CN114340212B - Manufacturing method of circuit board golden finger slope structure and circuit board golden finger - Google Patents
Manufacturing method of circuit board golden finger slope structure and circuit board golden finger Download PDFInfo
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- CN114340212B CN114340212B CN202111618342.6A CN202111618342A CN114340212B CN 114340212 B CN114340212 B CN 114340212B CN 202111618342 A CN202111618342 A CN 202111618342A CN 114340212 B CN114340212 B CN 114340212B
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- slope
- circuit board
- golden finger
- film
- etching
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 36
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052737 gold Inorganic materials 0.000 claims abstract description 24
- 239000010931 gold Substances 0.000 claims abstract description 24
- 239000003814 drug Substances 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000011161 development Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 238000012545 processing Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 9
- 239000012466 permeate Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical group [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a circuit board golden finger slope structure and a circuit board golden finger, wherein the manufacturing method of the circuit board golden finger slope structure comprises the following steps: taking a circuit board with an outer layer circuit processed, wherein the circuit board is provided with a golden finger which is connected with the outer layer circuit; film pressing: pressing a layer of dry film on the circuit board, wherein the dry film is attached to the golden finger, the pressure range of the film pressing is 5.5kg/cm < 2 > to 6.5kg/cm < 2 >, and the temperature range of the film pressing is 115 ℃ to 125 ℃; and (3) exposure and development: the negative film is placed in alignment with a circuit in a circuit board pressed with a dry film, the front end of the gold finger of the negative film is designed to be light-blocking, and an exposure machine is used for exposing the circuit board; developing by using a developing solution after exposure to expose the front end of the golden finger; etching a slope: side etching is carried out by utilizing the edge of the liquid medicine, and the front end of the golden finger is corroded into a slope; film stripping: the dry film is removed by using a stripping solution. The golden finger slope is processed by adopting the manners of windowing and etching the slope with a dry film, so that the processing cost is low and the plugging effect is better.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a circuit board golden finger slope structure and a circuit board golden finger using the manufacturing method of the circuit board golden finger slope structure.
Background
The golden finger board in the printed circuit board is a common type, and the board structure is generally that strip-shaped bonding pads which are arranged in order are arranged at the edge of the board in a protruding way, and the board and the device are communicated through corresponding finger bonding pad pins. In order to ensure the wear resistance of the plug and improve the number of times of the plug, the golden finger is generally subjected to gold plating treatment, and in addition, in order to facilitate the plug operation, the front end of the golden finger is subjected to chamfering treatment, but the structure still has the problem that the copper layer is not consistent with the front end of the finger due to the steps, the plug is blocked, and the line angle is likely to be damaged during the operation.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the manufacturing method of the circuit board golden finger slope structure, which adopts the dry film windowing and golden finger slope etching modes to improve the insertion and extraction effects of golden fingers, and compared with the conventional cutting mode, the manufacturing method of the circuit board golden finger slope structure has the advantages of higher processing efficiency, lower cost and more remarkable realization effect.
The invention also provides the circuit board golden finger using the manufacturing method of the circuit board golden finger slope structure.
The manufacturing method of the circuit board golden finger slope structure comprises the following steps:
Taking a circuit board with an outer layer circuit processed, wherein the circuit board is provided with a golden finger, and the golden finger is connected with the outer layer circuit;
Film pressing: pressing a layer of dry film on the circuit board, wherein the dry film is attached to the golden finger, the pressure range of the film pressing is 5.5kg/cm 2 to 6.5kg/cm 2, and the temperature range of the film pressing is 115 ℃ to 125 ℃;
And (3) exposure and development: placing a negative film in alignment with a circuit in the circuit board pressed with the dry film, designing the negative film to block light at the front end of the golden finger, and exposing the circuit board by an exposure machine; developing by using a developing solution after exposure so as to expose the front end of the golden finger;
Etching a slope: side etching is carried out by utilizing the edge of the liquid medicine, and the front end of the golden finger is corroded into a slope;
Film stripping: the dry film is removed by using a stripping solution.
The manufacturing method of the circuit board golden finger slope structure has at least the following beneficial effects: the golden finger slope is processed by adopting the modes of windowing and etching the slope of the dry film, the processing cost is low, the better plugging effect is achieved, in addition, the pressure and the temperature of the film pressing are improved compared with those of normal board production, the dry film lamination is more compact, and the problem that etching liquid medicine permeates into the bottom of the dry film to cause over-etching due to uneven board surface after the circuit board is completed is avoided.
According to the manufacturing method of the circuit board golden finger slope structure, in the exposure and development step, the film compensation amount is adjusted according to the copper thickness of the golden finger, the copper thickness is increased by 1 ounce, and the compensation amount is 2 mils, so that the front end size of the golden finger is ensured not to be corroded by etching liquid medicine and become smaller in the slope etching process.
According to the manufacturing method of the circuit board golden finger slope structure, in the step of etching the slope, the etching speed is adjusted according to the copper thickness during slope corrosion, so that the distance between the midpoint of the slope and the bottom wall of the slope is controlled to be equal to half of the thickness of the golden finger, the slope is guaranteed to have better continuity, and the plugging effect is better.
According to the manufacturing method of the circuit board golden finger slope structure, in the step of etching the slope, the etching speed is adjusted according to the copper thickness during the slope corrosion so as to control the slope to be in an S-shaped curve, the bottom end of the slope is arranged in a protruding mode, and the top end of the slope is arranged in a concave mode. Because the copper of slope bottom can be corroded a part in the copper process of subtracting, the copper-free and copper-containing junction continuity of base plate is relatively poor, and slope bottom evagination sets up, and copper-free and copper-containing junction continuity of base plate is better, effectively improves the plug effect.
According to the manufacturing method of the circuit board golden finger slope structure, on the curve of the slope, the second derivative at the midpoint of the connecting line between the bottom end and the top end of the slope is equal to 0. As a reference standard in the design, the S-shaped slope plug path is more reasonable and is matched with the actual etching effect, so that the plug effect is further improved.
According to the manufacturing method of the circuit board golden finger slope structure, in the film pressing step, the thickness of the dry film is 1.8 mil, the film pressing pressure is 6.0kg/cm 2, and the film pressing temperature is 120 ℃. Compared with the common normal dry film with the thickness of 1.5 mil, the film pressing temperature of 110 ℃ and the film pressing pressure of 4.5kg/cm 2, the thickness of the dry film is increased by 20%, the film pressing temperature is increased by 9%, the film pressing pressure is increased by 33%, the influence of the roughness of the processed circuit board surface is reduced, the number of bubbles generated by film pressing is less, and etching liquid medicine cannot permeate under the dry film to cause over-etching.
According to the manufacturing method of the circuit board golden finger slope structure, in the exposure and development step, the exposed width range of the front end of the golden finger is 0.2mm to 0.4mm, so that a good plugging effect can be achieved.
According to the manufacturing method of the circuit board golden finger slope structure, in the step of etching the slope, the minimum distance between the slope and the nearest hole on the circuit board is larger than 4 mils, so that electronic components can be conveniently welded on the hole without interference to the golden finger.
The manufacturing method of the circuit board golden finger slope structure provided by the invention further comprises the following steps: gold plating: and electroplating alloy on the surface of the golden finger after the film removing step, so that the wear resistance of the front end of the golden finger is improved.
The circuit board golden finger comprises the manufacturing method of the circuit board golden finger slope structure.
The circuit board golden finger has at least the following beneficial effects: the gold finger is processed, the junction of the copper-free substrate and the copper-containing substrate is in a slope shape at the front end of the gold finger, so that the gold finger has better consistency, the plugging effect of the circuit board is improved, and the wear resistance of the front end of the gold finger is increased.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a first flow chart of a method for manufacturing a ramp structure of a golden finger of a circuit board according to an embodiment of the invention;
FIG. 2 is a second flowchart illustrating a method for fabricating a ramp structure of a golden finger of a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a ramp structure of a golden finger of a circuit board according to an embodiment of the present invention;
fig. 4 is a micro-slice diagram of a circuit board golden finger slope structure according to an embodiment of the invention.
Reference numerals illustrate:
A substrate 100; a golden finger 200; a gold plating layer 210; a dry film 300;
a ramp tip 200a; a ramp bottom end 200b; slope midpoint 200c.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
As shown in fig. 1 and 2, the manufacturing method of the circuit board golden finger slope structure according to the embodiment of the invention comprises the following steps in sequence:
S1, taking a circuit board with an outer layer circuit processed, wherein the circuit board is provided with a golden finger 200, and the golden finger 200 is connected with the outer layer circuit.
S2, film pressing: and pressing a layer of dry film 300 on the circuit board, wherein the dry film 300 is tightly attached to the golden finger 200, the pressure range of the film pressing is 5.5kg/cm 2 to 6.5kg/cm 2, and the temperature range of the film pressing is 115 ℃ to 125 ℃. The surface of the processed outer layer circuit is uneven, bubbles are easy to generate during secondary film pressing, and etching liquid medicine permeates into the lower part of the dry film 300 to cause over-etching during the etching stage, so that the pressure and the temperature of film pressing are improved, and fewer bubbles are generated after film pressing.
S3, exposure and development: the negative film is placed in alignment with a circuit in the circuit board pressed with the dry film 300, the negative film is designed to block light at the front end of the golden finger 200, and an exposure machine is used for exposing the circuit board; after exposure, development is performed by using a developing solution, so that the front end of the golden finger 200 is exposed.
S4, etching slope: the edge of the liquid medicine is used for side etching, and the front end of the golden finger 200 is etched into a slope.
S5, film stripping: dry film 300 is removed using a stripping solution.
Compared with conventional cutting processing, the processing cost is low, the continuity of the slope bottom end 200b and the substrate 100 is better, and the whole golden finger 200 has better plugging effect.
In some embodiments, in the exposure and development step, the film compensation amount is adjusted according to the copper thickness of the gold finger 200, specifically, each time the copper thickness of the gold finger 200 is increased by 1 oz, the line film compensation at the front end of the gold finger 200 is compensated for 2 mil more outwards, so as to ensure that the front end size of the gold finger 200 is not corroded by etching liquid medicine and becomes smaller in the process of etching a slope.
As shown in fig. 3, in some embodiments of the present invention, in the step of etching the slope, the etching speed is adjusted according to the copper thickness during the slope etching, so as to control the distance between the midpoint 200c of the slope and the bottom wall of the slope to be equal to half of the thickness of the gold finger 200, thereby ensuring better continuity of the slope and better plugging effect. The thickness of the slope midpoint 200c is designed with reference to half the thickness of the gold finger 200, and further, with reference to fig. 4, a relatively gentle slope is obtained after the actual processing.
In some embodiments of the invention, as shown in fig. 3, in the step of etching the slope, the etching speed is adjusted according to the copper thickness during the slope etching to control the slope to be S-shaped, wherein the slope bottom end 200b is arranged in a convex manner and the slope top end 200a is arranged in a concave manner. Since the copper at the bottom end 200b of the slope will be corroded partially in the copper reduction process, the continuity of the junction between the copper-free substrate 100 and the copper-free substrate is poor, the bottom end 200b of the slope is arranged in a convex manner, the continuity of the junction between the copper-free substrate 100 and the copper-free substrate is better, and the plugging effect is effectively improved. Optionally, on the ramp curve, the second derivative at the midpoint of the line between the ramp bottom 200b and the ramp top 200a is equal to 0. The S-shaped slope plug path is more reasonable and the plug effect is further improved when the S-shaped slope plug path is matched with the actual etching effect.
In some embodiments of the present invention, the thickness of dry film 300 is 1.8 mils, the pressure of the lamination is 6.0kg/cm 2, and the temperature of the lamination is 120 ℃. Compared with the common dry film 300 with the thickness of 1.5 mil, the film pressing temperature of 110 ℃ and the film pressing pressure of 4.5kg/cm 2, the thickness of the dry film 300 is increased by 20%, the film pressing temperature is increased by 9%, the film pressing pressure is increased by 33%, the influence of the processed circuit board surface roughness is reduced, the number of bubbles generated by film pressing is less, and etching liquid medicine cannot permeate under the dry film 300 to cause over-etching.
In some embodiments of the present invention, referring to fig. 2, the exposed width of the front end of the gold finger 200 ranges from 0.2mm to 0.4mm in the exposure developing step. Optionally, the exposed width of the front end of the golden finger 200 is 0.3mm. Can achieve better plug effect.
In some embodiments, the minimum distance of the ramp from the nearest hole in the circuit board is greater than 4 mils (not shown) during the etching ramp step, facilitating soldering of the electronic components to the holes without interference from the gold finger 200.
Referring to fig. 3 and 4, in some embodiments, the surface of the gold finger 200 is provided with a gold plating layer 210. Specifically, referring to fig. 1 and 2, a gold plating process is provided after the film removing step, and the surface of the gold finger 200 is subjected to an alloy plating process. Because the golden finger 200 is to be plugged and unplugged, the common electroplated alloy is gold-nickel alloy, has relatively hard hardness, is suitable for being used in places with forced friction, and does not reduce conductivity while enhancing friction resistance.
The circuit board golden finger according to the embodiment of the invention comprises the manufacturing method of the circuit board golden finger slope structure according to the embodiment of the invention. At the front end of the golden finger 200, the junction of the copper-free and copper-free substrate 100 presents a slope shape, has better continuity, improves the plugging effect of the circuit board, and increases the wear resistance of the front end of the golden finger 200.
Other configurations and operations of the circuit board golden finger according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. The manufacturing method of the circuit board golden finger slope structure is characterized by comprising the following steps of:
Taking a circuit board with an outer layer circuit processed, wherein the circuit board is provided with a golden finger, and the golden finger is connected with the outer layer circuit;
Film pressing: pressing a layer of dry film on the circuit board, wherein the dry film is attached to the golden finger, the pressure range of the film pressing is 5.5kg/cm 2 to 6.5kg/cm 2, and the temperature range of the film pressing is 115 ℃ to 125 ℃;
And (3) exposure and development: placing a negative film in alignment with a circuit in the circuit board pressed with the dry film, designing the negative film to block light at the front end of the golden finger, and exposing the circuit board by an exposure machine; developing by using a developing solution after exposure so as to expose the front end of the golden finger;
Etching a slope: side etching is carried out by utilizing the edge of the liquid medicine, and the front end of the golden finger is corroded into a slope;
Film stripping: the dry film is removed by using a stripping solution.
2. The method of claim 1, wherein in the exposing and developing step, a film compensation amount is adjusted according to a copper thickness of the gold finger, the copper thickness is increased by 1 oz, and the compensation amount is 2 mil.
3. The method according to claim 1, wherein in the step of etching the slope, the etching speed is adjusted according to the copper thickness of the slope when the slope is corroded, so as to control the distance between the midpoint of the slope and the bottom wall of the slope to be equal to half of the thickness of the gold finger.
4. The method according to claim 1, wherein in the step of etching the slope, the etching speed is adjusted according to the copper thickness of the slope when the slope is corroded, so as to control the slope to be in an S-shaped curve, the bottom end of the slope is arranged in a convex manner, and the top end of the slope is arranged in a concave manner.
5. The method of claim 4, wherein the second derivative at the midpoint of the line between the bottom and the top of the ramp is equal to 0 on the curve of the ramp.
6. The method of claim 1, wherein in the film pressing step, the dry film has a thickness of 1.8 mil, the film pressing pressure is 6.0kg/cm 2, and the film pressing temperature is 120 ℃.
7. The method according to claim 1, wherein in the exposure developing step, the exposed width of the front end of the gold finger is in a range of 0.2mm to 0.4mm.
8. The method of claim 1, wherein in the step of etching the ramp, the minimum distance of the ramp from the nearest hole in the circuit board is greater than 4 mils.
9. The method of manufacturing a circuit board golden finger ramp structure according to claim 1, further comprising:
gold plating: and electroplating alloy on the surface of the golden finger after the film removing step.
10. A method for manufacturing a circuit board golden finger using the circuit board golden finger slope structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111618342.6A CN114340212B (en) | 2021-12-24 | 2021-12-24 | Manufacturing method of circuit board golden finger slope structure and circuit board golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111618342.6A CN114340212B (en) | 2021-12-24 | 2021-12-24 | Manufacturing method of circuit board golden finger slope structure and circuit board golden finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114340212A CN114340212A (en) | 2022-04-12 |
| CN114340212B true CN114340212B (en) | 2024-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111618342.6A Active CN114340212B (en) | 2021-12-24 | 2021-12-24 | Manufacturing method of circuit board golden finger slope structure and circuit board golden finger |
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| CN (1) | CN114340212B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140734A (en) * | 1992-10-28 | 1994-05-20 | Hitachi Cable Ltd | Plastic molded object provided with circuit terminals |
| US5486657A (en) * | 1994-06-09 | 1996-01-23 | Dell Usa, L.P. | Beveled edge circuit board with channeled connector pads |
| US6764937B1 (en) * | 2003-03-12 | 2004-07-20 | Hewlett-Packard Development Company, L.P. | Solder on a sloped surface |
| CN101494349A (en) * | 2009-03-10 | 2009-07-29 | 江西圣达威电工材料有限公司 | Method for preparing aluminum wire disk connection terminal |
| WO2013022112A1 (en) * | 2011-08-08 | 2013-02-14 | 日本電気株式会社 | Slope and method of forming said slope |
| KR20180037866A (en) * | 2016-10-05 | 2018-04-13 | 주식회사 아모센스 | Ceramic substrate and ceramic substrate manufacturing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3894774B2 (en) * | 2001-10-31 | 2007-03-22 | 富士通株式会社 | Card edge connector and method for manufacturing the same, electronic card and electronic device |
| US7032827B2 (en) * | 2004-06-18 | 2006-04-25 | Super Talent Electronics, Inc. | Combination SD/MMC flash memory card with thirteen contact pads |
| WO2008005736A1 (en) * | 2006-06-30 | 2008-01-10 | 3M Innovative Properties Company | Flexible circuit |
| TWI334320B (en) * | 2007-07-16 | 2010-12-01 | Nanya Technology Corp | Fabricating method of gold finger of circuit board |
| CN201657501U (en) * | 2010-01-29 | 2010-11-24 | 比亚迪股份有限公司 | Circuit board golden finger |
-
2021
- 2021-12-24 CN CN202111618342.6A patent/CN114340212B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140734A (en) * | 1992-10-28 | 1994-05-20 | Hitachi Cable Ltd | Plastic molded object provided with circuit terminals |
| US5486657A (en) * | 1994-06-09 | 1996-01-23 | Dell Usa, L.P. | Beveled edge circuit board with channeled connector pads |
| US6764937B1 (en) * | 2003-03-12 | 2004-07-20 | Hewlett-Packard Development Company, L.P. | Solder on a sloped surface |
| CN101494349A (en) * | 2009-03-10 | 2009-07-29 | 江西圣达威电工材料有限公司 | Method for preparing aluminum wire disk connection terminal |
| WO2013022112A1 (en) * | 2011-08-08 | 2013-02-14 | 日本電気株式会社 | Slope and method of forming said slope |
| KR20180037866A (en) * | 2016-10-05 | 2018-04-13 | 주식회사 아모센스 | Ceramic substrate and ceramic substrate manufacturing method |
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| CN114340212A (en) | 2022-04-12 |
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