CN221249418U - Semiconductor wafer cutting equipment - Google Patents
Semiconductor wafer cutting equipment Download PDFInfo
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- CN221249418U CN221249418U CN202323080346.0U CN202323080346U CN221249418U CN 221249418 U CN221249418 U CN 221249418U CN 202323080346 U CN202323080346 U CN 202323080346U CN 221249418 U CN221249418 U CN 221249418U
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- semiconductor wafer
- supporting box
- cutting platform
- cutting
- movable
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 230000000694 effects Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 11
- 230000000087 stabilizing effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses semiconductor wafer cutting equipment which comprises a supporting box, wherein an installation frame is fixedly installed on the outer side wall of the supporting box, a cutter main body is fixedly installed on the inner top end of the installation frame, a cutting platform is movably arranged on the top end of the supporting box, a movable supporting component is arranged between the top end of the supporting box and the bottom end of the cutting platform, a semiconductor wafer is arranged on the top end of the cutting platform, a clamping component for stabilizing and positioning the semiconductor wafer is arranged between the installation frames, a driving component for driving the cutting platform to rotate is arranged in the supporting box, and a control panel is fixedly installed on the outer side wall of the installation frame. The movable supporting component is arranged, so that the stability of the cutting platform is ensured while the support of the cutting platform is realized, and the clamping component is arranged, so that the rubber pad is attached to the outer side wall of the semiconductor wafer, the clamping of the semiconductor wafer is realized, and the stability of the device during the cutting of the semiconductor wafer is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to semiconductor wafer cutting equipment.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. Domestic wafer lines are mainly 8 inches and 12 inches.
Application number: CN202221221909.6 discloses a silicon wafer cutting device for processing semiconductor wafers, comprising a machine body, wherein two groups of first collecting discs and two groups of second collecting discs are wound with steel wire ropes, and the side parts and the bottom parts of the mounting brackets are fixedly provided with first illuminating lamps; through the setting of first collection dish and fixed block, through hand wheel, bull stick, first collection dish, second collection dish, sprocket, chain, wire rope and fixed block cooperation, accessible wire rope drives first light and removes with the fixed block to can accomplish the regulation to first light position.
However, the above-mentioned apparatus is used without considering the positioning at the time of placing the semiconductor wafer and also without considering the rotation of the semiconductor wafer, so that the movement of the apparatus is easily caused at the time of dicing, and therefore, there is a need for a semiconductor wafer dicing apparatus.
Disclosure of utility model
The utility model aims to solve the defects in the prior art and provides a semiconductor wafer cutting device.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The utility model provides a semiconductor wafer cutting equipment, includes supporting box 1, supporting box 1 lateral wall fixed mounting has mounting bracket 2, top fixed mounting has cutting machine main part 3 in the mounting bracket 2, supporting box 1 top activity is provided with cutting platform 4, be provided with movable supporting component 5 between supporting box 1 top and the cutting platform 4 bottom, cutting platform 4 top is provided with semiconductor wafer 6, be provided with firm, the clamping component 7 of location semiconductor wafer 6 between the mounting bracket 2, be provided with drive cutting platform 4 pivoted actuating component 8 in the supporting box 1, 2 lateral wall fixed mounting of mounting bracket has control panel 9.
Preferably, the movable supporting component 5 comprises a fixed block 51 fixedly installed at the bottom end of the cutting platform 4, a first movable groove 52 is formed at the bottom end of the fixed block 51, a first rotating ball 53 is movably installed in the first movable groove 52, and the first rotating ball 53 is attached to the top end of the supporting box 1;
The top end of the supporting box 1 is fixedly provided with an annular track 54, a plurality of supporting columns 55 are movably arranged in the annular track 54, one ends of the supporting columns 55 are fixedly arranged at the bottom end of the cutting platform 4, the other ends of the supporting columns 55 are provided with second movable grooves 56, second rotating balls 57 are movably arranged in the second movable grooves 56, and the second rotating balls 57 are attached to the inner bottom end of the annular track 54;
The rotary ball support device is used for conveniently rotating the cutting platform 4, when the cutting platform 4 rotates, the first rotary ball 53 in the first movable groove 52 rotates at the top end of the support box 1, so that the support of the cutting platform 4 is realized, meanwhile, the support column 55 rotates in the annular track 54 along with the rotation of the cutting platform 4, the second rotary ball 57 in the second movable groove 56 rotates in the annular track 54, and the stability of the cutting platform 4 is further ensured while the cutting platform 4 is supported.
Preferably, the clamping assembly 7 comprises a threaded rod 71 rotatably installed between the installation frames 2, a limiting rod 72 is fixedly installed between the installation frames 2, reverse threads are arranged at two ends of the threaded rod 71, screw nuts 73 are symmetrically sleeved at two ends of the threaded rod 71, the screw nuts 73 are slidably sleeved on the limiting rod 72, and a forward and reverse rotation motor 77 with an output shaft coaxially and fixedly connected with the threaded rod 71 is fixedly installed on the outer side wall of the installation frame 2;
A connecting rod 74 is fixedly arranged on one side, close to the semiconductor wafer 6, of the lead screw nut 73, a clamping block 75 is fixedly arranged on the other end of the connecting rod 74, an arc-shaped surface is arranged on one side, close to the semiconductor wafer 6, of the clamping block 75, and a rubber pad 76 is fixedly arranged on one side, close to the semiconductor wafer 6, of the clamping block 75;
The clamping device is used for clamping the semiconductor wafer 6, the forward and backward motor 77 drives the threaded rod 71 to rotate and drives the lead screw nut 73 to move in opposite directions, the lead screw nut 73 drives the connecting rod 74 to drive the clamping block 75 to move, the rubber pad 76 is attached to the outer side wall of the semiconductor wafer 6, the clamping of the semiconductor wafer 6 is achieved, and the stability of the device during cutting of the semiconductor wafer 6 is guaranteed.
Preferably, the driving assembly 8 comprises a rotating shaft 81 fixedly installed at the center of the bottom end of the cutting platform 4, the rotating shaft 81 movably penetrates into the supporting box 1, a low-speed motor 82 is fixedly installed at the bottom end of the supporting box 1, and an output shaft of the low-speed motor 82 is fixedly connected with the rotating shaft 81 coaxially;
The cutting machine is used for driving the cutting platform 4 to rotate so as to drive the semiconductor wafer 6 to rotate, and can realize cutting of different positions of the semiconductor wafer 6 by the cutting machine body 3.
The utility model has the following beneficial effects:
1. Through setting up movable support assembly, the first ball that rotates in the first movable groove rotates on the supporting box top, and the support column rotates in annular orbit along with cutting platform's rotation for the second ball that rotates in the second movable groove rotates in annular orbit, guarantees cutting platform's stability when realizing the support to cutting platform.
2. Through setting up clamping assembly, positive and negative rotating motor drives the threaded rod and rotates, drives screw nut and moves in opposite directions for screw nut drives the connecting rod and drives the grip block motion, makes the lateral wall laminating of rubber pad and semiconductor wafer, realizes the centre gripping of semiconductor wafer, guarantees the stability of device when semiconductor wafer cuts.
Drawings
Fig. 1 is a schematic diagram of an external structure of a semiconductor wafer dicing apparatus according to the present utility model;
Fig. 2 is a schematic diagram illustrating an internal structure of a semiconductor wafer dicing apparatus according to the present utility model;
FIG. 3 is a schematic view of a movable support assembly according to the present utility model;
FIG. 4 is a schematic cross-sectional view of a movable support assembly according to the present utility model.
In the figure: 1. a supporting box; 2. a mounting frame; 3. a cutter body; 4. a cutting platform;
5. A movable support assembly; 51. a fixed block; 52. a first movable groove; 53. a first rotating ball; 54. an endless track; 55. a support column; 56. a second movable groove; 57. a second rotating ball;
6. a semiconductor wafer;
7. A clamping assembly; 71. a threaded rod; 72. a limit rod; 73. a lead screw nut; 74. a connecting rod; 75. a clamping block; 76. a rubber pad; 77. a forward and reverse rotation motor;
8. A drive assembly; 81. a rotating shaft; 82. a low-speed motor; 9. and a control panel.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-4, a semiconductor wafer cutting device comprises a supporting box 1, wherein an installation frame 2 is fixedly installed on the outer side wall of the supporting box 1, a cutter main body 3 is fixedly installed on the inner top end of the installation frame 2, a cutting platform 4 is movably arranged on the top end of the supporting box 1, a movable supporting component 5 is arranged between the top end of the supporting box 1 and the bottom end of the cutting platform 4, a semiconductor wafer 6 is arranged on the top end of the cutting platform 4, a clamping component 7 for stabilizing and positioning the semiconductor wafer 6 is arranged between the installation frames 2, a driving component 8 for driving the cutting platform 4 to rotate is arranged in the supporting box 1, a control panel 9 is fixedly installed on the outer side wall of the installation frame 2, and the control panel 9 is electrically connected with the cutter main body 3, a forward-reverse motor 77 and a low-speed motor 82.
The driving component 8 drives the semiconductor wafer 6 to rotate when driving the cutting platform 4 to rotate, the movable supporting component 5 guarantees the stability of the cutting platform 4 while guaranteeing the support of the cutting platform 4, and the clamping component 7 achieves clamping of the semiconductor wafer 6, so that the rubber pad 76 is attached to the outer side wall of the semiconductor wafer 6, clamping of the semiconductor wafer 6 is achieved, and stability of the device during cutting of the semiconductor wafer 6 is guaranteed.
The movable supporting component 5 comprises a fixed block 51 fixedly arranged at the bottom end of the cutting platform 4, a first movable groove 52 is formed in the bottom end of the fixed block 51, a first rotating ball 53 is movably arranged in the first movable groove 52, and the first rotating ball 53 is attached to the top end of the supporting box 1.
The supporting box 1 top fixed mounting has annular rail 54, and movable mounting has a plurality of support columns 55 in the annular rail 54, and support column 55 one end fixed mounting is in cutting platform 4 bottom, and second movable groove 56 has been seted up to the support column 55 other end, and movable mounting has second rotating ball 57 in the second movable groove 56, and second rotating ball 57 is laminated with annular rail 54 inner bottom.
The clamping assembly 7 comprises threaded rods 71 which are rotatably arranged between the mounting frames 2, limiting rods 72 are fixedly arranged between the mounting frames 2, reverse threads are arranged at two ends of the threaded rods 71, screw nuts 73 are symmetrically sleeved at two ends of the threaded rods 71, the screw nuts 73 are slidably sleeved on the limiting rods 72, and a forward and reverse rotation motor 77 with an output shaft fixedly connected with the threaded rods 71 in a coaxial mode is fixedly arranged on the outer side wall of the mounting frame 2.
The lead screw nut 73 is close to the semiconductor wafer 6 one side fixed mounting has the connecting rod 74, and connecting rod 74 other end fixed mounting has grip block 75, and grip block 75 is close to semiconductor wafer 6 one side and is provided with the arcwall face, and grip block 75 is close to semiconductor wafer 6 one side fixed mounting has rubber pad 76.
The driving assembly 8 comprises a rotating shaft 81 fixedly arranged at the center of the bottom end of the cutting platform 4, the rotating shaft 81 movably penetrates into the supporting box 1, a low-speed motor 82 is fixedly arranged at the inner bottom end of the supporting box 1, and an output shaft of the low-speed motor 82 is fixedly connected with the rotating shaft 81 coaxially.
It should be noted that the electrical control technology of the control panel 9 is a conventional mature technology, and is not a key technical point of the present utility model, and will not be described herein.
In the utility model, a semiconductor wafer 6 is placed on a cutting platform 4, a control panel 9 starts a forward and backward rotating motor 77, the forward and backward rotating motor 77 drives a threaded rod 71 to rotate, a lead screw nut 73 drives a connecting rod 74 to drive a clamping block 75 to move, a rubber pad 76 is attached to the outer side wall of the semiconductor wafer 6, clamping of the semiconductor wafer 6 is achieved, stability of the device is guaranteed when the semiconductor wafer 6 is cut, the semiconductor wafer 6 is cut through a cutting machine main body 3, when the semiconductor wafer 6 needs to be rotated, a low-speed motor 82 drives a rotating shaft 81 and the cutting platform 4 to rotate, and then drives the semiconductor wafer 6 to rotate, when the cutting platform 4 rotates, a first rotating ball 53 in a first movable groove 52 rotates at the top end of a supporting box 1, a supporting column 55 rotates in an annular track 54 along with rotation of the cutting platform 4, and a second rotating ball 57 in a second movable groove 56 rotates in the annular track 54, so that stability of the cutting platform 4 is guaranteed while support of the cutting platform 4 is achieved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. Semiconductor wafer cutting equipment, including supporting box (1), its characterized in that: supporting box (1) lateral wall fixed mounting has mounting bracket (2), top fixed mounting has cutting machine main part (3) in mounting bracket (2), supporting box (1) top activity is provided with cutting platform (4), be provided with movable supporting component (5) between supporting box (1) top and cutting platform (4) bottom, cutting platform (4) top is provided with semiconductor wafer (6), be provided with clamping component (7) firm, location semiconductor wafer (6) between mounting bracket (2), be provided with drive cutting platform (4) pivoted actuating component (8) in supporting box (1), mounting bracket (2) lateral wall fixed mounting has control panel (9).
2. A semiconductor wafer dicing apparatus according to claim 1, wherein: the movable supporting component (5) comprises a fixed block (51) fixedly installed at the bottom end of the cutting platform (4), a first movable groove (52) is formed in the bottom end of the fixed block (51), a first rotating ball (53) is movably installed in the first movable groove (52), and the first rotating ball (53) is attached to the top end of the supporting box (1).
3. A semiconductor wafer dicing apparatus according to claim 2, wherein: the utility model discloses a cutting machine, including supporting box (1), supporting box, annular track (54) are installed on supporting box (1) top fixed mounting, movable mounting has a plurality of support columns (55) in annular track (54), support column (55) one end fixed mounting is in cutting platform (4) bottom, second movable groove (56) have been seted up to support column (55) other end, movable mounting has second rotating ball (57) in second movable groove (56), second rotating ball (57) are laminated with annular track (54) inner bottom.
4. A semiconductor wafer dicing apparatus according to claim 1, wherein: clamping assembly (7) are including rotating threaded rod (71) of installing between mounting bracket (2), fixed mounting has gag lever post (72) between mounting bracket (2), threaded rod (71) both ends are provided with reverse screw thread, threaded rod (71) both ends symmetry cover is equipped with lead screw nut (73), lead screw nut (73) slip cap is established on gag lever post (72), mounting bracket (2) lateral wall fixed mounting has positive and negative rotating motor (77) of output shaft and coaxial fixed connection of threaded rod (71).
5. The semiconductor wafer dicing apparatus according to claim 4, wherein: the lead screw nut (73) is fixedly arranged on one side, close to the semiconductor wafer (6), of the lead screw nut, the connecting rod (74) is fixedly arranged on the other end of the connecting rod (74), the clamping block (75) is provided with an arc-shaped surface on one side, close to the semiconductor wafer (6), of the clamping block (75), and a rubber pad (76) is fixedly arranged on one side, close to the semiconductor wafer (6).
6. A semiconductor wafer dicing apparatus according to claim 1, wherein: the driving assembly (8) comprises a rotating shaft (81) fixedly mounted at the center of the bottom end of the cutting platform (4), the rotating shaft (81) movably penetrates into the supporting box (1), a low-speed motor (82) is fixedly arranged at the inner bottom end of the supporting box (1), and an output shaft of the low-speed motor (82) is fixedly connected with the rotating shaft (81) in a coaxial mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323080346.0U CN221249418U (en) | 2023-11-14 | 2023-11-14 | Semiconductor wafer cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323080346.0U CN221249418U (en) | 2023-11-14 | 2023-11-14 | Semiconductor wafer cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221249418U true CN221249418U (en) | 2024-07-02 |
Family
ID=91657912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323080346.0U Active CN221249418U (en) | 2023-11-14 | 2023-11-14 | Semiconductor wafer cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221249418U (en) |
-
2023
- 2023-11-14 CN CN202323080346.0U patent/CN221249418U/en active Active
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