CN110722272A - Ultrafast laser micro-nano cutting drilling equipment and method - Google Patents
Ultrafast laser micro-nano cutting drilling equipment and method Download PDFInfo
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- CN110722272A CN110722272A CN201910994932.5A CN201910994932A CN110722272A CN 110722272 A CN110722272 A CN 110722272A CN 201910994932 A CN201910994932 A CN 201910994932A CN 110722272 A CN110722272 A CN 110722272A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
The invention discloses ultrafast laser micro-nano cutting and drilling equipment which comprises a laser generating module, a double-beam cutting module and a splinter drilling module, wherein the laser generating module comprises an ultrafast laser, a continuous laser and a gas laser, the double-beam cutting module comprises a movable cutting platform, a laser cutting head arranged above the cutting platform and two beam shaping units, the two beam shaping units are respectively arranged on a transmission light path of laser generated by the ultrafast laser and the continuous laser, and the splinter drilling module comprises a movable splinter drilling platform and a splinter drilling head arranged above the splinter drilling platform. The ultrafast laser micro-nano cutting and drilling equipment disclosed by the invention realizes the processing of holes with high depth-diameter ratio through the compound processing of beam shaping, double-beam cutting, laser splitting and laser rotary cutting and drilling. In addition, the invention also discloses an ultrafast laser micro-nano cutting and drilling method.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to ultrafast laser micro-nano cutting and drilling equipment and a method.
Background
Ultrafast laser is used as an ideal light source in the fields of micro-nano processing and science, has been widely applied to industries such as aerospace, information technology, new energy and new materials, and has the characteristics of precision, fineness, low loss, low heat, three-dimensional selection and the like.
However, the existing ultrafast laser micro-nano processing equipment cannot process holes with high depth-diameter ratio, wherein the depth-diameter ratio refers to the ratio of the hole depth to the hole diameter. Therefore, an ultrafast laser micro-nano cutting and drilling device capable of processing holes with high depth-diameter ratio is urgently needed.
Disclosure of Invention
The invention mainly aims to provide ultrafast laser micro-nano cutting and drilling equipment to solve the technical problem that high-depth-diameter-ratio holes cannot be machined by existing ultrafast laser micro-nano machining equipment.
In order to solve the technical problems, the invention provides ultrafast laser micro-nano cutting and drilling equipment, which comprises a machine base, and a laser generating module, a double-beam cutting module and a splinter drilling module which are arranged on the machine base, wherein the laser generating module comprises an ultrafast laser, a continuous laser and a gas laser, the ultrafast laser and the continuous laser are used for generating two different laser beams and inputting the two different laser beams into the double-beam cutting module, the gas laser is used for generating another laser beam and inputting the other laser beam into the splinter drilling module, the double-beam cutting module comprises a movable cutting platform, a laser cutting head arranged above the cutting platform and two beam shaping units, the two beam shaping units are respectively arranged on a transmission light path of the laser generated by the ultrafast laser and the continuous laser, the lobe of a leaf drilling module includes mobilizable lobe of a leaf drilling platform and sets up the lobe of a leaf drilling head above lobe of a leaf drilling platform.
Preferably, the beam shaping unit includes a beam expander and a plurality of reflectors sequentially arranged along a transmission direction of the laser beam, the beam expander is used for performing beam expanding collimation on the laser beam, and the reflectors are used for adjusting the transmission direction of the laser beam after beam expanding collimation.
Preferably, the dual-beam cutting module further comprises a flat top shaper for shaping a gaussian beam into a flat top beam and a micro lens array for splitting a laser beam into a plurality of laser beams, the flat top shaper is arranged between the beam expander and the reflector, and the micro lens array is arranged on an output light path of the laser cutting head.
Preferably, the ultrafast laser micro-nano cutting and drilling equipment further comprises a first motor, a first motion unit connected with an output execution end of the first motor, and a first grating ruler used for detecting displacement of the first motion unit, wherein the other end of the first motion unit is connected with the cutting platform; and the second motor, a second motion unit connected with an output execution end of the second motor and a second grating ruler used for detecting the displacement of the second motion unit, wherein the other end of the second motion unit is connected with the splinter drilling platform.
Preferably, the ultrafast laser micro-nano cutting drilling equipment further comprises a vacuum generating device for adsorption positioning, wherein the vacuum generating device comprises a vacuum generator, a vacuum pipeline and adsorption holes which are respectively arranged on the cutting platform and the splinter drilling platform.
Preferably, the ultrafast laser micro-nano cutting and drilling equipment further comprises a visual detection device arranged above the cutting platform, and the visual detection device comprises a CCD camera and a light source.
Preferably, the ultrafast laser micro-nano cutting and drilling equipment further comprises a first clamping device used for fixing the workpiece placed on the cutting platform and a second clamping device used for fixing the workpiece placed on the splinter drilling platform, wherein the first clamping device is movably arranged above the cutting platform, and the second clamping device is movably arranged above the splinter drilling platform.
Preferably, the ultrafast laser micro-nano cutting drilling equipment further comprises an automatic loading and unloading device, wherein the automatic loading and unloading device comprises a loading platform, a first mechanical arm used for transferring the workpiece on the loading platform to the cutting platform, a blanking platform and a second mechanical arm used for transferring the finished product on the splinter drilling platform to the blanking platform.
Preferably, the ultrafast laser is a femtosecond laser or a picosecond laser, and the gas laser is a carbon dioxide laser.
The invention also provides an ultrafast laser micro-nano cutting and drilling method, which comprises the following steps: conveying the workpiece to be processed to a cutting platform; starting the ultrafast laser and the continuous laser, respectively expanding and collimating two beams of laser emitted by the ultrafast laser and the continuous laser, and adjusting the transmission direction of the laser after expanding and collimating; the two beams of received laser are respectively irradiated on the surface of a workpiece through a laser cutting head, and the workpiece is cut in a scanning mode; conveying the cut workpiece to a splinter drilling platform; starting the gas laser, inputting laser beams generated by the gas laser into the splitting drilling head, irradiating the received laser beams on the surface of a workpiece through the splitting drilling head, and splitting and drilling the workpiece in a scanning mode; and conveying the finished product on the splinter drilling platform to a blanking platform.
The embodiment of the invention has the beneficial effects that: the processing of the hole with the high depth-diameter ratio is realized through the compound processing of beam shaping, double-beam cutting, laser splitting and laser drilling.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of ultrafast laser micro-nano cutting and drilling equipment according to the present invention;
FIG. 2 is a structural diagram of the ultrafast laser micro-nano cutting and drilling equipment of the invention without assembling a first clamping device;
FIG. 3 is a schematic diagram of dual beam cutting of the ultrafast laser micro-nano cutting and drilling equipment of the present invention;
FIG. 4 is a schematic diagram of beam shaping of the ultrafast laser micro-nano cutting and drilling equipment of the present invention;
FIG. 5 is a multi-beam femtosecond rotary cutting schematic diagram of the ultrafast laser micro-nano cutting and drilling device of the present invention;
fig. 6 is a flowchart of an embodiment of the ultrafast laser micro-nano cutting and drilling method of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
In order to solve the technical problems, the invention provides ultrafast laser micro-nano cutting and drilling equipment, which comprises a machine base 1, and a laser generating module, a double-beam cutting module and a splinter drilling module which are arranged on the machine base 1, wherein the laser generating module comprises an ultrafast laser 2, a continuous laser 3 and a gas laser, the ultrafast laser 2 and the continuous laser 3 are used for generating two different laser beams and inputting the two different laser beams to the double-beam cutting module, the gas laser is used for generating another laser beam and inputting the another laser beam to the splinter drilling module, the double-beam cutting module comprises a movable cutting platform 4, a laser cutting head 5 arranged above the cutting platform 4 and two beam shaping units 6, the two beam shaping units 6 are respectively arranged on a transmission light path of the laser generated by the ultrafast laser 2 and the continuous laser 3, the lobe of a leaf drilling module includes mobilizable lobe of a leaf drilling platform 7 and sets up the lobe of a leaf drill head above lobe of a leaf drilling platform 7.
It should be noted that the peak density of the continuous laser generated by the continuous laser 3 is low, which results in low overall power, and when the continuous laser irradiates the surface of the workpiece to be processed, the surface of the workpiece to be processed absorbs the continuous laser to reach the initial temperature of laser cutting, so that the powder material ablated or broken on the surface of the workpiece is melted, and no high-temperature plasma ablation effect is generated. The laser generated by the ultrafast laser 2 is a pulse laser, and when the pulse laser irradiates the surface of the workpiece to be processed, a high-temperature plasma ablation effect is generated so as to ablate the surface of the workpiece to be processed and remove an ablated part, thereby realizing the fine processing of the workpiece to be processed. Meanwhile, the ultrafast laser micro-nano cutting and drilling equipment provided by the invention utilizes the ultrafast laser 2 and the continuous laser 3 to perform double-beam parallel processing on the workpiece, so that the processing efficiency can be effectively improved. The ultrafast laser micro-nano cutting and drilling equipment can be used for industries such as smart phone touch screen cutting, thin film etching, solar cell wafer scribing, circuit board micro-drilling, micro-nano structures, biological scientific research, medical appliances and the like, and comprises but is not limited to the industries.
When a workpiece to be processed needs to be processed, the control system controls the continuous laser 3 to generate continuous laser, and the continuous laser is shaped by the beam shaping unit 6 and then irradiates the surface of the workpiece to be processed, so that the workpiece to be processed is roughly processed, and the surface of the workpiece to be processed reaches a preset initial temperature. Meanwhile, the control system controls the ultrafast laser 2 to generate pulse laser, and the pulse laser is shaped by the beam shaping unit 6 and then irradiates the surface of the workpiece to be processed to generate a high-temperature plasma ablation effect, so that the workpiece to be processed is finely processed. After the double-beam cutting is finished, the split and drilled workpiece is split and drilled by the split drilling module, specifically, the gas laser is controlled by the control system to generate laser beams and input the laser beams into the split drilling head, the received laser beams are irradiated on the surface of the workpiece through the split drilling head to heat the workpiece, and the product and the waste are quickly separated by mainly utilizing the principle of expansion with heat and contraction with cold. Multiple tests prove that the edge breakage of the separated product is less than 5um, the strength is higher, and the method is particularly suitable for cutting, splitting, drilling and other processing on transparent brittle materials such as sapphire, strengthened or non-strengthened glass and the like.
It can be understood that the above mentioned control system is a computer, i.e. an industrial controller, programmed with a control program in advance, so as to control the operation of the laser generation module, the dual-beam cutting module and the splinter drilling module through the computer program, and realize the micro-nano machining of the hole with the high depth-diameter ratio.
In addition, the laser cutting head 5 and the splinter drilling head according to the invention move according to the preset processing track, and carry out laser cutting, splinter and drilling on the workpiece to be processed in a scanning mode. The essence of the laser cutting head 5 and the splinter drilling head is a scanning galvanometer, which comprises a galvanometer, a scanning mirror and a field lens.
The ultrafast laser micro-nano cutting drilling equipment adopts ultrafast laser multi-beam rotary cutting micropores with high depth-diameter ratio, specifically, a workpiece to be processed is fixed through a clamp and kept static, and the shaped ultrafast laser beam performs rotary circular motion. The laser beam rotates around the rotation center in a radius manner for one or more circles, so that a through hole with the aperture r is cut on the workpiece.
Referring to fig. 5, the basic principle of ultrafast laser rotational atherectomy drilling: the laser energy and the defocusing amount track influence the hole shape and the surface quality in the blind hole processing process by the laser rotary cutting method, laser is a photon flow beam highly concentrated in space, the laser can be focused in a tiny range of micron magnitude by applying an optical focusing technology, and therefore the laser beam with the power density of 107-1011W/cm 2 is obtained, and laser drilling can be performed on any material almost at the high power density. The laser beam rotates around the central line to process workpieces by rotating a wedge-shaped prism in a light path system, the power of ultrafast laser is adjustable, the pulse frequency of the laser is adjustable, the pulse width is 1ps-10fs, auxiliary gas is nitrogen, and the material of the adjustable processing test piece with the pressure of 0-0.8 MPa is silicon carbide ceramic composite material.
Deep hole machining equipment is an important component in the category of mechanical manufacturing equipment (machine tool) doors. The rise of modern deep hole processing technology adds two specialized equipment manufacturing industries of a deep hole machine tool and a deep hole cutter and a manufacturing industry with special deep hole part processing as a characteristic for the manufacturing equipment industry. The historical contribution of the deep hole drilling technology is that the deep hole drilling technology is popularized and applied to various fields of national economic construction, and new vitality is added for the modern development of the society.
Further, referring to fig. 3, the beam shaping unit 6 proposed in the above embodiment includes a beam expanding lens 61 and a plurality of reflecting mirrors 62 sequentially arranged along the transmission direction of the laser beam, where the beam expanding lens 61 is configured to expand and collimate the laser beam, and the reflecting mirrors 62 are configured to adjust the transmission direction of the expanded and collimated laser beam. In this embodiment, the laser beam generated by the ultrafast laser 2 or the continuous laser 3 is subjected to beam expanding and collimating processing by the beam expanding lens 61; then, the laser beam is reflected for the first time through a first reflector so as to change the transmission direction of the laser beam; then, the second reflection is performed by the second reflection mirror to change the transmission direction of the laser beam again and to enable the laser beam to be inputted into the laser cutting head 5 for laser cutting. Of course, the number of the reflecting mirrors 62 can be set according to practical situations, and is not limited to the number of the reflecting mirrors 62 in the technical solution of the embodiment.
Referring to fig. 4, the dual-beam cutting module according to the present invention further includes a flat-top shaper 8 for shaping a gaussian beam into a flat-top beam, and a micro-lens array 9 for splitting a laser beam into a plurality of laser beams, wherein the flat-top shaper 8 is disposed between the beam expander 61 and the reflector 62, and the micro-lens array 9 is disposed on an output optical path of the laser cutting head 5. In this embodiment, the flat-top shaper 8 can convert the incident laser light with gaussian distribution into laser output (circular, square, and linear) with any wavefront shape, and the light intensity distribution of the light beam is uniform and has steep edges. The uniformly distributed light spots have great advantages in the light processing process, the overexposure or underexposure of a special area can be effectively eliminated, and in addition, the sharp light beam edge makes the boundary between a light processing area and a non-processing area more obvious. In addition, the micro lens array 9 in the embodiment can effectively divide the incident laser into a plurality of separated beams, so that the input laser can obtain better energy distribution in multiple channels, the efficiency and the performance of laser cutting can be improved, and meanwhile, the thermal effect can be effectively reduced.
In a preferred embodiment, in order to improve the motion precision of the cutting platform 4 and the splinter drilling platform 7, the laser cutting head 5 and the splinter drilling head can perform precise cutting, splinter and drilling processes on the workpiece placed on the cutting platform 4 and the splinter drilling platform 7, so as to improve the product quality. Referring to fig. 2, the ultrafast laser micro-nano cutting and drilling apparatus according to the present invention further includes a first motor, a first motion unit 10 connected to an output execution end of the first motor, and a first grating scale 20 for detecting a displacement of the first motion unit 10, wherein the other end of the first motion unit 10 is connected to the cutting platform 4; and the second motor, a second motion unit 30 connected with the output execution end of the second motor, and a second grating ruler 40 for detecting the displacement of the second motion unit 30, wherein the other end of the second motion unit 30 is connected with the splinter drilling platform 7. Specifically, the first motor and the second motor are X/Y linear motors, and full closed-loop control is realized through the linear motors, the grating ruler and the control system so as to accurately control the displacement of the moving unit.
In another preferred embodiment, in order to fix the workpiece placed on the worktable (the cutting platform and the splinter drilling platform) at a preset position, the ultrafast laser micro-nano cutting and drilling equipment according to the present invention further comprises a vacuum generating device for adsorption positioning, wherein the vacuum generating device comprises a vacuum generator, a vacuum pipeline and adsorption holes respectively disposed on the cutting platform 4 and the splinter drilling platform 7. In this embodiment, utilize the negative pressure to adsorb the location to the work piece to make the work piece stably place on the workstation. Specifically, after the work piece was placed on the workstation, start vacuum generator to take out the air between work piece and the workstation through vacuum line, so that the pressure between work piece and the workstation is less than external atmospheric pressure, thereby forms pressure differential (negative pressure), can make the stable laminating of work piece at the workstation surface through this pressure differential.
In another preferred embodiment, the ultrafast laser micro-nano cutting and drilling equipment further comprises a visual detection device arranged above the cutting platform 4, wherein the visual detection device comprises a CCD camera and a light source. In the embodiment, a CCD camera is used for image acquisition, and the acquired image is processed and analyzed so as to position the area to be cut on the surface of the workpiece; after the positioning is finished, planning a cutting path by the control system; then, starting the ultrafast laser 2 and the continuous laser 3, and focusing laser beams generated by the ultrafast laser 2 and the continuous laser 3 on a to-be-cut area of the workpiece through a laser cutting head 5; then, a laser focus tracking system arranged on the laser cutting head 5 measures and displays the distance between the focus of the laser output by the laser cutting head 5 and the workpiece in real time; and finally, under the control of the control system, scanning the laser beam on the surface of the workpiece to be cut to finish laser cutting.
In order to avoid the workpiece from shaking during the processes of laser cutting, laser splitting and laser drilling, referring to fig. 1, the ultrafast laser micro-nano cutting and drilling equipment according to the present invention further includes a first clamping device 50 for fixing the workpiece placed on the cutting platform 4 and a second clamping device 60 for fixing the workpiece placed on the splitting and drilling platform 7, wherein the first clamping device 50 is movably disposed above the cutting platform 4, and the second clamping device 60 is movably disposed above the splitting and drilling platform 7. In this embodiment, after the workpiece is placed on the worktable (cutting platform, splinter drilling platform), before the workpiece is machined, the control system controls the first clamping device 50 or the second clamping device 60 to move to a position right above the worktable, and adjusts the position of the first clamping device 50 or the second clamping device 60 according to the position of the workpiece, so that the first clamping device 50 can clamp the surface of the workpiece, and the workpiece can be stably placed on the preset position of the worktable. As for the specific structure of the first clamping device 50 and the second clamping device 60, there is no limitation as long as it can fix the workpiece to avoid the shaking during the machining process.
In order to further improve the production efficiency and reduce the labor cost, the ultrafast laser micro-nano cutting and drilling equipment further comprises an automatic loading and unloading device, wherein the automatic loading and unloading device comprises a loading platform, a first mechanical arm used for transferring workpieces on the loading platform 70 to the cutting platform 4, a blanking platform 80 and a second mechanical arm used for transferring finished products on the splinter drilling platform 7 to the blanking platform 80. In this embodiment, the first manipulator and the second manipulator replace manual feeding, and the first manipulator and the second manipulator may have multiple degrees of freedom, and may be specifically set according to actual needs, which is not limited herein. In order to further improve the motion precision of the mechanical arm, a servo motor can be used as a power source of the first mechanical arm and the second mechanical arm.
Based on the ultrafast laser micro-nano cutting and drilling equipment provided above, referring to fig. 6, the invention also provides an ultrafast laser micro-nano cutting and drilling method, which comprises the following steps:
step S10, conveying the workpiece to be processed to a cutting platform;
step S20, starting the ultrafast laser and the continuous laser, respectively expanding and collimating the two beams of laser emitted by the ultrafast laser and the continuous laser, and adjusting the transmission direction of the laser after expanding and collimating;
step S30, respectively irradiating the two received laser beams on the surface of the workpiece through the laser cutting head, and cutting the workpiece in a scanning mode;
step S40, conveying the cut workpiece to a splinter drilling platform;
step S50, starting the gas laser, and inputting the laser beam generated by the gas laser to the splinter drilling head;
step S60, irradiating the received laser beam on the surface of the workpiece through the splinter drilling head, and splinting and drilling the workpiece in a scanning mode;
and step S70, conveying the finished product on the splinter drilling platform to a blanking platform.
Before processing, a workpiece to be processed is conveyed to a cutting platform from a feeding platform through a manual or mechanical arm; then, starting the ultrafast laser and the continuous laser, and expanding, collimating and adjusting the transmission direction of laser beams generated by the ultrafast laser and the continuous laser through a beam shaping unit; the shaped laser beam is transmitted into a laser cutting head, the laser cutting head respectively irradiates the two received laser beams on the surface of the workpiece, and the control system controls the laser cutting head to cut the workpiece in a scanning mode according to a preset motion track.
After cutting, the workpiece is conveyed to the splinter drilling platform again through a manual or mechanical arm, then the gas laser is started, and laser beams generated by the gas laser are input into the splinter drilling head; then, irradiating the received laser beam on the surface of the workpiece through a splitting drilling head, and controlling the workpiece by a control system and performing splitting and drilling on the workpiece in a surface scanning manner; and finally, conveying the finished product on the splinter drilling platform to a blanking platform, thereby finishing the processing of the holes with high depth-diameter ratio of the workpiece.
The method adopts ultrafast dual-beam laser rotary cutting to process the air film hole, obtains a taper hole without cracks, attached residues and recast layers, and adjusts the influence of defocusing amount and relative deflection angle of an optical wedge on the hole diameter and the influence of laser defocusing amount on the taper of the micropore in the ultrafast laser rotary cutting process.
The ultrafast laser micro-nano cutting and drilling method is based on ultrafast laser micro-nano cutting and drilling equipment, so that the technical schemes of flat top shaping, beam splitting focusing, grating ruler feedback, vacuum adsorption, visual detection, workpiece fixing, automatic feeding and discharging and the like related to the ultrafast laser micro-nano cutting and drilling equipment are also suitable for the ultrafast laser micro-nano cutting and drilling method, the specific technical scheme is recorded in the foregoing text, and therefore the description is omitted.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An ultrafast laser micro-nano cutting and drilling device is characterized by comprising a machine base, and a laser generating module, a double-beam cutting module and a splinter drilling module which are arranged on the machine base, the laser generating module comprises an ultrafast laser, a continuous laser and a gas laser, the ultrafast laser and the continuous laser are used for generating two different laser beams and inputting the two laser beams to the double-beam cutting module, the gas laser is used for generating another laser beam and inputting the laser beam to the splinter drilling module, the double-beam cutting module comprises a movable cutting platform, a laser cutting head arranged above the cutting platform and two beam shaping units, the two beam shaping units are respectively arranged on a transmission light path of the laser generated by the ultrafast laser and the continuous laser, the lobe of a leaf drilling module includes mobilizable lobe of a leaf drilling platform and sets up the lobe of a leaf drilling head above lobe of a leaf drilling platform.
2. The ultrafast laser micro-nano cutting drilling equipment of claim 1, wherein the beam shaping unit comprises a beam expanding lens and a plurality of reflectors which are sequentially arranged along the transmission direction of the laser beam, the beam expanding lens is used for expanding and collimating the laser beam, and the reflectors are used for adjusting the transmission direction of the laser beam after expanding and collimating.
3. The ultrafast laser micro-nano cutting and drilling equipment according to claim 2, wherein the dual-beam cutting module further comprises a flat top shaper for shaping a gaussian beam into a flat top beam and a micro lens array for splitting a laser beam into a plurality of laser beams, the flat top shaper is arranged between the beam expander and the reflector, and the micro lens array is arranged on an output light path of the laser cutting head.
4. The ultrafast laser micro-nano cutting and drilling equipment according to claim 1, further comprising a first motor, a first motion unit connected with an output execution end of the first motor, and a first grating scale for detecting displacement of the first motion unit, wherein the other end of the first motion unit is connected with the cutting platform; and the number of the first and second groups,
the second motor, a second motion unit connected with an output execution end of the second motor and a second grating ruler used for detecting the displacement of the second motion unit, wherein the other end of the second motion unit is connected with the splinter drilling platform.
5. The ultrafast laser micro-nano cutting and drilling equipment according to claim 1, further comprising a vacuum generating device for adsorption positioning, wherein the vacuum generating device comprises a vacuum generator, a vacuum pipeline and adsorption holes respectively arranged on the cutting platform and the splinter drilling platform.
6. The ultrafast laser micro-nano cutting and drilling equipment of claim 1, further comprising a visual detection device arranged above the cutting platform, wherein the visual detection device comprises a CCD camera and a light source.
7. The ultrafast laser micro-nano cutting and drilling equipment of claim 1, further comprising a first clamping device for fixing the workpiece placed on the cutting platform and a second clamping device for fixing the workpiece placed on the splinter drilling platform, wherein the first clamping device is movably arranged above the cutting platform, and the second clamping device is movably arranged above the splinter drilling platform.
8. The ultrafast laser micro-nano cutting and drilling equipment as claimed in claim 1, further comprising an automatic loading and unloading device, wherein the automatic loading and unloading device comprises a loading platform, a first manipulator used for transferring workpieces on the loading platform to the cutting platform, a blanking platform and a second manipulator used for transferring finished products on the splinter drilling platform to the blanking platform.
9. The ultrafast laser micro-nano cutting and drilling equipment as claimed in any one of claims 1 to 8, wherein the ultrafast laser is a femtosecond laser or a picosecond laser, and the gas laser is a carbon dioxide laser.
10. An ultrafast laser micro-nano cutting and drilling method is characterized by comprising the following steps:
conveying the workpiece to be processed to a cutting platform;
starting the ultrafast laser and the continuous laser, respectively expanding and collimating two beams of laser emitted by the ultrafast laser and the continuous laser, and adjusting the transmission direction of the laser after expanding and collimating;
the two beams of received laser are respectively irradiated on the surface of a workpiece through a laser cutting head, and the workpiece is cut in a scanning mode;
conveying the cut workpiece to a splinter drilling platform;
starting the gas laser, and inputting laser beams generated by the gas laser into the splinter drilling head;
irradiating the received laser beam on the surface of a workpiece through a splitting drilling head, and splitting and drilling the workpiece in a scanning mode;
and conveying the finished product on the splinter drilling platform to a blanking platform.
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