solder composition, and contains (a) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an antioxidant, which are described below.
[ (A) component ]
Examples of the rosin-based resin (a) used in the present embodiment include rosins and rosin-based modified resins. Examples of the rosin include gum rosin, wood rosin, and tall oil rosin. Examples of the rosin-based modified resin include disproportionated rosin, polymerized rosin, hydrogenated rosin, and derivatives thereof. Examples of hydrogenated rosins include: hydrogenated products of unsaturated organic acid-modified rosins (also referred to as "hydrogenated acid-modified rosins") which are modified rosins of fully hydrogenated rosins, partially hydrogenated rosins, and unsaturated organic acids (aliphatic unsaturated monobasic acids such as (meth) acrylic acid, aliphatic unsaturated dibasic acids such as α, β -unsaturated carboxylic acids such as fumaric acid and maleic acid, unsaturated carboxylic acids having an aromatic ring such as cinnamic acid, and the like). These rosin-based resins may be used singly or in combination of two or more.
The amount of the component (a) is preferably 30 to 70 mass%, more preferably 34 to 60 mass%, and particularly preferably 35 to 50 mass% with respect to 100 mass% of the flux composition. (A) When the amount of the component is not less than the lower limit, solderability, which is a property of preventing oxidation of the copper foil surface of the solder pad and making the surface of the solder pad easily wet with molten solder, can be improved and solder balls can be sufficiently suppressed. When the amount of the component (a) is not more than the upper limit, the flux residue can be sufficiently suppressed.
[ (B) component ]
The activator (B) used in the present embodiment preferably contains (B1) an organic acid having 10 or more (more preferably 11 or more) carbon atoms. Even when the preheating time is long, the component (B1) is less likely to be deactivated, and the meltability in a minute area can be improved. Further, this component (B1) tends to be less likely to cause copper corrosion.
Examples of the (B1) component include: dodecanedioic acid, eicosanedioic acid, dimer acid, trimer acid, 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, 1, 4-dihydroxy-2-naphthoic acid, and the like. These may be used alone or in combination of two or more.
The amount of the component (B1) is preferably 8 to 20 mass%, more preferably 10 to 18 mass%, based on 100 mass% of the flux composition. (B1) When the amount of the component is not less than the lower limit, the melting property in a minute area tends to be improved, and when the amount is not more than the upper limit, the insulating property of the flux composition tends to be maintained.
The component (B) may contain (B2) an organic acid having less than 10 carbon atoms within a range that can achieve the effects of the present invention. However, since such a low molecular weight organic acid having less than 10 carbon atoms is easily deactivated and easily causes copper corrosion when the preheating time is long, it is preferable that the component (B2) is not contained as the activator (B) used in the present embodiment.
Examples of the component (B2) include monocarboxylic acids having 10 or less carbon atoms, dicarboxylic acids, and other organic acids.
Examples of the monocarboxylic acid having less than 10 carbon atoms include: formic acid, acetic acid, propionic acid, and butyric acid, and the like.
Examples of the dicarboxylic acid having less than 10 carbon atoms include: oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and the like.
Examples of the other organic acid having less than 10 carbon atoms include: lactic acid, benzoic acid, salicylic acid, citric acid, and the like.
The component (B) may further contain other activators (e.g., (B3) halogen activators and (B4) amine activators) in addition to the component (B1) within a range not to impair the effects of the present invention. However, since the component (B3) is likely to cause copper corrosion, the component (B) preferably contains only the component (B1). The total amount of the component (B1) is preferably 85 mass% or more, more preferably 90 mass% or more, and particularly preferably 95 mass% or more, based on 100 mass% of the component (B).
The amount of the component (B) is preferably 8 to 25 mass%, more preferably 10 to 20 mass%, and particularly preferably 12 to 18 mass% with respect to 100 mass% of the flux composition. (B) When the amount of the component is not less than the lower limit, the activating action tends to be improved, while when the amount is not more than the upper limit, the insulating property of the flux composition tends to be maintained.
[ (C) component ]
As the solvent (C) used in the present embodiment, a known solvent can be suitably used. As such a solvent, a solvent having a boiling point of 170 ℃ or higher is preferably used.
Examples of such solvents include: diethylene glycol, dipropylene glycol, triethylene glycol, hexanediol, 1, 5-pentanediol, methyl carbitol, butyl carbitol, 2-ethylhexyl diglycol, octanediol, phenyl glycol, diethylene glycol monohexyl ether (DEH), tetraethylene glycol dimethyl ether (MTEM), dibutyl maleic acid, and the like. These solvents may be used alone or in combination of two or more.
The amount of component (C) is preferably 10 to 60 mass%, more preferably 20 to 50 mass%, based on 100 mass% of the flux composition. When the amount of the solvent is within the above range, the viscosity of the obtained solder composition can be appropriately adjusted to an appropriate range.
[ (D) component ]
The antioxidant (D) used in the present embodiment needs to contain (D1) a compound represented by the following structural formula (D1). The (D1) component can improve the meltability in a minute area and suppress copper corrosion caused by the (B) component. The component (D1) is N, N' -bis {3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl } hydrazine.
The amount of the component (D1) is preferably 0.1 to 10 mass%, more preferably 0.2 to 5 mass%, and particularly preferably 0.5 to 2 mass% with respect to 100 mass% of the flux composition. (D1) When the amount of the component (b) is within the above range, the meltability in a minute area can be improved and the copper corrosion can be suppressed.
From the viewpoint of meltability in a minute area and suppression of copper corrosion, it is preferable that the component (D) further contains (D2) an antioxidant having a hindered phenol structure (excluding the component (D1)).
Examples of the (D2) component include: pentaerythritol tetrakis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propanoic acid ] [ ethylene bis (oxyethylene) ] and N, N' -bis [2- [2- (3, 5-di-tert-butyl-4-hydroxyphenyl) ethylcarbonyloxy ] ethyl ] oxamide and the like.
In the case of using the (D2) component, the mass ratio of the (D2) component to the (D1) component ((D2)/(D1)) is preferably 1 to 10, more preferably 2 to 9, and particularly preferably 4 to 8, from the viewpoint of the balance between the solder fusibility and other physical properties.
The (D) component may further contain other antioxidant (hereinafter, referred to as (D3) component) in addition to the (D1) component and the (D2) component within a range not to impair the effects of the present invention. However, it is preferable that the (D) component contains only the (D1) component or contains only the (D1) component and the (D2) component. The total amount of the component (D1) and the component (D2) is preferably 85 mass% or more, more preferably 90 mass% or more, and particularly preferably 95 mass% or more, based on 100 mass% of the component (D).
Examples of the (D3) component include: sulfur compounds (e.g., 3' -didodecyl thiodipropionate), benzotriazole compounds (e.g., 1,2, 3-benzotriazole), and phosphite compounds.
The amount of component (D) needs to be 4 mass% or more with respect to 100 mass% of the flux composition. (D) When the amount of the component (b) is less than 4% by mass, the meltability in a minute area becomes insufficient or copper corrosion occurs. From the viewpoint of the balance between the solder fusibility and other physical properties, the amount of the component (D) is preferably 4 mass% or more and 15 mass% or less, more preferably 4.5 mass% or more and 10 mass% or less, and particularly preferably 5 mass% or more and 8 mass% or less.
[ thixotropic agent ]
The flux composition of the present embodiment preferably further contains a thixotropic agent from the viewpoint of printability and the like. Examples of the thixotropic agent used herein include: solidified castor oil, amides, kaolin, colloidal silicon dioxide, organic bentonite, glass powder and the like. These may be used alone or in combination of two or more.
The amount of the thixotropic agent is preferably 1 mass% to 20 mass%, more preferably 2 mass% to 12 mass%, based on 100 mass% of the flux composition. When the amount is less than the lower limit, thixotropy is not obtained and sagging tends to occur easily, while when it exceeds the upper limit, thixotropy is too high and poor printing tends to occur easily.
[ other ingredients ]
The flux composition used in the present embodiment may contain, in addition to the component (a), the component (B), the component (C), the component (D), and the thixotropic agent, other additives and other resins as needed. Examples of other additives include: defoaming agents, modifiers, matting agents, foaming agents, and the like. The amount of these additives is preferably 0.01 to 5 mass% based on 100 mass% of the flux composition. Examples of the other resin include acrylic resins and polybutadiene.
[ solder composition ]
Next, the solder composition of the present embodiment will be explained. The solder composition of the present embodiment contains the flux composition of the present embodiment and (E) solder powder described below.
The amount of the flux composition to be added is preferably 5 to 35 mass%, more preferably 7 to 15 mass%, and particularly preferably 8 to 12 mass% with respect to 100 mass% of the solder composition. When the amount of the flux composition to be mixed is less than 5 mass% (when the amount of the solder powder to be mixed exceeds 95 mass%), the flux composition as a binder is insufficient, and therefore, it tends to be difficult to mix the flux composition and the solder powder, whereas when the amount of the flux composition to be mixed exceeds 35 mass% (when the amount of the solder powder to be mixed is less than 65 mass%), it tends to be difficult to form a sufficient solder joint when the obtained solder composition is used.
[ (E) ingredient ]
The solder powder (E) used in the present invention preferably contains only Lead-free (Lead-free) solder powder, but may be Lead-containing solder powder. The solder alloy In the solder powder preferably contains at least 1 kind selected from tin (Sn), copper (Cu), zinc (Zn), silver (Ag), antimony (Sb), lead (Pb), indium (In), bismuth (Bi), nickel (Ni), gold (Au), cobalt (Co), and germanium (Ge).
As the solder alloy in the solder powder, an alloy containing tin as a main component is preferable. Further, the solder alloy more preferably contains tin, silver, and copper. Further, as the additive element, the solder alloy may contain at least one of antimony, bismuth, and nickel. With the flux composition of the present embodiment, generation of voids can be suppressed even when a solder alloy containing an additive element that is easily oxidized, such as antimony, bismuth, and nickel, is used.
Here, the lead-free solder powder refers to a powder of a solder metal or alloy to which lead is not added. However, lead is allowed to exist as an unavoidable impurity in the lead-free solder powder, and in this case, the amount of lead is preferably 300 mass ppm or less.
Specific examples of the alloy system of the lead-free solder powder include: Sn-Ag-Cu system, Sn-Ag system, Sn-Bi system, Sn-Ag-Cu-Ni system, Sn-Ag-Cu-Bi-Sb system, Sn-Ag-Bi-In system, Sn-Ag-Cu-Bi-In-Sb system, and the like.
(E) The average particle size of the component (A) is usually 1 to 40 μm, but from the viewpoint of coping with an electronic substrate having a narrow land pitch, it is more preferably 1 to 35 μm, still more preferably 2 to 35 μm, and particularly preferably 3 to 32 μm. The average particle diameter can be measured by a dynamic light scattering particle diameter measuring apparatus.
[ method for producing solder composition ]
The solder composition of the present embodiment can be produced by: the flux composition described above and the solder powder (E) described above are mixed in the given ratio and stirred and mixed.
[ method for producing electronic substrate ]
Next, a method for manufacturing an electronic substrate according to the present embodiment will be described. The method for manufacturing an electronic substrate according to the present embodiment is characterized by using the solder composition described above. According to the method for manufacturing an electronic substrate of the present embodiment, an electronic substrate can be manufactured by mounting an electronic component on an electronic substrate (a printed circuit board or the like) using the solder composition.
The solder composition of the present embodiment is excellent in meltability in a minute area and can suppress copper corrosion. Therefore, the electronic component can be miniaturized and can be applied to a large substrate.
Examples of the coating apparatus used herein include: screen printers, metal mask printers, dispensers, spray dispensers, and the like.
Further, the electronic component can be mounted on the electronic substrate by a reflow step of disposing the electronic component on the solder composition applied by the application device, and heating the electronic component in a reflow furnace under a predetermined condition to mount the electronic component on the printed wiring board.
In the reflow step, the electronic component is placed on the solder composition and heated in a reflow furnace under a predetermined condition. By this reflow process, sufficient solder bonding can be performed between the electronic component and the printed circuit board. As a result, the electronic component can be mounted on a printed circuit board or the like.
The reflow conditions may be appropriately set according to the melting point of the solder. For example, the preheating temperature is preferably 140 ℃ to 200 ℃. From the viewpoint of handling a large substrate, the preheating time is preferably 100 seconds to 250 seconds, and more preferably 120 seconds to 200 seconds. The peak temperature is preferably 230 ℃ to 270 ℃ inclusive, more preferably 240 ℃ to 255 ℃ inclusive. From the viewpoint of handling large substrates, the holding time at a temperature of 220 ℃ or higher is preferably 40 seconds to 160 seconds, and more preferably 100 seconds to 150 seconds.
From the viewpoint of handling large-sized substrates, the time for reaching the preheating temperature (for example, 140 ℃) is preferably 180 seconds or more, more preferably 200 seconds or more, and particularly preferably 220 seconds or more and 500 seconds or less. From the viewpoint of handling a large substrate, the arrival time of the melting temperature (for example, 220 ℃) is preferably 330 seconds or more, more preferably 350 seconds or more, and particularly preferably 360 seconds or more and 700 seconds or less.
As the reflow conditions described above are applied, the longer the solder powder is exposed to the reflow furnace, the more the solder powder is oxidized, and the solder fusibility tends to deteriorate. In contrast, the solder composition of the present embodiment can cope with such reflow conditions.
The solder composition and the electronic board according to the present embodiment are not limited to the above-described embodiments, and modifications, improvements, and the like within a range that can achieve the object of the present invention are also included in the present invention.
For example, the electronic substrate is not limited to the above, but the printed circuit board and the electronic component are bonded by a reflow process. For example, instead of the reflow step, the printed wiring board and the electronic component can be bonded by a step of heating the solder composition with a laser (laser heating step). In this case, the laser light source is not particularly limited, and can be suitably used according to the wavelength matching the absorption band of the metal. Examples of the laser light source include: solid-state laser (ruby, glass, YAG, etc.), semiconductor laser (GaAs, InGaAsP, etc.), liquid laser (dye, etc.), and gas laser (He-Ne, Ar, CO)2And excimer molecules, etc.).
Examples
The present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to these examples. Materials used in examples and comparative examples are shown below.
(component (A))
Rosin resin: hydrogenated acid-modified rosin available under the trade name "PINECRYSTALKE-604", available from Micahuan chemical industries, Ltd
((B1) component)
An organic acid A: 3-hydroxy-2-naphthoic acid
Organic acid B: dodecanedioic acid
An organic acid C: dimer acid, product name "UNIDYME 14", manufactured by ARIZNA CHEMICAL Co
An organic acid D: trimer acid (trimer acid content 90% by mass or more) under the trade name "Floradex 6500", manufactured by Florachem
((B2) component)
An organic acid E: succinic acid
An organic acid F: glutaric acid
An organic acid G: adipic acid
Organic acid H: suberic acid
(component (C))
Solvent A: diethylene glycol monohexyl ether (DEH, hexyldiglycol) solvent B: tetraethylene glycol dimethyl ether (trade name: HAISORUBU (ハイソルブ) MTEM, manufactured by Toho chemical industries Co., Ltd
((D1) component)
Antioxidant A: n, N' -bis {3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl } hydrazine, trade name "IRGANOX MD 1024", manufactured by BASF JAPAN
((D2) component)
And (3) antioxidant B: bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionic acid ] [ ethylenebis (oxyethylene) ], product name "IRGANOX 245", manufactured by BASF corporation
And (3) antioxidant C: pentaerythrityl tetrakis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], trade name "ANOX 20"
And (3) antioxidant D: n, N' -bis [2- [2- (3, 5-di-tert-butyl-4-hydroxyphenyl) ethylcarbonyloxy ] ethyl ] oxamide, trade name "NAUGARD XL-1", manufactured by SHIRAISHI CALCIUM
((D3) component)
And (3) antioxidant E: 1,2, 3-benzotriazole under the trade name "VERZONE Crysta", manufactured by DAHEXANE CHEMICAL CO., LTD
(other Components)
Thixotropic agent: trade name "SLIPACKS H", manufactured by Nippon chemical Co., Ltd
((E) component)
Solder powder: the alloy composition is Sn-3.0Ag-0.5Cu, the grain size distribution is 15-25 μm, the melting point of the solder is 217-220 DEG C
[ example 1]
35 mass% of rosin resin, 4 mass% of organic acid a, 4 mass% of organic acid B, 4 mass% of organic acid C, 32.5 mass% of solvent a, 8 mass% of solvent B, 0.5 mass% of antioxidant a, 4 mass% of antioxidant B, and 8 mass% of thixotropic agent were put in a container and mixed by a planetary mixer to obtain a flux composition.
Then, 11.8 mass% of the obtained flux composition and 88.2 mass% (total 100 mass%) of the solder powder were put into a container and mixed by a planetary mixer to prepare a solder composition.
[ examples 2 to 6]
Solder compositions were obtained in the same manner as in example 1 except that the respective materials were blended in accordance with the compositions shown in table 1.
[ comparative examples 1 to 11]
Solder compositions were obtained in the same manner as in example 1, except that the respective materials were blended in accordance with the compositions shown in table 1.
< evaluation of solder composition >
The evaluation of the solder composition (melting property of fine pads, copper corrosion, solder balls, voids) was performed by the following method. The obtained results are shown in table 1. Note that, for solder compositions having a problem in characteristics, some evaluations concerning viscosity stability and wettability are omitted.
(1) Fusibility of micro bonding pad
The solder composition was printed on the substrate using a metal mask having a thickness of 0.08 mm. Test patterns of copper foil pads having diameters of 0.28mm, 0.26mm, 0.24mm, 0.22mm and 0.20mm were printed 100 by 100 for each. Then, the test substrate was prepared by refluxing under conditions of a preheating temperature of 140 to 200 ℃ for 160 seconds (an arrival time at 140 ℃ is 235 seconds), a holding time at 220 ℃ or higher for 120 seconds (an arrival time at 220 ℃ (melting temperature) is 413 seconds), and a peak temperature of 250 ℃. The test substrate was observed by a microscope to measure the diameter (unit: mm. phi.) of the minimum fusion bonding pad. The smaller the diameter, the more excellent the meltability. From the viewpoint of excellent meltability in a minute area, the minimum fusion pad preferably has a diameter of 0.20 mm.
(2) Corrosion of copper
Copper foil corrosion test was performed based on the method described in IPC TM6502.6.15C to evaluate copper corrosion. The copper foil was judged to be "a" when the copper foil passed the corrosion test result, and was judged to be "C" in the other cases.
(3) Solder ball
The solder composition was printed on a substrate using a metal mask having a thickness of 0.08mm, a Quad Flat Package (QFP) having a pitch of 0.8mm was mounted, and a reflow process was performed under the same conditions as for the evaluation of the meltability of the fine pad to prepare a substrate for evaluation. The slit portion of the QFP was observed with a magnifying glass, and the number of solder balls generated between the slits was counted. Then, the solder ball was evaluated according to the following criteria.
A: the number of balls generated per pin is 10 or less.
B: the number of balls generated per pin is more than 10 and 30 or less.
C: the number of balls produced per pin exceeds 30.
(4) Voids
The solder composition was printed on a substrate using a metal mask having a thickness of 0.08mm, and a Quad Flat Non-leaded package (QFN) having a pitch of 0.5mm was mounted thereon, and a reflow treatment was performed under the same conditions as those for evaluating the meltability of the fine pad to prepare a substrate for evaluation. Further, as an X-ray inspection apparatus, "NLX-5000", manufactured by famous-ancient motor industries, was used to measure the void, and the void area ratio [ (total void area/total land area) × 100] in the land portion of QFN was calculated using a standard application program of the apparatus. Then, the voids were evaluated according to the following criteria.
A: the void area ratio is 20% or less.
B: the void area ratio is more than 20% and 25% or less.
C: the void area ratio exceeds 25%.
From the results shown in table 1, it was confirmed that all the results of the melting property of the fine pad, the copper corrosion, the solder ball, and the void of the solder composition of the present invention (examples 1 to 6) were good.
Therefore, it was confirmed that the solder composition of the present invention has excellent melting properties in a minute area and can suppress copper corrosion.
Claims (7)
1. A flux composition comprising (A) a rosin-based resin, (B) an activator, (C) a solvent and (D) an antioxidant,
the component (D) contains (D1) a compound represented by the following structural formula (D1),
the amount of the component (D) is 4% by mass or more based on 100% by mass of the flux composition,
2. the solder flux composition of claim 1,
the (D) component further contains (D2) an antioxidant having a hindered phenol structure, in addition to the (D1) component.
3. The solder flux composition of claim 1,
the component (B) contains (B1) an organic acid having 10 or more carbon atoms,
the amount of the (B1) is 8 to 20 mass% based on 100 mass% of the flux composition.
4. The solder flux composition of any one of claims 1 to 3, wherein,
the amount of the (A) is 30 to 70 mass% with respect to 100 mass% of the flux composition.
5. A solder composition comprising:
the solder flux composition of any one of claims 1 to 4, and
(E) and (3) solder powder.
6. The solder composition of claim 5, wherein,
the solder alloy in the component (E) contains at least 1 selected from tin, copper, zinc, silver, antimony, lead, indium, bismuth, nickel, gold, cobalt, and germanium.
7. A method for manufacturing an electronic substrate, which is a method for manufacturing an electronic substrate soldered using the solder composition according to claim 5 or claim 6, the method comprising:
a reflow step of disposing an electronic component on the solder composition and heating the electronic component in a reflow furnace,
the time for reaching the melting temperature in the reflow step is 330 seconds or more.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182882A JP7220694B2 (en) | 2020-10-30 | 2020-10-30 | FLUX COMPOSITION, SOLDER COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE |
| JP2020-182882 | 2020-10-30 |
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| CN114434046A true CN114434046A (en) | 2022-05-06 |
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| CN202111282359.9A Pending CN114434046A (en) | 2020-10-30 | 2021-11-01 | Flux composition, solder composition, and method for manufacturing electronic substrate |
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| JP (1) | JP7220694B2 (en) |
| CN (1) | CN114434046A (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| JP5887330B2 (en) * | 2013-12-26 | 2016-03-16 | 株式会社タムラ製作所 | Solder composition and printed wiring board using the same |
| JP6310894B2 (en) * | 2015-09-30 | 2018-04-11 | 株式会社タムラ製作所 | Solder composition and method for producing electronic substrate |
| JP6826059B2 (en) * | 2018-01-31 | 2021-02-03 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic substrate |
| JP6684372B2 (en) * | 2018-03-29 | 2020-04-22 | 株式会社タムラ製作所 | Solder composition for dispensing application |
| JP6575705B1 (en) * | 2019-03-05 | 2019-09-18 | 千住金属工業株式会社 | Flux and solder paste |
| JP7133579B2 (en) * | 2020-03-26 | 2022-09-08 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
-
2020
- 2020-10-30 JP JP2020182882A patent/JP7220694B2/en active Active
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- 2021-11-01 CN CN202111282359.9A patent/CN114434046A/en active Pending
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| JP2022073104A (en) | 2022-05-17 |
| JP7220694B2 (en) | 2023-02-10 |
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