CN114042685A - 一种半导体晶圆循环清洗装置 - Google Patents
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Abstract
本发明公开了一种半导体晶圆循环清洗装置,包括:转动柱,所述转动柱两侧固定连接有用于支撑的支撑架;清洗管组件,多个所述清洗管组件等距环状固定连接在转动柱侧边,所述清洗管组件包括用于放置多个晶圆的管体和管盖,所述管体一侧设置为开口;夹持固定组件,所述夹持固定组件包括安装块和夹持板,多个所述安装块等距固定安装在管体内部,两个所述夹持板位于安装块两侧;放置组件,所述放置组件固定安装在两个相邻夹持固定组件之间;循环水机构,所述循环水组件包括进水组件和出水组件,用于将水在管体内部进行导入和导出。本发明通过转动的方式进行晶圆的清理,同时可以同步对晶圆的放入和取出进行操作,提高了清理的速率。
Description
技术领域
本发明涉及半导体加工技术领域,尤其涉及一种半导体晶圆循环清洗装置。
背景技术
晶圆是指硅半导体集成电路制作所用的硅晶片,由于其形状为圆形,故称为晶圆;在硅晶片上可加工制作成各种电路元件结构,而成为有特定电性功能之IC产品,现有的半导体便可采用晶圆进行制成,晶圆半导体制造过程中,容易受到尘粒、金属的污染,造成晶片内电路功能的损坏,形成短路或断路等,导致集成电路的失效以及影响几何特征的形成,因此在制作过程中需要对晶圆表面进行清洗,有效地清除残留在晶圆上之微尘、金属离子及有机物等杂质。
现有的清洗装置多是之间将晶圆进行固定,然后用水进行清洗,但是这种直接冲洗的方式会对晶圆与固定装置的接触面造成冲击,使晶圆发生形变,造成半导体无法正常使用,同时这种固定放置在使用过程中步骤复杂,对晶圆的清理效率较低。
发明内容
本发明的目的是为了解决现有技术中以下缺点,这种直接冲洗的方式会对晶圆与固定装置的接触面造成冲击,使晶圆发生形变,造成半导体无法正常使用,同时这种固定放置在使用过程中步骤复杂,对晶圆的清理效率较低,而提出的一种半导体晶圆循环清洗装置。
为了实现上述目的,本发明采用了如下技术方案:
一种半导体晶圆循环清洗装置,包括:
转动柱,所述转动柱两侧固定连接有用于支撑的支撑架;
清洗管组件,多个所述清洗管组件等距环状固定连接在转动柱侧边,所述清洗管组件包括用于放置多个晶圆的管体和管盖,所述管体一侧设置为开口,且远离开口的一侧管内壁为平面,所述管盖一侧与开口靠近转动柱的一侧转动连接;
夹持固定组件,所述夹持固定组件包括安装块和夹持板,多个所述安装块等距固定安装在管体内部,两个所述夹持板位于安装块两侧,且通过调节组件与管盖连接,两个相邻所述安装块上相对的一组夹持板用于固定晶圆;
放置组件,所述放置组件固定安装在两个相邻夹持固定组件之间,用于放置晶圆;
循环水机构,所述循环水组件包括进水组件和出水组件,用于将水在管体内部进行导入和导出。
优选的,所述夹持板远离安装块的一侧设置弧形,且夹持板侧壁开设有多个夹槽,所述夹持板由弹性材质制成。
优选的,所述放置组件包括伸缩杆和置晶板,所述伸缩杆垂直固定连接在两个相邻夹持固定组件中间,所述置晶板为圆形薄板,且固定连接在伸缩杆顶端。
优选的,所述调节组件包括液管、压杆和滑动杆,所述液管开设在安装块内部,且为倒T形,所述压杆一端与管盖内壁固定连接,且另一端密封滑动在液管竖直端,两个所述滑动杆一端密封滑动在液管的两侧水平端内部,且另一端与夹持板侧侧边固定连接。
优选的,所述进水组件包括水箱、进水接口和进水管,所述水箱固定连接在一侧支撑架上,所述进水管固定连通在水箱上,所述进水接口固定安装在管体靠近水箱的一侧,且进水接口保持正向水平时,与进水管连接。
优选的,所述出水组件包括出水管、污水处理箱和出水接口,所述污水处理箱固定安装在支撑远离进水组件的支撑架外侧,所述出水管与污水处理箱连通,多个所述出水接口固定连通在管体底部,且保持正向水平时,与出水管连通。
优选的,所述管体和管盖之间设置有密封闭合组件,所述密封闭合组件包括密封条、卡槽和连接条,所述密封条固定连接在管盖内壁,所述连接条固定连接在管盖外侧,所述卡槽固定连接在卡槽侧边,所述连接条卡设在卡槽内部。
优选的,所述压杆始终位于液管内部的底端部分由硬性材质制成,且与管盖连接,发生弯曲的部分由弹性材质制成。
优选的,所述出水管与进水管分别位于转动柱两侧,用于两侧管体同时进行进水和出水处理。
与现有技术相比,本发明的有益效果是:
当一侧的管体保持水平时,管盖在电动转轴的作用下打开,将需要清洗的晶圆放置在多个放置组件上,这时自动闭合的管盖带动调节组件进行压动作用,将两个夹持板进行移动,从而将位于放置组件上的晶圆进行夹持作用,当管盖完全闭合之后,通过进水组件对管体内部进行导水处理,转动柱转动,带动管体进行转动,从而使管体内部的晶圆在转动的水中进行清理处理,将表面的灰尘和杂质分离,当管体转动180度之后,通过出水组件将混有杂质的污水进行导出,同时开启管盖将内部清理完成的晶圆取出,同时另一侧放入需要清理的晶圆,本发明通过转动的方式进行晶圆的清理,保证了晶圆的清理,同时可以同步对晶圆的放入和取出进行操作,方便了晶圆的放取,提高了清理的速率。
附图说明
图1为本发明提出的一种半导体晶圆循环清洗装置的右侧结构示意图;
图2为本发明提出的一种半导体晶圆循环清洗装置的左侧结构示意图;
图3为本发明提出的一种半导体晶圆循环清洗装置的正面结构示意图;
图4为本发明提出的一种半导体晶圆循环清洗装置的清洗管组件结构示意图;
图5为本发明提出的一种半导体晶圆循环清洗装置的夹持固定组件示意图。
图中:1转动柱、2支撑架、3清洗管组件、31管体、32管盖、4夹持固定组件、41安装块、42夹持板、5放置组件、51伸缩杆、52置晶板、6进水组件、61水箱、62进水接口、63进水管、7出水组件、71出水管、72污水处理箱、73出水接口、8调节组件、81液管、82压杆、83滑动杆、9密封闭合组件、91密封条、92卡槽、93连接条。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
参照图1-5,一种半导体晶圆循环清洗装置,包括:
转动柱1,转动柱1两侧固定连接有用于支撑的支撑架2,转动柱1受到内部电机驱动,在两个支撑架2之间进行转动;
清洗管组件3,多个清洗管组件3等距环状固定连接在转动柱1侧边,清洗管组件3包括用于放置多个晶圆的管体31和管盖32,管体31一侧设置为开口,且远离开口的一侧管内壁为平面,管盖32一侧与开口靠近转动柱1的一侧转动连接,且通过电动转轴对管盖32的转动密闭进行操作;
夹持固定组件4,夹持固定组件4包括安装块41和夹持板42,多个安装块41等距固定安装在管体31内部,两个夹持板42位于安装块41两侧,且通过调节组件8与管盖32连接,两个相邻安装块41上相对的一组夹持板42用于固定晶圆;
放置组件5,放置组件5固定安装在两个相邻夹持固定组件4之间,用于放置晶圆;
循环水机构,循环水组件包括进水组件6和出水组件7,用于将水在管体31内部进行导入和导出。
本发明中,当一侧的管体31保持水平时,管盖32在电动转轴的作用下打开,将需要清洗的晶圆放置在多个放置组件5上,这时自动闭合的管盖32带动调节组件8进行压动作用,将两个夹持板42进行移动,从而将位于放置组件5上的晶圆进行夹持作用,当管盖32完全闭合之后,通过进水组件6对管体31内部进行导水处理,转动柱1转动,带动管体31进行转动,从而使管体31内部的晶圆在转动的水中进行清理处理,将表面的灰尘和杂质分离,当管体31转动180度之后,通过出水组件7将混有杂质的污水进行导出,同时开启管盖32将内部清理完成的晶圆取出,同时另一侧放入需要清理的晶圆,本发明通过转动的方式进行晶圆的清理,保证了晶圆的清理,同时可以同步对晶圆的放入和取出进行操作,方便了晶圆的放取,提高了清理的速率。
本实施例中优选的技术方案,夹持板42远离安装块41的一侧设置弧形,且夹持板42侧壁开设有多个夹槽,夹持板42由弹性材质制成,通过两侧向中间移动的夹持板42对放置在放置组件5上的晶圆进行夹持固定,通过夹槽对晶圆的侧边进行固定,同时由于夹持板42为弹性,可以对不同直径的晶圆进行夹持作用,方便了不同规格的晶圆的清洗;
放置组件5包括伸缩杆51和置晶板52,伸缩杆51垂直固定连接在两个相邻夹持固定组件4中间,伸缩杆51受到电机控制,在数据调控下进行上下收缩,置晶板52为圆形薄板,且固定连接在伸缩杆51顶端,置晶板52的直径要小于一般的晶圆直径,且两个相对夹持板42之间的间距大于晶圆直径,使晶圆相对限位放置在置晶板52上,当需要进行清理时,放置在置晶板52上的晶圆从两侧被夹持板42固定,这时伸缩杆51带动置晶板52向下移动,与晶圆分离,使晶圆在清洗时可以上下面受到均匀的清洗;
调节组件8包括液管81、压杆82和滑动杆83,液管81开设在安装块41内部,且为倒T形,液管81内部填充有液体,压杆82一端与管盖32内壁固定连接,且另一端密封滑动在液管81竖直端,两个滑动杆83一端密封滑动在液管81的两侧水平端内部,且另一端与夹持板42侧侧边固定连接,通过管盖32的转动,从而带动压杆82进行上下移动,当管盖32闭合时,压杆82在液管81内部移动,从而将两侧的滑动杆83向外推动,带动夹持板42移动,对晶圆进行夹持,当管盖32上移时,压杆82上移,由于液压作用,带动两个滑动杆83向内移动,从而将固定的晶圆松开;
进水组件6包括水箱61、进水接口62和进水管63,水箱61固定连接在一侧支撑架2上,进水管63固定连通在水箱61上,进水接口62固定安装在管体31靠近水箱61的一侧,且进水接口62保持正向水平时,与进水管63连接,通过水泵将水箱61内部的的水从进水管63导入导进水接口62内部,当管体31保持正向水平向上时,进水管63进行移动于进水接口62进行连接,将水导入管体31内部;
出水组件7包括出水管71、污水处理箱72和出水接口73,污水处理箱72固定安装在支撑远离进水组件6的支撑架2外侧,出水管71与污水处理箱72连通,多个出水接口73固定连通在管体31底部,且保持正向水平时,与出水管71连通,当经过转动清洗过后,反向水平的管体31上的出水接口73与出水管71进行接触连接,通过污水处理箱72内部的抽水泵将管体31内部的污水进行抽取导出,从而实现污水的清理,再循环利用;
管体31和管盖32之间设置有密封闭合组件9,密封闭合组件9包括密封条91、卡槽92和连接条93,密封条91固定连接在管盖32内壁,连接条93固定连接在管盖32外侧,卡槽92固定连接在卡槽92侧边,连接条93卡设在卡槽92内部,由于管体31会随着转动柱1进行转动处理,为了保证管体31内部的水不会渗出,通过密封闭合组件9加强管体31和管盖32的密封性,通过密封条91加强管体31和管盖32的练级,在通过卡槽92年内部的电动卡锁对移动到卡槽92内部的连接条93进行卡死,从而保证了管体31和管盖32的密封连接性;
压杆82始终位于液管81内部的底端部分由硬性材质制成,且与管盖32连接,发生弯曲的部分由弹性材质制成,由于压杆82的上部分会随着管盖32进行偏移,需要压杆82的上部分具有弯曲弹性,从而实现调节组件8的正常使用;
出水管71与进水管63分别位于转动柱1两侧,用于两侧管体31同时进行进水和出水处理,当一个管体31保持水平时,另一侧管体31也保持水平,从而可以对两侧的管体31同时进行输水和出水作用,对两侧的晶圆进行放置和取出。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (9)
1.一种半导体晶圆循环清洗装置,其特征在于,包括:
转动柱(1),所述转动柱(1)两侧固定连接有用于支撑的支撑架(2);
清洗管组件(3),多个所述清洗管组件(3)等距环状固定连接在转动柱(1)侧边,所述清洗管组件(3)包括用于放置多个晶圆的管体(31)和管盖(32),所述管体(31)一侧设置为开口,且远离开口的一侧管内壁为平面,所述管盖(32)一侧与开口靠近转动柱(1)的一侧转动连接;
夹持固定组件(4),所述夹持固定组件(4)包括安装块(41)和夹持板(42),多个所述安装块(41)等距固定安装在管体(31)内部,两个所述夹持板(42)位于安装块(41)两侧,且通过调节组件(8)与管盖(32)连接,两个相邻所述安装块(41)上相对的一组夹持板(42)用于固定晶圆;
放置组件(5),所述放置组件(5)固定安装在两个相邻夹持固定组件(4)之间,用于放置晶圆;
循环水机构,所述循环水组件包括进水组件(6)和出水组件(7),用于将水在管体(31)内部进行导入和导出。
2.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述夹持板(42)远离安装块(41)的一侧设置弧形,且夹持板(42)侧壁开设有多个夹槽,所述夹持板(42)由弹性材质制成。
3.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述放置组件(5)包括伸缩杆(51)和置晶板(52),所述伸缩杆(51)垂直固定连接在两个相邻夹持固定组件(4)中间,所述置晶板(52)为圆形薄板,且固定连接在伸缩杆(51)顶端。
4.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述调节组件(8)包括液管(81)、压杆(82)和滑动杆(83),所述液管(81)开设在安装块(41)内部,且为倒T形,所述压杆(82)一端与管盖(32)内壁固定连接,且另一端密封滑动在液管(81)竖直端,两个所述滑动杆(83)一端密封滑动在液管(81)的两侧水平端内部,且另一端与夹持板(42)侧侧边固定连接。
5.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述进水组件(6)包括水箱(61)、进水接口(62)和进水管(63),所述水箱(61)固定连接在一侧支撑架(2)上,所述进水管(63)固定连通在水箱(61)上,所述进水接口(62)固定安装在管体(31)靠近水箱(61)的一侧,且进水接口(62)保持正向水平时,与进水管(63)连接。
6.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述出水组件(7)包括出水管(71)、污水处理箱(72)和出水接口(73),所述污水处理箱(72)固定安装在支撑远离进水组件(6)的支撑架(2)外侧,所述出水管(71)与污水处理箱(72)连通,多个所述出水接口(73)固定连通在管体(31)底部,且保持正向水平时,与出水管(71)连通。
7.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述管体(31)和管盖(32)之间设置有密封闭合组件(9),所述密封闭合组件(9)包括密封条(91)、卡槽(92)和连接条(93),所述密封条(91)固定连接在管盖(32)内壁,所述连接条(93)固定连接在管盖(32)外侧,所述卡槽(92)固定连接在卡槽(92)侧边,所述连接条(93)卡设在卡槽(92)内部。
8.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述压杆(82)始终位于液管(81)内部的底端部分由硬性材质制成,且与管盖(32)连接,发生弯曲的部分由弹性材质制成。
9.根据权利要求1所述的一种半导体晶圆循环清洗装置,其特征在于,所述出水管(71)与进水管(63)分别位于转动柱(1)两侧,用于两侧管体(31)同时进行进水和出水处理。
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CN116741666B (zh) * | 2023-06-01 | 2024-03-01 | 浙江精瓷半导体有限责任公司 | 用于半导体铜制程的水相清洗设备及组合物 |
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