CN114274623A - High-temperature-resistant wave absorbing plate and preparation method thereof - Google Patents
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Abstract
The invention provides a high-temperature-resistant wave-absorbing plate and a preparation method thereof, wherein the high-temperature-resistant wave-absorbing plate comprises a wave-absorbing honeycomb core layer, wherein an upper skin is arranged on the upper side of the wave-absorbing honeycomb core layer, and a lower skin is arranged on the lower side of the wave-absorbing honeycomb core layer; the wave-absorbing honeycomb core layer is made of glass fiber materials, and a wave-absorbing coating is sprayed on the surface of the wave-absorbing honeycomb core layer; the upper skin and the lower skin are manufactured by hot-press molding of prepreg prepared from fiber reinforced resin. According to the invention, the high-temperature resistant problem of the wave-absorbing plate with the honeycomb structure is solved by adopting the glass fiber honeycomb core and the high-temperature resistant wave-absorbing coating, the temperature resistance of the wave-absorbing plate is improved from 160 ℃ to 240 ℃, and the honeycomb wave-absorbing plate has better wave-absorbing performance at 1-4 GHz; and the co-curing process is changed into a secondary curing process, and meanwhile, the reflecting layer is clamped in the middle of the prepreg, so that the wave-absorbing plate shape variability can be reduced.
Description
Technical Field
The invention relates to the field of radar wave absorbing materials, in particular to a high-temperature-resistant honeycomb structure material with radar wave absorbing effect and a preparation method thereof.
Background
Along with the increasing development of aerospace equipment technology, more and more application technologies are applied to radar wave-absorbing materials, and the honeycomb structure material has excellent wave-absorbing performance due to the characteristics of light weight and high strength and can load a wave-absorbing coating.
The existing wave absorbing plate with the honeycomb structure does not have the capability of resisting high temperature for a long time or fails due to serious performance reduction after high temperature resistance, and based on the current situation, the invention provides the wave absorbing plate with the honeycomb structure, which is resistant to high temperature and has better radar wave absorbing performance at low frequency.
Disclosure of Invention
The invention provides a high-temperature-resistant wave absorbing plate and a preparation method thereof.
The technical scheme of the invention is that the high-temperature resistant wave absorbing plate comprises the following specific steps: the wave-absorbing honeycomb sandwich structure comprises a wave-absorbing honeycomb core layer, wherein an upper skin is arranged on the upper side of the wave-absorbing honeycomb core layer, and a lower skin is arranged on the lower side of the wave-absorbing honeycomb core layer; the wave-absorbing honeycomb core layer is made of glass fiber materials, and a wave-absorbing coating is sprayed on the surface of the wave-absorbing honeycomb core layer; the upper skin and the lower skin are made by hot-pressing and molding after the fiber is soaked in resin material.
Furthermore, the holes of the wave-absorbing honeycomb core are regular hexagons, the side length is 2.5-6mm, and the thickness is 10-30 mm.
Furthermore, raw material glass fiber in the wave-absorbing honeycomb core layer is made into glass fiber cloth, and the glass fiber cloth is impregnated with polyimide, phenolic cyanate resin or cyano resin.
Further, the wave-absorbing coating comprises, by weight, 60-75 parts of an absorbent, 20-40 parts of a matrix resin, 90-112 parts of an organic solvent, 0.5-1 part of a leveling agent, and 0.2-0.5 part of an anti-settling agent.
Further, the absorbent is alloy powder FSA (ferro-silicon-aluminum) and/or FSC (ferro-silicon-chromium).
Further, the matrix resin is one or more of organic silicon resin or modified organic silicon resin for compound use; the organic silicon resin is polyalkyl organic silicon resin, polyaryl organic silicon resin or polyalkyl aryl organic silicon resin, and the modified organic silicon resin is epoxy modified organic silicon resin, acrylic acid modified organic silicon resin or polyurethane modified organic silicon resin;
further, the organic solvent is xylene, n-butanol and/or butyl acetate; the anti-settling agent is one of modified polyurea compound, fumed silica and organic bentonite; the leveling agent is acrylic copolymer or polyester modified polydimethylsiloxane.
Furthermore, the fibers in the upper skin and the lower skin are glass fibers, and the resin material is polyimide or bismaleimide resin; carrying out hot press molding on a prepreg prepared by soaking glass fibers in resin; the lower layer of the covering is also provided with a copper mesh layer.
Furthermore, glue films are arranged between the wave-absorbing honeycomb core layer and the upper skin and between the wave-absorbing honeycomb core layer and the lower skin.
The invention also relates to a preparation method of the high-temperature-resistant wave absorption plate, which is characterized by comprising the following steps of:
s1, preparing a wave-absorbing coating, spraying the wave-absorbing coating on the surface of the honeycomb core layer, drying and curing to obtain a wave-absorbing honeycomb core layer;
s2, laying the prepreg, and curing and forming to prepare an upper skin;
s3, curing and molding to obtain a lower-layer skin according to the laying mode of the prepreg, the copper mesh and the prepreg;
s4, laying layers according to the laying mode of the upper skin, the glue film, the wave-absorbing honeycomb core, the glue film and the lower skin, and finally carrying out high-temperature curing molding to obtain the high-temperature-resistant wave-absorbing plate.
The invention has the following beneficial effects:
1. the invention adopts the magnetic alloy absorbent with excellent temperature resistance and the organic silicon resin adhesive with excellent high temperature resistance, and simultaneously adopts the prepreg and the glass fiber cloth honeycomb with excellent high temperature resistance, so that the whole system structure has high temperature resistance, and the temperature resistance of the honeycomb wave-absorbing plate is improved from 160 ℃ to 240 ℃.
2. According to the wave-absorbing plate, a secondary curing process is adopted during preparation, meanwhile, the reflecting layer copper mesh is additionally arranged in the middle of the lower skin layer, the copper mesh is clamped in the middle of the prepreg and then cured, and the deformation rate of the wave-absorbing plate can be reduced by clamping the copper mesh in the middle of the prepreg and co-curing compared with the way that the reflecting layer is adhered after the wave-absorbing plate is co-cured.
3. The invention adopts the alloy powder absorbent subjected to ball milling treatment, and can improve the low-frequency absorption effect of the wave absorption plate.
Drawings
Fig. 1 is a schematic diagram of a structure of the wave-absorbing plate in example 1.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to examples, but those skilled in the art will appreciate that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention.
Example 1
The coating formula comprises: 20 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is epoxy modified organic silicon resin, the absorbent is FSA, and the solvent is dimethylbenzene; the leveling agent is polyester modified polydimethylsiloxane, the anti-settling agent is organic bentonite, the FSA proportion is 85% of Fe9.6% of Si5.4% of Al, when the leveling agent is used, ball milling treatment is carried out on FSA particles, and the mass ratio of material balls is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling.
And (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating material.
Spraying the design weight (2.6 kg/m) on the surface of a 10mm glass fiber cloth honeycomb core2) And (3) drying the wave-absorbing coating, putting the wave-absorbing coating in an oven at 80 ℃ for 2h, drying the wave-absorbing coating, and curing the wave-absorbing coating at 180 ℃ for 2 h.
Two pieces of 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) are cut, then are layered, and are placed on a flat hot press for hot pressing and curing to obtain an upper skin.
Laying a 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm copper mesh +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing on a flat hot press, and carrying out hot pressing and curing to obtain the lower-layer skin.
According to the lower layer skin and 0.2mm glue film (300 g/m)2) 10mm wave-absorbing honeycomb core and 0.2mm glue film (glue content 300 g/m)2) And layering the upper skin, and performing hot-pressing curing molding to obtain the high-temperature-resistant structure wave absorption plate.
Example 2
The coating formula comprises: 40 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is polyalkyl organic silicon resin, the absorbent is FSA, and the solvent is n-butanol; the leveling agent is polyester modified polydimethylsiloxane, the anti-settling agent is organic bentonite, the FSA proportion is 85% of Fe9.6% of Si5.4% of Al, when the leveling agent is used, ball milling treatment is carried out on FSA particles, and the mass ratio of material balls is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling. And (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating.
Spraying design weight (3.9 kg/m) on the surface of a 15mm glass cloth honeycomb core2) And (3) drying the wave-absorbing coating, putting the wave-absorbing coating in an oven at 80 ℃ for 2h, drying the wave-absorbing coating, and curing the wave-absorbing coating at 180 ℃ for 2 h.
Two pieces of 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) are cut, then are layered, and are placed on a flat hot press for hot pressing and curing to obtain an upper skin.
Laying a 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm copper mesh +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing on a flat hot press, and carrying out hot pressing and curing to obtain the lower-layer skin.
According to the lower layer skin and 0.2mm glue film (300 g/m)2) 15mm wave-absorbing honeycomb core and 0.2mm glue film (300 g/m)2) And layering the upper skin, and performing hot-pressing curing molding to obtain the high-temperature-resistant structure wave absorption plate.
Example 3
The coating formula comprises: 20 parts of resin, 75 parts of absorbent, 112 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is polyalkyl organic silicon resin, the absorbent is FSC, and the solvent is n-butanol; the leveling agent is polyacrylate copolymer, the anti-settling agent is fumed silica, the FSC proportion is 91% of Fe3.8% of Si4.5% of Cr, when the FSC particles are used, ball milling treatment is carried out on the FSC particles, and the mass ratio of material balls is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling.
And (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating.
Spraying (7.8 kg/m) on the surface of a 30mm glass cloth honeycomb core2) And (3) drying the wave-absorbing coating, putting the wave-absorbing coating in an oven at 80 ℃ for drying, and curing for 2 hours at 180 ℃.
Two pieces of 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) are cut, then are layered, and are placed on a flat hot press for hot pressing and curing to obtain an upper skin.
Laying a 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm copper mesh +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing on a flat hot press, and carrying out hot pressing and curing to obtain the lower-layer skin.
According to the lower layer skin and 0.2mm glue film (300 g/m)2) 30mm wave-absorbing honeycomb core and 0.2mm glue film (300 g/m)2) And layering the upper skin, and performing hot-pressing curing molding to obtain the high-temperature-resistant structure wave absorption plate.
Example 4
The coating formula comprises: 40 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is polyalkyl organic silicon resin, the absorbent is FSC, and the solvent is n-butanol; the leveling agent is polyacrylate copolymer, the anti-settling agent is fumed silica, the FSC proportion is 91% of Fe3.8% of Si4.5% of Cr, when the FSC particles are used, ball milling treatment is carried out on the FSC particles, and the mass ratio of material balls is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling. And (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating.
Spraying a designed weight wave-absorbing coating (7.8 kg/m) on the surface of a 30mm glass cloth honeycomb core2) And after surface drying, placing the mixture in an oven at 80 ℃ for surface drying for 2h, and then curing the mixture at 180 ℃ for 2 h.
Laying two layers of 0.2mm glass fiber prepreg, and placing the prepreg on a flat hot press for hot pressing and curing to obtain the upper skin.
Laying a 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm copper mesh +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing on a flat hot press, and carrying out hot pressing and curing to obtain the lower-layer skin.
According to the lower layer skin and 0.2mm glue film (300 g/m)2) 30mm wave-absorbing honeycomb core and 0.2mm glue film (300 g/m)2) And layering the upper skin, and performing hot-pressing curing molding to obtain the high-temperature-resistant structure wave absorption plate.
In contrast, comparative examples 1 and 2 were designed according to the following formulation, and a honeycomb-structured wave-absorbing sheet was prepared, which was similar to the embodiment of the embodiment and will not be described in detail.
Comparative example 1:
the honeycomb structure wave absorbing plate of the comparative example comprises the following components:
the coating formula comprises: 20 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is epoxy resin, the absorbent is FSA, the solvent is dimethylbenzene, the leveling agent is polyester modified polydimethylsiloxane, and the anti-settling agent is organic bentonite. Wherein the honeycomb core material is aramid fiber paper honeycomb, and honeycomb core thickness is 10mm, and the used resin of prepreg and glued membrane is epoxy, and the cloth that the prepreg adopted is glass fiber cloth, and wherein the FSA proportion is 85% Fe9.6% Si5.4% Al, carries out ball-milling processing to the FSA granule during the use, and the material ball mass ratio is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling. .
Comparative example 2:
the honeycomb structure wave absorbing plate of the comparative example comprises the following components:
the coating formula comprises: 20 parts of resin, 75 parts of absorbent, 112 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is polyalkyl organic silicon resin, the absorbent is carbonyl iron powder, and the solvent is dimethylbenzene; the leveling agent is polyacrylate copolymer, and the anti-settling agent is fumed silica. Wherein the honeycomb core material is the glass fiber cloth honeycomb, and honeycomb core thickness is 30mm, and the used resin of preimpregnation material and glued membrane is polyimide resin, and the cloth that the preimpregnation material adopted is glass fiber cloth.
Comparative example 3:
the coating formula comprises: 20 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is epoxy modified organic silicon resin, the absorbent is FSA, and the solvent is dimethylbenzene; the leveling agent is polyester modified polydimethylsiloxane, the anti-settling agent is organic bentonite, the FSA proportion is 85% of Fe9.6% of Si5.4% of Al, when the leveling agent is used, ball milling treatment is carried out on FSA particles, and the mass ratio of material balls is 1: 4, rotating speed is 300r/min, ball milling time is 20h, adding a proper amount of absolute ethyl alcohol solution and silane coupling agent into a ball milling tank, and vacuumizing and introducing nitrogen gas into the ball milling tank to remove air in the tank before ball milling.
The wave absorbing plate is prepared by adopting a co-curing process, and the copper mesh is cold-bonded after being formed, and the specific method comprises the following steps:
and (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating material.
Spraying design weight (2.6 kg/m) on the surface of 10mm glass cloth honeycomb core2) And (3) drying the wave-absorbing coating, putting the wave-absorbing coating in an oven at 80 ℃ for 2h, drying the wave-absorbing coating, and curing the wave-absorbing coating at 180 ℃ for 2 h.
Laying 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), laying a wave-absorbing honeycomb core, laying two pieces of 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing the pieces under a hot press for curing and forming, and finally carrying out resin cold bonding forming on a copper mesh and a wave-absorbing plate.
Comparative example 4:
the coating formula comprises: 20 parts of resin, 60 parts of absorbent, 90 parts of organic solvent, 0.5 part of flatting agent and 0.5 part of anti-settling agent. Wherein the resin is epoxy modified organic silicon resin, the absorbent is FSA which is not subjected to ball milling treatment, and the solvent is dimethylbenzene; the leveling agent is polyester modified polydimethylsiloxane, the anti-settling agent is organic bentonite, and the FSA proportion is 85% of Fe9.6% of Si5.4% of Al.
The wave absorbing plate is prepared by adopting a co-curing process, and the copper mesh is cold-bonded after being formed, and the specific method comprises the following steps:
and (3) uniformly dispersing the resin, the absorbent, the leveling agent, the anti-settling agent and the solvent under the condition of high-speed stirring to obtain the wave-absorbing coating material.
Spraying design weight (2.6 kg/m) on the surface of 10mm glass cloth honeycomb core2) And (3) drying the wave-absorbing coating, putting the wave-absorbing coating in an oven at 80 ℃ for 2h, drying the wave-absorbing coating, and curing the wave-absorbing coating at 180 ℃ for 2 h.
Laying 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%) +0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), laying a wave-absorbing honeycomb core, laying two pieces of 0.2mm glass fiber prepreg (the weight of glass fiber cloth is 210g, the resin content is 42%), placing the pieces under a hot press for curing and forming, and finally carrying out resin cold bonding forming on a copper mesh and a wave-absorbing plate.
The honeycomb-structure wave absorbing plates obtained in the above examples and comparative examples pass 240 ℃ high temperature tests for 2h and 100h respectively, and the high temperature resistance of the material is evaluated through the electrical property, mechanical property and deformation amount, and the test table is shown in the following table 1:
TABLE 1
Note: comparative example 1 failed the 240 ℃ 2h and 100h tests and suffered damage
The test results show that the four embodiments of the invention still have better mechanics after high-temperature test, have smaller change of reflectivity and deformation, still have better electromagnetic wave absorption effect, and can meet the use under the condition of high-temperature environment. The comparative example 1 has serious reduction of mechanical and wave-absorbing properties at the high temperature of 240 ℃ and can not be used for a long time at the temperature of 240 ℃ or above. Compared with the prior art, the part of the comparative example 2 used at high temperature is oxidized, the wave-absorbing performance is greatly reduced, meanwhile, the deformation amount is larger when the comparative example 3 is used at high temperature, the use can not be satisfied, and the absorbent of the comparative example 4 is not treated, and the low-frequency absorption effect is poorer, so that the high-temperature-resistant structure wave-absorbing material has better high-temperature-resistant wave-absorbing performance effect through comparison.
The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. The high-temperature-resistant wave absorbing plate is characterized by comprising the following specific steps: the wave-absorbing honeycomb sandwich structure comprises a wave-absorbing honeycomb core layer, wherein an upper skin is arranged on the upper side of the wave-absorbing honeycomb core layer, and a lower skin is arranged on the lower side of the wave-absorbing honeycomb core layer; the wave-absorbing honeycomb core layer is made of glass fiber materials, and a wave-absorbing coating is sprayed on the surface of the wave-absorbing honeycomb core layer; the upper skin and the lower skin are manufactured by hot-press molding of prepreg prepared from fiber reinforced resin.
2. The high temperature resistant wave absorbing plate of claim 1, characterized in that: the wave-absorbing honeycomb core has regular hexagonal holes with side length of 2.5-6mm and thickness of 10-30 mm.
3. The high temperature resistant wave absorbing plate of claim 1, characterized in that: the raw material in the wave-absorbing honeycomb core layer is glass fiber cloth made of glass fiber, and the glass fiber cloth is impregnated with polyimide, phenolic cyanate resin or cyano resin.
4. The high temperature resistant wave absorbing plate of claim 1, characterized in that: the wave-absorbing coating comprises, by weight, 60-75 parts of an absorbent, 20-40 parts of matrix resin, 90-112 parts of an organic solvent, 0.5-1 part of a leveling agent and 0.2-0.5 part of an anti-settling agent.
5. The high temperature resistant wave absorbing plate according to claim 4, characterized in that: the absorbent is alloy powder FSA and/or FSC.
6. The high temperature resistant wave absorbing plate according to claim 4, characterized in that: the matrix resin is one or more of organic silicon resin or modified organic silicon resin for compounding; the organic silicon resin is polyalkyl organic silicon resin, polyaryl organic silicon resin or polyalkyl aryl organic silicon resin, and the modified organic silicon resin is epoxy modified organic silicon resin, acrylic acid modified organic silicon resin or polyurethane modified organic silicon resin.
7. The high temperature resistant wave absorbing plate according to claim 4, characterized in that: the organic solvent is xylene, n-butanol and/or butyl acetate; the anti-settling agent is one of modified polyurea compound, fumed silica and organic bentonite; the leveling agent is acrylic copolymer or polyester modified polydimethylsiloxane.
8. The high temperature resistant wave absorbing plate of claim 1, characterized in that: the fibers in the upper skin and the lower skin are glass fibers, and the resin is polyimide resin or bismaleimide resin; the lower layer of the covering is also provided with a copper mesh layer.
9. The high temperature resistant wave absorbing plate of claim 1, characterized in that: glue films are arranged between the wave-absorbing honeycomb core layer and the upper skin and between the wave-absorbing honeycomb core layer and the lower skin.
10. The method for preparing the high-temperature-resistant wave-absorbing plate as claimed in any one of claims 1 to 9, which is characterized by comprising the following steps:
s1, preparing a wave-absorbing coating, spraying the wave-absorbing coating on the surface of the honeycomb core layer, drying the surface of the honeycomb core layer, and then drying and curing the honeycomb core layer to obtain the wave-absorbing honeycomb core layer;
s2, laying the prepreg, and curing and forming to prepare an upper skin;
s3, curing and molding to obtain a lower-layer skin according to the laying mode of the prepreg, the copper mesh and the prepreg;
s4, laying layers according to the laying mode of the upper skin, the glue film, the wave-absorbing honeycomb core, the glue film and the lower skin, and finally carrying out high-temperature curing molding to obtain the high-temperature-resistant wave-absorbing plate.
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| CN115365488A (en) * | 2022-07-21 | 2022-11-22 | 航天特种材料及工艺技术研究所 | High-performance high-temperature-resistant electromagnetic loss material and preparation method thereof |
| CN115384128A (en) * | 2022-07-25 | 2022-11-25 | 成都飞机工业（集团）有限责任公司 | Wave-absorbing honeycomb material and preparation method thereof |
| CN115651601A (en) * | 2022-11-11 | 2023-01-31 | 航天特种材料及工艺技术研究所 | High-reliability cyano resin wave-absorbing adhesive film with controllable flowability and preparation method thereof |
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| CN112564351A (en) * | 2020-12-11 | 2021-03-26 | 陕西航空电气有限责任公司 | Composite material sleeve for high-speed motor and preparation method thereof |
| CN112564351B (en) * | 2020-12-11 | 2023-12-05 | 陕西航空电气有限责任公司 | Composite sleeve for high-speed motor and preparation method thereof |
| CN115365488A (en) * | 2022-07-21 | 2022-11-22 | 航天特种材料及工艺技术研究所 | High-performance high-temperature-resistant electromagnetic loss material and preparation method thereof |
| CN115384128A (en) * | 2022-07-25 | 2022-11-25 | 成都飞机工业（集团）有限责任公司 | Wave-absorbing honeycomb material and preparation method thereof |
| CN115651601A (en) * | 2022-11-11 | 2023-01-31 | 航天特种材料及工艺技术研究所 | High-reliability cyano resin wave-absorbing adhesive film with controllable flowability and preparation method thereof |
| CN116285660A (en) * | 2023-02-08 | 2023-06-23 | 之江实验室 | Multifunctional magnetic resin-based composite wave-absorbing coating and preparation method and application thereof |
| CN116285660B (en) * | 2023-02-08 | 2023-08-11 | 之江实验室 | Multifunctional magnetic resin-based composite wave-absorbing coating and preparation method and application thereof |
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| CN114274623B (en) | 2023-06-09 |
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