CN108838515A - A kind of method and device of excimer laser process tapered micro holes - Google Patents
A kind of method and device of excimer laser process tapered micro holes Download PDFInfo
- Publication number
- CN108838515A CN108838515A CN201810703941.XA CN201810703941A CN108838515A CN 108838515 A CN108838515 A CN 108838515A CN 201810703941 A CN201810703941 A CN 201810703941A CN 108838515 A CN108838515 A CN 108838515A
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- mask
- excimer laser
- sample
- platform
- laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention discloses a kind of method and device of excimer laser process tapered micro holes, which includes instruction light (1), excimer laser (2), mask exchange platform (3), mask (4), reflecting mirror (5), focus projection object lens (6), sample mounting table (7), three-dimensional automatically controlled displacement platform (8), motor driver (9) and computer (10).The present invention increases the taper of micropore by changing the size of mask in process, thoroughly changes the disadvantages of fine bellmouth taper is small and uncontrollable at present, hence it is evident that improve the purpose of micropore taper；Bellmouth is processed as laser light source using gas lasers such as excimer lasers, since gas photon energy is larger, greater than the chemical bond energy between material, the chemical bond that material can directly be interrupted realizes cold working, obtain preferable machined surface quality, have many advantages, such as that machining accuracy height, high reliablity, material are high to the absorptivity of light and without heat affected area simultaneously.
Description
Technical field
The invention belongs to laser micro-machining technology fields, swash more particularly to a kind of quasi-molecule for processing tapered micro holes
Light processing method and device.
Background technique
With the rapid development of the high-tech areas such as modern science, advanced manufacturing technology, biomedicine, to accurate micro element
Demand be increasingly urgent to.Traditional processing method is no longer satisfied the demand of people, and laser processing is that a kind of comparison is popular
Processing method, in micro processing field, laser processing is also equipped with all incomparable technical advantage of other any technologies, it is distinguished
It is processed in traditional material, it is the process of a Multiphoton Absorbtion, and nonlinear interaction process is occupied an leading position, and machining accuracy
It is high.The current development comparative maturity of nanosecond pulse excimer laser, with wavelength is short, photon energy is high, pulse output
The advantages such as energy is high, pulsed laser output is stablized, it has also become the key industry type laser in Laser Micro-Machining field, especially
248nm KrF excimer laser beam is advantageous for manufacture polymer material.Excimer laser process, which has, to be easy to answer
To processing object design variation, the high advantage of microfabrication, machining accuracy can be carried out.
Laser Micro-Machining is the desirable technique for Medical Devices manufacture, by selecting wavelength appropriate and pulse width,
Laser processing technology is substantially contactless simultaneously, dustless and nothing needed for this makes it can be used for Medical Devices manufacture
Collarium border, this method is for processing the polymeric molds that can repeatedly inject in relatively short cycle time.The present invention is used for
Excimer laser processes tapered micro holes at polymethyl methacrylate (PMMA), carries out reverse mould as micropin mold, obtains to give birth to
Object degradation polymer micropin, the low invasive syringe needle for therapeutic treatment carry out subcutaneous administration.
The method of existing laser processing tapered micro holes, obtained bellmouth taper is small, and bottom end aperture is big, obtains after reverse mould
Micropin tip the requirement of medical application is not achieved.How to increase the taper of micropore, while being easy demoulding after making reverse mould, is managed
The micropin thought has become a problem in urgent need to solve.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of sides of excimer laser process tapered micro holes
Method and device use dual masks to carry out Laser Micro-Machining bellmouth.
The technical scheme adopted by the invention is that：
A kind of device of excimer laser process tapered micro holes, the device include：Indicate light (1), excimer laser
(2), mask exchanges platform (3), mask (4), reflecting mirror (5), focus projection object lens (6), sample mounting table (7), three-dimensional automatically controlled position
Moving stage (8), motor driver (9) and computer (10).System control program, sample mounting table (7) are housed in computer (10)
Machine table is formed after being placed on three-dimensional automatically controlled displacement platform (8), reflecting mirror (5) is diagonally disposed along 45 ° of directions, reflecting mirror (5)
Center is overlapped with the central axes of focus projection object lens (6), and sample is fixed on sample mounting table (7) by fixture, computer
(10) pass through computer with excimer laser (2), motor driver (9) and three-dimensional automatically controlled displacement platform (8) connection respectively
(10) the three-dimensional automatically controlled displacement platform (8) of control carries out realizing moving up and down for sample；Indicate light (1), excimer laser
(2), mask exchange platform (3), reflecting mirror (5), focus projection object lens (6) are successively attached along optic path direction, mask tune
Have at the incident light of zapping (3) mask (4), the emergent light that mask exchanges platform (3) passes through the diagonally disposed reflecting mirror in 45 ° of directions
(5) reflection becomes with original optical path in the optical path of the angle 90o straight down, then passes through focus projection object lens (6) to three-dimensional automatically controlled displacement
On sample on platform (8) and sample mounting table (7).
The instruction light (1) is that HeNe indicates that light, excimer laser (2) are 248nm KrF excimer laser, reflection
Mirror (5) is 248nm wave band high reflectivity mirror.
Utilize the method for the excimer laser process tapered micro holes that described device is realized, which is characterized in that including following step
Suddenly：
(1) calibrate excimer laser process device optical path, make excimer laser instruction light and quasi-molecule it is ultraviolet
Laser coaxial is overlapped, and the laser beam that excimer laser issues can pass perpendicularly through the hole of mask center and by reflecting mirror
The heart changes optical path, and by laser beam deflection 90o, the laser beam direction of propagation after deflection is arrived by focus projection object lens straight down
Up on sample surfaces；
(2) mask is attached to mask to exchange at the incident light of platform, mask is adjusted to spot center position, and laser beam is enable to cover
Entire mask hole is covered, mask is fixed and mask exchanges platform；
(3) sample is placed on sample mounting table and is fixed, three-dimensional automatically controlled displacement is moved left and right by computer control
Platform changes the relative position of sample and hot spot, is allowed to be radiated at the position that will be processed；Three are moved up and down by computer control
The relative position that automatically controlled displacement platform changes sample and hot spot is tieed up, is placed exactly in the upper surface of sample in the image planes of exposure mask projection,
The sample upper surface obtained in this way is the shape of mask hole；
(4) shape of peep hole, finally selects suitable working process parameter after being processed by transformation different parameters
That is laser energy, laser pulse frequency, pulse number, the technological parameters such as mask pore size；
(5) laser is opened, according to the technological parameter processed sample chosen.
Computer in the present invention includes following functions to the control program of the system of processing：The triggering of excimer laser
Control, the driving motor control of three-dimensional automatically controlled displacement platform.
Sample of the present invention modes of emplacement in sample stage is shown in Fig. 2, when positive out of focus, the energy of material internal
Density specific surface is low, and the taper in hole can be made larger.
The invention has the advantages that：
The advantages of present invention makes full use of dual masks to process, it is micro- to increase by changing the size of mask in process
The taper in hole thoroughly changes the disadvantages of fine bellmouth taper is small and uncontrollable at present, hence it is evident that improve the purpose of micropore taper；
The present invention processes bellmouth as laser light source using gas lasers such as excimer lasers, due to gas light
Sub- energy is larger, and greater than the chemical bond energy between material, the chemical bond that can directly interrupt material realizes cold working, obtains preferable
Machined surface quality, while having that machining accuracy is high, high reliablity, material is high to the absorptivity of light and without heat affected area etc.
Advantage.
Detailed description of the invention
Fig. 1 is the processing unit (plant) schematic diagram of excimer laser process tapered micro holes of the present invention；
Fig. 2 is the schematic diagram of sample modes of emplacement in sample stage.
Fig. 3 is two masks of different sizes and mask hole schematic diagram.
Fig. 4 is that single mask processes tapered micro holes result figure.
Fig. 5 is that dual masks process tapered micro holes result figure.
In figure：1- indicates that light, 2- excimer laser, 3- mask exchange platform, 4- mask, 5- reflecting mirror, 6- focus projection
The three-dimensional automatically controlled displacement platform of object lens, 7- sample mounting table, 8-, 9- motor driver, 10- computer.
Specific embodiment
The technical detail of method and apparatus proposed by the present invention is described in further details with reference to the accompanying drawing：
Referring to Fig.1, a kind of processing unit (plant) of excimer laser process tapered micro holes proposed by the present invention includes：Computer and
It controls software, instruction light, excimer laser, exposure mask and exposure mask and exchanges platform, 248nm wave band high reflectivity mirror, focus and throw
Shadow object lens, sample mounting table, three-dimensional automatically controlled displacement platform and motor driver.
The present invention can carry out the tapered micro holes of the preferable taper of excimer laser process on organic glass PMMA thin plate.
The specific steps that excimer laser processes bellmouth on organic glass PMMA include：
(1) light channel structure for calibrating excimer laser process system, by laser beat facula position on sensitive paper with
It indicates relative position of the illumination on paper, to judge to indicate light and the whether same overlapping of axles of laser beam, while light beam being enable to hang down
Direct puncture crosses mask aperture and center and focus projection object lens axis across reflecting mirror；
(2) exposure mask is attached to exposure mask to exchange at the incident light of platform, exposure mask is adjusted to spot center position, issues laser
Beam and focus can cover entire mask aperture, fix exposure mask and exposure mask exchanges platform；
(3) PMMA thin plate is placed on sample mounting table and is fixed, laser and material are controlled by the program on computer
The relative position of material makes it that the upper surface of Working position be wanted to be placed exactly at the image planes of optical projection system；
(4) mask that aperture is 2mm is first fixed on mask to exchange on platform, opens laser, joined according to the laser set
It is several to play 100 pulses；
(5) motionless in same position sample, mask is changed to the aperture 1mm, be equally fixed on mask exchange platform on, with it is upper
It states identical laser parameter and plays 200 pulses；
(5) movement of sample is carried out by computer control bit moving stage, and its upper surface is made to be always positioned at optical projection system
As plane, guarantee that the shape of upper surface is round always.Next hole is beaten in continuation in the same way, until tapered micro holes dot matrix
Template completes the process.
The above is only a preferred embodiment of the present invention, it is not intended to limit the invention, it is noted that all foundations
Technical spirit of the invention any trickle amendment, equivalent replacement and improvement to the above embodiments, also should be regarded as the present invention
Protection scope within.
Claims (4)
1. a kind of device of excimer laser process tapered micro holes, it is characterised in that：The device includes instruction light (1), quasi-molecule
Laser (2), mask exchange platform (3), mask (4), reflecting mirror (5), focus projection object lens (6), sample mounting table (7), three-dimensional
Automatically controlled displacement platform (8), motor driver (9) and computer (10)；System control program is housed, sample is placed in computer (10)
Platform (7) forms machine table after being placed on three-dimensional automatically controlled displacement platform (8), and reflecting mirror (5) is diagonally disposed along 45 ° of directions, reflecting mirror
(5) center is overlapped with the central axes of focus projection object lens (6), and sample is fixed on sample mounting table (7) by fixture, is calculated
Machine (10) with excimer laser (2), motor driver (9) and three-dimensional automatically controlled displacement platform (8) connection, passes through computer respectively
(10) the three-dimensional automatically controlled displacement platform (8) of control carries out realizing moving up and down for sample；Indicate light (1), excimer laser
(2), mask exchange platform (3), reflecting mirror (5), focus projection object lens (6) are successively attached along optic path direction, mask tune
Have at the incident light of zapping (3) mask (4), the emergent light that mask exchanges platform (3) passes through the diagonally disposed reflecting mirror in 45 ° of directions
(5) reflection becomes with original optical path in the optical path of 90 ° of angles straight down, then passes through focus projection object lens (6) to three-dimensional automatically controlled displacement
On sample on platform (8) and sample mounting table (7).
2. a kind of device of excimer laser process tapered micro holes according to claim 1, it is characterised in that：The instruction
Light (1) is that HeNe indicates that light, excimer laser (2) are 248nm KrF excimer laser, and reflecting mirror (5) is 248nm wave band
High reflectivity mirror.
3. a kind of device of excimer laser process tapered micro holes according to claim 1, it is characterised in that：Computer pair
The control program of the system of processing includes following functions：The triggering of excimer laser controls, the driving of three-dimensional automatically controlled displacement platform
Motor control.
4. utilizing the method for the excimer laser process tapered micro holes that described device is realized, which is characterized in that include the following steps：
(1) optical path for calibrating excimer laser process device makes the ultraviolet laser of the instruction light and quasi-molecule of excimer laser
Same overlapping of axles, the laser beam that excimer laser issues can pass perpendicularly through the hole of mask center and be changed by mirror center
Darkening road, by 90 ° of laser beam deflection, the laser beam direction of propagation after deflection reaches sample straight down, by focus projection object lens
On product surface；
(2) mask is attached to mask to exchange at the incident light of platform, mask is adjusted to spot center position, enables laser beam to cover whole
A mask hole, fixes mask and mask exchanges platform；
(3) sample is placed on sample mounting table and is fixed, three-dimensional automatically controlled displacement platform is moved left and right by computer control and is changed
Change the relative position of product and hot spot, is allowed to be radiated at the position that will be processed；Three-dimensional electricity is moved up and down by computer control
The relative position that displacement platform changes sample and hot spot is controlled, is placed exactly in the upper surface of sample in the image planes of exposure mask projection, in this way
Obtained sample upper surface is the shape of mask hole；
(4) shape of peep hole, finally selects suitable working process parameter to swash after being processed by transformation different parameters
Light energy, laser pulse frequency, pulse number, mask hole dimension process parameter；
(5) excimer laser is opened, according to the technological parameter processed sample chosen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703941.XA CN108838515A (en) | 2018-07-01 | 2018-07-01 | A kind of method and device of excimer laser process tapered micro holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703941.XA CN108838515A (en) | 2018-07-01 | 2018-07-01 | A kind of method and device of excimer laser process tapered micro holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108838515A true CN108838515A (en) | 2018-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810703941.XA Pending CN108838515A (en) | 2018-07-01 | 2018-07-01 | A kind of method and device of excimer laser process tapered micro holes |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113146075A (en) * | 2020-12-02 | 2021-07-23 | 温锦华 | Manufacturing method of atomization structure |
| CN114227026A (en) * | 2021-12-10 | 2022-03-25 | 西安交通大学 | Ultrafast laser hole-controllable group hole precision machining device and method |
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| JPH09285887A (en) * | 1996-04-23 | 1997-11-04 | Canon Inc | Drilling method and drilling device, and mask for drilling |
| JP3254650B2 (en) * | 1993-09-30 | 2002-02-12 | ブラザー工業株式会社 | Laser processing apparatus and its processing method |
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN105108347A (en) * | 2015-06-15 | 2015-12-02 | 北京工业大学 | Method for quickly preparing synthetic glass microlens having adjustable curvature through excimer laser rotary etching |
| CN105904105A (en) * | 2016-05-25 | 2016-08-31 | 广东工业大学 | Laser drilling device and method capable of improving hole taper |
| CN105983786A (en) * | 2015-02-04 | 2016-10-05 | 大族激光科技产业集团股份有限公司 | Method for processing glass with laser |
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2018
- 2018-07-01 CN CN201810703941.XA patent/CN108838515A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3254650B2 (en) * | 1993-09-30 | 2002-02-12 | ブラザー工業株式会社 | Laser processing apparatus and its processing method |
| JPH09285887A (en) * | 1996-04-23 | 1997-11-04 | Canon Inc | Drilling method and drilling device, and mask for drilling |
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN105983786A (en) * | 2015-02-04 | 2016-10-05 | 大族激光科技产业集团股份有限公司 | Method for processing glass with laser |
| CN105108347A (en) * | 2015-06-15 | 2015-12-02 | 北京工业大学 | Method for quickly preparing synthetic glass microlens having adjustable curvature through excimer laser rotary etching |
| CN105904105A (en) * | 2016-05-25 | 2016-08-31 | 广东工业大学 | Laser drilling device and method capable of improving hole taper |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113146075A (en) * | 2020-12-02 | 2021-07-23 | 温锦华 | Manufacturing method of atomization structure |
| CN114227026A (en) * | 2021-12-10 | 2022-03-25 | 西安交通大学 | Ultrafast laser hole-controllable group hole precision machining device and method |
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Application publication date: 20181120 |
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