CN114012542A - Automatic chamfering device suitable for monocrystalline silicon piece - Google Patents
Automatic chamfering device suitable for monocrystalline silicon piece Download PDFInfo
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- CN114012542A CN114012542A CN202111394356.4A CN202111394356A CN114012542A CN 114012542 A CN114012542 A CN 114012542A CN 202111394356 A CN202111394356 A CN 202111394356A CN 114012542 A CN114012542 A CN 114012542A
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- bottom plate
- rod
- silicon wafers
- top plate
- automatic chamfering
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 235000012431 wafers Nutrition 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract description 15
- 244000309464 bull Species 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052710 silicon Inorganic materials 0.000 abstract description 27
- 239000010703 silicon Substances 0.000 abstract description 27
- 230000009471 action Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 230000002457 bidirectional effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 229910001651 emery Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/003—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to the field of silicon wafer processing, and discloses an automatic chamfering device suitable for monocrystalline silicon wafers, which comprises a bottom plate, wherein four corners of the top end of the bottom plate are respectively provided with a telescopic supporting rod, the top ends of a plurality of supporting rods are jointly fixed with a top plate, a sliding groove is formed in the center of the top plate in a penetrating mode along the length direction of the top plate, two sliding blocks penetrating through the sliding grooves are symmetrically arranged in the sliding grooves, the bottom end of each sliding block is connected with an installation block positioned below the top plate, a clamping bearing is arranged on the inner side of each installation block, the outer side of the inner ring of each clamping bearing extends out of the corresponding installation block, and a second driving mechanism used for driving the two sliding blocks to slide along the sliding grooves in opposite directions is arranged on the top plate. The inner rings of the two clamping bearings are provided with one side close to each other and positioned outside the corresponding mounting block, namely the inner rings of the two bearings extend out, and the silicon wafers are clamped and fixed through the inner rings of the two bearings, so that the silicon wafers are fixed and can rotate relatively.
Description
Technical Field
The invention belongs to the field of silicon wafer processing, and particularly relates to an automatic chamfering device suitable for a monocrystalline silicon wafer.
Background
The manufacture of silicon wafers comprises a series of production processes, such as silicon rod slicing, grinding, polishing and the like, wherein after the silicon wafers are ground, the silicon wafers with edges and corners are ground into round shapes because the four corners of the silicon wafers have edges and corners, and the process is called chamfering.
In the modern chamfering process, a silicon wafer is fixed through a sucker, the other end of the sucker is connected with a rotating rod, the rotating rod is in transmission connection with a rotating mechanism, and then the rotating silicon wafer is chamfered through a grinding wheel until the silicon wafer becomes circular. In the process, although the silicon wafer is light in weight and can be adsorbed by the sucker, the silicon wafer also rotates in the chamfering process by using the grinding wheel, the rotation generates the action of centrifugal force, and the centrifugal force can possibly cause the separation of the silicon wafer from the sucker.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an automatic chamfering device suitable for monocrystalline silicon wafers, which comprises a bottom plate, wherein two upright posts are symmetrically arranged at the center position of the top end of the bottom plate, each upright post is rotatably connected with a rotating rod, a grinding wheel positioned at the center position between the two upright posts is fixed on the outer peripheral sides of the two rotating rods, and a first driving mechanism used for driving the rotating rods to rotate is arranged on one of the upright posts; telescopic branch is all installed in the top four corners of bottom plate, and is a plurality of the top of branch is fixed with a roof altogether, the central point of roof puts and runs through the spout of seting up along its length direction, the spout internal symmetry is provided with two sliders that run through it, every the bottom of slider all is connected with the installation piece that is located the roof below, every the centre gripping bearing is all installed to the inboard of installation piece, every the outside of the inner circle of centre gripping bearing all extends to outside the installation piece that corresponds, be provided with on the roof and be used for driving two sliders and carry out gliding second actuating mechanism to opposite direction along the spout simultaneously.
Furthermore, one of them bull stick runs through the outside that extends to the pole setting that corresponds, first actuating mechanism is including installing the motor in one of them pole setting, the output shaft of motor and the periphery side of the bull stick that corresponds all fix the cup joint and be located the pole setting that corresponds outside and intermeshing's gear.
Furthermore, the second driving mechanism comprises two bearing seats which are arranged on the top end of the top plate and are symmetrical about the sliding groove, two lead screws which are respectively in threaded penetration with the two sliding blocks and are bidirectional are connected to the bearing seats in a penetrating and rotating mode, rotating handles are arranged at two ends of each lead screw, and a guide mechanism used for limiting the moving direction of the sliding blocks is arranged on the top plate.
Further, guiding mechanism includes symmetrical connection and just is located two outer fishplates on roof top in the side around every slider, is located two with one side the activity through connection altogether has a guide bar on the outer fishplate bar, every the both ends of guide bar all are connected with the mount pad of fixing on the roof top.
Furthermore, every branch all includes the loop bar fixed with the bottom plate top, every the top of loop bar is all the activity is pegged graft have with roof bottom mounting's connecting rod, be provided with the elevating system who is used for adjusting the connecting rod height on the bottom plate.
Further, elevating system includes that the symmetry is installed at two electric putter one on the bottom plate top, every electric putter one's stiff end all is connected with the bottom plate, and every electric putter one's flexible end all is connected with the roof.
Further, the emery wheel is including running through the through-hole of seting up in its central point, the diameter of through-hole equals the diameter of bull stick, every the periphery side of bull stick all fixed cover has a diameter to be greater than its chuck, two distance between the chuck equals the degree of depth of through-hole, two be provided with the fixed establishment who is used for making emery wheel and bull stick fixed between the pole setting, the shifting chute along its length direction is seted up in the position of keeping away from first actuating mechanism in the top of bottom plate, keep away from first actuating mechanism the pole setting passes through shifting chute and bottom plate block sliding connection, be provided with on the bottom plate and be used for driving this pole setting and carry out gliding third actuating mechanism along the shifting chute.
Furthermore, the fixing mechanism comprises a plurality of uniformly distributed first connecting holes which are respectively penetrated through and arranged on each chuck, a plurality of second connecting holes which correspond to the first connecting holes are penetrated through and arranged on the grinding wheel, and a plurality of bolts which sequentially penetrate through the corresponding first connecting holes and the corresponding second connecting holes are connected between the two chucks.
Furthermore, the third driving mechanism comprises a moving block which is fixed at the bottom end of the vertical rod far away from the first driving mechanism and is in clamping sliding connection with the moving groove, the top end of the bottom plate is connected with an installation frame, and a second electric push rod parallel to the moving groove is installed between the installation frame and the corresponding vertical rod.
Compared with the prior art, the invention has the beneficial effects that:
1. in the silicon wafer chamfering machine, one side, close to each other, of each inner ring of each clamping bearing is positioned outside the corresponding mounting block, namely the inner rings of the two clamping bearings extend out, and a silicon wafer is clamped and fixed through the inner rings of the two clamping bearings, so that the silicon wafer is fixed in the horizontal direction and can rotate in the vertical direction, and under the action of the first driving mechanism, the rotating rod drives the grinding wheel to rotate, and then chamfering can be carried out on the silicon wafer.
2. In the invention, the grinding wheel is fixed on the two rotating rods through the action of the fixing mechanism, so that the grinding wheel and the two rotating rods form a rotatable whole, and meanwhile, the vertical rod far away from the first driving mechanism can slide along the moving groove, so that the grinding wheel can be taken down from one rotating rod after the grinding wheel and the rotating rods are accidentally loosened, and thus, the grinding wheels with the same type and different meshes can be replaced to perform more detailed chamfering on the silicon wafer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a partially exploded view of the present invention;
FIG. 4 is an enlarged view of the structure at A of the present invention;
FIG. 5 is a schematic top view of the present invention;
in the figure: 1. a base plate; 2. erecting a rod; 3. a rotating rod; 4. a grinding wheel; 5. a first drive mechanism; 501. a motor; 502. a gear; 6. a strut; 601. a loop bar; 602. a connecting rod; 7. a top plate; 8. a chute; 9. a slider; 10. mounting blocks; 11. clamping the bearing; 12. a second drive mechanism; 1201. a bearing seat; 1202. a screw rod; 1203. turning a handle; 13. a guide mechanism; 1301. an outer connecting plate; 1302. a guide bar; 1303. a mounting seat; 14. a lifting mechanism; 1401. an electric push rod I; 15. a through hole; 16. a chuck; 17. a fixing mechanism; 1701. a first connecting hole; 1702. a second connecting hole; 1703. a bolt; 18. a moving groove; 19. a third drive mechanism; 1901. a moving block; 1902. a mounting frame; 1903. and a second electric push rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1, the automatic chamfering device for a single crystal silicon wafer according to the present embodiment includes a base plate 1:
on one hand, two upright posts 2 are symmetrically arranged at the center position of the top end of the bottom plate 1, each upright post 2 is rotatably connected with a rotating rod 3, a grinding wheel 4 positioned at the center position between the two upright posts 2 is fixed on the outer peripheral sides of the two rotating rods 3, namely the grinding wheel 4 and the two rotating rods 3 form a rotatable whole, in addition, a first driving mechanism 5 for driving the rotating rods 3 to rotate is arranged on one upright post 2, and the grinding wheel 4 can be driven to rotate under the action of the first driving mechanism 5;
on the other hand, four corners of the top end of the bottom plate 1 are all provided with the telescopic supporting rods 6, a top plate 7 is fixed at the top ends of the plurality of supporting rods 6, a sliding groove 8 along the length direction of the top plate 7 penetrates through the center position of the top plate 7, two sliding blocks 9 penetrating through the sliding groove 8 are symmetrically arranged in the sliding groove 8, a mounting block 10 positioned below the top plate 7 is connected to the bottom end of each sliding block 9, a clamping bearing 11 is arranged on the inner side of each mounting block 10, the outer side of the inner ring of each clamping bearing 11 extends to the outside of the corresponding mounting block 10, in addition, a second driving mechanism 12 for driving the two sliding blocks 9 to slide along the sliding groove 8 in the opposite direction is arranged on the top plate 7, under the arrangement, one side of the inner rings of the two clamping bearings 11, which is close to each other, is positioned outside the corresponding mounting block 10, namely the inner rings of the two clamping bearings 11 extend out, under the action of the second driving mechanism 12, make two sliders 9 drive installation piece 10 and slide to opposite direction, can be fixed with the silicon chip block through the inner circle of two centre gripping bearings 11, like this, the silicon chip is fixed on the horizontal direction, and can rotate again in vertical direction, so, under the mating reaction of first actuating mechanism 5 and telescopic branch 6, make bull stick 3 drive emery wheel 4 and rotate and can carry out the chamfer to the silicon chip.
As shown in fig. 3, one of the rotating rods 3 extends through to the outside of the corresponding vertical rod 2, the first driving mechanism 5 includes a motor 501 installed on one of the vertical rods 2, and here, the output shaft of the motor 501 and the outer peripheral side of the corresponding rotating rod 3 are both fixedly sleeved with a gear 502 which is located outside the corresponding vertical rod 2 and is meshed with each other, so that, under the action of the motor 502, the whole formed by the two rotating rods 3 and the grinding wheel 4 can be driven to rotate by the two gears 502 which are meshed with each other.
The second driving mechanism 12 is specifically configured as shown in fig. 2, the second driving mechanism 12 includes two bearing seats 1201 installed at the top end of the top plate 7 and symmetrical about the sliding chute 8, two bearing seats 1201 are connected to each other in a penetrating manner and are threaded with two sliders 9, respectively, and are provided with a bidirectional screw 1202, the two sliders 9 are connected to the bidirectional screw 1202 in a threaded manner in opposite directions, and at the same time, rotating handles 1203 are installed at both ends of the screw 1202, so that the two sliders 9 can slide in opposite directions simultaneously by rotating the bidirectional screw 1202, and in addition, in order to maintain stability of the sliders 9 during sliding, a guide mechanism 13 for limiting the moving direction of the sliders 9 is further provided on the top plate 7, as shown in fig. 5, the guide mechanism 13 includes two external plates 1301 symmetrically connected to the front and rear sides of each slider 9 and located at the top end of the top plate 7, a guide rod 1302 is movably connected to the two outer connecting plates 1301 on the same side in a penetrating manner, and moreover, mounting seats 1303 fixed to the top end of the top plate 7 are connected to two ends of each guide rod 1302.
The telescopic reason of the supporting rods 6 is as shown in fig. 1, each supporting rod 6 comprises a sleeve rod 601 fixed to the top end of the bottom plate 1, a connecting rod 602 fixed to the bottom end of the top plate 7 is movably inserted into the top end of each sleeve rod 601, and the connecting rod 602 is movably inserted into the bottom end of the top plate 1, so that a lifting mechanism 14 used for adjusting the height of the connecting rod 602 is further arranged on the bottom plate 1, as shown in fig. 1, the lifting mechanism 14 comprises two electric push rods 1401 symmetrically installed on the top end of the bottom plate 1, the fixed end of each electric push rod 1401 is connected with the bottom plate 1, and the telescopic end of each electric push rod 1401 is connected with the top plate 7.
Example two:
as shown in fig. 1, the automatic chamfering device for a single crystal silicon wafer according to the present embodiment includes a base plate 1:
on one hand, two upright posts 2 are symmetrically arranged at the center position of the top end of the bottom plate 1, each upright post 2 is rotatably connected with a rotating rod 3, a grinding wheel 4 positioned at the center position between the two upright posts 2 is fixed on the outer peripheral sides of the two rotating rods 3, namely the grinding wheel 4 and the two rotating rods 3 form a rotatable whole, in addition, a first driving mechanism 5 for driving the rotating rods 3 to rotate is arranged on one upright post 2, and the grinding wheel 4 can be driven to rotate under the action of the first driving mechanism 5;
on the other hand, four corners of the top end of the bottom plate 1 are all provided with the telescopic supporting rods 6, a top plate 7 is fixed at the top ends of the plurality of supporting rods 6, a sliding groove 8 along the length direction of the top plate 7 penetrates through the center position of the top plate 7, two sliding blocks 9 penetrating through the sliding groove 8 are symmetrically arranged in the sliding groove 8, a mounting block 10 positioned below the top plate 7 is connected to the bottom end of each sliding block 9, a clamping bearing 11 is arranged on the inner side of each mounting block 10, the outer side of the inner ring of each clamping bearing 11 extends to the outside of the corresponding mounting block 10, in addition, a second driving mechanism 12 for driving the two sliding blocks 9 to slide along the sliding groove 8 in the opposite direction is arranged on the top plate 7, under the arrangement, one side of the inner rings of the two clamping bearings 11, which is close to each other, is positioned outside the corresponding mounting block 10, namely the inner rings of the two clamping bearings 11 extend out, under the action of the second driving mechanism 12, make two sliders 9 drive installation piece 10 and slide to opposite direction, can be fixed with the silicon chip block through the inner circle of two centre gripping bearings 11, like this, the silicon chip is fixed on the horizontal direction, and can rotate again in vertical direction, so, under the mating reaction of first actuating mechanism 5 and telescopic branch 6, make bull stick 3 drive emery wheel 4 and rotate and can carry out the chamfer to the silicon chip.
As shown in fig. 3, one of the rotating rods 3 extends through to the outside of the corresponding vertical rod 2, the first driving mechanism 5 includes a motor 501 installed on one of the vertical rods 2, and here, the output shaft of the motor 501 and the outer peripheral side of the corresponding rotating rod 3 are both fixedly sleeved with a gear 502 which is located outside the corresponding vertical rod 2 and is meshed with each other, so that, under the action of the motor 502, the whole formed by the two rotating rods 3 and the grinding wheel 4 can be driven to rotate by the two gears 502 which are meshed with each other.
The second driving mechanism 12 is specifically configured as shown in fig. 2, the second driving mechanism 12 includes two bearing seats 1201 installed at the top end of the top plate 7 and symmetrical about the sliding chute 8, two bearing seats 1201 are connected to each other in a penetrating manner and are threaded with two sliders 9, respectively, and are provided with a bidirectional screw 1202, the two sliders 9 are connected to the bidirectional screw 1202 in a threaded manner in opposite directions, and at the same time, rotating handles 1203 are installed at both ends of the screw 1202, so that the two sliders 9 can slide in opposite directions simultaneously by rotating the bidirectional screw 1202, and in addition, in order to maintain stability of the sliders 9 during sliding, a guide mechanism 13 for limiting the moving direction of the sliders 9 is further provided on the top plate 7, as shown in fig. 5, the guide mechanism 13 includes two external plates 1301 symmetrically connected to the front and rear sides of each slider 9 and located at the top end of the top plate 7, a guide rod 1302 is movably connected to the two outer connecting plates 1301 on the same side in a penetrating manner, and moreover, mounting seats 1303 fixed to the top end of the top plate 7 are connected to two ends of each guide rod 1302.
The telescopic reason of the supporting rods 6 is as shown in fig. 1, each supporting rod 6 comprises a sleeve rod 601 fixed to the top end of the bottom plate 1, a connecting rod 602 fixed to the bottom end of the top plate 7 is movably inserted into the top end of each sleeve rod 601, and the connecting rod 602 is movably inserted into the bottom end of the top plate 1, so that a lifting mechanism 14 used for adjusting the height of the connecting rod 602 is further arranged on the bottom plate 1, as shown in fig. 1, the lifting mechanism 14 comprises two electric push rods 1401 symmetrically installed on the top end of the bottom plate 1, the fixed end of each electric push rod 1401 is connected with the bottom plate 1, and the telescopic end of each electric push rod 1401 is connected with the top plate 7.
As shown in fig. 3, the grinding wheel 4 includes a through hole 15 penetrating through the center of the grinding wheel 4, the diameter of the through hole 15 is equal to the diameter of the rotary rod 3, a chuck 16 with a diameter larger than that of the rotary rod 3 is fixedly sleeved on the outer periphery of each rotary rod 3, the distance between the two chucks 16 is equal to the depth of the through hole 15, so that when the grinding wheel 4 is sleeved on the two rotary rods 3, the inner sides of the two chucks 16 are attached to the grinding wheel 4, and furthermore, a fixing mechanism 17 for fixing the grinding wheel 4 and the rotary rod 3 is further provided between the two upright rods 2, as shown in fig. 4, the fixing mechanism 17 includes a plurality of uniformly distributed connecting holes 1701 penetrating through the chucks 16 respectively, and simultaneously, a plurality of connecting holes di 1702 corresponding to the connecting holes first 1701 are penetrated through the grinding wheel 4, and a plurality of bolts 1703 sequentially penetrating through the corresponding connecting holes first 1701 and the connecting holes di 1702 are connected between the two chucks 16, in addition, a moving groove 18 along the length direction is arranged at the position far away from the first driving mechanism 5 at the top end of the bottom plate 1, the vertical rod 2 far away from the first driving mechanism 5 is connected with the bottom plate 1 in a clamping and sliding manner through the moving groove 18, a third driving mechanism 19 for driving the vertical rod 2 to slide along the moving groove 18 is further arranged on the bottom plate 1, the third driving mechanism 19 comprises a moving block 1901 which is fixed at the bottom end of the vertical rod 2 far away from the first driving mechanism 5 and connected with the moving groove 18 in a clamping and sliding manner, an installation frame 1902 is connected with the top end of the bottom plate 1, a second electric push rod 1903 parallel to the moving groove 18 is arranged between the installation frame 1902 and the corresponding vertical rod 2, the grinding wheel 4 is fixed on the two rotating rods 3 through the action of a fixing mechanism 17, so that the grinding wheel 4 and the two rotating rods 3 form a rotatable whole, and at the same time, the vertical rod 2 far away from the first driving mechanism 5 can slide along the moving groove 18, this means that the grinding wheel 4 can be removed from one of the rotating rods 3 after the grinding wheel 4 is released from the rotating rods 3, so that the silicon wafer can be chamfered more finely by replacing the grinding wheels 4 of the same type and different meshes.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. An automatic chamfering device suitable for monocrystalline silicon wafers comprises a bottom plate (1) and is characterized in that:
two upright posts (2) are symmetrically arranged at the center of the top end of the bottom plate (1), each upright post (2) is rotatably connected with a rotating rod (3), a grinding wheel (4) positioned at the center between the two upright posts (2) is fixed on the outer peripheral sides of the two rotating rods (3), and a first driving mechanism (5) for driving the rotating rods (3) to rotate is arranged on one upright post (2);
telescopic branch (6) are all installed in the top four corners of bottom plate (1), and are a plurality of the top of branch (6) is fixed with a roof (7) altogether, the central point of roof (7) puts and runs through spout (8) of seting up along its length direction, spout (8) internal symmetry is provided with two slider (9) that run through it, every the bottom of slider (9) all is connected with installation piece (10) that are located roof (7) below, every centre gripping bearing (11), every are all installed to the inboard of installation piece (10) the outside of the inner circle of centre gripping bearing (11) all extends outside corresponding installation piece (10), be provided with on roof (7) and be used for driving two slider (9) and carry out gliding second actuating mechanism (12) along spout (8) to opposite direction simultaneously.
2. The automatic chamfering apparatus for single crystal silicon wafers according to claim 1, wherein: one of them bull stick (3) run through the outside that extends to corresponding pole setting (2), first actuating mechanism (5) are including installing motor (501) on one of them pole setting (2), the output shaft of motor (501) and the periphery side of corresponding bull stick (3) all fix the cover and be located outside corresponding pole setting (2) and intermeshing's gear (502).
3. The automatic chamfering apparatus for single crystal silicon wafers according to claim 1, wherein: the second driving mechanism (12) comprises two bearing seats (1201) which are arranged on the top end of the top plate (7) and are symmetrical about a sliding groove (8), the two bearing seats (1201) are connected with a two-way screw rod (1202) which is respectively in threaded penetration with the two sliding blocks (9) in a penetrating and rotating mode, rotating handles (1203) are arranged at two ends of the screw rod (1202), and a guide mechanism (13) used for limiting the moving direction of the sliding blocks (9) is arranged on the top plate (7).
4. The automatic chamfering apparatus for single crystal silicon wafers according to claim 3, wherein: the guide mechanism (13) comprises two outer connecting plates (1301) which are symmetrically connected to the front side and the rear side of each sliding block (9) and located at the top end of the top plate (7), two outer connecting plates (1301) located on the same side are connected with a guide rod (1302) in a penetrating mode in a co-moving mode, and two ends of each guide rod (1302) are connected with a mounting seat (1303) fixed to the top end of the top plate (7).
5. The automatic chamfering apparatus for single crystal silicon wafers according to claim 1, wherein: every branch (6) all include with fixed loop bar (601) in bottom plate (1) top, every the top of loop bar (601) all activity is pegged graft have with roof (7) bottom mounting's connecting rod (602), be provided with on bottom plate (1) and be used for adjusting elevating system (14) of connecting rod (602) height.
6. The automatic chamfering apparatus for single crystal silicon wafers according to claim 5, wherein: the lifting mechanism (14) comprises two electric push rods (1401) symmetrically arranged at the top end of the bottom plate (1), the fixed end of each electric push rod (1401) is connected with the bottom plate (1), and the telescopic end of each electric push rod (1401) is connected with the top plate (7).
7. The automatic chamfering apparatus for single crystal silicon wafers according to claim 1, wherein: the grinding wheel (4) comprises a through hole (15) penetrating through the center of the grinding wheel, the diameter of the through hole (15) is equal to that of the rotating rod (3), a chuck (16) with the diameter larger than that of the rotating rod is fixedly sleeved on the outer peripheral side of each rotating rod (3), the distance between the two chucks (16) is equal to the depth of the through hole (15), a fixing mechanism (17) used for fixing the grinding wheel (4) and the rotating rod (3) is arranged between the two upright rods (2), the top end of the bottom plate (1) is provided with a moving groove (18) along the length direction at the position far away from the first driving mechanism (5), the upright rod (2) far away from the first driving mechanism (5) is clamped and connected with the bottom plate (1) in a sliding way through the moving groove (18), and a third driving mechanism (19) for driving the upright rod (2) to slide along the moving groove (18) is arranged on the bottom plate (1).
8. The automatic chamfering apparatus for single crystal silicon wafers according to claim 7, wherein: the fixing mechanism (17) comprises a plurality of uniformly distributed first connecting holes (1701) which are respectively penetrated and opened on each chuck (16), a plurality of second connecting holes (1702) corresponding to the first connecting holes (1701) are penetrated and opened on the grinding wheel (4), and a plurality of bolts (1703) which sequentially penetrate through the corresponding first connecting holes (1701) and the second connecting holes (1702) are connected between the two chucks (16).
9. The automatic chamfering apparatus for single crystal silicon wafers according to claim 7, wherein: third actuating mechanism (19) including fix keep away from first actuating mechanism (5) pole setting (2) bottom and with shifting chute (18) block sliding connection's movable block (1901), the top of bottom plate (1) is connected with mounting bracket (1902), install between mounting bracket (1902) and the pole setting (2) that corresponds and move groove (18) parallel electric putter two (1903).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111394356.4A CN114012542A (en) | 2021-11-21 | 2021-11-21 | Automatic chamfering device suitable for monocrystalline silicon piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111394356.4A CN114012542A (en) | 2021-11-21 | 2021-11-21 | Automatic chamfering device suitable for monocrystalline silicon piece |
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| CN114012542A true CN114012542A (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111394356.4A Pending CN114012542A (en) | 2021-11-21 | 2021-11-21 | Automatic chamfering device suitable for monocrystalline silicon piece |
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Cited By (1)
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| CN113681368A (en) * | 2021-08-23 | 2021-11-23 | 安徽安吉特轨道交通科技有限公司 | Automatic calibration device suitable for rail vehicle wheel |
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Application publication date: 20220208 |