CN114184931A - Probe adjustment method, probe adjustment device, electronic device, and storage medium - Google Patents
Probe adjustment method, probe adjustment device, electronic device, and storage medium Download PDFInfo
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- CN114184931A CN114184931A CN202111311250.3A CN202111311250A CN114184931A CN 114184931 A CN114184931 A CN 114184931A CN 202111311250 A CN202111311250 A CN 202111311250A CN 114184931 A CN114184931 A CN 114184931A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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Abstract
The application discloses a probe adjusting method, a probe adjusting device, electronic equipment and a storage medium. The method comprises the following steps: acquiring initial position information of a probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface; acquiring height information of a calibration reference surface to obtain first height information; acquiring height information of the PCBA to obtain second height information; acquiring the installation angle of the probe to obtain installation angle information; obtaining deviation compensation information according to the first height information, the second height information and the installation angle information; compensating the initial position information according to the deviation compensation information to obtain target position information; and adjusting the position of the probe according to the target position information. The probe adjusting method can adjust the position of the probe in real time, so that the flying probe testing equipment can conveniently realize the needle inserting mark points of the multilayer PCBA board, and the accuracy of the needle inserting mark points of the flying probe testing equipment is improved.
Description
Technical Field
The present application relates to the field of probe technologies, and in particular, to a probe adjustment method and apparatus, an electronic device, and a storage medium.
Background
In the process of manufacturing electronic products, electronic manufacturing companies generate a plurality of multi-layer PCBA boards. The PABA boards need to be detected by adopting flying probe testing equipment, and needle punching and marking are needed when the PCBA boards are detected by using the flying probe testing equipment. However, the conventional flying probe test equipment realizes the probe marking on one plane, and cannot realize the probe marking on the multilayer PCBA.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the probe adjusting method can adjust the position of the probe in real time, so that the flying probe testing equipment can conveniently realize the needle inserting marking point of the multilayer PCBA board, and the accuracy of the needle inserting marking point of the flying probe testing equipment is improved.
The application also provides a probe adjusting device.
The application also provides an electronic device.
The present application also provides a storage medium.
According to the probe adjustment method of the first aspect embodiment of the application, including:
acquiring initial position information of a probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface;
acquiring height information of a calibration reference surface to obtain first height information;
acquiring height information of the PCBA to obtain second height information;
acquiring the installation angle of the probe to obtain installation angle information;
obtaining deviation compensation information according to the first height information, the second height information and the installation angle information;
compensating the initial position information according to the deviation compensation information to obtain target position information;
and adjusting the position of the probe according to the target position information.
According to the probe adjusting method provided by the embodiment of the application, at least the following beneficial effects are achieved: calculating the thickness information of the PCBA board through the first height information and the second height information, then calculating deviation compensation information of the probe according to probe installation angle information obtained through testing, then performing compensation processing on initial position information of the probe according to the calculated deviation compensation information to obtain target position information, and then adjusting the position of the probe to a target position corresponding to the target position information. The real-time adjustment to the probe position is realized, so that the flying probe test equipment can conveniently realize the needle inserting mark points of the multilayer PCBA board, and the accuracy of the needle inserting mark points of the flying probe test equipment is improved.
According to some embodiments of the application, the installation angle information includes: abscissa angle information; the deviation compensation information includes abscissa compensation information;
obtaining deviation compensation information according to the first height information, the second height information and the installation angle information, including:
calculating a difference value between the first height information and the second height information to obtain height difference value information;
and obtaining abscissa compensation information according to the height difference information and the abscissa angle information.
According to some embodiments of the present application, the installation angle information includes ordinate angle information; the deviation compensation information comprises vertical coordinate compensation information;
obtaining deviation compensation information according to the first height information, the second height information and the installation angle information, and further comprising:
and obtaining vertical coordinate compensation information according to the height difference information and the vertical coordinate angle information.
According to some embodiments of the present application, the offset compensation information further comprises vertical coordinate compensation information;
obtaining deviation compensation information according to the first height information, the second height information and the installation angle information, and further comprising:
and obtaining vertical coordinate compensation information according to the height difference information and the horizontal coordinate angle information.
According to some embodiments of the present application, obtaining height information of a calibration reference plane to obtain first height information includes:
moving the laser sensor to enable the laser sensor to move from a preset fixed position to a calibration datum plane;
and acquiring the moving distance of the laser sensor to obtain first height information.
According to some embodiments of the present application, obtaining height information of the PCBA board, obtaining second height information, comprises:
moving the laser sensor to enable the laser sensor to move from a preset fixed position to a plane where the upper surface of the PCBA is located;
and acquiring the moving distance of the laser sensor to obtain second height information.
According to the probe adjusting device of the second aspect embodiment of this application, including:
the position acquisition module is used for acquiring initial position information of the probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface;
the first height acquisition module is used for acquiring height information of the calibration reference surface to obtain first height information;
the second height acquisition module is used for acquiring the height information of the PCBA to obtain second height information;
the angle acquisition module is used for acquiring the installation angle of the probe to obtain installation angle information;
the calculation processing module is used for obtaining deviation compensation information according to the first height information, the second height information and the installation angle information;
the compensation processing module is used for performing compensation processing on the initial position information according to the deviation compensation information to obtain target position information;
and the adjusting module is used for adjusting the position of the probe according to the target position information.
According to the probe adjusting device of the embodiment of the application, at least the following beneficial effects are achieved: calculating the thickness information of the PCBA board through the first height information and the second height information, then calculating deviation compensation information of the probe according to probe installation angle information obtained through testing, then performing compensation processing on initial position information of the probe according to the calculated deviation compensation information to obtain target position information, and then adjusting the position of the probe to a target position corresponding to the target position information. The real-time adjustment to the probe position is realized, so that the flying probe test equipment can conveniently realize the needle inserting mark points of the multilayer PCBA board, and the accuracy of the needle inserting mark points of the flying probe test equipment is improved.
An electronic device according to an embodiment of a third aspect of the present application includes:
at least one memory;
at least one processor;
at least one program;
the program is stored in the memory, and the processor executes at least one program to implement:
the method of the embodiment of the first aspect.
A storage medium according to an embodiment of the fourth aspect of the present application is a computer-readable storage medium storing computer-executable instructions for causing a computer to perform:
the method of the embodiment of the first aspect.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
FIG. 1 is a flow chart of a probe adjustment method provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of probe position adjustment in the horizontal axis direction according to an embodiment of the present disclosure;
FIG. 3 is a flowchart illustrating a specific method of step S500 in FIG. 1;
FIG. 4 is a schematic diagram illustrating probe position adjustment in the longitudinal direction according to an embodiment of the present disclosure;
FIG. 5 is a flowchart illustrating a specific method of step S200 in FIG. 1;
FIG. 6 is a flowchart illustrating a specific method of step S300 in FIG. 1;
FIG. 7 is a block diagram of a probe adjustment apparatus according to an embodiment of the present disclosure;
fig. 8 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present number, and the above, below, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
First, the terms that may be referred to in this application are resolved:
printed Circuit Board (Printed Circuit Board Assembly, PCBA): PCBA boards are important electronic components, support electronic components, and are providers of circuit connections for electronic components.
A laser sensor: laser sensors are sensors that use laser technology for measurement. It consists of laser, laser detector and measuring circuit. The laser sensor is a new measuring instrument, its advantages are non-contact remote measurement, high speed, high precision, wide range, strong anti-light and anti-electric interference ability, etc.
In the process of manufacturing electronic products, electronic manufacturing companies generate a plurality of multi-layer PCBA boards. The PCBA boards need to be detected by adopting flying probe test equipment, and needle punching mark points need to be performed when the PCBA boards are detected by using the flying probe test equipment. However, the existing flying probe test equipment performs tests on one plane, and if the condition of a multilayer PCBA board is met in the test process, the flying probe test equipment cannot adjust the position of a probe in real time according to PCBA boards with different heights, so that the pinpoint is inaccurate in the test process.
Based on the method, the device, the electronic equipment and the storage medium, the position of the probe can be adjusted in real time, so that the flying probe test equipment can conveniently realize the needle punching mark point of the multilayer PCBA board, and the accuracy of the needle punching mark point of the flying probe test equipment is improved.
The embodiments of the present application will be further explained with reference to the drawings.
Referring to fig. 1, in a first aspect, some embodiments of the present application provide a probe adjustment method, including, but not limited to, step S100, step S200, step S300, step S400, step S500, step S600, and step S700. These seven steps are described in detail below.
Step S100, acquiring initial position information of a probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface;
in step S100, the initial position information of the probe may be represented by coordinates. It is desirable that the probe in the flying probe test apparatus have completed a calibration operation before the probe can be adjusted. After the calibration operation is completed, a rectangular spatial coordinate system is established, and the initial position information of the probe can be represented by coordinates (x, y, z). The initial position information may be characterized as a position coordinate of a contact point of the probe and the calibration reference surface, and may also be characterized as a position coordinate of another point on the probe, which is not specifically limited in this application. In the embodiments of the present application, the description will be made in detail by taking as an example the initial position information representing the position coordinates of the contact point of the probe with the calibration reference surface.
It should be noted that, establishing the spatial rectangular coordinate system may establish a coordinate system with the surface where the calibration reference surface is located as an xy surface, or may adopt other forms. In the embodiment of the present application, a coordinate system is established by taking a plane where the calibration reference plane is located as an xy plane as an example for explanation, and in other cases, only corresponding conversion is required.
Step S200, height information of a calibration reference surface is obtained, and first height information is obtained;
step S300, height information of the PCBA is obtained, and second height information is obtained;
s400, acquiring the installation angle of the probe to obtain installation angle information;
step S500, obtaining deviation compensation information according to the first height information, the second height information and the installation angle information;
step S600, compensating the initial position information according to the deviation compensation information to obtain target position information;
and step S700, adjusting the position of the probe according to the target position information.
According to the probe adjusting method, the thickness information of the PCBA board is calculated through the first height information and the second height information, then the deviation compensation information of the probe is calculated according to the probe installation angle information obtained through testing, then the initial position information of the probe is compensated according to the deviation compensation information obtained through calculation, the target position information is obtained, and then the position of the probe is adjusted to the target position corresponding to the target position information. The real-time adjustment to the probe position is realized, so that the flying probe test equipment can conveniently realize the needle inserting mark points of the multilayer PCBA board, and the accuracy of the needle inserting mark points of the flying probe test equipment is improved.
Referring to fig. 2 and 3, fig. 2 is a schematic diagram illustrating probe position adjustment in the transverse axis direction according to some embodiments of the present disclosure. Referring to fig. 3, in some embodiments of the present application, the installation angle information includes: abscissa angle information; the deviation compensation information includes abscissa compensation information, and step S500 includes, but is not limited to, step S510 and step S520.
Step S510, calculating a difference value between the first height information and the second height information to obtain height difference value information;
and step S520, acquiring abscissa compensation information according to the height difference information and the abscissa angle information.
Specifically, as shown in fig. 2, in the present embodiment, the height information of the calibration reference surface is represented by h1, the height information of the PCBA board is represented by h2, Δ x represents abscissa compensation information, θxIndicating the angle of the probe with the horizontal axis after calibration of the probe, point a1 indicating the actual needle insertion position before adjustment, point B1 indicating the actual needle insertion position after adjustment, and point C1 indicating the theoretical needle insertion position before adjustment. The thickness of the PCBA plate is obtained by calculating the difference between h1 and h 2. Acquiring an included angle between a probe and a transverse shaft after the probe is calibrated to obtain transverse coordinate angle information, determining the included angle between the probe and the transverse shaft after the probe is calibrated, and determining a corresponding tangent value, so that a transverse coordinate offset can be determined according to the thickness of the PCBA plate and the tangent value of the included angle of the transverse shaft to obtain transverse coordinate compensation information, wherein a specific calculation formula is shown as a formula (1):
Δx＝(h2-h1)×tanθx (1)
after obtaining Δ x according to formula (1), performing compensation processing on the initial position information according to Δ x to obtain target position information after abscissa compensation processing, that is, the target position information after abscissa compensation processing is represented by coordinates as: (X + Δ X, Y, Z).
Referring to fig. 4, fig. 4 is a schematic diagram illustrating probe position adjustment in the longitudinal direction according to some embodiments of the present disclosure. In some embodiments of the present application, the installation angle information includes ordinate angle information; the deviation compensation information includes ordinate compensation information. Step S500 further includes, but is not limited to, the step of "obtaining ordinate compensation information from the altitude difference information and the ordinate angle information".
Specifically, in the present embodiment, the height information of the calibration reference plane is continued to be represented by h1, the height information of the PCBA board is represented by h2, Δ y represents ordinate compensation information, θyIndicating the angle of the probe with the vertical axis after calibration of the probe, point a2 indicating the actual needle insertion position before adjustment, point B2 indicating the actual needle insertion position after adjustment, and point C2 indicating the theoretical needle insertion position before adjustment. The thickness of the PCBA plate is obtained by calculating the difference between h1 and h 2. Acquiring an included angle between the probe and a longitudinal axis after the probe is calibrated to obtain longitudinal coordinate angle information, and then determining longitudinal coordinate compensation information according to the longitudinal coordinate angle information and the thickness of the PCBA plate, wherein the calculation formula is shown as a formula (2):
Δy＝(h2-h1)×tanθy (2)
after obtaining Δ y according to the formula (2), performing compensation processing on the initial position information according to Δ y to obtain target position information which is subjected to abscissa compensation processing and then to ordinate compensation processing, wherein the target position information is represented by coordinates as: (X + Δ X, Y + Δ Y, Z).
In some embodiments of the present application, the offset compensation information further includes vertical coordinate compensation information. Step S500 further includes, but is not limited to, the step of "obtaining vertical coordinate compensation information from the height difference information and the horizontal coordinate angle information".
Specifically, in the present embodiment, the height information of the calibration reference plane is continuously represented by h1, and the height information of the PCBA board is represented by h 2. The thickness of the PCBA plate is obtained by calculating the difference between h1 and h 2. Acquiring an included angle between the probe and a vertical axis after the probe is calibrated to obtain horizontal coordinate angle information, and then determining vertical coordinate compensation information according to the horizontal coordinate angle information and the thickness of the PCBA plate, wherein the calculation formula is shown as a formula (3) and a formula (4):
h4＝h2-h1 (3)
in the formula (3) and the formula (4), Δ z represents a vertical coordinate shift amount, i.e., vertical coordinate compensation information, θxRepresenting the angle of the probe to the longitudinal axis after alignment of the probe. After obtaining the Δ z, performing compensation processing on the initial position information according to the Δ z to obtain target position information after abscissa compensation processing, ordinate compensation processing and vertical coordinate compensation processing, wherein the target position information is represented by coordinates as: (X + Δ X, Y + Δ Y, Z + Δ Z).
It should be noted that, in the embodiment of the present application, the compensation adjustment operations for the abscissa, the ordinate and the ordinate are not in a sequential order, and the compensation operations may be performed simultaneously, and the above-mentioned order is only for exemplary illustration, and the present application is not limited specifically.
Referring to fig. 2, 4 and 5, in some embodiments of the present application, the step S200 includes, but is not limited to, the step S210 and the step S220. These two steps are described in detail below.
Step S210, moving the laser sensor to enable the laser sensor to move to a calibration reference surface from a preset fixed position;
step S220, obtaining a moving distance of the laser sensor to obtain first height information.
Specifically, in the present embodiment, the laser sensor is adopted for the height measurement. When the probe is calibrated according to the preset calibration reference surface, the position of the laser sensor is also fixed, namely the preset fixed position. The first height information is characterized by a distance of the calibration reference plane from the laser sensor. Therefore, after the laser sensor is moved from the fixed position to the calibration reference surface, the moving distance of the laser sensor is acquired, and the first height information can be obtained.
Referring to fig. 2, 4 and 6 together, in some embodiments of the present application, step S300 includes, but is not limited to, step S310 and step S320. These two steps are described in detail below.
Step S310, moving the laser sensor to enable the laser sensor to move from a preset fixed position to a plane where the upper surface of the PCBA is located;
step S320, obtaining a moving distance of the laser sensor to obtain second height information.
Specifically, in the present embodiment, the laser sensor is adopted for the height measurement. When the probe is calibrated according to the preset calibration reference surface, the position of the laser sensor is also fixed, namely the preset fixed position. The second height information is characterized as a distance from the upper surface of the PCBA board to the laser sensor. Therefore, after the laser sensor is moved from the fixed position to the plane where the upper surface of the PCBA board is located, the moving distance of the laser sensor is acquired, and the second height information can be obtained.
Referring to fig. 7, in a second aspect, some embodiments of the present application further provide a probe adjustment apparatus 800 including a position acquisition module 810, a first height acquisition module 820, a second height acquisition module 830, an angle acquisition module 840, a calculation processing module 850, a compensation processing module 860, and an adjustment module 870.
A position obtaining module 810, configured to obtain initial position information of the probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface.
The first height obtaining module 820 is configured to obtain height information of the calibration reference plane, so as to obtain first height information.
A second height obtaining module 830, configured to obtain height information of the PCBA board, to obtain second height information.
The angle obtaining module 840 is configured to obtain a mounting angle of the probe, and obtain mounting angle information.
And a calculation processing module 850, configured to obtain deviation compensation information according to the first height information, the second height information, and the installation angle information.
And the compensation processing module 860 is configured to perform compensation processing on the initial position information according to the deviation compensation information to obtain target position information.
And an adjusting module 870 for adjusting the position of the probe according to the target position information.
The probe adjustment device 800 according to the embodiment of the application calculates the thickness information of the PCBA board through the first height information and the second height information, calculates the deviation compensation information of the probe according to the probe installation angle information obtained through the test, performs compensation processing on the initial position information of the probe according to the calculated deviation compensation information to obtain the target position information, and adjusts the position of the probe to the target position corresponding to the target position information. The real-time adjustment to the probe position is realized, so that the flying probe test equipment can conveniently realize the needle inserting mark points of the multilayer PCBA board, and the accuracy of the needle inserting mark points of the flying probe test equipment is improved.
It should be noted that the probe adjusting apparatus of the embodiment of the present application corresponds to the probe adjusting method, and for a specific adjusting method or an operation method, please refer to the probe adjusting method, which is not described herein again.
An embodiment of the present disclosure further provides an electronic device, including:
at least one memory;
at least one processor;
at least one program;
a program is stored in the memory and the processor executes at least one program to implement the present disclosure to implement the probe adjustment method described above. The electronic device may be any intelligent terminal including a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), a vehicle-mounted computer, and the like.
The electronic device according to the embodiment of the present application will be described in detail with reference to fig. 8.
Referring to fig. 8, fig. 8 illustrates a hardware structure of an electronic device according to another embodiment, where the electronic device includes:
the processor 910 may be implemented by a general Central Processing Unit (CPU), a microprocessor, an Application Specific Integrated Circuit (ASIC), or one or more Integrated circuits, and is configured to execute related programs to implement the technical solution provided by the embodiments of the present disclosure;
the Memory 920 may be implemented in the form of a Read Only Memory (ROM), a static storage device, a dynamic storage device, or a Random Access Memory (RAM). The memory 920 may store an operating system and other application programs, and when the technical solution provided by the embodiments of the present disclosure is implemented by software or firmware, the relevant program codes are stored in the memory 920 and called by the processor 910 to execute the probe adjustment method according to the embodiments of the present disclosure;
an input/output interface 930 for implementing information input and output;
the communication interface 940 is configured to implement communication interaction between the device and other devices, and may implement communication in a wired manner (e.g., USB, network cable, etc.) or in a wireless manner (e.g., mobile network, WIFI, bluetooth, etc.);
a bus 950 that transfers information between various components of the device (e.g., the processor 910, the memory 920, the input/output interface 930, and the communication interface 940);
wherein the processor 910, the memory 920, the input/output interface 930, and the communication interface 940 are communicatively coupled to each other within the device via a bus 950.
The embodiment of the present disclosure also provides a storage medium, which is a computer-readable storage medium, and the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used for causing a computer to execute the probe adjustment method.
The memory, which is a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. Further, the memory may include high speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory located remotely from the processor, and these remote memories may be connected to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The embodiments described in the embodiments of the present disclosure are for more clearly illustrating the technical solutions of the embodiments of the present disclosure, and do not constitute a limitation to the technical solutions provided in the embodiments of the present disclosure, and it is obvious to those skilled in the art that the technical solutions provided in the embodiments of the present disclosure are also applicable to similar technical problems with the evolution of technology and the emergence of new application scenarios.
Those skilled in the art will appreciate that the solutions shown in the figures are not intended to limit embodiments of the present disclosure, and may include more or less steps than those shown, or some of the steps may be combined, or different steps.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
One of ordinary skill in the art will appreciate that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof.
The terms "first," "second," "third," "fourth," and the like in the description of the application and the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" for describing an association relationship of associated objects, indicating that there may be three relationships, e.g., "a and/or B" may indicate: only A, only B and both A and B are present, wherein A and B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single item(s) or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes multiple instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing programs, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
The preferred embodiments of the present disclosure have been described above with reference to the accompanying drawings, and therefore do not limit the scope of the claims of the embodiments of the present disclosure. Any modifications, equivalents and improvements within the scope and spirit of the embodiments of the present disclosure should be considered within the scope of the claims of the embodiments of the present disclosure by those skilled in the art.
Claims (9)
1. A probe adjustment method is characterized by comprising the following steps:
acquiring initial position information of the probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface;
acquiring height information of the calibration reference surface to obtain first height information;
acquiring height information of the PCBA to obtain second height information;
acquiring the installation angle of the probe to obtain installation angle information;
obtaining deviation compensation information according to the first height information, the second height information and the installation angle information;
compensating the initial position information according to the deviation compensation information to obtain target position information;
and adjusting the position of the probe according to the target position information.
2. The method of claim 1, wherein the installation angle information comprises: abscissa angle information; the deviation compensation information comprises abscissa compensation information;
the obtaining deviation compensation information according to the first height information, the second height information and the installation angle information includes:
calculating a difference value between the first height information and the second height information to obtain height difference value information;
and obtaining the abscissa compensation information according to the height difference information and the abscissa angle information.
3. The method of claim 2, wherein the installation angle information comprises ordinate angle information; the deviation compensation information comprises ordinate compensation information;
the obtaining deviation compensation information according to the first height information, the second height information and the installation angle information further includes:
and obtaining the vertical coordinate compensation information according to the height difference information and the vertical coordinate angle information.
4. The method of claim 2 or 3, wherein the bias compensation information further comprises vertical coordinate compensation information;
the obtaining deviation compensation information according to the first height information, the second height information and the installation angle information further includes:
and obtaining the vertical coordinate compensation information according to the height difference information and the horizontal coordinate angle information.
5. The method of claim 1, wherein the obtaining height information of the calibration reference plane to obtain first height information comprises:
moving a laser sensor to enable the laser sensor to move from a preset fixed position to the calibration datum plane;
and acquiring the moving distance of the laser sensor to obtain first height information.
6. The method of claim 1, wherein obtaining height information for the PCBA board to obtain second height information comprises:
moving the laser sensor to enable the laser sensor to move from a preset fixed position to a plane where the upper surface of the PCBA is located;
and acquiring the moving distance of the laser sensor to obtain second height information.
7. A probe adjustment apparatus, comprising:
the position acquisition module is used for acquiring initial position information of the probe; the initial position information is position information of the probe after calibration according to a preset calibration reference surface;
the first height acquisition module is used for acquiring the height information of the calibration reference surface to obtain first height information;
the second height acquisition module is used for acquiring the height information of the PCBA to obtain second height information;
the angle acquisition module is used for acquiring the installation angle of the probe to obtain installation angle information;
the calculation processing module is used for obtaining deviation compensation information according to the first height information, the second height information and the installation angle information;
the compensation processing module is used for performing compensation processing on the initial position information according to the deviation compensation information to obtain target position information;
and the adjusting module is used for adjusting the position of the probe according to the target position information.
8. An electronic device, comprising:
at least one memory;
at least one processor;
at least one program;
the programs are stored in the memory, and the processor executes the at least one program to implement:
the method of any one of claims 1 to 6.
9. A storage medium that is a computer-readable storage medium having stored thereon computer-executable instructions for causing a computer to perform:
the method of any one of claims 1 to 6.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116859920A (en) * | 2023-07-03 | 2023-10-10 | 广州明珞装备股份有限公司 | Precision compensation method and device, electronic equipment and punching system |
| CN117476529A (en) * | 2023-12-27 | 2024-01-30 | 深圳市森美协尔科技有限公司 | Probe calibration method, probe calibration device, electronic equipment and storage medium |
| WO2024022178A1 (en) * | 2022-07-28 | 2024-02-01 | 华为技术有限公司 | Sensor position self-adaptive method, sensor, and sensor apparatus |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121183A (en) * | 2005-10-31 | 2007-05-17 | Hioki Ee Corp | Device for inspecting circuit board |
| TW200928374A (en) * | 2007-12-26 | 2009-07-01 | Tokyo Cathode Lab | Circit board inspection device |
| CN109738788A (en) * | 2019-01-02 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | Flying probe tester test method, device, flying probe tester and storage medium |
| CN110333471A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of probe error compensating method for flying probe |
| CN110333469A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of target point calculating method for flying probe |
| CN111929566A (en) * | 2020-08-20 | 2020-11-13 | 厦门市三安集成电路有限公司 | Wafer testing method, device and control equipment thereof |
-
2021
- 2021-11-08 CN CN202111311250.3A patent/CN114184931A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121183A (en) * | 2005-10-31 | 2007-05-17 | Hioki Ee Corp | Device for inspecting circuit board |
| TW200928374A (en) * | 2007-12-26 | 2009-07-01 | Tokyo Cathode Lab | Circit board inspection device |
| CN109738788A (en) * | 2019-01-02 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | Flying probe tester test method, device, flying probe tester and storage medium |
| CN110333471A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of probe error compensating method for flying probe |
| CN110333469A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of target point calculating method for flying probe |
| CN111929566A (en) * | 2020-08-20 | 2020-11-13 | 厦门市三安集成电路有限公司 | Wafer testing method, device and control equipment thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024022178A1 (en) * | 2022-07-28 | 2024-02-01 | 华为技术有限公司 | Sensor position self-adaptive method, sensor, and sensor apparatus |
| CN116859920A (en) * | 2023-07-03 | 2023-10-10 | 广州明珞装备股份有限公司 | Precision compensation method and device, electronic equipment and punching system |
| CN116859920B (en) * | 2023-07-03 | 2024-03-26 | 广州明珞装备股份有限公司 | Precision compensation method and device, electronic equipment and punching system |
| CN117476529A (en) * | 2023-12-27 | 2024-01-30 | 深圳市森美协尔科技有限公司 | Probe calibration method, probe calibration device, electronic equipment and storage medium |
| CN117476529B (en) * | 2023-12-27 | 2024-04-09 | 深圳市森美协尔科技有限公司 | Probe calibration method, probe calibration device, electronic equipment and storage medium |
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