CN113954476A - 一种设置有标签芯片的软包装 - Google Patents
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Abstract
本发明涉及一种设置有标签芯片的软包装,软包装由内至外至少包括热封层、阻隔层,阻隔层为软包装的最外层,阻隔层和热封层层叠连接,标签芯片设置在阻隔层和热封层之间。阻隔层的厚度为40‑80μm,热封层的厚度不小于30μm。阻隔层的平均孔径为30‑40nm。阻隔层的孔隙率为55‑60%。制备热封层的组分包括乙烯‑丙烯共聚物、高密聚乙烯、聚丙烯酸酯。制备阻隔层的组分包括高密聚乙烯、聚(丙烯‑alt‑乙烯)、聚(丙烯酸丁酯‑苯乙烯)、超高分子量聚乙烯。阻隔层和热封层的拉伸强度均为100kgf/cm2以上。阻隔层和热封层的穿刺强度为3.0N以上。
Description
技术领域
本发明涉及软包装领域,特别是涉及一种设置有标签芯片的软包装。
背景技术
超高频射频识别(RFID)技术是一种非接触式的自动识别技术。在射频识别***中,读写器发送射频微波信号激活射频标签芯片,并接收从标签返回的射频信号,从而达到识别的目的。而标签芯片可以贴在各种物品上。目前超高频RFID已经应用于各种领域,例如酒类防伪、服装、电力等等。
标签芯片通常包括RFID芯片和电连接到RFID芯片的天线组件,RFID芯片包含数据(如产品类型和/或产品组件的识别码),天线组件用于向读写器传输信号和/或从读写器接收信号。
目前,在硬质包装领域中超高频射频识别(RFID)技术被广泛应用,例如用于封装高档产品(如酒类,药品等)的硬质包装容器上设置标签芯片,通过读写器可以读取硬质包装容器上的标签芯片存储的数据,从而能在不触碰硬质包装容器的情况下识别该硬质包装容器内部的产品的信息(例如品牌、生产日期、生产地址等)。
目前,在软包装领域中应用超高频射频识别(RFID)技术存在的技术问题为:1.标签芯片通过胶黏剂附着在软包装外侧的时候,标签芯片在软包装容器的运输过程中容易丢失,并且存在人为拆贴标签的可能性;2.将标签芯片嵌入到软包装的复合膜中可以消除标签芯片在货物转移、运输过程中丢失的风险,但因软包装容器的复合膜的不同膜层分界面上的电磁波反射、复合膜的电磁波能量吸收、复合膜对电磁波的干扰及衍射等现象,会消弱标签芯片的信号强度,因此导致出现标签芯片的识别性能和识别率明显下降的情况。
发明内容
针对现有技术中存在的技术问题,本发明提供一种设置有标签芯片的软包装,标签芯片嵌入到软包装容器的复合膜中,并且不会出现标签芯片的识别性能和识别率明显下降的情况。
在本发明中所记载的标签芯片包括与一个或多个偶极子型天线电子通信的RFID芯片,该标签芯片的天线组件采取混合环槽天线或槽环混合天线的形式,该标签芯片还包括集成电路,RFID芯片和天线组件均设置在集成电路上。
本发明所记载的软包装是由复合膜制备的卷膜或包装袋。
本发明所记载的软包装由内至外至少包括热封层、阻隔层,其中阻隔层为软包装的最外层,阻隔层和热封层层叠连接,阻隔层、热封层均采用聚烯烃材料制备。阻隔层作为表层使用,作用在于提供阻隔性能、表面抗穿刺和抗撕裂性能。热封层的作用在于提供热封面,两层热封面相贴合可以实现热封连接或者热封制袋。
本发明提供的一种设置有标签芯片的软包装,其中标签芯片设置在阻隔层和热封层之间。通过将标签芯片嵌入到软包装的阻隔层和热封层之间,使得标签芯片不容易与软包装发生分离,软包装通过设置标签芯片能实现防伪、追溯、大数据分析等功能。
在一实施例中,标签芯片的两个面上均涂覆有有功能性粘合剂,阻隔层覆盖在标签芯片的一个面上,热封层覆盖在标签芯片的另一个面上。该功能性粘合剂为聚乙烯醇复配胶水、聚氨酯双组份胶水和改性聚烯烃胶粘剂中的一种或多种。阻隔层和热封层直接接触的部分通过热贴合连接。
标签芯片的天线组件的无线信号以波的形式发送,因此为了使得嵌入软包装的阻隔层和热封层之间的标签芯片不出现识别性能和识别率明显下降的情况,阻隔层和热封层需要至少满足以下几点:
1.由于标签芯片的天线组件为金属材质,阻隔层和热封层的穿刺强度要足够高来防止被标签芯片损坏;
2.阻隔层在保持一定的机械强度的情况下其厚度要尽可能的薄,并且阻隔层不能掺杂有金属离子或设置有金属层。设置有标签芯片的软包装,该标签芯片支持短距离无线通信,该标签芯片和读写器之间的一种非可接触类型的通信一般发生在10cm左右内。标签芯片嵌入软包装的阻隔层和阻隔层之间的情况下,若阻隔层掺杂有金属离子或设置有金属层,由于金属离子/金属层所具有的导电性,经由标签芯片的天线组件生成的无线信号不能够穿透掺杂有金属离子或设置有金属层的阻隔层并向外行进。因此若阻隔层掺杂有金属离子或设置有金属层有可能使标签芯片的天线组件的效果劣化;
3.阻隔层在保持一定的阻隔性能的情况下,在阻隔层上设置孔,孔的宽度可以相对细小,波长的衍射会允许标签芯片的天线组件通过孔的无线信号以足够的波长进行发送。优选的,孔的宽度不大于标签芯片的天线组件产生和/或接受的无线信号的波长的1/2;
4.读写器能识别标签芯片的角度范围需要尽可能的广,因此阻隔层在保持在保持一定的抗撕裂性能的情况下,阻隔层上的孔隙率要处在一定的范围内。
阻隔层可以为单层或多层聚烯烃多孔薄膜例如为单层聚乙烯多孔薄膜、多层聚乙烯多孔薄膜、单层聚丙烯多孔薄膜、多层聚丙烯多孔薄膜、聚乙烯/聚丙烯复合多层薄膜(例如聚乙烯/聚丙烯复合薄膜、聚乙烯/聚丙烯/聚乙烯复合薄膜、聚丙烯/聚乙烯/聚丙烯复合薄膜)等。但为了使阻隔层的厚度要尽可能的薄,优选的,阻隔层为单层聚烯烃多孔薄膜。
若阻隔层上的孔宽度若过大和/或孔隙率过大,则对于阻隔层的阻隔性能、机械强度产生负面效果。阻隔层和热封层均可以通过掺杂绝缘材料来增强阻隔层的机械强度。通过控制阻隔层上的孔的宽度范围和孔隙率范围,可以提高标签芯片的天线组件所围成区域内的磁力线分布均匀性,改善标签芯片的天线组件的性能。
在本发明中,发明人经过多次试验意外发现,当同时满足:
1.阻隔层的厚度为40-80μm,热封层的厚度不小于30μm;
2.阻隔层的平均孔径为30-40nm;
3.阻隔层的孔隙率为55-60%;
4.制备热封层的组分包括乙烯-丙烯共聚物、高密聚乙烯、聚丙烯酸酯;
5.制备阻隔层的组分包括高密聚乙烯、聚(丙烯-alt-乙烯)、聚(丙烯酸丁酯-苯乙烯)、超高分子量聚乙烯;
6.阻隔层和热封层的拉伸强度均不小于100kgf/cm2;
7.阻隔层和热封层的穿刺强度均不小于3.0N;
此时,阻隔层和热封层具有较好的机械强度,防止被嵌入在阻隔层和热封层之间的标签芯片所损害,使得该设置有标签芯片的软包装在储存及运输时不易损坏。阻隔层在提供很好的阻隔性能的情况下不会导致出现标签芯片的识别性能和识别率明显下降的情况。
下面结合具体实施例进行说明。
附图说明
附图对本发明作进一步说明,但附图中的实施例不构成对本发明的任何限制。
图1是本发明一实施例提供的标签芯片的结构图。
图2是本发明一实施例提供的阻隔层和标签芯片的天线组件的截面图。
其中,附图标记为:1.天线;2.RFID芯片;3.阻隔层;31.孔。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
除非另有说明,以下实施例中使用的原料和试剂均为市售商品,或者可以通过已知方法制备。
如下实施例中涉及的平均孔径采用PMI孔径分析仪按照毛细管流动法进行孔径测试,具体步骤为:将一个完全为浸润液浸润饱和的阻隔层置于一定容积的密闭样品室内,在一系列压力下,气体克服孔内液体的毛细管作用,将孔内浸润液排出,直到被排空为止,记录气体压力与流动速率,然后根据相应公式计算孔径大小及分布。
如下实施例中的拉伸强度按照GB/T1040.1-2006标准,使用宽为25mm的长条状阻隔层/热封层样片,采用MTS公司的CMT4000型电子测试机进行测定。
如下实施例中的孔隙率按照测试阻隔层的假体密度(g/cm3)=隔膜重量/(厚度*面积),与理论值0.94g/cm3相除,即视为阻隔层的孔隙率。
如下实施例中的穿刺强度按照GB/T 36363-2018中的测试方法采用MTS公司的CMT4000型电子测试机进行测试,测定用前端为球面(曲率半径R:0.5mm)直径1mm的针,以2mm/s的速度扎入阻隔层/热封层样片时的最大负荷。
本发明实施例中,热封层为单层聚烯烃薄膜,热封层采用熔体拉伸法制备进行制备,具体步骤为:
S1.挤出流延:将制备热封层的组分混合后进行挤出、流延,得到流延膜;
S2.退火:将所述流延膜片进行高温退火处理以完善片晶,得到退火膜;
S3.拉伸:将所述退火膜进行冷拉和热拉,得到拉伸膜;
S4.热定型:将所述拉伸膜进行热定型,得到所述热封层。
本发明实施例中,阻隔层采用相分离法制备,具体步骤为:
S1.熔融混合:将阻隔层的组分与高沸点的成孔剂进行混合,进行加热、熔融混合,得到混合熔体;
S2.压片成型:将所述混合熔体经高温压片成型,得到膜片;
S3.拉伸:将所述膜片冷却后去除成孔剂,并进行双向拉伸,得到拉伸多孔膜;
S4.热定型:将所述拉伸多孔膜进行热定型,得到所述阻隔层。
实施例1
本发明实施例提供一种设置有标签芯片的软包装,该软包装相对于硬质包装容器具有优异的柔韧性,该软包装的复合膜层由内至外包括基础层、印刷层、热封层、阻隔层,其中基础层、热封层、阻隔层3均采用聚烯烃材料制备,复合膜层通过热封合的方式进行连接得到密闭的软包装,标签芯片设置在热封层、阻隔层3之间。
请参见图1,图1是本发明实施例提供的标签芯片的结构图,如图1所示,标签芯片包括:天线1和RFID芯片2。其中,天线1的第一端与RFID芯片2的第一端连接,天线1的第二端与与RFID芯片2的第二端连接。天线1包括金属线结构,且该金属线绕制成如图1所示的“回”形结构,这样,可以缩短天线1在软包装内的长度。
请参见图2,图2是示出阻隔层3和天线1的截面图。阻隔层3上设置有孔31,通过控制孔31的平均孔径范围,使得标签芯片的天线1的信号通过的孔31。
本发明实施例中,制备热封层的组分包括:30-40质量份的乙烯-丙烯共聚物、20-30质量份的高密聚乙烯、20-30质量份的聚丙烯酸酯、1-5质量份的1-丁烯、1-2质量份的对苯二甲酸二辛酯。热封层的厚度为30μm,热封层的穿刺强度为3.5N。热封层的平均拉伸断裂强度为140MPa以上,平均拉伸断裂伸长率为90%以上,所述平均拉伸断裂强度是MD方向即机器方向的拉伸断裂强度和TD方向即宽度方向的拉伸断裂强度的平均值,所述平均拉伸断裂伸长率是MD方向的拉伸断裂伸长率和TD方向的拉伸断裂伸长率的平均值。
本发明实施例中,阻隔层的孔隙率优选为55%以,这无线信号的透过性能的观点优选。作为孔隙率的上限,从确保机械强度的观点优选为60%以下。阻隔层的孔隙率可以通过组分配比、拉伸温度、热处理条件来调整。
本发明实施例中,阻隔层的平均孔径优选是30nm以上,上限优选为40nm以下、更优选35nm以下。阻隔层的平均孔径可以通过组分配比、熔融混合、拉伸倍率、拉伸方式来调整。
本发明实施例中,阻隔层的膜厚的上限值优选是80μm以下、更优选70μm以下、进而优选60μm以下。膜厚的下限值是40μm以上、更优选50μm以上。通过使阻隔层的膜厚为80μm以下,能够提高无线信号的透过性能。膜厚小于40μm时,强度变低,容易发生裂膜,或对天线1等异物的抵抗力变弱,所以不优选。此外,在膜较厚时,有可能使标签芯片的天线组件的效果劣化。阻隔层的膜厚可以通过未拉伸片的宽度、制膜速度、拉伸时的拉伸倍率来调整。
本发明实施例中,制备阻隔层的组分包括:40-50质量份的高密聚乙烯、20-30质量份的聚(丙烯-alt-乙烯)、20-30质量份的聚(丙烯酸丁酯-苯乙烯)、30-40质量份的超高分子量聚乙烯。
其中,超高分子量聚乙烯为含有重均分子量为1.0×106以上的超高分子量聚乙烯。高密度聚乙烯是指密度大于0.94g/cm3的聚乙烯。此外,阻隔层可以根据需要在不破坏本发明的目的的范围内配合抗氧化剂、紫外线吸收剂、颜料、染料等各种添加剂。
通过控制阻隔层的组分配比,能够控制阻隔层的层间的连接分子链的根数和交缠,能够通过拉伸使连接分子高度取向,在不提升厚度的情况下提升阻隔层的穿刺强度和拉伸断裂强度等机械强度。
实施例2、对比实施例1-3均提供相同厚度(50μm)的阻隔层,阻隔层采用相同制备工艺所制备,阻隔层的组分配比如表1所示。
表1
对实施例2、对比实施例1-3提供的阻隔层进行孔隙率、拉伸强度、穿刺强度、平均孔径的测试,结果如表2所示。
表2
项目 | 实施例2 | 对比实施例1 | 对比实施例2 | 对比实施例3 | 对比实施例4 |
孔隙率(%) | 58 | 45 | 52 | 50 | 50 |
拉伸强度(kgf/cm<sup>2</sup>) | ≥200 | 160 | 180 | 180 | 120 |
穿刺强度(N) | 5.5 | 4 | 3.2 | 3.5 | 4 |
平均孔径(nm) | 32 | 40 | 35 | 40 | 35 |
根据表2的测试结果,可以判断出,当阻隔层的组分中缺少任一组分时,均会对阻隔层的穿刺强度和拉伸强度造成负面影响。实施例2提供的阻隔层的平均孔径小,孔隙率大,对于无线信号的透过性好,同时可以达到屏障微生物和粉尘,该阻隔层的优良的机械性能可以防止袋体破损。
应当理解,本发明提供一种设置有标签芯片的软包装,标签芯片经热封层、阻隔层的覆盖策略性地设计为从例如简单的点覆盖到标签芯片的全部覆盖或其部分覆盖,以实现各种可能的标签芯片嵌入软包装设计、配置和结构的期望结果。例如,策略性设计将在UHF、HF或NFC的各种射频(RF)频率之间变化。而且,热封层、阻隔层的厚度可以根据标签芯片的细节和预期应用而变化。
在不脱离本公开的范围的情况下,除了本文展示的那些之外,还可以采用其它实施方式。例如,可以采用用于将标签芯片附接到服饰或其它织物物品或其它可弯曲的材料的其它手段,如缝制、用销钉固定或其它连接机构。进一步,可以采用标签芯片构造变化。层的相对尺寸可以根据预期用途而变化,包括面片材面积的变化以完全延伸超过内部组件,以及功能性或层压粘合剂的施加面积的变化以将多个组件固定在一起。
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (7)
1.一种设置有标签芯片的软包装,其特征在于:
所述软包装由内至外至少包括热封层、阻隔层,所述阻隔层为所述软包装的最外层,所述阻隔层和所述热封层层叠连接,所述标签芯片设置在所述阻隔层和所述热封层之间;
所述阻隔层的厚度为40-80μm,所述热封层的厚度不小于30μm;
所述阻隔层的平均孔径为30-40nm;
所述阻隔层的孔隙率为55-60%;
制备所述热封层的组分包括乙烯-丙烯共聚物、高密聚乙烯、聚丙烯酸酯;
制备所述阻隔层的组分包括高密聚乙烯、聚(丙烯-alt-乙烯)、聚(丙烯酸丁酯-苯乙烯)、超高分子量聚乙烯;
所述阻隔层和所述热封层的拉伸强度均不小于100kgf/cm2;
所述阻隔层和所述热封层的穿刺强度均不小于3.0N。
2.根据权利要求1所述的软包装,其特征在于:制备所述热封层的组分包括30-40质量份的所述乙烯-丙烯共聚物、20-30质量份的所述高密聚乙烯、20-30质量份的所述聚丙烯酸酯、1-5质量份的1-丁烯、1-2质量份的对苯二甲酸二辛酯。
3.根据权利要求1所述的软包装,其特征在于:制备所述阻隔层的组分包括40-50质量份的所述高密聚乙烯、20-30质量份的所述聚(丙烯-alt-乙烯)、20-30质量份的所述聚(丙烯酸丁酯-苯乙烯)、30-40质量份的所述超高分子量聚乙烯。
4.根据权利要求3所述的软包装,其特征在于:所述超高分子量聚乙烯为含有重均分子量为1.0×106以上的超高分子量聚乙烯。
5.根据权利要求4所述的软包装,其特征在于:所述高密度聚乙烯是指密度大于0.94g/cm3的聚乙烯。
6.根据权利要求1所述的软包装,其特征在于:所述标签芯片的两个面上均涂覆有有功能性粘合剂,所述阻隔层覆盖在标签芯片的一个面上,所述热封层覆盖在标签芯片的另一个面上,所述阻隔层和所述热封层直接接触的部分通过热贴合连接。
7.根据权利要求6所述的软包装,其特征在于:所述功能性粘合剂为聚乙烯醇复配胶水、聚氨酯双组份胶水和改性聚烯烃胶粘剂中的一种或多种。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1337352A (zh) * | 2000-08-03 | 2002-02-27 | 厦门宝龙工业股份有限公司 | 电池芯包装膜 |
US20030148119A1 (en) * | 2002-02-06 | 2003-08-07 | Toray Plastics (America), Inc. | Polyolefin oil resistant film using high isotactic content polypropylene |
JP2005037895A (ja) * | 2003-06-27 | 2005-02-10 | Oji Paper Co Ltd | Icラベル |
CN203093202U (zh) * | 2012-12-28 | 2013-07-31 | 苏州思展实业有限公司 | 防静电阻隔防潮薄膜 |
CN206615565U (zh) * | 2017-04-07 | 2017-11-07 | 莫伟智 | 封口膜包装盒 |
CN206619164U (zh) * | 2017-04-07 | 2017-11-07 | 莫伟智 | 蛋形包装盒 |
-
2021
- 2021-08-31 CN CN202111014223.XA patent/CN113954476A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1337352A (zh) * | 2000-08-03 | 2002-02-27 | 厦门宝龙工业股份有限公司 | 电池芯包装膜 |
US20030148119A1 (en) * | 2002-02-06 | 2003-08-07 | Toray Plastics (America), Inc. | Polyolefin oil resistant film using high isotactic content polypropylene |
JP2005037895A (ja) * | 2003-06-27 | 2005-02-10 | Oji Paper Co Ltd | Icラベル |
CN203093202U (zh) * | 2012-12-28 | 2013-07-31 | 苏州思展实业有限公司 | 防静电阻隔防潮薄膜 |
CN206615565U (zh) * | 2017-04-07 | 2017-11-07 | 莫伟智 | 封口膜包装盒 |
CN206619164U (zh) * | 2017-04-07 | 2017-11-07 | 莫伟智 | 蛋形包装盒 |
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