CN114141685A - Automatic wafer carrying platform and using method thereof - Google Patents
Automatic wafer carrying platform and using method thereof Download PDFInfo
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- CN114141685A CN114141685A CN202111430315.6A CN202111430315A CN114141685A CN 114141685 A CN114141685 A CN 114141685A CN 202111430315 A CN202111430315 A CN 202111430315A CN 114141685 A CN114141685 A CN 114141685A
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 83
- 239000010703 silicon Substances 0.000 claims abstract description 83
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 82
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 230000006698 induction Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 4
- 238000012840 feeding operation Methods 0.000 claims description 3
- 230000009194 climbing Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 90
- 238000001179 sorption measurement Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses automatic wafer carrying platform and use method thereof, wherein the automatic wafer carrying platform comprises: the middle part of the sucker is provided with a jacking sliding hole; the sucking disc is mounted on the upper portion of the base, and a groove is formed in the middle of the contact surface of the base and the sucking disc to form a mounting position; climbing mechanism, climbing mechanism set up in the installation position, climbing mechanism is configured as and carries out the jacking to silicon wafer, climbing mechanism includes mounting panel, fixed plate and jacking axle, and wherein, the mounting panel be used for with climbing mechanism install in installation position, the telescopic link that the fixed plate passes through the cylinder is connected in the mounting panel top, and the jacking axle is located the fixed plate up end, the jacking axle slide in the jacking sliding hole is in the working face lift setting of sucking disc. The application solves the technical problem that when a silicon wafer is in a shape with large warpage, a common vacuum chuck cannot absorb firmly.
Description
Technical Field
The application relates to the technical field of semiconductor equipment, in particular to an automatic wafer carrying platform.
Background
The clamping and conveying of silicon wafers is an important link in the semiconductor production process, and the quality and reliability of the silicon wafers are greatly influenced.
In the prior art, a contact type vacuum chuck technology is mainly adopted for clamping and conveying silicon wafers. In other words, the lower surface of the silicon wafer is tightly attached through vacuum adsorption, but the direct contact with the sucker easily causes uneven stress on the silicon wafer, and the silicon wafer is easy to warp and deform. Some products are easy to generate high temperature or micro deformation during laser processing, the sucker is easy to age when used at high temperature under the condition that the products with higher high temperature are easy to deform, and the contact type vacuum adsorption technology is easier to cause the further increase of the rejection rate in the chip manufacturing process with nanometer precision.
Disclosure of Invention
In order to overcome the defects in the prior art, a main object of the present application is to provide an automatic wafer carrier and a method for using the same, and provide a carrier with stable adsorption effect, wide application range, heat dissipation function and product lifting function.
In order to achieve the above object, the present application provides an automated wafer stage, comprising:
the middle part of the sucker is provided with a jacking sliding hole;
the sucking disc is mounted on the upper portion of the base, and a groove is formed in the middle of the contact surface of the base and the sucking disc to form a mounting position;
a jacking mechanism disposed in the mounting location, the jacking mechanism configured to jack up a silicon wafer, the jacking mechanism including a mounting plate, a fixed plate, and a jacking shaft, wherein,
the mounting plate is used for mounting the jacking mechanism on the mounting position,
the fixed plate is connected above the mounting plate through a telescopic rod of the cylinder,
the jacking shaft is arranged on the upper end face of the fixed plate, the jacking shaft is lifted on the working face of the sucker, and the jacking sliding hole is configured to be a passage for the jacking shaft to lift.
Preferably, the jacking mechanism further comprises:
the guide hole is formed in the fixing plate;
the guide shaft sets up in the mounting panel, and the guide shaft sets up with the guiding hole is coaxial, and the guiding hole is configured to the spacing track of guide shaft.
Preferably, the mounting position comprises a stepped hole, and the jacking mechanism is connected to the stepped hole through a mounting plate.
Preferably, the suction cup comprises:
the air jet is arranged on the working surface of the sucker;
the air pipe is connected with an external air source.
Preferably, the air injection port is arranged in a ring shape and is used for uniformly injecting high-pressure air at the bottom of the silicon wafer.
Preferably, a negative pressure area is formed between the silicon wafer and the sucker by generating cyclone through high-pressure air, and the silicon wafer is suspended and adsorbed on the sucker through an air surface.
Preferably, the carrier further comprises:
a driver connected to the base by a connection;
the connecting part is used for connecting a driving machine and the base and is of an annular structure, and the connecting part is driven by the driving machine to rotate coaxially.
Preferably, the carrier further comprises:
the sensing assembly is arranged on the side part of the automatic wafer carrying platform and comprises a sensing piece and a photoelectric switch, the sensing piece is fixed on the outer side of the connecting part along the radial direction of the connecting part,
the photoelectric switch and the driver are arranged on the same workbench, when the driver rotates, the induction sheet is driven to synchronously rotate through the connecting part, and the photoelectric switch detects the rotating induction sheet;
the tail end of the induction part is bent by a preset angle to form a contact part, and the contact part is configured as a detection target of the photoelectric switch on the induction sheet;
the photoelectric switches are arranged in two numbers, the two photoelectric switches are arranged on the rotating path of the induction sheet at intervals, and the motion trail of the contact part of the induction sheet is located in the signal receiving area of the photoelectric switches.
Preferably, the carrier further comprises:
the limiting block is arranged on one side of the connecting part through the sensing piece;
the limiting columns are arranged on the outer sides of the two photoelectric switches respectively, and are configured to limit the rotation range of the carrier through the limiting blocks and the limiting columns when the carrier rotates.
A use method of an automatic wafer carrier comprises the following steps:
controlling the jacking shaft to extend out of the working surface of the sucker, moving and loading the silicon wafer on the jacking shaft through the feeding operation,
the air jet port jets high-pressure air, the high-pressure air forms a low-pressure area at the bottom of the silicon wafer, a high-pressure area is formed at the top of the silicon wafer, the flow rate of the high-pressure air jetted by the air jet port is adjusted, so that the silicon wafer is stably adsorbed on the sucking disc, the jacking shaft descends on the working surface of the sucking disc, and the silicon wafer is suspended and restrained between the low-pressure area and the high-pressure area by air flow;
the driver drives the silicon wafer to rotate for processing;
after the processing is finished, the silicon wafer is jacked by the jacking shaft to be far away from the working surface of the sucker, the air jet port is controlled to stop jetting high-pressure air, and the silicon wafer is blanked through blanking operation.
The beneficial effect that this application realized does:
the application discloses automatic change wafer microscope carrier and application method, negative pressure that silicon wafer produced through the sucking disc adsorbs in the sucking disc, because the sucking disc is when adsorbing, is being formed with the air plane between sucking disc and the silicon wafer, and the silicon wafer is hung to be restrained on the sucking disc, consequently when the silicon wafer is the great form of warpage, ordinary vacuum chuck absorbs insecurely, and this application is adsorbed through the negative pressure, has improved stability greatly.
Furthermore, the sucking disc realizes the adsorption effect by generating negative pressure through the air jet, so the sucking disc can adsorb the silicon wafer and simultaneously has a certain heat dissipation effect.
The application discloses automatic wafer carrying platform and use method thereof, through set up climbing mechanism at the sucking disc working face, realize on the carrying platform in vertical direction to the lift of silicon wafer move carry, to equipment, save one and get the cost and the space of material z axle module.
The application discloses automatic wafer carrying platform and a using method thereof.A sensing assembly is arranged on the side part of the carrying platform and comprises a sensing piece and a photoelectric switch, the sensing piece is detected by the photoelectric switch, so that a control circuit is switched on or switched off, and the control on the working state of the wafer carrying platform is realized by controlling the circuit.
Meanwhile, one side of the carrier is provided with a limiting block which synchronously rotates along with the carrier, and two limiting columns which are fixed on the rotating track of the limiting block, so that the rotating range of the carrier is limited firmly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of an automated wafer carrier of the present application;
FIG. 2 is a schematic view of an automated wafer carrier of the present application;
FIG. 3 is a schematic view of an automated wafer carrier of the present application;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
FIG. 5 is an exploded view of an automated wafer carrier of the present application;
FIG. 6 is a schematic view of a jacking mechanism of the present application;
FIG. 7 is a schematic diagram illustrating an automatic ejecting condition of a wafer stage according to the present application;
FIG. 8 is a schematic diagram of an automated wafer stage processing state according to the present application;
FIG. 9 is a schematic structural view of a sensing assembly and a coupling portion of the present application;
FIG. 10 is a schematic view of an automated wafer carrier of the present application;
in the figure:
10-a driver;
20-a base;
201-an installation site;
30-a sucker;
301-jacking sliding holes; 302-an air jet; 303-trachea;
40-a sensing component;
401-a sensing piece; 4012-contact; 402-a photoelectric switch; 403-a limiting block; 404-a connection plate; 405-a spacing post;
50-a jacking mechanism;
501-jacking shaft; 502-a fixed plate; 503-telescopic rod; 504-a mounting plate; 505-a cylinder; 506-a guide hole; 507-a guide shaft;
60-a connecting part;
70-silicon wafer.
Detailed Description
In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As described in the background art, most of the existing platforms have potential safety hazards of air leakage and untight suction when a common adsorption platform is used in combination with a vacuum generator for products with large warpage (large flatness), and flying sheets (products fly out of the platform) when the platform moves at high speed; some products laser beam machining produces high temperature easily or product micro deformation, under the higher yielding condition of product of high temperature, the sucking disc is easy ageing in the use under the high temperature, and gas leakage appears easily in ordinary platform that punches, and the limitation of use is great. In order to solve the problems, the application provides an automatic wafer carrying platform, and provides a carrying platform which is stable in adsorption effect, wide in application range and has a heat dissipation function and a product lifting function.
In order to achieve the technical effects, a driving machine 10 is fixedly installed on a workbench, a base 20 is installed on a rotating shaft of the driving machine 10 through a connecting part 60, a suction cup 30 is installed on the upper part of the base 20, and the suction cup 30 comprises an air jet port 302 and an air pipe 303 and is arranged on the working surface of the suction cup 30 through the air jet port 302; one end of the air pipe 303 is connected to an external air source, and the other end of the air pipe is connected to the suction cup 30 to provide high-pressure air for the air nozzle 302, further, the air nozzle 302 is annular and used for uniformly spraying high-pressure air to the bottom of the silicon wafer 70, so that the bottom of the silicon wafer 70 is prevented from being stressed unevenly.
The suction cup 30 employs the bernoulli principle, when the gas ejected from the gas ejection port 302 encounters the silicon wafer 70, the gas rapidly diffuses outward from the center of the silicon wafer 70 along the radial direction of the silicon wafer 70 so that the gas velocity at the upper part of the silicon wafer 70 is lower than the gas velocity at the lower part of the silicon wafer 70, and the gas pressure at the bottom of the silicon wafer 70 is lower than the gas pressure at the upper part thereof, so that the silicon wafer 70 is sucked by the negative pressure formed by the suction cup 30. Further, the high pressure air between the silicon wafer 70 and the suction cup 30 forms an air surface when flowing, so that the silicon wafer 70 is suspended on the suction cup 30 when the silicon wafer 70 is sucked, and when the silicon wafer 70 is in a state of large warpage, the silicon wafer 70 is sucked by the suction cup 30 in a non-contact manner, which is more reliable than a common vacuum suction cup.
When the suction cup 30 adsorbs the silicon wafer 70, when the material is required to be taken, the silicon wafer 70 cannot be held up in the vertical direction, and the product can only be moved by disconnecting the input of high-pressure air or providing a large lateral force from the side of the silicon wafer 70, in order to solve the technical problem, in the embodiment, the suction cup 30 is provided with the jacking mechanism 50, the jacking mechanism 50 is arranged below the suction cup 30, and the jacking mechanism 50 is configured to jack the silicon wafer 70.
In this embodiment, in order to prevent the jacking mechanism 50 from interfering with the chuck 30 to adsorb the silicon wafer 70, the jacking mechanism 50 is disposed below the working surface of the chuck 30, and a mounting position 201 is formed in the base 20 on which the chuck 30 is mounted, the mounting position 201 includes a stepped hole disposed inside the base 20, the jacking mechanism 50 is mounted in the stepped hole, the jacking mechanism 50 is mounted in the mounting position 201, the jacking mechanism 50 further includes a jacking shaft 501, a mounting plate 504, a cylinder 505, a fixing plate 502, a guide hole 506, and a guide shaft 507, wherein the mounting plate 504 is used for mounting the jacking mechanism 50 in the stepped hole; the cylinder 505 is arranged in the middle of the mounting plate 504; the fixing plate 502 is connected above the mounting plate 504 in a lifting manner through an expansion rod 503 of the air cylinder 505, the lifting shaft 501 is arranged on the fixing plate 502, the lifting slide hole 301 is formed in the working surface of the suction cup 30, and the lifting shaft 501 moves in the lifting slide hole 301 in a lifting manner, so that the lifting shaft 501 lifts the silicon wafer 70. Specifically, by arranging the lifting shaft 501 to lift, when the silicon wafer 70 does not need to be lifted, the lifting shaft 501 descends to a position below the working surface of the suction cup 30, so that the interference of the existence of the lifting shaft on the adsorption performance of the suction cup 30 is avoided; when the material needs to be taken out, the air cylinder 505 drives the lifting shaft to lift the silicon wafer 70 in the vertical direction.
In this embodiment, the guiding hole 506 is opened in the fixing plate 502; a guide shaft 507 is provided to the mounting plate 504, wherein the guide shaft 507 is provided coaxially with a guide hole 506, the guide hole 506 being configured as a limit rail of the guide shaft 507. When the jacking mechanism 50 operates, the guide shaft 507 slides in the guide hole 506, so that the fixed plate 502 can be restrained, the fixed plate 502 is prevented from rotating when being pushed by the air cylinder 505, and the jacking shaft 501 and the jacking sliding hole 301 are prevented from being dislocated.
In this embodiment, in order to facilitate control of a circuit, a state of a carrier needs to be monitored, in this embodiment, a sensing assembly 40 is arranged to monitor a motion state of the carrier, wherein the sensing assembly 40 is arranged at a side portion of the carrier, the sensing assembly 40 includes a sensing piece 401 and a photoelectric switch 402, the sensing piece 401 is fixed outside the connecting portion 60 along a radial direction of the connecting portion, the photoelectric switch 402 detects the sensing piece 401, specifically, the photoelectric switch 402 and the driver 10 are arranged on the same workbench, when the driver 10 rotates, the sensing piece 401 rotates synchronously, the sensing piece 401 is fixed on the photoelectric switch 402 of the workbench to detect the rotating sensing piece 401, and when the sensing piece 401 rotates to a sensing area of the photoelectric switch 402, position information of the carrier is fed back to software to control an angle, at which the driver needs to correct a deviation, of the driver.
Further, the connecting portion 60 is of an annular structure, the connecting portion 60 is coaxially connected with the rotating portion of the driving mechanism 10, and when the stage operates, the sensing piece 401 and the limiting block 403 rotate coaxially with the stage, that is, when the stage operates, the sensing piece 401 and the limiting block 403 relatively still rotate synchronously with the stage.
In this embodiment, the carrier further includes a limiting block 403 and a limiting column 405, the limiting block is disposed on one side of the connecting portion 60 through the sensing piece, the number of the limiting columns 405 is two, and the two limiting columns are disposed on the outer sides of the two photoelectric switches 402, respectively, and the limiting column 405 is configured to limit the rotation range of the carrier through the limiting block 403 and the limiting column 405 when the carrier rotates. Specifically, the limiting block 403 is driven by the carrier to rotate synchronously through the connecting portion 60, the limiting posts 405 are fixed on the rotation track of the limiting block 403, so that the carrier can only rotate within the limiting range between the two limiting posts 405, preferably, the limiting posts 405 are cylinders made of high-strength rubber, and when the limiting block 403 impacts the two limiting posts 405, no excessive abnormal sound is generated and a certain buffering effect is achieved. The sensing piece 401 further comprises a contact portion 4012, the end of the sensing piece 401 is bent by a preset angle to form the contact portion 4012, in this case, the bending angle is preferably 90 °, the contact portion 4012 is bent to a horizontal position, when the sensing piece rotates along with the stage, the rotation track of the contact portion 4012 is located in the sensing area of the photoelectric switch 402, and the contact portion 4012 is configured as a detection target of the photoelectric switch 402 on the sensing piece 401, so that the detection of the motion state of the stage is realized through feedback data, and thus when the silicon wafer 70 is processed, the processing equipment is controlled according to the motion state of the stage. When the carrier rotates to a certain angle, the limiting column 405 limits the carrier through the limiting block 403, so that the carrier stops rotating, the sensing piece 401 rotates in the sensing area of the photoelectric switch 402, the driver encoder program is read and fed back to the software for recording, and the angle of the driver needing to be corrected is controlled through the position of the code record.
In one embodiment, the laser lift-off operation is performed with the processing equipment disposed above the stage being a laser source, when the silicon wafer 70 is irradiated with the laser for lift-off, the laser source needs to adjust the laser irradiated to the silicon wafer 70 according to the process, that is, when the stage drives the silicon wafer 70 to rotate, the motion state of the stage, such as the start and stop of the stage and the rotation speed of the stage, is detected by the sensing assembly, when the laser irradiates and peels off the silicon wafer 70, when the carrier is limited by the limiting block and the limiting column, the sensing piece 401 is located in the sensing area of the photoelectric switch 402, reads the program of the driver encoder and feeds the program back to the software for recording, the angle of the driver needing to be rectified or reset to zero is controlled through the position recorded by the code, correspondingly, the control program of the laser source can control the output power of the laser source according to the preset processing technology, thus, the silicon wafer 70 is processed by the laser light source outputting laser light of different powers at different rotation speeds of the stage.
Further, in order to control the circuit to be switched on or switched off, the optoelectronic switch 402 is configured to detect the movement of the sensing piece 401, preferably, a limit optoelectronic switch is adopted in this example, the contact portion 4012 is provided at the end of the sensing piece 401, a limit optoelectronic switch is provided on the rotation path of the sensing piece 401 carried by the base 20, and the sensing area of the limit optoelectronic switch is the movement path of the contact portion 4012, that is, when the sensing piece 401 rotates, the contact portion 4012 moves in the sensing area of the limit optoelectronic switch.
In this embodiment, the limit photoelectric switch is installed on the machine platform through the connecting plate 404, and is installed on a side surface of the connecting plate 404 far away from the carrier, so that when the sensing piece 401 rotates, the limit photoelectric switch detects the contact portion 4012 of the sensing piece 401. In this embodiment, two photoelectric switches 402 are disposed, and the two photoelectric switches 402 are disposed on the rotation path of the sensing piece 401 at intervals. The contact part 4012 is detected through the limit photoelectric switch, so that cooperative control of other processes and the automatic wafer carrier in production and manufacturing is finally realized through a preset program control circuit.
In this embodiment, in a specific operation, a method for using an automatic wafer stage includes the following steps:
controlling the jacking shaft 501 to extend out of the working surface of the sucker 30, and transferring the silicon wafer 70 on the jacking shaft 501 through the feeding operation;
the air injection ports 302 inject high-pressure air, the high-pressure air rapidly diffuses from the center of the wafer along the radial direction of the silicon wafer 70, so that the air flow speed of the upper part of the silicon wafer 70 is lower than that of the lower part of the silicon wafer, according to Bernoulli's principle, the air pressure at the bottom of the silicon wafer 70 is lower than that of the upper part of the silicon wafer, so that a low-pressure area is formed at the bottom of the silicon wafer 70, a high-pressure area is formed at the top of the silicon wafer 70, the flow speed of the high-pressure air injected by the air injection ports 302 is adjusted, so that the silicon wafer 70 is stably adsorbed on the suction cup 30, the jacking shaft 501 descends to the working surface of the suction cup 30, and the silicon wafer 70 is suspended and restrained between the low-pressure area and the high-pressure area by the air flow;
the driver 10 drives the silicon wafer 70 to rotate, and meanwhile, the processing equipment processes the silicon wafer 70;
after the processing is completed, the silicon wafer 70 is lifted by the lifting shaft 501 to be far away from the working surface of the suction cup 30, meanwhile, the air injection ports 302 are controlled to stop injecting high-pressure air, the silicon wafer 70 is discharged through discharging operation, the silicon wafer 70 is moved away from the lifting shaft 501, and the discharged silicon wafer 70 is placed at a specified position.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. An automated wafer carrier, comprising:
the middle part of the sucker is provided with a jacking sliding hole;
the sucking disc is mounted on the upper portion of the base, and a groove is formed in the middle of the contact surface of the base and the sucking disc to form a mounting position;
a jacking mechanism disposed in the mounting location, the jacking mechanism configured to jack up a silicon wafer, the jacking mechanism including a mounting plate, a fixed plate, and a jacking shaft, wherein,
the mounting plate is used for mounting the jacking mechanism on the mounting position,
the fixed plate is connected above the mounting plate through a telescopic rod of the cylinder,
the jacking shaft is arranged on the upper end face of the fixed plate, the jacking shaft is lifted on the working face of the sucker, and the jacking sliding hole is configured to be a passage for the jacking shaft to lift.
2. The automated wafer stage of claim 1, wherein the lift mechanism further comprises:
the guide hole is formed in the fixing plate;
the guide shaft sets up in the mounting panel, and the guide shaft sets up with the guiding hole is coaxial, and the guiding hole is configured to the spacing track of guide shaft.
3. An automated wafer stage as in claim 1 wherein the mounting location comprises a stepped bore and the lift mechanism is connected to the stepped bore by a mounting plate.
4. An automated wafer carrier as claimed in claim 1 wherein the chuck comprises:
the air jet is arranged on the working surface of the sucker;
the air pipe is connected with an external air source.
5. An automated wafer stage according to claim 4 wherein said air jets are arranged in a ring pattern for uniformly jetting high pressure air at the bottom of said silicon wafer.
6. The automated wafer stage of claim 5, wherein a negative pressure region is formed between the silicon wafer and the chuck by creating a cyclone with high pressure air, and the silicon wafer is attached to the chuck by being suspended from the air surface.
7. An automated wafer carrier as claimed in claim 1, wherein the carrier further comprises:
a driver connected to the base by a connection;
the connecting part is used for connecting a driving machine and the base and is of an annular structure, and the connecting part is driven by the driving machine to rotate coaxially.
8. An automated wafer carrier as claimed in claim 1, wherein the carrier further comprises:
the sensing assembly is arranged on the side part of the automatic wafer carrying platform and comprises a sensing piece and a photoelectric switch, the sensing piece is fixed on the outer side of the connecting part along the radial direction of the connecting part,
the photoelectric switch and the driver are arranged on the same workbench, when the driver rotates, the induction sheet is driven to synchronously rotate through the connecting part, and the photoelectric switch detects the rotating induction sheet;
the tail end of the induction part is bent by a preset angle to form a contact part, and the contact part is configured as a detection target of the photoelectric switch on the induction sheet;
the photoelectric switches are arranged in two numbers, the two photoelectric switches are arranged on the rotating path of the induction sheet at intervals, and the motion trail of the contact part of the induction sheet is located in the signal receiving area of the photoelectric switches.
9. An automated wafer carrier as claimed in claim 8, wherein the carrier further comprises:
the limiting block is arranged on one side of the connecting part through the sensing piece;
the limiting columns are arranged on the outer sides of the two photoelectric switches respectively, and are configured to limit the rotation range of the carrier through the limiting blocks and the limiting columns when the carrier rotates.
10. A method of using an automated wafer carrier, the automated wafer carrier of claim 1, the method comprising:
controlling the jacking shaft to extend out of the working surface of the sucker, and moving and loading the silicon wafer on the jacking shaft through the feeding operation;
the air jet port jets high-pressure air, the high-pressure air forms a low-pressure area at the bottom of the silicon wafer, a high-pressure area is formed at the top of the silicon wafer, the flow rate of the high-pressure air jetted by the air jet port is adjusted, so that the silicon wafer is stably adsorbed on the sucking disc, the jacking shaft descends on the working surface of the sucking disc, and the silicon wafer is suspended and restrained between the low-pressure area and the high-pressure area by air flow;
the driver drives the silicon wafer to rotate for processing;
after the processing is finished, the silicon wafer is jacked by the jacking shaft to be far away from the working surface of the sucker, the air jet port is controlled to stop jetting high-pressure air, and the silicon wafer is blanked through blanking operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111430315.6A CN114141685A (en) | 2021-11-29 | 2021-11-29 | Automatic wafer carrying platform and using method thereof |
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| CN114619308A (en) * | 2022-03-29 | 2022-06-14 | 杭州众硅电子科技有限公司 | Wafer polishing system, loading method and using method thereof |
| CN117226319A (en) * | 2023-11-16 | 2023-12-15 | 镭神泰克科技(苏州)有限公司 | Material carrying device, precise marking equipment and marking method |
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