CN112969300A - Etching processing method for flexible circuit board - Google Patents
Etching processing method for flexible circuit board Download PDFInfo
- Publication number
- CN112969300A CN112969300A CN202110116386.2A CN202110116386A CN112969300A CN 112969300 A CN112969300 A CN 112969300A CN 202110116386 A CN202110116386 A CN 202110116386A CN 112969300 A CN112969300 A CN 112969300A
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- copper
- etching
- copper layer
- flexible
- flexible board
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- 238000005530 etching Methods 0.000 title claims abstract description 82
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 205
- 229910052802 copper Inorganic materials 0.000 claims abstract description 188
- 239000010949 copper Substances 0.000 claims abstract description 188
- 238000000034 method Methods 0.000 claims description 53
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 11
- 239000003814 drug Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005111 flow chemistry technique Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
The invention relates to the technical field of FPC (flexible printed circuit) processing, in particular to an etching processing method of a flexible circuit board. According to the invention, the rolled copper and the electroplated copper are combined on the same flexible board through half etching treatment, so that the copper layer outside an etching area ensures excellent flexibility, and the electroplated copper ensures excellent electric conductivity of a flexible board circuit, thereby forming the flexible board with high-frequency dynamic bending performance; simultaneously before carrying out the electrocoppering operation, carry out secondary development to the flexible board and handle in order to get rid of the copper facing dry film on the etching region edge, spill the hole of side etching, avoid the copper facing dry film gap to lead to the not enough breach that forms of copper facing liquid medicine exchange, eliminate the flexible board and lead to the copper layer crackle problem because of the breach when realizing the flexion function, saved the quality and verified the human cost, improved the yield of product.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) processing, in particular to an etching processing method of a flexible circuit board.
Background
Flexible Printed Circuit boards (Flexible Printed Circuit boards), referred to as Flexible Printed Circuit boards (FPCs), also known as Flexible Printed Circuit boards (FPCs), are highly reliable and highly Flexible Printed circuits made of polyimide or polyester film as a substrate.
With the increasing abundance of types of end products, the performance of the flexible board with high-frequency dynamic bending starts to be more proposed. This requirement must be met by the use of a rolled copper foil having better flexibility, but the rolled copper foil is insufficient in hardness and roughness compared to conventional electroplated copper foils, resulting in insufficient bonding force of the surface wire bonding fasteners. Conventional rolled copper foil is inexpensive and readily available, and if direct electroplating of copper onto the rolled copper foil results in an increase in overall thickness, dense lines cannot be formed. The same requirements are met in the manufacturing process of copper plating locally in the wire bonding area if a thin rolled copper foil (thickness 6 um) is used, but the cost is high and the copper foil is not easily available due to the unconventional mainstream thickness of the copper foil.
Referring to fig. 2 and 3, in the current half-etching process, the copper of the dry film in the area adjacent to the half-etching mask region is etched to form voids due to the unavoidable side etching during the etching process during the thinning process, and these voids cannot be filled with the electroplated copper during the subsequent electroplating process, which may then form gaps. The notch is a concentrated part of internal stress, and cracks are easily formed at the notch position due to the bending action of a subsequent product in the using process, so that the electronic product has the use reliability problem even if being put into the market.
Disclosure of Invention
The invention aims to solve the technical problem of providing a flexible circuit board which has both high-frequency dynamic bending performance and excellent conductivity and avoids the problem of copper layer cracks caused by gaps when the flexible circuit board realizes the bending function.
In order to solve the technical problems, the technical scheme adopted by the invention for solving the technical problems is as follows:
a flexible circuit board etching processing method comprises the following steps:
pressing a copper-plated dry film on a copper layer of the flexible board, and then carrying out primary development treatment to expose an area to be etched;
and carrying out half etching treatment on the copper layer of the etching area:
and carrying out secondary development treatment on the flexible board to remove the copper-plated dry film on the edge of the etching area, and electroplating copper on the copper layer of the etching area.
In a preferred embodiment of the invention, the flexible board comprises a single copper layer or two copper layers, and a copper-plated dry film is pressed on the single copper layer or the two upper and lower copper layers of the flexible board.
In a preferred embodiment of the present invention, after pressing the copper dry film on the copper layer of the flexible board, performing a developing process to expose the area to be etched includes:
and carrying out UV exposure treatment on a preset etching area, carrying out primary development on the flexible board, and removing the copper-plated dry film in the etching area to leak out the copper layer in the etching area.
In a preferred embodiment of the present invention, the half-etching process is performed on the copper layer in the etched region, and comprises:
and adjusting the copper etching amount of the half etching treatment on the copper layer, and controlling the etching thickness of the copper layer in the etching area to be greater than or equal to 1/2 of the copper layer and slightly smaller than the thickness of the copper layer.
In a preferred embodiment of the invention, the thickness of the copper layer is 8 μm to 20 μm, the thickness of the electroplated copper is 4 μm to 15 μm, and the etching depth of the copper layer is equal to the thickness of the electroplated copper.
In a preferred embodiment of the present invention, after electroplating copper on the copper layer of the etched region, a normal flow process is required for the flexible board after electroplating copper, wherein the normal flow process comprises: one or more of a dry film removing process, a circuit forming process, a surface treatment process and a circuit board subsequent process.
In a preferred embodiment of the present invention, a dry film copper-plated film is laminated on a copper layer of a flexible board, comprising:
and positioning the position of the flexible board by using a jig, and firstly attaching a copper-plated dry film to the copper layer of the flexible board, wherein the copper-plated dry film and the flexible board are pressed in any one of vacuum pressing, hot pressing or rolling.
In a preferred embodiment of the present invention, before laminating the copper dry film on the copper layer of the flexible board, the method comprises:
and forming a through hole or a blind hole on the flexible board by adopting a mechanical drilling or laser etching method, and metalizing the hole.
The invention has the beneficial effects that:
according to the invention, the rolled copper and the electroplated copper are combined on the same flexible board through half etching treatment, so that the copper layer outside an etching area ensures excellent flexibility, and the electroplated copper ensures excellent electric conductivity of a flexible board circuit, thereby forming the flexible board with high-frequency dynamic bending performance; simultaneously before carrying out the electrocoppering operation, carry out secondary development to the flexible board and handle in order to get rid of the copper facing dry film on the etching region edge, spill the hole of side etching, avoid the copper facing dry film gap to lead to the not enough breach that forms of copper facing liquid medicine exchange, eliminate the flexible board and lead to the copper layer crackle problem because of the breach when realizing the flexion function, saved the quality and verified the human cost, improved the yield of product.
Drawings
Fig. 1 is a schematic diagram of an etching method for a flexible printed circuit board according to the present invention.
FIG. 2 is a schematic view of a notch of a flexible board according to the present invention.
FIG. 3 is a schematic cross-sectional view of a flexible plate of the present invention.
FIG. 4 is a schematic view of the flexible plate of the present invention.
FIG. 5 is a schematic view of the flexible board laminated with a copper-plated dry film according to the present invention.
FIG. 6 is a schematic diagram of one development of the flexible plate of the present invention.
FIG. 7 is a schematic diagram of a flexible board half-etching process according to the present invention.
FIG. 8 is a schematic diagram of the second development of the flexible plate of the present invention.
FIG. 9 is a schematic diagram of the flexible board electro-coppering of the present invention.
FIG. 10 is a schematic diagram of a dry film removing process of the flexible board of the present invention.
The reference numbers in the figures illustrate: 1. a copper layer; 2. a substrate PI layer; 3. a copper layer; 4. copper plating of a dry film; 5. copper plating of a dry film; 6. electroplating copper; 7. electroplating copper;
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 1, 4-10, a flexible circuit board etching method includes:
step S10, pressing a copper-plated dry film on the copper layer of the flexible board, and then carrying out primary development treatment to expose the area to be etched;
step S20, performing half-etching treatment on the copper layer in the etched region:
step S30, performing a secondary development process on the flexible board to remove the copper-plated dry film on the edge of the etched area, and electroplating copper on the copper layer of the etched area.
According to the invention, the rolled copper and the electroplated copper are combined on the same flexible board through half etching treatment, so that the copper layer outside an etching area ensures excellent flexibility, and the electroplated copper ensures excellent electric conductivity and flatness of a flexible board circuit, thereby forming the flexible board with high-frequency dynamic bending performance; simultaneously, before the copper electroplating operation, secondary development treatment is carried out on the flexible plate to remove a copper-plated dry film on the edge of an etching area, a hole of side etching is leaked, a gap formed by insufficient exchange of copper-plated liquid medicine due to a copper-plated dry film gap is avoided, and the problem of copper layer crack caused by the gap when the flexible plate achieves a bending function is solved.
The rolled copper and the electroplated copper are combined on the same flexible board through a half-etching process, the rolled copper part is used for realizing the high-frequency dynamic flexibility of the flexible board in a flexible area, and the electroplated copper part is used for a loop circuit part to keep the excellent conductivity and the flatness of the traditional electroplated copper of the flexible board.
The secondary development process is added between half etching and copper plating, the side corrosion of the edge of a copper-plated dry film is eliminated, the dry film without support above a cavity is removed, a gap is prevented from being formed at the junction of original base material rolled copper and newly added electroplated copper in the copper plating process, the problem of the gap at the junction of a flexible plate copper layer and the electroplated copper is solved, the problem of copper layer cracks caused by the gap when the flexible plate is bent is eliminated, and therefore the flexible plate is manufactured by the half etching process method in a mode of considering the excellent bending performance of rolled copper and the excellent conductive performance and the flatness of the electroplated copper.
The flexible board comprises a single copper layer or two copper layers, and a copper-plated dry film is pressed on the single copper layer or the upper and lower copper layers of the flexible board.
In this embodiment, for a flexible circuit board with a 3-layer structure, that is, including a substrate PI layer and copper layers laminated on two sides of the substrate PI layer, it is necessary to laminate a copper-plated dry film on the copper layers on the two sides, so as to ensure that the two copper layers are synchronously processed, thereby improving the production efficiency; aiming at a flexible circuit board with a 2-layer structure, namely, the flexible circuit board comprises a substrate PI layer and a copper layer pressed on one side of the substrate PI layer, a copper-plated dry film needs to be pressed on the copper layer on one side.
As an alternative embodiment, in step S30, the method includes:
and carrying out UV exposure treatment on a preset etching area, carrying out primary development on the flexible board, and removing the copper-plated dry film in the etching area to leak out the copper layer in the etching area.
As an alternative embodiment, in step S20, the method includes:
and adjusting the copper etching amount of the half etching treatment on the copper layer, and controlling the etching thickness of the copper layer in the etching area to be greater than or equal to 1/2 of the copper layer and slightly smaller than the thickness of the copper layer.
In this embodiment, the half etching process is to etch and reduce the thickness of copper in the flexible board copper layer of the area to be etched, and then perform electroplating copper on the reduced area to increase the thickness to the original thickness or slightly greater than the original thickness, so that the flexible board copper layer has the flatness of the electroplating copper in the etched area, and the original thickness of the copper layer can ensure the density of the formed circuit and the quality of the circuit.
After copper is electroplated on the copper layer of the etching area, normal flow processing needs to be carried out on the flexible board after the copper electroplating, and the normal flow processing comprises the following steps: one or more of a dry film removing process, a circuit forming process, a surface treatment process and a circuit board subsequent process.
In this embodiment, the circuit forming process includes processes such as UV exposure, development, etching, and stripping for a set circuit pattern, and the circuit forming process in the present invention refers to all processes of circuit processing for a flexible board after copper electroplating of the flexible board, so as to obtain a desired circuit pattern; the subsequent process of the circuit board comprises the steps of normally sticking a protective film, solder resist ink, chemically depositing gold, manufacturing the printed circuit board by appearance and the like.
The flexible board copper layer adopts electrolytic copper foil or rolled copper foil; in this embodiment, the rolled copper foil has good flexibility, so that a dense and bending-resistant circuit can be formed. The non-half-etched area ensures the excellent flexibility of the rolled copper foil of the circuit part substrate, and the flexible plate with high-frequency dynamic bending performance is formed.
As an alternative embodiment, in step S10, the method includes:
and positioning the position of the flexible board by using a jig, and firstly attaching a copper-plated dry film to the copper layer of the flexible board, wherein the copper-plated dry film and the flexible board are pressed in any one of vacuum pressing, hot pressing or rolling.
The copper-plated dry film and the flexible board can be laminated by a laminating technique commonly used in the art, such as vacuum lamination, hot pressing or rolling. In this embodiment, in order to improve the production efficiency, the copper-plated dry film and the flexible board are directly rolled on both sides.
Before the copper layer pressfitting copper facing dry film on the flexbile plate, include:
and forming a through hole or a blind hole on the flexible board by adopting a mechanical drilling or laser etching method, and metalizing the hole.
In an alternative embodiment, the copper layer has a thickness of 8 μm to 20 μm, the electroplated copper has a thickness of 4 μm to 15 μm, and the etching depth of the copper layer is equal to the electroplated copper thickness.
Further, when the thickness of the copper layer is 8-10 μm and the thickness of the electroplated copper is 4-7 μm, the etching depth of the copper layer is less than the thickness of the electroplated copper, and 0-1.5 μm is added to the current thickness of the copper layer.
When the thickness of the copper layer is 10-13 μm and the thickness of the electroplated copper is 5-8 μm, the etching depth of the copper layer is equal to the thickness of the electroplated copper, and the thickness of the connection part of the copper layer and the electroplated copper is the current thickness of the copper layer.
When the thickness of the copper layer is 13-15 μm and the thickness of the electroplated copper is 7-10 μm, the etching depth of the copper layer is less than or equal to the thickness of the electroplated copper, and the thickness of the joint of the copper layer and the electroplated copper is +/-1-2 μm of the current thickness of the copper layer.
When the thickness of the copper layer is 15-20 μm and the thickness of the electroplated copper is 10-15 μm, the etching depth of the copper layer is less than or equal to the thickness of the electroplated copper, and the thickness of the connection part of the copper layer and the electroplated copper is +/-1-2 μm of the current thickness of the copper layer.
In this example, the copper layer thickness is affected by the electroplated copper thickness and the half-etch depth: the larger the thickness of the copper layer is, the larger the etching depth is, the thicker the thickness of the electroplated copper is, the larger the connecting area of the rest copper layers is, and the strength of the joint of the copper layers is enough to support the flexible board without generating cracks; otherwise, the thickness of the joint is required to be larger than the thickness of the equal copper layer to ensure the processing strength, and the situation that the copper layer after half etching is too thin to cause fracture during copper plating is avoided. Therefore, the etching depth and the thickness of the joint of the electroplated copper and the copper layer are set according to the thickness of the copper layer on the flexible circuit board and the different thicknesses of the electroplated copper, so that the stability of the multi-layer flexible circuit board with different parameters is adapted.
According to a preferable scheme of the invention, when the thickness of the copper layer is 12 μm and the thickness of the electroplated copper is 6.5 μm, the etching depth of the copper layer is equal to the thickness of the electroplated copper, and the thickness of the connection part of the copper layer and the electroplated copper is equal to the thickness of the current copper layer. The conventional rolled copper foil has the thickness of 12 mu m, is low in price and easy to obtain, and after the rolled copper foil is directly half-etched, the electroplated copper can not increase the whole thickness, so that the dense circuit can be effectively formed on the copper foil.
The invention can also adopt the modes of acid cleaning, plasma cleaning and the like to increase the exchange of the copper plating liquid medicine between dry film gaps, and the applicant prefers secondary development according to the practical effect and the practical benefit, and the two modes can also replace the secondary development operation in the scheme.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (8)
1. A flexible circuit board etching processing method is characterized by comprising the following steps:
pressing a copper-plated dry film on a copper layer of the flexible board, and then carrying out primary development treatment to expose an area to be etched;
and carrying out half etching treatment on the copper layer of the etching area:
and carrying out secondary development treatment on the flexible board to remove the copper-plated dry film on the edge of the etching area, and electroplating copper on the copper layer of the etching area.
2. The etching method for the flexible circuit board according to claim 1, wherein the flexible board comprises a single copper layer or two copper layers, and a dry film copper plating film is laminated on the single copper layer or the upper and lower copper layers of the flexible board.
3. The etching method of claim 1, wherein the step of developing after pressing the dry film copper-coated layer on the copper layer of the flexible board to expose the area to be etched comprises:
and carrying out UV exposure treatment on a preset etching area, carrying out primary development on the flexible board, and removing the copper-plated dry film in the etching area to leak out the copper layer in the etching area.
4. The etching processing method of the flexible circuit board according to claim 1, wherein the half-etching treatment of the copper layer in the etched region comprises:
and adjusting the copper etching amount of the half etching treatment on the copper layer, and controlling the etching thickness of the copper layer in the etching area to be greater than or equal to 1/2 of the copper layer and slightly smaller than the thickness of the copper layer.
5. The etching method of a flexible circuit board according to claim 1, wherein the thickness of said copper layer is 8 μm to 20 μm, the thickness of electroplated copper is 4 μm to 15 μm, and the etching depth of said copper layer is equal to said thickness of electroplated copper.
6. The etching processing method of the flexible circuit board according to claim 1, wherein after the copper plating on the copper layer of the etching area, a normal flow process is required for the flexible circuit board after the copper plating, and the normal flow process comprises: one or more of a dry film removing process, a circuit forming process, a surface treatment process and a circuit board subsequent process.
7. The etching method of claim 1, wherein the pressing of the copper-coated dry film on the copper layer of the flexible board comprises:
and positioning the position of the flexible board by using a jig, and firstly attaching a copper-plated dry film to the copper layer of the flexible board, wherein the copper-plated dry film and the flexible board are pressed in any one of vacuum pressing, hot pressing or rolling.
8. The etching method of claim 1, wherein before pressing the dry film copper-coated film on the copper layer of the flexible board, the method comprises:
and forming a through hole or a blind hole on the flexible board by adopting a mechanical drilling or laser etching method, and metalizing the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110116386.2A CN112969300A (en) | 2021-01-28 | 2021-01-28 | Etching processing method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110116386.2A CN112969300A (en) | 2021-01-28 | 2021-01-28 | Etching processing method for flexible circuit board |
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| Publication Number | Publication Date |
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| CN112969300A true CN112969300A (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110116386.2A Pending CN112969300A (en) | 2021-01-28 | 2021-01-28 | Etching processing method for flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993288A (en) * | 2021-11-23 | 2022-01-28 | 上达电子（深圳）股份有限公司 | Etching method for realizing fine circuit by semi-developing dry film method |
| CN116801515A (en) * | 2023-05-23 | 2023-09-22 | 扬州市玄裕电子有限公司 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
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| CN111278229A (en) * | 2020-03-20 | 2020-06-12 | 盐城维信电子有限公司 | Preparation method of voice coil motor flexible circuit board |
| CN111556660A (en) * | 2020-04-14 | 2020-08-18 | 珠海崇达电路技术有限公司 | Manufacturing method of thick copper circuit board and thick copper circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0740497A1 (en) * | 1995-04-24 | 1996-10-30 | Dyconex Patente Ag | Electric interconnection substrate |
| CN101518163A (en) * | 2006-09-21 | 2009-08-26 | 株式会社大昌电子 | Rigid and flexible printed circuit board and method for manufacturing same |
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| CN113993288A (en) * | 2021-11-23 | 2022-01-28 | 上达电子（深圳）股份有限公司 | Etching method for realizing fine circuit by semi-developing dry film method |
| CN116801515A (en) * | 2023-05-23 | 2023-09-22 | 扬州市玄裕电子有限公司 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
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Application publication date: 20210615 |
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