CN110333469A - A kind of target point calculating method for flying probe - Google Patents
A kind of target point calculating method for flying probe Download PDFInfo
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- CN110333469A CN110333469A CN201910649043.5A CN201910649043A CN110333469A CN 110333469 A CN110333469 A CN 110333469A CN 201910649043 A CN201910649043 A CN 201910649043A CN 110333469 A CN110333469 A CN 110333469A
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- pcba board
- target detection
- board pad
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a kind of target point calculating method for flying probe, S1: load gerber files and the design coordinate for obtaining PCBA board pad center point；S2: according to the design coordinate of the PCBA board pad center point, tying point type, device packaging types, target detection point and its plane coordinates are calculated, the difference that designs coordinate of the plane coordinates relative to the PCBA board pad center point of the target detection point is calculated；S3: the deviation of the target detection point in height is calculated；S4: in conjunction with the deviation profile situation of the target detection point, compensated distance is carried out；S5: final goal test point three-dimensional coordinate is obtained.The present invention is compensated by using the difference to target detection point and pad center point and height tolerance compensates the technological means to obtain the coordinate of final goal test point, overcome the problems, such as that probe tying point test inaccuracy exists in the prior art, realizes the target for improving the accuracy of probe tying point test component electrode.
Description
Technical field
The present invention relates to the technical field of automated test device, especially a kind of target point for flying probe is calculated
Method.
Background technique
Flying probe tester is that the element arrangement high density of PCBA, the number of plies is more, wiring density is big, measuring point is apart from small for testing
A kind of instrument for being tested of PCBA board (printed circuit board), work is connected to driver (signal by multiplex system
Generator, power supply supply etc.) and sensor (digital multimeter, frequency counter etc.) test the element on circuit board.
With the development of semiconductor process technique, the density of electronic component and the complexity of element constantly increase in PCBA board
Add, and mounted component size constantly reduces, this requirement just to probe tying point test method is higher and higher.
In the prior art, what gerber files provided coordinate is pad coordinate design value, but since practical tying point position is electricity
Pole or scolding tin, and there are processing errors, need to calculate pin mark under real target, thus cause under target pin mark accuracy by
It is influenced to certain, and then influences probe tying point precision.
Summary of the invention
The present invention is directed to solve in the related technology at least to a certain extent.For this purpose, the purpose of the present invention
It is to provide a kind of target point calculating method for flying probe, can be improved the accuracy of flying probe pin mark at present.
The technical scheme adopted by the invention is that:
The present invention provides a kind of target point calculating method for flying probe, comprising:
S1: load gerber files and the design coordinate for obtaining PCBA board pad center point；
S2: according to the design coordinate of the PCBA board pad center point, tying point type, device packaging types, target is calculated
Test point and its plane coordinates calculate plane coordinates the setting relative to the PCBA board pad center point of the target detection point
Count the difference of coordinate；
S3: the deviation of the target detection point in height is calculated；
S4: in conjunction with the deviation situation of the target detection point, compensated distance is carried out；
S5: final goal test point three-dimensional coordinate is obtained.
Further, in the S2, tying point type is determined according to the special parameter that device encapsulates.
Further, the design coordinate obtained in the S1 is plane coordinates.
Further, the S2 the following steps are included:
S21: setting left and right two PCBA board pads central point be zero point, then the coordinate of the target detection point be ±
(L-a)/2, wherein L is the contour length of component, and a is the width of electrode；
S22: the design coordinate of the PCBA board pad center point, and the design of the PCBA board pad center point are calculated
Coordinate calculation formula is ± (L1+2L2)/2, and wherein L1 is PCBA board pad spacing, L2 be PCBA board pad center to side away from
From；
S23: calculating the deviant of the target detection point Yu the PCBA board pad center point, and calculation formula is (L1+
2L2-L+a)/2。
Further, the S3 is the following steps are included: S31: calculate the PCBA board pad center point height with it is described
The uncompensation distance C of target detection point height, its calculation formula is C=T*tanQ=(t+t1) * tanQ, and wherein Q fixes for probe
Angle, t are the height of corresponding various encapsulation components, and wherein t is standard value；T1 is floating height when component welds.
Further, the special parameter includes: type, size and height.
Further, the S4 includes:
The S4 includes:
S41, it is carried out according to the plane coordinates of the target detection point and the difference of the PCBA board pad center point coordinate
Corresponding compensated distance；
S42, corresponding compensated distance is carried out according to the height tolerance value for calculating target detection point.
The beneficial effects of the present invention are:
The present invention from gerber files by using theoretical pad center point coordinate is obtained, by calculating on X/Y plane
The deviant of pad center point and target detection point compensates out, calculates target detection point in height inclined in Z-direction
Difference compensates, and finally obtains the technological means of final goal test point three-dimensional coordinate, overcomes and probe exists in the prior art
Tying point tests the low problem of middle probe tying point precision, realizes and calculates pin mark under real target, improves probe tying point
The target of accuracy and precision.
Detailed description of the invention
Fig. 1 is the component of the embodiment of the present invention and the structure chart of PCBA board；
Fig. 2 is the component shape assumption diagram of the embodiment of the present invention；
Fig. 3 is the plan view of 01005 packing forms component and PCBA board pad of the embodiment of the present invention；
Fig. 4 is the plan view of 0201 and 0402 packing forms component and PCBA board pad of the embodiment of the present invention；
Fig. 5 is the plan view of 0603 packing forms component and PCBA board pad of the embodiment of the present invention；
Fig. 6 is the plan view of 0604 packing forms component and PCBA board pad of the embodiment of the present invention；
Fig. 7 is the plan view of 0805 packing forms component and PCBA board pad of the embodiment of the present invention；
Fig. 8 is the component of the embodiment of the present invention and the side view of PCBA board pad.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
Referring to Fig.1, Fig. 1 is the component of the embodiment of the present invention and the structure chart of PCBA board, and the invention discloses a kind of use
In the target point calculating method of flying probe, comprising:
S1: load gerber files and the design coordinate for obtaining PCBA board pad center point；
S2: according to the design coordinate of the PCBA board pad center point, tying point type, device packaging types, target is obtained
The plane of test point and its plane coordinates, the design coordinate and the target detection point that calculate the PCBA board pad center point is sat
Target difference；
S3: the deviation of the target detection point in height is calculated；
S4: in conjunction with the deviation situation of the target detection point, compensated distance is carried out；
S5: obtaining final goal test point three-dimensional coordinate, is sat by the PCBA board pad center point obtained in gerber files
Mark calculates the difference between the target detection point of actual needs test electrode, carries out further according to difference between the two apart from benefit
It repays, the accuracy of knit stitch when being conducive to improve the test of probe tying point.
Wherein, the coordinate obtained in S1 is plane coordinates, and in S2, the target detection point coordinate of calculating is plane coordinates.
For flying probe system, the extracting method of the coordinate of target detection point is to obtain PCBA board pad from gerber files
The design coordinate of central point, wherein the coordinate obtained is plane coordinates.Since the design coordinate of PCBA board pad center point is not
Component testing electrode coordinate is needed coordinate minute for the relationship between PCBA board pad center point and component testing electrode
For the height relationships in the positional relationship and Z height on X/Y plane.By loading gerber files, PCBA board pad center point is obtained
Design coordinate, this coordinate be some PCBA board pad fixed value, but actual test need by probe prick this weldering
On component electrode above disk, to need to calculate the coordinate of the design coordinate and target detection point of PCBA board pad center point
Between gap, thus the positional relationship and Z height that need to be divided into the design coordinate of PCBA board pad center point on X/Y plane
On height relationships, difference between the two is compared and then calculates in order to axially different, to improve between the two
The accuracy that difference calculates.
As depicted in figs. 1 and 2, Fig. 2 is the component shape assumption diagram of the embodiment of the present invention, and B1, B2 are the right and left member
The central point of device electrode, B1, B2 point are the coordinate that practical acupuncture treatment point coordinate is also target detection point, and D is two PCBA board welderings
Central point, that is, zero point of disk.A1, A2 are two PCBA board pad center points below component, and A1, A2 are component two in Fig. 2
The central point of a PCBA board pad.PCBA board pad center point is different with the coordinate of target detection point as can be seen from Figure 1, so needing
It is a little accurate in order to have an acupuncture treatment to calculate target detection point by PCBA board pad center point.
Special parameter includes type, size and height, by according to device packaging types, size and highly to determine tying point
Type, such as device electrode, pad or scolding tin, pad is handset single-plate in the present embodiment, and device encapsulation includes 0603 encapsulation
Form, 0402 packing forms, 0201 packing forms, 01005 packing forms etc. belong to miniature device, therefore tying point type is
Device electrode rather than the pad of component, so needing to calculate the position of device electrode namely the position of target detection point.
S2 includes: S21: the central point of the two PCBA board pads in setting left and right is zero point, then the seat of the target detection point
It is designated as ± (L-a)/2, wherein L is the contour length of component, and a is the width of electrode；
S22: the design coordinate of the PCBA board pad center point, and the design of the PCBA board pad center point are calculated
Coordinate calculation formula is ± (L1+2L2)/2, and wherein L1 is PCBA board pad spacing, L2 be PCBA board pad center to side away from
From；
S23: calculating the deviant of zero point Yu the PCBA board pad center point, calculation formula be (L1+2L2-L+a)/
2；
Since packing forms are international professional standards, so, be directed to a certain encapsulation, L and a are fixed values, and L1 and
L2 is the product design standard of each company, so an in-company same type encapsulation L1 and L2 is identical, L1 and L2
It is also standard value (there are subtle difference in different companies) that the off-centring of PCBA board pad and component electrode is fixed value,
Database can be developed into call for test.
As shown in figure 3, Fig. 3 is the plan view of 01005 packing forms component and PCBA board pad of the embodiment of the present invention；
In the present embodiment, the outer dimension of 01005 packing forms is L=16mil (0.1mm=4mil), wherein 1mil=
0.0255mm, the back gauge of two PCBA board pads are L1=2mil, and PCBA board pad width is 2L2=10mil, and M is two welderings
The farthest distance of disk, then the farthest back gauge of two PCBA board pads is M=(2+10*2)=22mil, the width of component electrode
Degree is a=0.1mm=4mil, then (L1+2L2-L+a)/2=offset=0mil, that is, indicate the PCBA board of 01005 packing forms
Pad center and component electrode centers (namely target detection point) are overlapped, and do not need to deviate.
As shown in figure 4, Fig. 4 is 0201 and 0402 packing forms component of the embodiment of the present invention and putting down for PCBA board pad
Face figure, wherein L1=10mil, L2=10mil, L=40mil, a=0.2mil of 0402 packing forms, and 0201 L1=
8mil, L2=5mil, L=24mil, a=0.1mil, M=50mil, therefore (L1+2L2-L+a)/2 is calculated by S33 step
=offset=-1mil, that is, indicate this two class wrappers form PCBA board pad center point and component electrode centers point (namely
Target detection point) it is not overlapped, need to deviate 1mil, and offset direction is the center of SMD component.
As shown in Figure 5 and Figure 6, Fig. 5 is 0603 packing forms component of the embodiment of the present invention and putting down for PCBA board pad
Face figure, Fig. 6 are the plan views of 0604 packing forms component and PCBA board pad of the embodiment of the present invention, wherein 0603 encapsulation shape
L1=24mil, L2=12.5mil, L=63mil, a=0.3mil, M=74mil of formula calculate 0603 envelope by step S33
Offset=(L1+2L2-L+a)/2=-1mil of dress form, then need to carry out offset 1mil, wherein 0604 L1=29mil,
L2=11mil, L=63mil, a=0.3mil, M=73mil and 0604 packing forms calculate offset=(L1+2L2-L+
A)/2=0mil does not need then to be deviated.
As shown in fig. 7, Fig. 7 is the plan view of 0805 packing forms component and PCBA board pad of the embodiment of the present invention,
Wherein L1=28mil, L2=16mil, L=80mil, a=0.4mil, M=60mil of 0805 packing forms are according in S33
Calculation formula is that (L1+2L2-L+a)/2 obtains offset=(L1+2L2-L+a)/2=5mil, from showing that offset needs to carry out
Deviate 5mil.
As shown in figure 8, Fig. 8 is the component of the embodiment of the present invention and the side view of PCBA board pad, the S3 include with
Lower step: S31: calculating the uncompensation distance C of the PCBA board pad center point height Yu the target detection point height, wherein
C1 and C2 is the central point (namely central point of target detection point) of component electrode, and its calculation formula is C=T*tanQ=(t+
T1) * tanQ, wherein Q is probe fixed angle, and t is the height of corresponding various encapsulation components, and wherein t is standard value；T1 is member
Floating height when device welds.T is element heights, and t1 is general industry mark after the welding of SMD component and the distance between PCBA board
Quasi- t1=0.1~0.2, t1 are commonly called as " floating height "；T+t1 is the distance between the upper surface SMD and PCBA；B1 and B2 is the first device in left and right
The center of part electrode.Q angle be flying needle equipment Z axis probe advance when vertical axis between angle (usually 5 °~
15°).After probe is fixed, it will be pricked along this angle to component electrode centers point B1 and B2.Due to the Z axis of flying probe
It is to tilt vertically (there are the angles Q), due to the influence of T height, actually probe and the point of component contact is D1, D2
(probe tip has withstood on D1 and D2 point at this time, cannot pass through SMD component and reaches central point), rather than B1, B2.To guarantee
The needle point of probe pricks heart B1, B2 in the electrodes, is realized by uncompensation distance difference C1 or C2, to eliminate T height to probe tip
It influences.
S4 includes: that the S4 includes: S41, in plane coordinates and the PCBA board pad according to the target detection point
The difference of heart point coordinate carries out corresponding compensated distance；S42, phase is carried out according to the height tolerance value for calculating target detection point
Corresponding compensated distance.According to deviation of the calculated target detection point of S2, S3 in plane and height, and to this deviation
Value compensates, thus by obtaining final target detection point after compensated distance, in order to improve target detection point tying point
Accuracy that is accurate and then improving device electric test.
The implementation principle of the present embodiment: load gerber files first obtain PCBA board pad center point from gerber files
Design coordinate, according to component package type, size and height etc. parameters, determine tying point type, in the present embodiment PCBA
Plate is handset single-plate, so tying point type is device electrode, the design coordinate classification XY for the PCBA board pad center point that will acquire
The height relationships in positional relationship and Z height in plane calculate two pads first against the positional relationship on X/Y plane
Central point then calculate target detection point, finally calculate the deviant of target detection point and PCBA board pad center point,
Calculation formula is (L1+2L2-L+a)/2, then calculates offsets in height value, and the calculation formula of offsets in height value is C1=C2=T*
The coordinate of target detection point, finally exists according to component on tanQ=(t+0.1~0.2) * tanQ, you can get it X, Y, Z plane
Deviation in plane and in height compensates, to obtain the coordinate of final target detection point, improves flying probe
Accuracy.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (7)
1. a kind of target point calculating method for flying probe characterized by comprising
S1: load gerber files and the design coordinate for obtaining PCBA board pad center point；
S2: according to the design coordinate of the PCBA board pad center point, tying point type, device packaging types, target detection is calculated
Point and its plane coordinates, the plane coordinates for calculating the target detection point are sat relative to the design of the PCBA board pad center point
Target difference；
S3: the deviation of the target detection point in height is calculated；
S4: in conjunction with the deviation situation of the target detection point, compensated distance is carried out；
S5: final goal test point three-dimensional coordinate is obtained.
2. a kind of target point calculating method for flying probe according to claim 1, which is characterized in that the S2
In, tying point type is determined according to the special parameter that device encapsulates.
3. a kind of target point calculating method for flying probe according to claim 1, which is characterized in that in the S1
The design coordinate of acquisition is plane coordinates.
4. a kind of target point calculating method for flying probe according to claim 1 or 2 or 3, which is characterized in that institute
State S2 the following steps are included:
S21: setting left and right two PCBA board pads central point be zero point, then the coordinate of the target detection point be ± (L-a)/
2, wherein L is the contour length of component, and a is the width of electrode；
S22: the design coordinate of the PCBA board pad center point, and the design coordinate of the PCBA board pad center point are calculated
Calculation formula is ± (L1+2L2)/2, and wherein L1 is PCBA board pad spacing, and L2 is distance of the PCBA board pad center to side；
S23: calculating the deviant of the target detection point Yu the PCBA board pad center point, and calculation formula is (L1+2L2-
L+a)/2。
5. a kind of target point calculating method for flying probe according to claim 4, which is characterized in that the S3 packet
Include following steps: S31: calculating the uncompensation distance C of the PCBA board pad center point height Yu the target detection point height,
Its calculation formula is C=T*tanQ=(t+t1) * tanQ, and wherein Q is probe fixed angle, and t is corresponding various encapsulation components
Height, wherein t be standard value；T1 is floating height when component welds.
6. a kind of target point calculating method for flying probe according to claim 2, which is characterized in that described specific
Parameter includes: type, size and height.
7. a kind of target point calculating method for flying probe according to claim 1, which is characterized in that the S4 packet
It includes:
S41, it is carried out relatively according to the plane coordinates of the target detection point and the difference of the PCBA board pad center point coordinate
The compensated distance answered；
S42, corresponding compensated distance is carried out according to the height tolerance value for calculating target detection point.
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| CN201910649043.5A CN110333469B (en) | 2019-07-18 | 2019-07-18 | Target point calculation method for flying probe test |
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| CN111141954A (en) * | 2020-01-02 | 2020-05-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Test file generation method and device of resistor network and electronic equipment |
| CN112066934A (en) * | 2020-09-16 | 2020-12-11 | 深圳市一博科技股份有限公司 | Method for checking intersection or heavy hole problem of via hole discs on same layer of PCB |
| CN112908895A (en) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Substrate plane correction method and system and laminating equipment |
| CN114152860A (en) * | 2021-11-05 | 2022-03-08 | 深圳橙子自动化有限公司 | Probe calibration method and device, electronic device and storage medium |
| CN114184931A (en) * | 2021-11-08 | 2022-03-15 | 深圳橙子自动化有限公司 | Probe adjustment method, probe adjustment device, electronic device, and storage medium |
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| CN110333469B (en) | 2021-10-29 |
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