CN210052728U - Flexible thimble operating means and system of encapsulation chip fall - Google Patents
Flexible thimble operating means and system of encapsulation chip fall Download PDFInfo
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- CN210052728U CN210052728U CN201920897129.5U CN201920897129U CN210052728U CN 210052728 U CN210052728 U CN 210052728U CN 201920897129 U CN201920897129 U CN 201920897129U CN 210052728 U CN210052728 U CN 210052728U
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Abstract
The application discloses flexible thimble operating means and system of encapsulation chip falls, be connected with the cam through servo motor, the pendulum rod is connected with the cam, therefore servo motor drive cam's rotation can drive the up-and-down motion of pendulum rod, thimble subassembly passes through thimble flexible adjusting spring and tension adjusting lever and is connected with the thimble seat, thimble on the thimble seat is withheld the thimble through thimble flexible adjusting spring, the setting is adjusted through the tension adjusting lever to the tensile force accessible of thimble flexible adjusting spring, thimble flexible adjusting spring receives external force and is greater than when predetermineeing the power, the thimble can retract, reach the flexonics of thimble and chip with this, the height that current thimble mechanism can only control the chip jack-up by the stroke of adjustment thimble has been solved, there is the thimble to press the technical problem who damages the risk of chip when absorbing the chip under the subsides.
Description
Technical Field
The application relates to the technical field of electronic packaging and manufacturing, in particular to an inverted packaged chip flexible thimble operating device and system.
Background
With the rapid development of power electronic technology, the market demand of electronic devices is increasing day by day, and integrated chips become the high-speed growth point of the current global economic development and become the fundamental and strategic industries concerned with the national economy and social development.
Electronic packaging is taken as a subsequent process of the integrated chip industry, the chip picking process is an indispensable key process step in the electronic packaging, the first transfer of a single integrated chip from a blue film substrate to a picking head is completed, the subsequent industrial processes such as visual guidance paster, bonding and the like are linked, the operation of jacking and stripping the integrated chip needs to be carried out by using an ejector pin mechanism, the traditional ejector pin mechanism only can jack up an ejector pin quickly, the height of jacking the chip can be controlled only by adjusting the stroke of the ejector pin, the chip cannot be damaged when the chip is sucked by a suction head, the flexible contact of the ejector pin with the chip cannot be realized, and the risk that the chip is damaged when the ejector pin presses and sucks the chip in a mounting manner exists.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an inverted packaged chip flexible thimble operating device and system, which are used for solving the technical problems that the existing thimble mechanism can only control the jacking height of a chip by adjusting the stroke of a thimble, and the thimble damages the chip when the thimble presses down to suck the chip.
In view of the above, a first aspect of the present application provides an inverted packaged chip flexible thimble operating device, including: the flexible movement mechanism comprises a base, a flexible movement mechanism and a thimble assembly;
the flexible motion mechanism is arranged on the base;
the thimble assembly is arranged on the bracket seat of the flexible movement mechanism through a thimble seat supporting plate;
the flexible motion mechanism comprises: the support seat, the thimble flexible adjusting spring, the tension adjusting rod, the servo motor, the cam and the oscillating bar are arranged on the support seat;
the thimble flexible adjusting spring is connected with the tension adjusting rod;
the ejector pin assembly is connected with an ejector pin base of the ejector pin assembly through the ejector pin flexible adjusting spring and the tension adjusting rod;
the servo motor is connected with the oscillating bar through the cam;
the swing rod is connected with the thimble seat;
the thimble assembly includes: the thimble seat, the thimble sleeve, the thimble locking sleeve and the thimble rod are arranged on the thimble seat;
the thimble seat is arranged on the thimble seat supporting plate and is connected with the thimble rod;
the thimble rod is connected with the thimble;
the thimble sleeve is sleeved at the connecting position of the thimble rod and the thimble;
the thimble lock sleeve is installed on the thimble sleeve and is used for locking the thimble.
Preferably, the method further comprises the following steps: a thimble protection component;
the thimble protection component is sleeved on the thimble component;
the thimble protection assembly comprises a fixing plate, a supporting seat, a cover plate, a floating sleeve and an induction sheet;
the supporting seat is arranged on the fixing plate;
the centers of the fixed plate, the supporting seat and the cover plate are all provided with through holes for the floating sleeves to penetrate through;
the floating sleeve is connected with the bracket base through a tension spring;
one end of the induction sheet is connected with the floating sleeve, and the other end of the induction sheet is connected with the optical fiber inductor.
Preferably, the thimble assembly further comprises: the thimble cap, the thimble rod guide sleeve and the sleeve are provided with a first vacuum hole and the thimble outlet hole;
the ejector pin rod guide sleeve is connected with the ejector pin rod;
the sleeve is sleeved on the outermost layer of the thimble assembly;
a second vacuum hole is formed in the side wall of the sleeve and is communicated with the first vacuum hole through a cavity in the sleeve;
the second vacuum hole is connected with a vacuum valve;
the sleeve is internally provided with a sealing ring and a plug connected with the sealing ring, and forms a vacuum cavity with the cavity.
Preferably, the method further comprises the following steps: an X/Y precision adjusting platform;
the X/Y precision adjusting platform is arranged between the base and the flexible motion mechanism.
Preferably, the method further comprises the following steps: a Z-direction motion platform;
and the Z-direction motion platform is arranged between the X/Y precision adjustment platform and the flexible motion mechanism.
Preferably, the number of the extension springs is three, and the three extension springs are arranged at an angle of 120 degrees.
Preferably, the thimble assembly further comprises a thimble sleeve pressing block;
the thimble sleeve pressing blocks are symmetrically sleeved and fixed on the outer side of the thimble sleeve and are fixedly connected with the thimble sleeve;
one end of the tension adjusting rod is connected with the thimble sleeve pressing block, and the other end of the tension adjusting rod is connected with the thimble seat supporting plate through the thimble flexible adjusting spring.
Preferably, the Z-direction moving platform is an air cylinder.
The application provides a flexible thimble operating system for an inverted packaged chip, which comprises any one of the flexible thimble operating devices for the inverted packaged chip described in the first aspect.
The third aspect of the present application further provides an inverted packaged chip flexible thimble operating system, which includes a controller and any one of the inverted packaged chip flexible thimble operating apparatuses described in the first aspect;
the controller is electrically connected with the inverted packaging chip flexible thimble operating device.
According to the technical scheme, the embodiment of the application has the following advantages:
in this application, a flexible thimble operating means of encapsulation chip that falls is provided, include: the base flexible movement mechanism and the ejector pin component; the flexible motion mechanism is arranged on the base; the thimble assembly is arranged on a bracket seat of the flexible movement mechanism through a thimble seat supporting plate; the flexible motion mechanism comprises: the device comprises a support base, a thimble flexible adjusting spring, a tension adjusting rod, a servo motor, a cam and a swing rod; the thimble flexible adjusting spring is connected with the tension adjusting rod; the thimble assembly is connected with a thimble seat of the thimble assembly through a thimble flexible adjusting spring and a tension adjusting rod; the servo motor is connected with the oscillating bar through a cam; the swing rod is connected with the thimble seat; the thimble subassembly includes: the thimble structure comprises a thimble seat, a thimble sleeve, a thimble locking sleeve and a thimble rod; the thimble seat is arranged on the thimble seat supporting plate and connected with the thimble rod; the thimble rod is connected with the thimble; the thimble sleeve is sleeved at the connecting position of the thimble rod and the thimble; the thimble lock sleeve is installed on the thimble cover for lock thimble. The flexible thimble operating device of the inverted packaging chip provided in the application is connected with a cam through a servo motor, a swing rod is connected with the cam, therefore, the servo motor drives the cam to rotate to drive the swing rod to move up and down, a thimble assembly is connected with a thimble seat through a flexible thimble adjusting spring and a tension adjusting rod, a thimble on the thimble seat is pulled by the thimble through the flexible thimble adjusting spring, the tension of the flexible thimble adjusting spring can be adjusted through the tension adjusting rod, the thimble can retract when the flexible thimble adjusting spring receives external force greater than preset force, thereby achieving the flexible contact of the thimble and the chip, and solving the technical problem that the existing thimble mechanism can only control the height of jacking of the chip by adjusting the stroke of the thimble, and the risk that the thimble damages the chip when the chip is pressed down and absorbed by mounting.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of an inverted packaged chip flexible thimble operating device provided in the present application;
FIG. 2 is a schematic structural diagram of a flexible motion mechanism provided in an embodiment of the present application;
FIG. 3 is a schematic structural view of a spike guard assembly provided in an embodiment of the present application;
FIG. 4 is a schematic view of a portion of the structure of FIG. 1;
FIG. 5 is a schematic structural view of a thimble assembly provided in the embodiments of the present application;
FIG. 6 is a schematic diagram of the components of the needle guard assembly of FIG. 5;
FIG. 7 is a schematic structural diagram of an X/Y fine adjustment stage;
wherein the reference numerals are:
1. a base; 2. a Z-direction motion platform; 3. a vacuum valve; 4. a thimble protection component; 5. a thimble assembly; 6. a servo motor; 7. a cam; 8. a swing rod; 9. a thimble sleeve pressing block; 10. an optical fiber sensor; 11. an induction sheet; 12. a fixing plate; 13. a supporting seat; 14. a cover plate; 15. a floating sleeve; 16. a thimble seat supporting plate; 17. a trimmer; 18. a thimble cap; 19. a thimble locking sleeve; 20. a thimble; 21. a thimble sleeve; 22. a thimble seat; 23. a thimble rod guide sleeve; 24. a thimble rod; 25. a plug; 26. a seal ring; 27. a fabrication hole; 28. a tension spring; 29. y-direction crossed ball guide rails; 30. x-direction crossed ball guide rails; 31. a Z-direction crossed ball guide rail; 32. a support base; 33. a thimble flexible adjusting spring; 34. a tension adjusting rod; 35. an X/Y precision adjusting platform; 36. a first vacuum hole; 37 second vacuum hole.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
For easy understanding, referring to fig. 1 to 6, an embodiment of a flexible thimble operating device for an inverted chip provided by the present application includes: the device comprises a base 1, a flexible movement mechanism and a thimble assembly 5;
the flexible motion mechanism is arranged on the base 1;
the thimble assembly 5 is arranged on a bracket seat 32 of the flexible movement mechanism through a thimble seat supporting plate 16;
the flexible motion mechanism comprises: the support seat 32, the thimble flexible adjusting spring 33, the tension adjusting rod 34, the servo motor 6, the cam 7 and the swing rod 8;
the thimble flexible adjusting spring 33 is connected with the tension adjusting rod 34;
the thimble assembly 5 is connected with a thimble seat of the thimble assembly 5 through a thimble flexible adjusting spring 33 and a tension adjusting rod 34;
the servo motor 6 is connected with the swing rod 8 through a cam 7;
the swing rod 8 is connected with the thimble seat;
the thimble assembly 5 includes: the thimble structure comprises a thimble seat 22, a thimble 20, a thimble sleeve 21, a thimble locking sleeve 19 and a thimble rod 24;
the thimble seat 22 is arranged on the thimble seat supporting plate 16 and connected with the thimble rod 24;
the thimble rod 24 is connected with the thimble;
the thimble sleeve 21 is sleeved at the connecting position of the thimble rod 24 and the thimble;
the thimble locking sleeve 19 is mounted on a thimble sleeve 21 for locking a thimble 20.
It should be noted that, as shown in fig. 1, the flexible moving mechanism in the embodiment of the present application is installed on the base 1, and a schematic structural diagram of the flexible moving mechanism is shown in fig. 2, where the flexible moving mechanism includes a support base 32, an ejector pin flexible adjusting spring 33, a tension adjusting rod 34, a servo motor 6, a cam 7, and a swing rod 8; the thimble flexible adjusting spring 33 is connected with the tension adjusting rod 34; the thimble assembly 5 is connected with the thimble seat 22 of the thimble assembly 5 through a thimble flexible adjusting spring 33 and a tension adjusting rod 34; the servo motor 6 is connected with the swing rod 8 through a cam 7; the swing rod 8 is connected with the thimble seat.
The flexible thimble operating device for the inverted packaged chip provided by the embodiment of the application is connected with the cam 7 through the servo motor 6, the swing rod 8 is connected with the cam 7, therefore, the servo motor 6 drives the cam 7 to rotate to drive the swing rod 8 to move up and down, the thimble assembly 5 is connected with the thimble seat 22 through the thimble flexible adjusting spring 33 and the tension adjusting rod 34, the thimble 20 is pulled by the thimble on the thimble seat 22 through the thimble flexible adjusting spring 33, the tension of the thimble flexible adjusting spring 33 can be adjusted and set through the tension adjusting rod 34, when the thimble flexible adjusting spring 33 receives external force greater than preset force, the thimble can retract, therefore, the flexible contact between the ejector pin 20 and the chip is achieved, and the technical problem that the ejector pin damages the chip when the ejector pin is pressed down to suck the chip due to the fact that the ejector pin can only control the jacking height of the chip by adjusting the stroke of the ejector pin 20 in the conventional ejector pin mechanism is solved.
For easy understanding, referring to fig. 1 to 6, the present application provides another embodiment of a flexible thimble operating device for a flip chip, including: the device comprises a base 1, a flexible movement mechanism and a thimble assembly 5;
the flexible motion mechanism is arranged on the base 1;
the thimble assembly 5 is arranged on a bracket seat 32 of the flexible movement mechanism through a thimble seat supporting plate 16;
the flexible motion mechanism comprises: the support seat 32, the thimble flexible adjusting spring 33, the tension adjusting rod 34, the servo motor 6, the cam 7 and the swing rod 8;
the thimble flexible adjusting spring 33 is connected with the tension adjusting rod 34;
the thimble assembly 5 is connected with the thimble seat 22 of the thimble assembly 5 through a thimble flexible adjusting spring 33 and a tension adjusting rod 34;
the servo motor 6 is connected with the swing rod 8 through a cam 7;
the swing rod 8 is connected with the thimble seat 22;
the thimble assembly 5 includes: the thimble structure comprises a thimble seat 22, a thimble 20, a thimble sleeve 21, a thimble locking sleeve 19 and a thimble rod 24;
the thimble seat 22 is arranged on the thimble seat supporting plate 16 and connected with the thimble rod 24;
the thimble rod 24 is connected with the thimble 20;
the thimble sleeve 21 is sleeved at the connecting position of the thimble rod 24 and the thimble 20;
the thimble locking sleeve 19 is mounted on a thimble sleeve 21 for locking a thimble 20.
Further, still include: a thimble protection component 4;
the thimble protection component 4 comprises a fixed plate 12, a supporting seat 13, a cover plate 14, a floating sleeve 15 and an induction sheet 11;
the supporting seat 13 is arranged on the fixed plate 12;
the centers of the fixed plate 12, the supporting seat 13 and the cover plate 14 are all provided with through holes for the penetration of the floating sleeve 15;
the floating sleeve 15 is connected with the bracket base 32 through a tension spring 28;
one end of the sensing piece 11 is connected with the floating sleeve 15, and the other end is connected with the optical fiber sensor 10.
It should be noted that, as an improvement, on the basis of the foregoing embodiments, in order to better protect the thimble 20 during operation, the thimble protection assembly 4 is additionally installed outside the thimble assembly 5, a structural schematic diagram of the thimble protection assembly 4 provided in the embodiments of the present application is shown in fig. 3, and fig. 6 is a structural schematic diagram of components of the thimble protection assembly, the floating sleeve 15 is connected to the support base 32 through three tension springs 28 and is suspended in the center of the support base 32, when the floating sleeve 15 is subjected to an external force in any direction, the floating sleeve 15 swings and drives the sensing piece 11 to move, so as to achieve the purpose of judgment, and can effectively prevent the thimble 20 from being damaged by the Wafer fixing disk when the thimble 20 moves to the edge of the Wafer fixing disk, therefore, when a force from any direction is applied to the floating sleeve 15 of the thimble protection assembly 4, the floating sleeve 15 will displace, the optical fiber sensor 10 can detect the change to achieve the shutdown state, thereby protecting the operation safety of the thimble 20.
As an improvement, the embodiment of the present application further includes, on the basis of the foregoing embodiment: an X/Y precision adjusting platform 35 and a Z-direction moving platform 2; the X/Y precision adjusting platform 35 is arranged between the base 1 and the flexible motion mechanism; the Z-direction moving platform 2 is arranged between the X/Y precision adjusting platform 35 and the flexible moving mechanism.
It should be noted that, as shown in fig. 1, the flexible thimble operating device for flip chip provided in the embodiment of the present application includes a base 1, an X/Y fine adjustment platform 35, a Z-direction movement platform 2, a flexible movement mechanism and a thimble assembly 5, the X-direction and Y-direction displacements of the thimble assembly 5 can be realized by the X/Y fine adjustment platform 35, the Z-direction displacement of the thimble assembly 5 can be realized by the Z-direction movement platform 2, the X/Y fine adjustment platform 35 and the Z-direction movement platform 2 of the thimble are connected to the base 1 by the X-direction crossed ball guide and the Y-direction crossed ball guide, the fine adjustment in the direction X, Y is completed by the fine adjuster 17 on the connection board of the X/Y fine adjustment platform 35, the structure of the X/Y fine adjustment platform 35 in the present application is shown in fig. 7, the X/Y fine adjustment platform 35 in the present application is a prior art, in the embodiment of the present application, the existing X/Y precision adjustment platform 35 is not structurally improved, and is not described in detail herein. The Z-direction moving platform 2 may be a cylinder, and the Z-direction displacement of the ejector pin assembly 5 is realized through the piston movement of the cylinder.
The inverted packaged chip flexible thimble operating device provided in the embodiment of the application can realize X, Y and Z travel displacement of the thimble assembly 5 through the X/Y precision adjusting platform 35 and the Z-direction moving platform 2, the servo motor 6 is connected with the cam 7, the swing rod 8 is connected with the cam 7, therefore, the servo motor 6 drives the cam 7 to rotate to drive the swing rod 8 to move up and down, the thimble assembly 5 is connected with the thimble seat 22 through the thimble flexible adjusting spring 33 and the tension adjusting rod 34, the thimble 20 is pulled by the thimble on the thimble seat 22 through the thimble flexible adjusting spring 33, the tension of the thimble flexible adjusting spring 33 can be adjusted and set through the tension adjusting rod 34, when the thimble flexible adjusting spring 33 receives an external force greater than a preset force, the thimble 20 can retract, thereby achieving flexible contact between the thimble 20 and the chip, and solving the problem that the existing thimble mechanism can only control the height of jacking up the chip by adjusting the travel of the thimble, the technical problem of the risk that the thimble damages the chip when mounting the downward-pressing suction chip exists.
As an improvement, the number of the tension springs 28 in the embodiment of the present application is three, and the three tension springs 28 are arranged at an angle of 120 degrees, so that the force balance in the 360-degree direction can be realized, and the accuracy of the determination result is improved.
Furthermore, the thimble assembly 5 also comprises a thimble sleeve 21 pressing block 9;
the pressing blocks 9 of the thimble sleeve 21 are symmetrically sleeved and fixed on the outer side of the thimble sleeve 21 and are fixedly connected with the thimble sleeve 21;
one end of the tension adjusting rod 34 is connected with the pressing block 9 of the thimble sleeve 21, and the other end is connected with the thimble seat supporting plate 16 through the thimble flexible adjusting spring 33.
It should be noted that, as an improvement, the flexible thimble operating device for the flip chip provided in the embodiment of the present application includes a pressing block 9 of the thimble sleeve 21 for fastening the thimble assembly 5, so as to drive the thimble assembly 5 to move under the action of the thimble flexibility adjusting spring 33 and the tension adjusting rod 34.
For easy understanding, referring to fig. 1 to 6, the present application provides a further embodiment of a flexible thimble operating device for a flip chip, including: the device comprises a base 1, a flexible movement mechanism and a thimble assembly 5;
the flexible motion mechanism is arranged on the base 1;
the thimble assembly 5 is arranged on a bracket seat 32 of the flexible movement mechanism through a thimble seat supporting plate 16;
the flexible motion mechanism comprises: the support seat 32, the thimble flexible adjusting spring 33, the tension adjusting rod 34, the servo motor 6, the cam 7 and the swing rod 8;
the thimble flexible adjusting spring 33 is connected with the tension adjusting rod 34;
the thimble assembly 5 is connected with a thimble seat of the thimble assembly 5 through a thimble flexible adjusting spring 33 and a tension adjusting rod 34;
the servo motor 6 is connected with the swing rod 8 through a cam 7;
the swing rod 8 is connected with the thimble seat;
the thimble assembly 5 includes: the thimble structure comprises a thimble seat, a thimble sleeve 21, a thimble locking sleeve 19 and a thimble rod 24;
the thimble seat 22 is arranged on the thimble seat supporting plate 16 and connected with the thimble rod 24;
the thimble rod 24 is connected with the thimble 20;
the thimble sleeve 21 is sleeved at the connecting position of the thimble rod 24 and the thimble 20;
the thimble locking sleeve 19 is mounted on a thimble sleeve 21 for locking a thimble 20.
Further, the thimble assembly 5 further includes: the thimble cap 18 provided with a first vacuum hole 36 and a thimble outlet hole, a thimble seat, a thimble rod 24 guide sleeve 23 and a sleeve;
the ejector pin rod 24 is connected with the ejector pin rod 24 through the guide sleeve 23;
the sleeve is sleeved on the outermost layer of the thimble assembly 5;
the side wall of the sleeve is provided with a second vacuum hole 37, and the second vacuum hole 37 is communicated with the first vacuum hole 36 through a cavity in the sleeve;
the second vacuum hole 37 is connected to the vacuum valve 3;
the sleeve is internally provided with a sealing ring 26 and a plug 25 connected with the sealing ring 26, and forms a vacuum cavity with the cavity.
It should be noted that, as an improved embodiment of the foregoing two embodiments, in the embodiment of the present application, an external connection type is adopted as a mode for realizing a vacuum chip in a conventional ejector pin mechanism, so that the ejector pin mechanism cannot be miniaturized, and the mechanism cannot be simplified and optimized, and in order to realize miniaturization of the ejector pin mechanism, it is necessary to improve this problem. Thereby adsorb the blue membrane on wafer, guarantee that the thimble is smooth ejecting with the chip, the structural diagram of thimble assembly 5 that provides in this application embodiment is shown in FIG. 5, and when thimble 20 contacts the chip, when needing to adsorb the blue membrane on wafer, carry out the evacuation processing to the vacuum cavity through opening the valve of vacuum valve 3, when needs peel off the chip, close the valve of vacuum valve 3 through vacuum valve 3 and remove the vacuum adsorption effect and peel off the chip.
The application further provides an embodiment of the inverted packaged chip flexible thimble operating system, and the inverted packaged chip flexible thimble operating system provided in the embodiment of the application comprises any one of the inverted packaged chip flexible thimble operating devices in the embodiment of the inverted packaged chip flexible thimble operating device.
The application further provides another embodiment of the inverted packaged chip flexible thimble operating system, the inverted packaged chip flexible thimble operating system provided in the embodiment of the application comprises a controller and any one of the inverted packaged chip flexible thimble operating devices in the embodiments of the inverted packaged chip flexible thimble operating devices, and the controller is electrically connected with the inverted packaged chip flexible thimble operating devices.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. The utility model provides a flexible thimble operating means of reverse encapsulation chip which characterized in that includes: the flexible movement mechanism comprises a base, a flexible movement mechanism and a thimble assembly;
the flexible motion mechanism is arranged on the base;
the thimble assembly is arranged on the bracket seat of the flexible movement mechanism through a thimble seat supporting plate;
the flexible motion mechanism comprises: the support seat, the thimble flexible adjusting spring, the tension adjusting rod, the servo motor, the cam and the oscillating bar are arranged on the support seat;
the thimble flexible adjusting spring is connected with the tension adjusting rod;
the ejector pin assembly is connected with an ejector pin base of the ejector pin assembly through the ejector pin flexible adjusting spring and the tension adjusting rod;
the servo motor is connected with the oscillating bar through the cam;
the swing rod is connected with the thimble seat;
the thimble assembly includes: the thimble seat, the thimble sleeve, the thimble locking sleeve and the thimble rod are arranged on the thimble seat;
the thimble seat is arranged on the thimble seat supporting plate and is connected with the thimble rod;
the thimble rod is connected with the thimble;
the thimble sleeve is sleeved at the connecting position of the thimble rod and the thimble;
the thimble lock sleeve is installed on the thimble sleeve and is used for locking the thimble.
2. The device for manipulating a flexible thimble of a flip chip according to claim 1, further comprising: a thimble protection component;
the thimble protection component is sleeved on the thimble component;
the thimble protection assembly comprises a fixing plate, a bracket seat, a cover plate, a floating sleeve and an induction sheet;
the bracket base is arranged on the fixed plate;
the centers of the fixing plate, the bracket base and the cover plate are all provided with through holes for the floating sleeves to penetrate through;
the floating sleeve is connected with the bracket base through a tension spring;
one end of the induction sheet is connected with the floating sleeve, and the other end of the induction sheet is connected with the optical fiber inductor.
3. The device for operating a flexible thimble of an inverted packaged chip according to claim 1 or 2, wherein the thimble assembly further comprises: the thimble cap, the thimble rod guide sleeve and the sleeve are provided with a first vacuum hole and the thimble outlet hole;
the ejector pin rod guide sleeve is connected with the ejector pin rod;
the sleeve is sleeved on the outermost layer of the thimble assembly;
a second vacuum hole is formed in the side wall of the sleeve and is communicated with the first vacuum hole through a cavity in the sleeve;
the second vacuum hole is connected with a vacuum valve;
the sleeve is internally provided with a sealing ring and a plug connected with the sealing ring, and forms a vacuum cavity with the cavity.
4. The device for manipulating a flexible thimble of a flip chip according to claim 1, further comprising: an X/Y precision adjusting platform;
the X/Y precision adjusting platform is arranged between the base and the flexible motion mechanism.
5. The device for manipulating a flexible thimble of a flip chip according to claim 4, further comprising: a Z-direction motion platform;
and the Z-direction motion platform is arranged between the X/Y precision adjustment platform and the flexible motion mechanism.
6. The device for operating a flexible thimble of a flip chip according to claim 2, wherein the number of the tension springs is three, and the three tension springs are arranged at an angle of 120 degrees.
7. The device for operating a flexible thimble of an inverted packaged chip according to claim 1 or 2, wherein the thimble assembly further comprises a thimble pressing block;
the thimble sleeve pressing blocks are symmetrically sleeved and fixed on the outer side of the thimble sleeve and are fixedly connected with the thimble sleeve;
one end of the tension adjusting rod is connected with the thimble sleeve pressing block, and the other end of the tension adjusting rod is connected with the thimble seat supporting plate through the thimble flexible adjusting spring.
8. The device for manipulating a flexible ejector pin of a flip chip according to claim 5, wherein the Z-direction moving platform is an air cylinder.
9. An inverted packaged chip flexible thimble operation system, comprising the inverted packaged chip flexible thimble operation device according to any one of claims 1 to 8.
10. An inverted packaged chip flexible thimble operating system, comprising a controller and the inverted packaged chip flexible thimble operating device according to any one of claims 1 to 8;
the controller is electrically connected with the inverted packaging chip flexible thimble operating device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920897129.5U CN210052728U (en) | 2019-06-14 | 2019-06-14 | Flexible thimble operating means and system of encapsulation chip fall |
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| CN201920897129.5U CN210052728U (en) | 2019-06-14 | 2019-06-14 | Flexible thimble operating means and system of encapsulation chip fall |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112093A (en) * | 2019-06-14 | 2019-08-09 | 深圳市哈德胜精密科技股份有限公司 | One kind falls to encapsulate chip flexible top needle operation means and system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112093A (en) * | 2019-06-14 | 2019-08-09 | 深圳市哈德胜精密科技股份有限公司 | One kind falls to encapsulate chip flexible top needle operation means and system |
| CN110112093B (en) * | 2019-06-14 | 2024-02-09 | 深圳市哈德胜精密科技股份有限公司 | Flexible ejector pin operating device and system for inverted packaging chip |
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