CN114195527A - 一种台阶结构高温共烧陶瓷的烧结方法 - Google Patents
一种台阶结构高温共烧陶瓷的烧结方法 Download PDFInfo
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Abstract
本发明涉及一种台阶结构高温共烧陶瓷的烧结方法,包括以下步骤:1)生瓷件和生瓷垫片的制备:使用生瓷带和金属化浆料按照多层陶瓷生产工艺制作台阶结构生瓷件和镂空生瓷垫片;2)生瓷件和镂空生瓷垫片的的排版:将大尺寸生瓷件的台阶面放置在镂空生瓷垫片的腔体上,然后一起放在承烧板上;3)排胶:将所述放有生瓷件和生瓷垫片的承烧板放入排胶炉中排胶;4)烧结:将排胶后放的、有生瓷件和生瓷垫片的承烧板放入高温烧结炉中烧结。优点:1)有效防止瓷件烧结过程中台阶边缘瓷件的变形翘曲,可应用于包含台阶结构瓷件基板及外壳等领域。2)所得共烧陶瓷平整度小于0.02μm/mm,性能满足电子陶瓷的使用要求。
Description
技术领域
本发明是一种台阶结构高温共烧陶瓷的烧结方法,属于电子陶瓷技术领域。
背景技术
高温共烧陶瓷(HTCC)常用的材料体系有氧化铝和氮化铝陶瓷体系。氧化铝高温共烧陶瓷的主要优点是绝缘好、机械强度高、耐腐蚀及高频特性好等,氮化铝的优点是热导率高、电性能好。高温共烧陶瓷主要应用于高可靠、气密器件封装及MCM基板和外壳等领域。高温共烧陶瓷烧结温度较高,一般在1500℃~1850℃,因此与之共烧的金属浆料必须耐高温,一般采用金属钨用作共烧陶瓷的金属化浆料。
高温共烧烧结由于有金属化钨,必须在还原性气氛下烧结,防止金属高温氧化,另外氧化铝陶瓷的共烧还需要一定的氧化气氛实现陶瓷与金属化的共烧,一般共烧的气氛采用加湿的还原性气氛,并控制在一定的露点范围;氮化铝陶瓷由于高温下与水发生反应,因此必须在低露点的氢气或氮氢混合气体下烧结,实验条件较为严格。
对于台阶结构陶瓷件,通常结构正面为腔体结构,背面为孤立的凸台台阶,这类瓷件烧结时如果腔体向上,背面由于台阶周围生瓷悬空,在重力作用下烧结后瓷件的边缘会产生明显翘曲不平,影响瓷件后续的使用;如果背面台阶向上烧结,则在腔体内容易产生翘曲,同样会影响瓷件使用。
发明内容
本发明提出的是一种台阶结构高温共烧陶瓷的烧结方法,其目的在于针对现有高温共烧陶瓷技术中存在的台阶结构瓷件烧结后翘曲缺陷,提出使用与台阶结构陶瓷件相同收缩率的镂空生瓷垫片,烧结前放置在生瓷件的背面台阶处,再进行排胶和烧结的烧结方法,以避免瓷件烧结过程的翘曲变形。
本发明的技术解决方案:一种台阶结构高温共烧陶瓷的烧结方法,包括以下步骤:
(1)台阶结构生瓷件和镂空生瓷垫片的制备:使用生瓷带和金属化浆料按照多层陶瓷生产工艺制作台阶结构生瓷件和镂空生瓷垫片;
(2)台阶结构生瓷件和镂空生瓷垫片的的排版:将台阶结构生瓷件的背面台阶嵌入在镂空生瓷垫片的腔体,然后一起平放在承烧板上;
(3)排胶:将所述放有生瓷件和镂空生瓷垫片的承烧板放入排胶炉中排胶;
(4)烧结:将排胶后放有台阶结构生瓷件和镂空生瓷垫片的承烧板放入高温烧结炉中烧结。
所述步骤(1)生瓷件和生瓷垫片的制备,包括以下工艺步骤:
1)配置生瓷浆料、流延生瓷片;
2)生瓷片印刷金属化浆料;
3)将生瓷片开腔形成台阶、镂空结构;
4)生瓷片叠片层压形成多层瓷片;
5)多层生瓷片切割形成成台阶结构生瓷件和镂空生瓷垫片。
所述步骤1)配置生瓷浆料、流延生瓷片中,生瓷浆料组成包括陶瓷粉、助烧剂、粘结剂和增塑剂,其中陶瓷粉的重量比为75%~80%,助烧剂的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为8%~15%,增塑剂的重量比为0.5%~1.5%。
所述步骤2)生瓷片印刷金属化浆料中,金属化浆料组成包括钨粉、陶瓷粉、粘结剂和溶剂,其中钨粉的重量比为85%~90%,陶瓷粉的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为5%~10%。
所述步骤3)将生瓷片开腔形成台阶、镂空结构中,台阶的尺寸比镂空腔体尺寸小0.10mm~1.00mm,台阶的厚度与镂空生瓷垫片厚度相同。
所述步骤(3)排胶中,排胶气氛为氮气或露点在10℃~35℃的氢气,排胶升温速率小于等于5℃/min,最高温度为350℃~600℃。
所述步骤(4)烧结中,烧结气氛为还原性气氛,烧结保温温度为1500℃~1850℃,保温时间为0.5~8小时。
本发明的有益效果:
1)本发明技术方案烧结制备台阶结构高温共烧陶瓷,有效防止瓷件烧结过程中的翘曲变形,可应用于高可靠、气密器件封装及多芯片组件(MCM)基板及外壳等领域。
2)使用本发明的方法烧结,得到的台阶结构共烧陶瓷翘曲变形量小于0.02mm,性能满足电子陶瓷的使用要求。
附图说明
附图1是本烧结方法烧结方形台阶结构陶瓷件的排版示意图。
附图2是本烧结方法烧结圆形台阶结构陶瓷件的排版示意图。
具体实施方式
一种台阶结构高温共烧陶瓷的烧结方法,包括以下步骤:
(1)生瓷件和生瓷垫片的制备:使用生瓷带和金属化浆料按照多层陶瓷生产工艺制作方形台阶结构生瓷件和镂空生瓷垫片;
(2)生瓷件和生瓷垫片的的排版:将大尺寸生瓷件放置在生瓷垫片上,然后一起放在承烧板上;
(3)排胶:将所述放有生瓷件和生瓷垫片的承烧板放入排胶炉中排胶;
(4)烧结:将排胶后放的、有生瓷件和生瓷垫片的承烧板放入高温烧结炉中烧结。
本发明使用与陶瓷基板或陶瓷框相同收缩率的生瓷垫片,烧结前放置在生瓷件的下面,然后进行排胶和烧结,在排胶和烧结过程中,瓷件和垫片共同收缩,避免了瓷件背面的划痕和瓷框的变形。
所述步骤(1)生瓷件和生瓷垫片的制备,包括以下工艺步骤:
1)配置生瓷浆料、流延生瓷片;
2)生瓷片印刷金属化浆料;
3)生瓷片开腔形成腔体和凸台;
4)生瓷片叠片层压形成多层生瓷片;
5)多层生瓷片热切或激光切割成生瓷件和镂空生瓷垫片。
所述步骤1)配置生瓷浆料、流延生瓷片中,生瓷浆料组成包括陶瓷粉、助烧剂、粘结剂和增塑剂,其中陶瓷粉的重量比为75%~80%,助烧剂的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为8%~15%,增塑剂的重量比为0.5%~1.5%。
所述步骤2)生瓷片印刷金属化浆料中,金属化浆料组成包括钨粉、陶瓷粉、粘结剂和溶剂,其中钨粉的重量比为85%~90%,陶瓷粉的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为5%~10%。
所述步骤3)生瓷片开腔形成腔体和凸台中,镂空生瓷垫片的腔体长度或直径尺寸应大于凸台结构生瓷件凸台的相应尺寸0.05~1mm,使得生瓷件凸台可以放在镂空生瓷垫片的腔体内,台阶的厚度与镂空生瓷垫片厚度相同。
所述步骤5)多层生瓷片热切或激光切割成生瓷件和镂空生瓷垫片中,镂空生瓷垫片的长度或直径外形尺寸应比凸台结构生瓷件的相应外形尺寸大1mm以上,以保证排胶和烧结时凸台瓷件边缘不悬空。
所述步骤(3)排胶中,排胶气氛为氮气或露点在10℃~35℃的氢气,排胶升温速率小于等于5℃/min,最高温度为350℃~600℃。
所述步骤(4)烧结中,烧结气氛为还原性气氛,烧结保温温度为1500℃~1850℃,保温时间为0.5~8小时。
本发明通过使用镂空生瓷片垫烧的方式,烧结后台阶结构瓷件的翘曲度小于0.02mm,满足电子陶瓷对外观和尺寸精度的使用要求。
下面结合附图对本发明技术方案进一步说明
如附图1、2所示,将方形或圆形台阶结构生瓷件放置在镂空生瓷垫片内,并一起放在承烧板上;生瓷垫片的外形尺寸每边应大于生瓷件的尺寸,生瓷件全部放在生瓷垫片之上,边缘无悬空。
将上述放有生瓷件和垫片的承烧板在排胶炉中排胶后,将放有生瓷件和垫片的承烧板放入高温烧结炉中烧结。
下面结合附图对本发明技术方案进一步说明
实施例1
如附图1所示,方形台阶结构高温共烧陶瓷基板的烧结方法,其中排胶采用单独的排胶炉,该方法如下:
1)按照80%Al2O3粉、4% 助烧剂、4%粘结剂、1%增塑剂、11%溶剂配置生瓷浆料,通过流延工艺生产Al2O3生瓷片;
2)按照90%钨粉、5%粘结剂、5%溶剂配置钨金属化浆料;
3)生瓷片表面通过印刷丝网工艺印刷钨金属化浆料;
4)通过激光开腔的方式开出瓷件和垫片的腔体、凸台;
5)将若干生瓷片通过叠片、热压形成多层生瓷件和镂空生瓷垫片;
6)按照附图1的方式将凸台结构生瓷件放入镂空生瓷垫片,并放入承烧装置。
7)将装有生瓷件的承烧装置,放入排胶炉中排胶。排胶气氛是氮气,氮气流量为3m3/h。排胶升温速率为1℃/min,排胶保温温度450℃,保温时间3小时,450℃以下随炉降温;
8)将排胶后装有生瓷件的承烧装置放入到高温气氛烧结炉中。高温烧结炉升温速率设置为10℃/min,保温温度1600℃,气氛采用加湿的氢气和氮气混合气体,保温时间设定为1小时。降温速率是5℃/min,500℃以下随炉降温;
9)将烧结好的凸台陶瓷间检验外观。
瓷件外观检验结果合格,陶瓷翘曲度小于0.02mm。
实施例2
如附图2所示,圆形台阶结构高温共烧陶瓷件的烧结方法,其中排胶和烧结都在高温气氛推板烧结炉中进行,该方法如下:
1)按照生瓷工艺制作圆形凸台结构生瓷件和镂空生瓷垫片。
2)将圆形凸台结构生瓷件和镂空生瓷垫片按照图2方式放置在承烧板中。
3)设置高温气氛推板烧结炉工艺参数,其中最高温度设定1600℃,其中排胶段最高温度为500℃,总运行周期26小时,气氛为加湿的氮气和氢气混合气体,总气体流量是10m3/h。
4)将装有生瓷件的承烧装置安装顺序依次放在烧结炉的推板上,烧结炉自动将产品依次推入烧结炉中,先经过排胶段排胶,然后继续升温进入高温烧结段进行烧结。
5)烧结完成后承烧装置和瓷件随推板依次出炉,将瓷件从承烧装置中取下,进行检验和测试。
基板外观检验结果合格,陶瓷翘曲度小于0.02mm。
Claims (7)
1.一种台阶结构高温共烧陶瓷的烧结方法,其特征是包括以下步骤:
(1)台阶结构生瓷件和镂空生瓷垫片的制备:使用生瓷带和金属化浆料按照多层陶瓷生产工艺制作台阶结构生瓷件和镂空生瓷垫片;
(2)台阶结构生瓷件和镂空生瓷垫片的的排版:将台阶结构生瓷件的背面台阶嵌入在镂空生瓷垫片的腔体,然后一起平放在承烧板上;
(3)排胶:将所述放有生瓷件和镂空生瓷垫片的承烧板放入排胶炉中排胶;
(4)烧结:将排胶后放有台阶结构生瓷件和镂空生瓷垫片的承烧板放入高温烧结炉中烧结。
2.根据权利要求1所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤(1)生瓷件和生瓷垫片的制备,包括以下工艺步骤:
1)配置生瓷浆料、流延生瓷片;
2)生瓷片印刷金属化浆料;
3)将生瓷片开腔形成台阶、镂空结构;
4)生瓷片叠片层压形成多层瓷片;
5)多层生瓷片切割形成成台阶结构生瓷件和镂空生瓷垫片。
3.根据权利要求2所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤1)配置生瓷浆料、流延生瓷片中,生瓷浆料组成包括陶瓷粉、助烧剂、粘结剂和增塑剂,其中陶瓷粉的重量比为75%~80%,助烧剂的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为8%~15%,增塑剂的重量比为0.5%~1.5%。
4.根据权利要求2所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤2)生瓷片印刷金属化浆料中,金属化浆料组成包括钨粉、陶瓷粉、粘结剂和溶剂,其中钨粉的重量比为85%~90%,陶瓷粉的重量比为2%~5%,粘结剂的重量比为2%~5%,溶剂的重量比为5%~10%。
5.根据权利要求2所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤3)将生瓷片开腔形成台阶、镂空结构中,台阶的尺寸比镂空腔体尺寸小0.10mm~1.00mm,台阶的厚度与镂空生瓷垫片厚度相同。
6.根据权利要求1所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤(3)排胶中,排胶气氛为氮气或露点在10℃~35℃的氢气,排胶升温速率小于等于5℃/min,最高温度为350℃~600℃。
7.根据权利要求1所述台阶结构高温共烧陶瓷的烧结方法,其特征是所述步骤(4)烧结中,烧结气氛为还原性气氛,烧结保温温度为1500℃~1850℃,保温时间为0.5~8小时。
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