CN114227026B - Ultra-fast laser controllable hole type group hole precision machining device and method - Google Patents
Ultra-fast laser controllable hole type group hole precision machining device and method Download PDFInfo
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- CN114227026B CN114227026B CN202111510708.8A CN202111510708A CN114227026B CN 114227026 B CN114227026 B CN 114227026B CN 202111510708 A CN202111510708 A CN 202111510708A CN 114227026 B CN114227026 B CN 114227026B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
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Abstract
The invention discloses a group hole precision machining device and method of an ultrafast laser controllable hole type, which are used in the field of laser precision machining, wherein the device consists of an ultrafast laser, a laser displacement sensor, a reflecting mirror, a focusing lens, three-dimensional numerical control motion platforms A and B, a manual swing sliding table, a numerical control rotating table, a tool clamp and a computer controller; the technical scheme principle is that laser is motionless, and a numerical control rotary table drives a workpiece to rotate for drilling. The aperture is mainly determined by the distance between the laser optical axis and the rotating shaft of the numerical control rotating table, the hole type is mainly determined by the inclination angle of the numerical control rotating table, and the hole type is adjusted through the three-dimensional numerical control moving platforms A and B and the manual swinging sliding table. The laser displacement sensor assists in accurate positioning, and a method for coaxially and accurately positioning the laser optical axis and the numerical control rotary table is also provided. The invention can realize high-quality precise flexible processing of fixed hole type, fixed aperture and group hole.
Description
Technical Field
The invention belongs to the field of laser precision machining, and particularly relates to an ultrafast laser controllable hole type group hole precision machining device and method.
Background
Nowadays, along with the continuous maturation and rapid development of laser technology, laser has the advantages of non-direct contact, no material selection, no mechanical stress, precise processing, good quality, high efficiency and the like, and is increasingly widely applied in the industrial fields of micro-hole processing, fine cutting and the like. Such as conventional mechanical drilling, are difficult to provide with a small, durable drill bit, are easily broken and chip-removing during drilling of large depth to diameter ratio holes, and are difficult to machine with hard and brittle materials. Spark-drilling can only process conductive materials again, and recast can occur on the machined surface. For these situations, laser drilling has shown an unprecedented advantage, and has increasingly played an indispensable important role.
At present, the hole size of continuous laser and long pulse laser processing is larger, and the quality precision is poor. And ultra-fast laser is good at processing fine structures, and has high quality precision. However, most of laser emitted by the current ultrafast laser is Gaussian beam with linear polarization state, the directly processed hole is always in a taper hole shape with a large inlet and a small outlet, and the straight hole is difficult to process. And the outlets of the holes processed by rotary cutting or spiral processing are not round, and can be flattened, and the direction of flattening is related to the direction of linear polarization. Thus, laser drilling is difficult for precise control of the hole pattern.
In response to these problems, there is an increase
The wave plate is used for drilling holes by adjusting linearly polarized light into circular polarization, and the roundness problem of an outlet can be solved, but the taper problem cannot be solved. The taper is realized by adopting a multi-wedge inclined beam rotating head at present, but the precision requirement of equipment is high, the manufacturing is difficult and the price is high. There are also a small number of studies on tilting rotary tables for drilling, but only preliminary assumptions have been made, and no specific feasible operation scheme has been given, and the hole pattern control capability is poor, making it difficult to repeatedly process the same two holes.
Disclosure of Invention
In order to solve the problems, the invention provides a group hole precision machining device and method for an ultrafast laser controllable hole type, which can realize precision control on taper, aperture, hole type, group hole machining and consistency of micropores on a workpiece and is simple and efficient in operation.
In order to achieve the purpose, the invention adopts the following technical scheme:
an ultrafast laser controllable hole type group hole precision machining device comprises an ultrafast laser, a laser displacement sensor, a numerical control motion platform and a computer controller;
the laser generated by the ultrafast laser can be converged on a workpiece through the reflecting mirror and the focusing lens in sequence, the workpiece is fixed on the numerical control motion platform through the fixture, the incidence angle of laser emitted by the laser displacement sensor on the reflecting mirror is 45 degrees, the laser is coaxial with the laser emitted by the ultrafast laser after penetrating through the reflecting mirror, and the computer controller is used for connecting and controlling the ultrafast laser and the numerical control motion platform.
The invention is further improved in that the numerical control moving platform comprises a three-dimensional numerical control moving platform A, a manual swing sliding table, a numerical control rotating table and a three-dimensional numerical control moving platform B;
the three-dimensional numerical control motion platform A can realize the motion in the directions of x, y and z, is provided with a manual swing sliding table and is fixedly connected through threads;
the manual swing sliding table can swing around a y axis, the maximum swing angle is +/-10 degrees, the resolution is 5', and the manual swing sliding table is provided with a numerical control rotating table and is fixedly connected through threads;
the rotation speed of the numerical control rotary table is maximum 12s/r, the rotation angle resolution is 1', and the three-dimensional numerical control motion platform B is arranged on the numerical control rotary table and is fixedly connected through threads;
the three-dimensional numerical control motion platform B can realize motions in the directions of x, y and z, is provided with a fixture and is fixed through threaded connection.
The invention is further improved in that the ultra-fast laser is a femtosecond laser with the wavelength of 800nm, the repetition frequency of 1000Hz and the maximum power of 4W.
The invention is further improved in that the reflecting mirror is a single-wavelength 800nm reflecting mirror, and the incident angle of laser on the reflecting mirror is 45 degrees.
The invention is further improved in that the focusing lens is a plano-convex lens with a focal length of 200mm.
The invention is further improved in that the laser displacement sensor emits laser with the wavelength of 650nm, can measure the distance on the inclined surface, has the measuring range of 300mm and the resolution of 10 mu m, and is positioned above the reflecting mirror.
The invention is further improved in that the tool clamp comprises a lower support, an upper support and a bolt, wherein the height of the lower support is h 4 The workpiece is clamped between the upper support and the lower support and is clamped and fixed through bolts.
The group hole precision machining method of the ultrafast laser controllable hole type is based on the group hole precision machining device of the ultrafast laser controllable hole type, and comprises the following steps of:
step one: finding a focus;
turning on an ultrafast laser, a laser displacement sensor, a numerical control motion platform and a computer controller, zeroing the swing angle of a manual swing sliding table, finding the focus position of laser by a scribing method, and recording the reading D of the laser displacement sensor at the moment, wherein D=d+f;
step two: adjusting the rotation axis of the numerical control rotation table to be coaxial with the laser emitted by the ultrafast laser;
moving the x and y axes of the three-dimensional numerical control moving platform A, roughly aligning the rotating shaft of the numerical control rotating platform with incident laser, clamping a test piece on a fixture, and moving the z axis of the three-dimensional numerical control moving platform B to enable the swinging center O of the manual swinging sliding platform to be positioned on the surface of the test piece, namely adjusting h 3 Let h=h 1 +h 2 +h 3 +h 4 +h 5 Moving the z axis of the three-dimensional numerical control motion platform A to enable the reading of the laser displacement sensor to be D, enabling the focus of laser to fall on the surface of a test piece at the moment, turning on the laser, enabling the numerical control rotary table to rotate 180 degrees, turning off the laser, measuring the distance between Deltax and Deltay at two ends of a processing semicircular track under a microscope, and moving the three-dimensional numerical control motion platform
And->
The distance is kept to enable the rotating shaft of the numerical control rotating table to be coaxial with laser emitted by the ultrafast laser;
step three: determining a processing position;
clamping a workpiece on a fixture, determining the processing position of the workpiece according to a laser spot emitted by a laser displacement sensor, and adjusting by using a three-dimensional numerical control motion platform B;
step four: determining machining size and hole pattern;
firstly, setting the deflection angle theta of a manual swing sliding table and the moving direction of a three-dimensional numerical control moving platform A according to the taper requirement of a machining hole type, setting the moving distance Deltax of the three-dimensional numerical control moving platform A according to the machining aperture requirement, and machining the radius of the hole
r is the hole radius of ultra-fast laser impact drilling, then the three-dimensional numerical control motion platform ADeltaz is moved, deltaz=Deltax·tan theta, the defocusing amount change caused by moving the three-dimensional numerical control motion platform ADeltax is compensated, and at the moment, the reading of the laser displacement sensor can be noticed and returned to D again;
step five: drilling a single hole;
setting the rotation number and the rotation speed of a numerical control rotary table, moving a three-dimensional numerical control motion platform ADeltaz, setting the defocus amount required by machining, and starting an ultrafast laser to start drilling;
step six: machining group holes;
after the single hole is machined, the ultrafast laser is turned off, the three-dimensional numerical control moving platform B is moved to the next machining station of the machined piece according to the laser light spot of the laser displacement sensor, and the steps five and six are repeated until all group holes are machined;
step seven: finishing the processing;
and after the machining is finished, the machined parts are removed, and all the equipment is closed.
Compared with the prior art, the invention has at least the following beneficial technical effects:
1. the ultrafast laser controllable hole type group hole machining device designed by the invention has the advantages of simple structure, low cost, flexible control, simple and convenient operation, capability of realizing machining of various holes such as fixed taper, fixed aperture and the like, capability of feeding and machining, high machining quality and precision, sharp and controllable hole edges and good consistency.
2. The laser emitted by the laser displacement sensor can be coaxial through the reflecting mirror and the ultrafast laser, the function of indicating light spots can be achieved, positioning is convenient, real-time grasping of defocus is easy to achieve when a workpiece is inclined, and machining precision is further enhanced.
3. The ultrafast laser controllable hole group hole machining method provided by the invention has the advantages that the operability is strong, the flow is simple, the geometric errors and positioning errors of the instrument are corrected in the preprocessing process of the test piece, and the difficult problem of precision control is effectively solved.
4. According to the invention, the mode of laser immobility and workpiece rotation driven by the numerical control rotary table is adopted for drilling, so that the problem of flattening of a hole outlet caused by linearly polarized light can be avoided, the problem of poor hole roundness caused by poor light beam quality can be avoided, meanwhile, compared with the scanning galvanometer and the three-dimensional numerical control motion platform for drilling, the problem of interpolation precision is avoided, and the overall roundness is very high.
Drawings
FIG. 1 is a schematic diagram of a group hole machining device with ultra-fast laser controllable hole patterns;
FIG. 2 is a partial enlarged view of a tooling fixture of the ultrafast laser controllable hole type group hole machining device;
FIG. 3 is a schematic view of a machining hole pattern of the present invention with different angles and positions of the incident laser relative to the workpiece rotation axis;
fig. 4 is a schematic diagram of calculation of the movement of the three-dimensional numerical control motion platform a to the change of the aperture and the defocus amount according to the present invention, wherein fig. 4 (a) is a rightward movement Δx, and fig. 4 (b) is a downward movement Δz;
FIG. 5 is a schematic view of an exemplary graph processed by rotating the numerical control turntable 180 ° in the second step of the present invention, wherein FIG. 5 (a) is before the alignment and FIG. 5 (b) is after the alignment;
FIG. 6 is an electron microscope image of an exemplary cone-free entry and exit of the process according to the present invention, FIG. 6 (a) being the entry and FIG. 6 (b) being the exit;
FIG. 7 is a cross-sectional electron microscope view of an exemplary 2mm no-taper hole of the process of the present invention;
fig. 8 is a cross-sectional view of 2 example 4.5mm different hole patterns of the process of the present invention, fig. 8 (a) is a straight hole, and fig. 8 (b) is a scaled hole.
The reference numerals are as follows:
the device comprises a 1-three-dimensional numerical control moving platform A, a 2-manual swing sliding table, a 3-numerical control rotating table, a 4-three-dimensional numerical control moving platform B, a 5-tool clamp, a 6-workpiece, a 7-focusing lens, an 8-reflecting mirror, a 9-laser A, a 10-laser displacement sensor, an 11-laser B, a 12-ultrafast laser, a 13-computer controller, a 51-upper supporting block, a 52-bolt and a 53-lower supporting block.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
As shown in FIG. 1, the group hole precision machining device with the ultrafast laser controllable hole pattern comprises an ultrafast laser 12, a laser displacement sensor 10, a reflecting mirror 8, a focusing lens 7, a three-dimensional numerical control moving platform A1, a manual swing sliding table 2, a numerical control rotating table 3, a three-dimensional numerical control moving platform B4, a tool fixture 5, a workpiece 6 and a computer controller 13.
The ultrafast laser 12 emits laser light B11, the laser light B11 is reflected after being incident on the reflecting mirror 8 at 45 degrees, the laser displacement sensor 10 emits laser light A9, the laser light A9 is transmitted after being incident on the reflecting mirror 8 at 45 degrees, the reflecting mirror 8 is an 800nm single-wavelength reflecting mirror, other wave band light can penetrate, the reflected laser light B11 and the transmitted laser light A9 are kept coaxial, and the reflected laser light B11 and the transmitted laser light A9 pass through the focusing lens 7 together and then are converged on the surface of the workpiece 6. The workpiece 6 is clamped by the fixture 5, the fixture 5 is installed and fixed on the three-dimensional numerical control moving platform B4 through threaded connection, the three-dimensional numerical control moving platform B4 is installed and fixed on the numerical control rotating platform 3 through threaded connection, the numerical control rotating platform 3 is installed and fixed on the manual swing sliding table 2 through threaded connection, and the manual swing sliding table 2 is installed and fixed on the three-dimensional numerical control moving platform A1 through threaded connection. The three-dimensional numerical control moving platform A1, the manual swing sliding table 2, the numerical control rotating table 3, the three-dimensional numerical control moving platform B4 and the tool fixture 5 jointly form a moving platform of the machining system, so that eight-axis movement of the workpiece 6 can be realized, and the eight-axis movement comprises six moving pairs and two rotating pairs. The two rotational degrees of freedom are provided by the numerical control rotary table 3 and the manual swing sliding table, rotary cutting drilling and inclined drilling of the workpiece 6 can be respectively realized, and holes with different conicity can be generated by different inclined angles; the six degrees of freedom of movement are provided by the three-dimensional numerical control motion platform A1 and the three-dimensional numerical control motion platform B4, so that the machining position, the drilling aperture and the drilling hole type of the workpiece 6 can be controlled, and the requirement of group hole machining is met. The computer controller 13 is connected with and controls the ultrafast laser 12, the three-dimensional numerical control motion platform A1, the numerical control rotary table 3 and the three-dimensional numerical control motion platform B4. The laser displacement sensor 10 can play a role in indicating light spots, can monitor the defocusing amount state of laser to the surface of a workpiece at different positions and angles in real time, and is helpful for ensuring accurate positioning.
Fig. 2 is a partial enlarged view of the tooling fixture 5 according to the invention, which comprises an upper supporting block 51, a bolt 52 and a lower supporting block 53, wherein the workpiece 6 is clamped between the upper supporting block 51 and the lower supporting block 53, threaded holes are arranged on the upper supporting block 51 and the lower supporting block 53, and the workpiece 6 is clamped by tightening the bolt 52.
As shown in fig. 3, when the swing angle of the manual swing sliding table 2 is 0 and the workpiece 6 is horizontally placed, a positive taper hole with a large inlet and a small outlet is generated due to gaussian energy distribution of the fast laser B11 and light beam shielding factors in the deep hole; when the manual swing sliding table 2 swings rightwards by a certain angle and the workpiece 6 tilts leftwards, the laser B11 is incident on the surface of the workpiece 6 and the right and left side of the intersection point O of the rotating shaft of the numerical control rotating table 3, the positive taper of the drilled hole becomes smaller, and even a hole without taper and a hole with negative taper can be generated along with the increase of the swing angle; when the manual swing sliding table 2 swings rightwards by a certain angle and the workpiece 6 tilts leftwards, the laser B11 is incident right of the intersection point O of the surface of the workpiece 6 and the rotating shaft of the numerical control rotating table 3, so that the positive taper of the drilled hole is increased; when the manual swing sliding table 2 swings rightwards by a certain angle and the workpiece 6 tilts leftwards, the laser B11 is incident right in front of or right behind the intersection point O of the surface of the workpiece 6 and the rotating shaft of the numerical control rotating table 3, the drilled hole is still a hole with positive taper, and the taper is the same as that when the workpiece 6 is horizontally placed.
As shown in fig. 4, the three-dimensional numerical control motion platform A1 is mainly used for controlling the drilling aperture and defocus amount of the workpiece 6. When the manual swing sliding table 2 swings rightwards by theta, the workpiece 6 tilts leftwards by theta, and the laser B11 is incident right and left of the intersection point O of the surface of the workpiece 6 and the rotating shaft of the numerical control rotating table 3, the three-dimensional numerical control moving platform A1 moves rightwards by delta x, the defocusing amount is increased by delta x and tan theta, and the aperture is increased
The three-dimensional numerical control motion platform A1 moves downwards by deltaz, the defocus amount is increased by deltaz, and the aperture is kept unchanged.
The following are specific examples:
in a first embodiment, the method for precisely machining group holes with ultra-fast laser controllable hole patterns provided by the invention is used for machining a row of hole groups consisting of 5 non-conical straight holes with the diameter phi=550 μm and the interval of 2mm on a stainless steel plate with the thickness of 2mm, and specifically comprises the following steps:
step one: find the focus. The ultrafast laser 12, the laser displacement sensor 10, the three-dimensional numerical control moving platform A1, the numerical control rotating platform 3, the three-dimensional numerical control moving platform B4 and the computer controller 13 are started, the swinging angle of the manual swinging sliding table 2 is zeroed, a silicon wafer is adopted for scribing and focusing, the height corresponding to the thinnest line is the focal position of the laser, and the reading of the laser displacement sensor 10 at the moment is recorded to be D= 243.54.
Step two: the rotation axis of the numerical control rotary table 3 is adjusted to be coaxial with the laser beam B11 emitted by the ultrafast laser 12. The x and y axes of the three-dimensional numerical control motion platform A1 are moved approximately to the rotation axis of the Ji Shukong rotation platform 3 and the incident laser beam B11. Clamping a stainless steel test piece 6 with the thickness of 2mm onto the fixture 5, and moving the three-dimensional numerical controlThe z axis of the motion platform B4 enables the swing center O of the manual swing sliding table 2 to be positioned on the surface of the stainless steel test piece 6 with the thickness of 2 mm. Known manual swing slipway 2 height h 1 =24mm, numerical control rotary table 3 height h 2 =45 mm, tool clamp 5 height h 4 Stainless steel test piece 6 height h =20mm 5 The height H of the swing center O of the manual swing sliding table 2 is=150mm, namely the height H of the three-dimensional numerical control moving platform B4 is adjusted 3 ＝H-h 1 -h 2 -h 4 -h 5 =59 mm. The z axis of the three-dimensional numerical control motion platform A1 is moved to enable the reading d= 243.54 of the laser displacement sensor 10, and at the moment, the focus of the laser B11 falls on the surface of the stainless steel test piece 6. The laser B11 is turned on, the numerical control rotary table 3 is rotated by 180 degrees, the laser B11 is turned off, the stainless steel test piece 6 is taken down to be placed under an optical microscope in the same direction on the tool fixture 5 for observation, and the deltax and deltay distances at two ends of the machined semicircular track are measured. As shown in fig. 5 (a), if Δx= 341.17 μm and Δy= 198.25 μm, the three-dimensional numerically-controlled motion platform is moved leftward
Forward moving three-dimensional numerical control motion platform>
The distance is such that the rotation axis of the nc rotation stage 3 is coaxial with the laser light B11 emitted from the ultrafast laser 12. At this time, the laser B11 is turned on, the numerical control rotary table 3 rotates 180 degrees, and the processing pattern on the stainless steel test piece 6 can only see one round pit instead of a half arc under an optical microscope as shown in fig. 5 (B), which indicates that the processing pattern is aligned;
step three: and determining a processing position. Clamping a stainless steel workpiece 6 with the thickness of 2mm onto a fixture 5, determining the machining position of the stainless steel workpiece 6 with the thickness of 2mm according to a laser A9 facula emitted by a laser displacement sensor 10, and adjusting by utilizing a three-dimensional numerical control motion platform B4;
step four: the machining size and hole pattern are determined. The size of the intended machining hole is phi=550 μm, and the hole pattern is a straight hole without taper. Setting a rightward deflection angle theta=6° of the manual swing sliding table 2, moving the three-dimensional numerical control moving platform A1 leftwards by a distance deltax= (R-R) cos theta, knowing the radius r=275 μm of a planned machining hole, the deflection angle theta=6° and the repetition frequency 1000kHz of the laser beam B11 emitted by the ultrafast laser 12, setting the laser power to 2.5W, and the hole radius r=146 μm of impact punching when the negative defocus is 2.5mm, and moving the three-dimensional numerical control moving platform A1 leftwards by a distance deltax= 128.29 μm. Then, the three-dimensional numerical control motion platform a1Δz, Δz=Δx·tanθ=13.48 μm is moved upward. The defocusing amount change caused by moving the three-dimensional numerical control motion platform A1Deltax can be compensated, and at the moment, the reading of the laser displacement sensor can be noticed to return to D= 243.54 again;
step five: and drilling a single hole. Setting the rotation number of the numerical control rotary table 3 to be 25, setting the rotation speed to be 37 s/turn, moving the three-dimensional numerical control motion platform A1Deltaz=2.5mm upwards to be the negative defocus amount required by processing, and starting the laser B11 to start drilling;
step six: and (5) machining group holes. After the single hole is machined, the laser B11 is turned off, the three-dimensional numerical control moving platform B4 moves 2mm to the next machining station of the stainless steel workpiece 6 in the x-axis negative direction according to the laser A9 facula of the laser displacement sensor 10, and the steps five and six are repeated until the rest 4 holes are finished. Fig. 6 is a photograph of an entrance and an exit of a hole under an electron microscope after processing, and fig. 7 is a photograph of a cross-section electron microscope of the processed hole after being cut, and it can be seen that the processing quality and the processing precision of the hole are higher.
Step seven: and finishing the processing. After the machining is finished, the stainless steel workpiece 6 is dismounted, and all the equipment is closed.
While the invention has been described in detail with respect to the general description and specific embodiments thereof, modifications or improvements may be made thereto based on the invention, such as selecting an appropriate laser and tool holder for processing a particular workpiece according to processing requirements, and integrating a CCD system into the optical path for on-line observation and measurement, thereby enabling faster calibration of the entire optical system and positioning of the process, and further increasing the drilling rate by the ultra-fast laser beam high-speed circular motion, as would be readily apparent to one skilled in the art. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.
Claims (4)
1. The group hole precision machining method of the ultrafast laser controllable hole type is characterized by being based on a group hole precision machining device of the ultrafast laser controllable hole type, and the device comprises an ultrafast laser, a laser displacement sensor, a numerical control motion platform and a computer controller;
the laser generated by the ultrafast laser can be converged on a workpiece through the reflecting mirror and the focusing lens in sequence, the workpiece is fixed on the numerical control motion platform through the fixture, the incidence angle of laser emitted by the laser displacement sensor on the reflecting mirror is 45 degrees, the laser is coaxial with the laser emitted by the ultrafast laser after passing through the reflecting mirror, and the computer controller is used for connecting and controlling the ultrafast laser and the numerical control motion platform;
the numerical control motion platform comprises a three-dimensional numerical control motion platform A, a manual swing sliding table, a numerical control rotating table and a three-dimensional numerical control motion platform B;
the three-dimensional numerical control motion platform A can realize the motion in the directions of x, y and z, is provided with a manual swing sliding table and is fixedly connected through threads;
the manual swing sliding table can swing around the y axis, the maximum swing angle is +/-10 degrees, the resolution is 5', and the height h is 1 A numerical control rotary table is arranged on the upper surface and is fixedly connected through threads;
the maximum rotation speed of the numerical control rotary table is 12s/r, the rotation angle resolution is 1', and the height h is 2 A three-dimensional numerical control motion platform B is arranged on the upper surface and is fixedly connected through threads;
the three-dimensional numerical control motion platform B can realize the motion in the directions of x, y and z, and has the height h 3 The fixture is arranged on the upper surface and is fixedly connected through threads;
the focusing lens is a plano-convex lens, and the focal length f=200mm;
the tool clamp comprises a lower support, an upper support and bolts, wherein the lower support is h in height 4 Is larger than the upper support, the workpiece is clamped between the upper support and the lower support, and the workpiece height h 5 And is clamped and fixed by bolts;
the method comprises the following steps:
step one: finding a focus;
turning on an ultrafast laser, a laser displacement sensor, a numerical control motion platform and a computer controller, zeroing the swing angle of a manual swing sliding table, finding the focus position of laser by a scribing method, and recording the reading D of the laser displacement sensor at the moment, wherein D=d+f, and D represents the height of a focusing lens from the laser displacement sensor;
step two: adjusting the rotation axis of the numerical control rotation table to be coaxial with the laser emitted by the ultrafast laser;
moving the x and y axes of the three-dimensional numerical control moving platform A, roughly aligning the rotating shaft of the numerical control rotating platform with incident laser, clamping a test piece on a fixture, and moving the z axis of the three-dimensional numerical control moving platform B to enable the swinging center O of the manual swinging sliding platform to be positioned on the surface of the test piece, namely adjusting h 3 Let h=h 1 +h 2 +h 3 +h 4 +h 5 Moving the z axis of the three-dimensional numerical control motion platform A to enable the reading of the laser displacement sensor to be D, enabling the focus of laser to fall on the surface of a test piece at the moment, turning on the laser, enabling the numerical control rotary table to rotate 180 degrees, turning off the laser, measuring the distance between Deltax and Deltay at two ends of a processing semicircular track under a microscope, and moving the three-dimensional numerical control motion platform A
And->
The distance is kept to enable the rotating shaft of the numerical control rotating table to be coaxial with laser emitted by the ultrafast laser;
step three: determining a processing position;
clamping a workpiece on a fixture, determining a processing position on the workpiece according to a laser spot emitted by a laser displacement sensor, and adjusting by using a three-dimensional numerical control motion platform B;
step four: determining machining size and hole pattern;
firstly, setting a deflection angle theta and three dimensions of a manual swing sliding table according to taper requirements of machining holesSetting the moving distance Deltax of the three-dimensional numerical control moving platform A according to the machining aperture requirement and the radius of a machining hole in the moving direction of the numerical control moving platform A
r is the hole radius of ultra-fast laser impact drilling, then the three-dimensional numerical control motion platform ADeltaz is moved, deltaz=Deltax·tan theta, the defocusing amount change caused by moving the three-dimensional numerical control motion platform ADeltax is compensated, and at the moment, the reading of the laser displacement sensor can be noticed and returned to D again;
step five: drilling a single hole;
setting the rotation number and the rotation speed of a numerical control rotary table, moving a three-dimensional numerical control motion platform ADeltaz, setting the defocus amount required by machining, and starting an ultrafast laser to start drilling;
step six: machining group holes;
after the single hole is machined, the ultrafast laser is turned off, the three-dimensional numerical control moving platform B is moved to the next machining station of the workpiece according to the laser spot of the laser displacement sensor, and the steps five and six are repeated until all group holes are machined;
step seven: finishing the processing;
and after the processing is finished, the workpiece is disassembled, and all the equipment is closed.
2. The ultra-fast laser controlled hole type group hole precision machining method according to claim 1, wherein the ultra-fast laser is a femtosecond laser with the wavelength of 800nm, the repetition frequency of 1000Hz and the maximum power of 4W.
3. The ultra-fast laser controllable pass group hole precision machining method according to claim 1, wherein the reflecting mirror is a single-wavelength 800nm reflecting mirror, and the incidence angle of laser on the reflecting mirror is 45 degrees.
4. The ultra-fast laser controllable hole type group hole precision machining method according to claim 1, wherein the laser displacement sensor emits laser with the wavelength of 650nm, can measure the distance on the inclined surface, has the measuring range of 300mm and the resolution of 10 μm, and is positioned above the reflecting mirror.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111510708.8A CN114227026B (en) | 2021-12-10 | 2021-12-10 | Ultra-fast laser controllable hole type group hole precision machining device and method |
| PCT/CN2022/102275 WO2023103354A1 (en) | 2021-12-10 | 2022-06-29 | Precision machining apparatus and method for group holes of ultrafast laser controllable hole pattern |
| US18/455,645 US20240042554A1 (en) | 2021-12-10 | 2023-08-25 | Precision machining apparatus and method for machining controllable-hole-type multiple holes using ultrafast laser |
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| CN202111510708.8A CN114227026B (en) | 2021-12-10 | 2021-12-10 | Ultra-fast laser controllable hole type group hole precision machining device and method |
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| CN114227026B (en) * | 2021-12-10 | 2023-04-28 | 西安交通大学 | Ultra-fast laser controllable hole type group hole precision machining device and method |
| CN114897110B (en) * | 2022-07-15 | 2022-11-18 | 成都飞机工业（集团）有限责任公司 | Group hole measurement swing angle planning method, readable medium and equipment |
| CN115091063B (en) * | 2022-08-24 | 2022-11-04 | 绵阳新能智造科技有限公司 | Femtosecond laser inner hole wall machining device |
| CN117804357B (en) * | 2024-03-01 | 2024-05-14 | 中北大学 | Deep hole detection device and detection method based on laser reflection |
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