CN113915971A - Vacuum flash evaporation system and vacuum flash evaporation method - Google Patents

Vacuum flash evaporation system and vacuum flash evaporation method Download PDF

Info

Publication number
CN113915971A
CN113915971A CN202111497140.0A CN202111497140A CN113915971A CN 113915971 A CN113915971 A CN 113915971A CN 202111497140 A CN202111497140 A CN 202111497140A CN 113915971 A CN113915971 A CN 113915971A
Authority
CN
China
Prior art keywords
chamber
process chamber
pumping
air pressure
pressure value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111497140.0A
Other languages
Chinese (zh)
Inventor
李卫东
李新连
赵志国
赵东明
张赟
夏渊
秦校军
李梦洁
丁坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huaneng Clean Energy Research Institute
Huaneng Renewables Corp Ltd
Original Assignee
Huaneng Clean Energy Research Institute
Huaneng Renewables Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huaneng Clean Energy Research Institute, Huaneng Renewables Corp Ltd filed Critical Huaneng Clean Energy Research Institute
Priority to CN202111497140.0A priority Critical patent/CN113915971A/en
Publication of CN113915971A publication Critical patent/CN113915971A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
    • F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application provides a vacuum flash evaporation system and a vacuum flash evaporation method, including: the process chamber is used for placing a substrate to be flashed, the process chamber is connected with the pre-pumping chamber, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, the volume of the pre-pumping chamber is larger than that of the process chamber, when the vacuum valve is in an open state, the process chamber is communicated with the pre-pumping chamber, and because the volume of the pre-pumping chamber is larger than that of the process chamber and the air pressure of the pre-pumping chamber is smaller than that of the process chamber, the air pressure value of the process chamber is rapidly reduced, compared with the long time consumption of putting the substrate to be flashed into the process chamber and then vacuumizing to remove the solvent, the pre-pumping chamber which is vacuumized in advance is utilized, the reduction time of the air pressure value in the process chamber can be shortened, so that the time for removing the residual solvent in the film layer is shortened, and the removal effect of the residual solvent is improved, the manufacturing cost of the semiconductor device is reduced.

Description

Vacuum flash evaporation system and vacuum flash evaporation method
Technical Field
The invention relates to the field of semiconductors, in particular to a vacuum flash evaporation system and a vacuum flash evaporation method.
Background
As technology advances, current semiconductor devices are generally of a stacked structure, such as self-emissive displays, top-incident photodetectors, image sensors, and solar cells. In the manufacture of a semiconductor device having a stacked structure, a solution method is generally used. Solvent may remain in the film layer of the semiconductor device formed by the solution process, and the semiconductor device needs to be placed in a vacuum process chamber to remove the remaining solvent.
The existing method for removing the solvent is called as a vacuum flash evaporation process, and the semiconductor device is placed in a process chamber, and then the process chamber is vacuumized to remove the residual solvent.
However, such a vacuum flash evaporation process takes a long time to remove the residual solvent, resulting in poor removal of the residual solvent and further resulting in an increase in manufacturing cost of the semiconductor device.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a vacuum flash evaporation system and a vacuum flash evaporation method, which can shorten the time for removing the residual solvent in the film layer of the semiconductor device, improve the effect of removing the residual solvent in the film layer of the semiconductor device, and reduce the manufacturing cost of the semiconductor device.
The embodiment of the application provides a vacuum flash system, includes: a process chamber and at least one pre-pumping chamber;
the process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber;
the process chamber is used for placing a substrate to be flashed;
the pre-pumping chamber is used for reducing the air pressure value of the process chamber when the vacuum valve is in an open state, and the air pressure value reduced by the process chamber is determined according to the air pressure value of the pre-pumping chamber, the volume of the pre-pumping chamber and the volume of the process chamber.
Optionally, the volume of the pre-pumping chamber is N times of the volume of the process chamber, when the air pressure value of the pre-pumping chamber is lower than the first air pressure threshold, and the vacuum valve is in an open state, the air pressure value of the process chamber is reduced by K times, a difference between N and K is smaller than a predetermined threshold, N is a positive number, and K is a positive number.
Optionally, the number of the pre-pumping chambers is M, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, the air pressure values of the M pre-pumping chambers are lower than a second air pressure threshold value, M is a positive integer greater than 1, and M is greater than or equal to i and greater than or equal to 2;
the pre-draw chamber is specifically configured to:
after the vacuum valves of the M pre-pumping chambers and the process chamber are opened for a preset time, the vacuum valves of the M pre-pumping chambers and the process chamber are closed, so that the air pressure value of the process chamber is reduced approximately
Figure 631547DEST_PATH_IMAGE001
And (4) doubling.
Optionally, the number of the pre-pumping chambers is M, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, and the air pressure value of the ith pre-pumping chamber is reduced by N compared with the air pressure value of the (i-1) th pre-pumping chamberiThe air pressure value of the 1 st pre-pumping chamber is reduced by 0.1/N than that of the process chamber1Multiplying, wherein M is a positive integer greater than 1, wherein M is more than or equal to i and more than or equal to 2;
the pre-draw chamber is specifically configured to:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for the preset time according to the sequence of reducing the air pressure values of the M pre-pumping chambers, and then the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
Optionally, the number of the pre-pumping chambers is M, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, the air pressure values of the M pre-pumping chambers are lower than a third air pressure threshold value, M is a positive integer greater than 1, and M is greater than or equal to i and greater than or equal to 2;
the pre-draw chamber is specifically configured to:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for a preset time according to a fixed sequence, and then the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
Optionally, the NiAt least greater than 10.
Optionally, M is 3, NiIs 100.
The embodiment of the application also provides a vacuum flash evaporation method, wherein a substrate to be flashed is processed by utilizing a vacuum flash evaporation system, the vacuum flash evaporation system comprises a process chamber and at least one pre-pumping chamber, the process chamber is connected with the pre-pumping chamber, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber;
the method comprises the following steps:
and opening a vacuum valve at a connecting port of the process chamber and the pre-pumping chamber to reduce the air pressure value of the process chamber.
Optionally, the volume of the pre-pumping chamber is N times of the process chamber, where N is a positive number, and the air pressure value of the pre-pumping chamber is a first air pressure threshold;
the opening of the vacuum valve at the connection port of the process chamber and the pre-pumping chamber to reduce the pressure value of the process chamber comprises:
and opening vacuum valves at the connecting ports of the process chamber and the pre-pumping chamber, wherein the air pressure value of the process chamber is reduced by K times, the difference value between N and K is smaller than a preset threshold value, and K is a positive number.
Optionally, the number of the pre-pumping chambers is M, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, and the air pressure value of the ith pre-pumping chamber is reduced by N compared with the air pressure value of the (i-1) th pre-pumping chamberiThe air pressure value of the 1 st pre-pumping chamber is reduced by N compared with the air pressure value of the process chamber1Multiplying, wherein M is a positive integer greater than 1, wherein M is more than or equal to i and more than or equal to 2;
the opening of the vacuum valve at the connection port of the process chamber and the pre-pumping chamber to reduce the pressure value of the process chamber comprises:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for a preset time according to the sequence of reducing the air pressure values of the M pre-pumping chambers, and then the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 j is more than or equal to 1.
The embodiment of the application provides a vacuum flash system, includes: the flash evaporation device comprises a process chamber and at least one pre-pumping chamber, wherein the process chamber is used for placing a substrate to be flashed, and the pre-pumping chamber is a chamber which is vacuumized. The process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber. When the vacuum valve is in an open state, the process chamber is communicated with the pre-pumping chamber, and because the volume of the pre-pumping chamber is larger than that of the process chamber and the air pressure of the pre-pumping chamber is smaller than that of the process chamber, the air pressure value of the process chamber is rapidly reduced. In addition, the pressure value of the process chamber to be reduced is determined according to the pressure value of the pre-pumping chamber, the volume of the pre-pumping chamber and the volume of the process chamber, so that the pressure value of the process chamber to be reduced and the volume of the process chamber can be determined firstly, and then the corresponding pressure value of the pre-pumping chamber and the volume of the pre-pumping chamber are determined by utilizing the determined pressure value of the process chamber to be reduced and the determined volume of the process chamber, so that the aim of rapidly reducing the pressure value of the process chamber is fulfilled.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a block diagram illustrating a vacuum flash system according to an embodiment of the present disclosure;
FIG. 2 is a block diagram of another vacuum flash system provided by an embodiment of the present application;
fig. 3 shows a schematic flow diagram of a vacuum flash evaporation method provided in an embodiment of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways than those described herein, and it will be apparent to those of ordinary skill in the art that the present application is not limited by the specific embodiments disclosed below.
Next, the present application will be described in detail with reference to the drawings, and in the detailed description of the embodiments of the present application, the cross-sectional views illustrating the structure of the device are not enlarged partially according to the general scale for convenience of illustration, and the drawings are only examples, which should not limit the scope of the protection of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
As described in the background art, in manufacturing a semiconductor device of a stacked structure, a solution method is generally used for manufacturing. Solvent may remain in the film layer of the semiconductor device formed by the solution process, and the semiconductor device needs to be placed in a vacuum process chamber to remove the remaining solvent. The existing method for removing the solvent is called as a vacuum flash evaporation process, and the semiconductor device is placed in a process chamber, and then the process chamber is vacuumized to remove the residual solvent. The residual solvent in the film layer is removed by a vacuum flash process, preferably by reducing the pressure in the process chamber from atmospheric pressure to less than 20 pascals for several tens of seconds. However, in the above manner of first placing the semiconductor device into the process chamber and then performing vacuum-pumping treatment on the process chamber, the time for reducing the air pressure value in the process chamber is long, the time for removing the residual solvent is long, the effect of removing the residual solvent is poor, and the manufacturing cost of the semiconductor device is further increased.
Based on this, this application embodiment provides a vacuum flash system, includes: the flash evaporation device comprises a process chamber and at least one pre-pumping chamber, wherein the process chamber is used for placing a substrate to be flashed, and the pre-pumping chamber is a chamber which is vacuumized. The process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber. When the vacuum valve is in an open state, the process chamber is communicated with the pre-pumping chamber, and because the volume of the pre-pumping chamber is larger than that of the process chamber and the air pressure of the pre-pumping chamber is smaller than that of the process chamber, the air pressure value of the process chamber is rapidly reduced. In addition, the pressure value of the process chamber to be reduced is determined according to the pressure value of the pre-pumping chamber, the volume of the pre-pumping chamber and the volume of the process chamber, so that the pressure value of the process chamber to be reduced and the volume of the process chamber can be determined firstly, and then the corresponding pressure value of the pre-pumping chamber and the volume of the pre-pumping chamber are determined by utilizing the determined pressure value of the process chamber to be reduced and the determined volume of the process chamber, so that the aim of rapidly reducing the pressure value of the process chamber is fulfilled.
For a better understanding of the technical solutions and effects of the present application, specific embodiments will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a block diagram of a vacuum flash system according to an embodiment of the present disclosure is shown.
The vacuum flash system 100 provided by the embodiment of the present application includes: a process chamber 110 and at least one pre-draw chamber 120.
The process chamber 110 is used to place a substrate to be flashed, which may be a substrate on which a layer is formed by spin coating in the manufacture of semiconductor devices. As an example, the substrate to be flashed is a substrate on which a perovskite photoelectric conversion layer is formed by a spin coating method.
The pre-pump chamber 120 is a pre-evacuated chamber, i.e., the pre-pump chamber 120 has a pressure lower than atmospheric pressure, i.e., lower than the process chamber.
The process chamber 110 and the pre-pumping chamber 120 are connected to each other, a vacuum valve 130 is disposed at a connection port of the process chamber 110 and the pre-pumping chamber 120, when the vacuum valve is in an open state, the process chamber 110 and the pre-pumping chamber 120 are communicated, the pressure of the process chamber 110 is high, the pressure of the pre-pumping chamber 120 is low, and in order to maintain the pressure balance, the pressure of the process chamber 110 is reduced, and the pressure of the pre-pumping chamber 120 is increased.
According to the ideal gas state equation PV = nRT, where P is the pressure of the ideal gas, V is the volume of the ideal gas, n represents the amount of gas species, T represents the thermodynamic temperature of the ideal gas, R is the ideal gas constant, and the process chamber 110 is capable of achieving a pressure value of
Figure 294610DEST_PATH_IMAGE002
，
Wherein P2 is the pressure of the pre-pumping chamber 120, V1 is the volume of the process chamber 110, V2 is the volume of the pre-pumping chamber 120, N is a multiple of V1 and V2, and P0 is the atmospheric pressure of 1.0 × 105Pascal (Pa).
When the vacuum valve is in an open state, the process chamber 110 is communicated with the pre-pumping chamber 120, and since the volume of the pre-pumping chamber 120 is larger than that of the process chamber 110 and the air pressure of the pre-pumping chamber 120 is smaller than that of the process chamber 110, the air pressure value of the process chamber 110 is rapidly reduced, compared with the long time of putting the substrate to be flashed into the process chamber first and then vacuumizing to remove the solvent, the time for reducing the air pressure value in the process chamber can be shortened by using the pre-pumping chamber which is vacuumized in advance, so that the time for removing the residual solvent in the film layer of the semiconductor device is shortened, the removal effect of the residual solvent is improved, and the manufacturing cost of the semiconductor device is reduced.
That is, the pressure to which the process chamber 110 is lowered may be determined according to the pressure of the pre-pump chamber 120, the volume of the pre-pump chamber 120, and the volume of the process chamber 110. Accordingly, the reduced pressure value of the process chamber 110 and the volume of the process chamber 110 may be first determined, and then the corresponding pressure value of the pre-pumping chamber 120 and the volume of the pre-pumping chamber 120 may be determined using the reduced pressure value of the process chamber 110 and the volume of the process chamber 110, so as to achieve the purpose of rapidly reducing the pressure value of the process chamber 110.
In the embodiment of the present application, if the volume V2 of the pre-pumping chamber is N times the volume V1 of the process chamber, and the pressure value P2 of the pre-pumping chamber 120 is less than or equal to the first pressure threshold, i.e., P2 is less than or equal to 0.1 × P0/N, when the vacuum valve 130 is in the open state, the pressure value of the process chamber 110 is rapidly decreased by K times, and the difference between K and N is less than the predetermined threshold, i.e., K and N are very close to or even equal, K is a positive number, and N is a positive number. The volume of the pre-pump chamber V2 and the volume of the process chamber V1, which are multiplied by N, may be set according to practical circumstances, for example, N may be at least greater than 10, which helps to rapidly reduce the pressure of the process chamber. In practical applications, the predetermined threshold value may be determined according to practical situations.
In practical applications, in order to further shorten the time for decreasing the pressure value of the process chamber, a plurality of pre-pumping chambers 120 may be provided, i.e., the number of pre-pumping chambers 120 is M, where M is a positive integer greater than 1. Each pre-pump chamber 120 is interconnected with the process chamber 110. The volume of each pre-pumping chamber 120 may not be equal, as may the volume of each pre-pumping chamber 120.
In the embodiment of the present application, if a plurality of pre-pumping chambers 120 are connected to the process chamber 110, the vacuum valve between each pre-pumping chamber and the process chamber may be opened and closed simultaneously, or may be opened and closed sequentially after the vacuum valve between one pre-pumping chamber and the process chamber is opened and closed, and then the vacuum valve between the next pre-pumping chamber and the process chamber is opened and closed, that is, the vacuum valve between each pre-pumping chamber and the process chamber is not opened and closed simultaneously.
The following M pre-pumping chambers are used, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiA possible implementation of reducing the pressure of the process chamber is described by way of example:
in a first possible implementation manner, the air pressure values of the M pre-pumping chambers are all lower than a second air pressure threshold, and the second air pressure threshold may be determined according to the finally achieved air pressure value of the process chamber, for example, the second air pressure threshold is smaller than or equal to the finally achieved air pressure value of the pre-designed process chamber divided by the maximum volume of the pre-pumping chamber and the volume multiple N of the process chamberi. For example, the final pressure of the process chamber is less than 10Pa, the maximum volume of the pre-pumping chamber and the volume multiple N of the process chamberiAnd the first air pressure threshold is 10Pa, and the air pressure values of the M pre-pumping chambers are all lower than 1 Pa.
After the vacuum valves of the M pre-pumping chambers and the process chamber are opened for a preset time, the vacuum valves of the M pre-pumping chambers and the process chamber are closed, so that the air pressure value of the process chamber is reduced approximately
Figure 69537DEST_PATH_IMAGE003
In practice, as long as the final pressure value of the process chamber is reduced
Figure 148351DEST_PATH_IMAGE003
The difference between the two obtained air pressure values is within a fixed threshold range, and the air pressure value of the process chamber is considered to be approximately reduced
Figure 974225DEST_PATH_IMAGE004
And (4) doubling. That is, a single pre-pump chamber may reduce the pressure of the process chamber by about Ni times, and M pre-pump chambers may reduce the pressure of the process chamber by about Ni times
Figure 745871DEST_PATH_IMAGE003
And (4) doubling. But to ensure that the pressure level of the process chamber is reduced
Figure 696510DEST_PATH_IMAGE003
After doubling, the first air pressure threshold can be reached, and the values of M and Ni can be very large, which can be very labor intensive in practical applications.
In a second possible implementation manner, the air pressure values of the M pre-pumping chambers are all lower than a third air pressure threshold, and the third air pressure threshold may also be determined according to the finally achieved air pressure value of the process chamber, for example, the third air pressure threshold is less than or equal to the air pressure value finally achieved by the pre-designed process chamber divided by the maximum volume of the pre-pumping chamber and the volume multiple N of the process chamberi. For example, the final pressure value of the process chamber is designed to be less than 10Pa, the maximum volume of the pre-pumping chamber and the volume multiple N of the process chamberiAnd 10, the third air pressure threshold is 1Pa, and the air pressure values of the M pre-pumping chambers are all lower than 1 Pa.
After the vacuum valves of the jth pre-pumping chamber and the process chamber are opened for preset time, the vacuum valves of the jth pre-pumping chamber and the process chamber are closed, the vacuum valves of the jth +1 pre-pumping chamber and the process chamber are continuously opened for preset time according to a fixed sequence, and then the vacuum valves of the jth +1 pre-pumping chamber and the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
That is, after opening the vacuum valve of one of the pre-pumping chamber and the process chamber for a predetermined time, the vacuum valve of the pre-pumping chamber and the process chamber are closed, so that the pressure of the process chamber can be reduced by about NiThe M pre-pumping chambers can reduce the air pressure value of the process chamber to be close to
Figure 392065DEST_PATH_IMAGE005
And (4) doubling. In practical application, if NiAll 100, M is 3, the process chamber pressure can be reduced from atmospheric pressure to below 1Pa, but this approach requires that the pressure of each pre-pumping chamber be reduced to below the third pressure threshold in advanceThe cost of vacuum flash evaporation is also increased to some extent.
In a third possible implementation, the pressure value of the ith pre-pumping chamber is reduced by N from the pressure value of the (i-1) th pre-pumping chamberiThe pressure value of the 1 st pre-pumping chamber is reduced by N compared with the pressure value of the process chamber1Wherein M is more than or equal to i and more than or equal to 2. .
After the vacuum valves of the jth pre-pumping chamber and the process chamber are opened for a preset time, the vacuum valves of the jth pre-pumping chamber and the process chamber are closed, the vacuum valves of the jth +1 pre-pumping chamber and the process chamber are continuously opened for the preset time according to the sequence that the air pressure values of the M pre-pumping chambers are reduced, and then the vacuum valves of the jth +1 pre-pumping chamber and the process chamber are closed, so that the air pressure values of the process chamber are gradually reduced by using the M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
That is, the pressure value of the process chamber can be decreased by N by opening only one of the vacuum valves of the pre-pumping chamber and the process chamber for a predetermined time and closing the vacuum valves of the pre-pumping chamber and the process chamber in the order of decreasing the pressure values of the M pre-pumping chambersiThe M pre-pumping chambers can reduce the air pressure value of the process chamber
Figure 744548DEST_PATH_IMAGE005
And (4) doubling. And in practical application, if NiBoth are 100, and M is 3, the atmospheric pressure value of the process chamber can be reduced to below 1 Pa. According to the scheme that the vacuum valves of only one pre-pumping chamber and the process chamber are opened at a time according to the decreasing sequence of the air pressure values of the M pre-pumping chambers, the air pressure of each pre-pumping chamber does not need to be reduced to be lower than the third air pressure threshold, and the cost of the flash evaporation process can be reduced.
As an example, M is 3, NiAre all 100, i.e. the number of pre-pumping chambers connected to the process chamber is 3, the volume of the pre-pumping chambers is all 100 times the volume of the process chamber, as shown with reference to fig. 2. In fig. 2, a process chamber 210 and 3 pre-pumping chambers 220 are shown, each pre-pumping chamber 220 having an equal volume and being interconnected with the process chamber 210.
The initial pressure P0 of the process chamber is 1.0 × 105Pa, the pressure value P1 of the pre-pumping chamber 1 being lower than atmospheric pressure divided by N1I.e. the pressure value P1 of the pre-pumping chamber 1 is lower than 1.0 x 103Pa, the pressure value P1 of the pre-pumping chamber 1 may be less than or equal to 1.0X 103Pa, the air pressure values of the rest pre-pumping chambers are sequentially reduced by NiThe pressure P2 of the pre-pumping chamber 2 may be less than or equal to 10Pa, and the pressure P3 of the pre-pumping chamber 3 may be less than or equal to 0.1 Pa.
After the vacuum valves of the pre-pumping chamber 1 and the process chamber are opened for a preset time, the vacuum valves of the pre-pumping chamber 1 and the process chamber are closed, and at the moment, the air pressure value P of the process chamber is1=NP1/（1+N）+P0/（1+N）≈1.0×103+1.0×105/100=2.0×103Pa, according to the decreasing sequence of the air pressure value of the pre-pumping chamber, after continuously opening the vacuum valve between the pre-pumping chamber 2 and the process chamber for a preset time, closing the vacuum valve between the pre-pumping chamber 2 and the process chamber, at this time, the air pressure value P of the process chamber2=10+2×103The pressure value P of the process chamber is at the moment when the vacuum valve between the pre-pumping chamber 3 and the process chamber is closed after the vacuum valve between the pre-pumping chamber 3 and the process chamber is continuously opened for a preset time according to the descending sequence of the pressure value of the pre-pumping chamber and the pressure value P of the process chamber is at the moment3=P3+P2/N=0.1+30/100=0.4Pa。
In the embodiment of the present application, the preset time may be determined according to actual conditions, for example, the preset time range may be 1 second to 3 seconds.
The embodiment of the application provides a vacuum flash system, includes: the flash evaporation device comprises a process chamber and at least one pre-pumping chamber, wherein the process chamber is used for placing a substrate to be flashed, and the pre-pumping chamber is a chamber which is vacuumized. The process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber. When the vacuum valve is in an open state, the process chamber is communicated with the pre-pumping chamber, and because the volume of the pre-pumping chamber is larger than that of the process chamber and the air pressure of the pre-pumping chamber is smaller than that of the process chamber, the air pressure value of the process chamber is rapidly reduced. In addition, the pressure value of the process chamber to be reduced is determined according to the pressure value of the pre-pumping chamber, the volume of the pre-pumping chamber and the volume of the process chamber, so that the pressure value of the process chamber to be reduced and the volume of the process chamber can be determined firstly, and then the corresponding pressure value of the pre-pumping chamber and the volume of the pre-pumping chamber are determined by utilizing the determined pressure value of the process chamber to be reduced and the determined volume of the process chamber, so that the aim of rapidly reducing the pressure value of the process chamber is fulfilled.
The vacuum flash system provided by the embodiment of the present application is described in detail above, and in addition, a vacuum flash method using the vacuum flash system is also provided by the embodiment of the present application, and as shown in fig. 3, the method includes:
s301, opening a vacuum valve at a connecting port of the process chamber and the pre-pumping chamber to reduce the air pressure value of the process chamber.
In the embodiment of the present application, when the vacuum valve is in the open state, the process chamber 110 is communicated with the pre-pumping chamber 120, and since the volume of the pre-pumping chamber 120 is greater than that of the process chamber 110 and the air pressure of the pre-pumping chamber 120 is less than that of the process chamber 110, the air pressure value of the process chamber 110 is rapidly reduced, compared to the long time of putting the substrate to be flashed into the process chamber first and then pumping vacuum to remove the solvent, the time for reducing the air pressure value in the process chamber can be shortened by using the pre-pumping chamber which has been pumped vacuum in advance, so as to shorten the time for removing the residual solvent in the film layer of the semiconductor device, improve the removal effect of the residual solvent, and reduce the manufacturing cost of the semiconductor device.
That is, the pressure to which the process chamber 110 is lowered may be determined according to the pressure of the pre-pump chamber 120, the volume of the pre-pump chamber 120, and the volume of the process chamber 110. Accordingly, the reduced pressure value of the process chamber 110 and the volume of the process chamber 110 may be first determined, and then the corresponding pressure value of the pre-pumping chamber 120 and the volume of the pre-pumping chamber 120 may be determined using the reduced pressure value of the process chamber 110 and the volume of the process chamber 110, so as to achieve the purpose of rapidly reducing the pressure value of the process chamber 110.
In the embodiment of the present application, if the volume V2 of the pre-pumping chamber is N times the volume V1 of the process chamber, and the pressure value P2 of the pre-pumping chamber 120 is less than or equal to the first pressure threshold, i.e., P2 is not greater than P0/N, when the vacuum valve 130 is in the open state, the pressure value of the process chamber 110 is rapidly decreased by K times, and the difference between K and N is less than the predetermined threshold, i.e., K and N are very close to or even equal to each other, K is a positive number, and N is a positive number. The volume of the pre-pump chamber V2 and the volume of the process chamber V1, which are multiplied by N, may be set according to practical circumstances, for example, N may be at least greater than 10, which helps to rapidly reduce the pressure of the process chamber. In practical applications, the predetermined threshold value may be determined according to practical situations.
In practical applications, in order to further shorten the time for decreasing the pressure value of the process chamber, a plurality of pre-pumping chambers 120 may be provided, i.e., the number of pre-pumping chambers 120 is M, where M is a positive integer greater than 1. Each pre-pump chamber 120 is interconnected with the process chamber 110. The volume of each pre-pumping chamber 120 may not be equal, as may the volume of each pre-pumping chamber 120.
In the embodiment of the present application, when the number of the pre-pumping chambers is M, the volume of the ith pre-pumping chamber is N of the volume of the process chamberiThe air pressure value of the ith pre-pumping chamber is reduced by N compared with the air pressure value of the (i-1) th pre-pumping chamberiThe pressure value of the 1 st pre-pumping chamber is reduced by N compared with the pressure value of the process chamber1Wherein M is more than or equal to i and more than or equal to 2. After the vacuum valves of the jth pre-pumping chamber and the process chamber are opened for the preset time, the vacuum valves of the jth pre-pumping chamber and the process chamber are closed, and after the vacuum valves of the jth + 1-th pre-pumping chamber and the process chamber are continuously opened for the preset time according to the sequence that the air pressure values of the M pre-pumping chambers are reduced, the vacuum valves of the jth + 1-th pre-pumping chamber and the process chamber are closed so as to useThe M pre-pumping chambers gradually reduce the air pressure value of the process chamber, wherein M-1 is more than or equal to j more than or equal to 1.
That is, the pressure value of the process chamber can be decreased by N by opening only one of the vacuum valves of the pre-pumping chamber and the process chamber for a predetermined time and closing the vacuum valves of the pre-pumping chamber and the process chamber in the order of decreasing the pressure values of the M pre-pumping chambersiThe M pre-pumping chambers can reduce the air pressure value of the process chamber
Figure 687097DEST_PATH_IMAGE006
And (4) doubling. And in practical application, if NiBoth are 100, and M is 3, the atmospheric pressure value of the process chamber can be reduced to below 1 Pa.
The foregoing is merely a preferred embodiment of the present application and, although the present application discloses the foregoing preferred embodiments, the present application is not limited thereto. Those skilled in the art can now make numerous possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the claimed embodiments. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still fall within the protection scope of the technical solution of the present application without departing from the content of the technical solution of the present application.

Claims (10)

1. A vacuum flash system, comprising: a process chamber and at least one pre-pumping chamber;
the process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber;
the process chamber is used for placing a substrate to be flashed;
the pre-pumping chamber is used for reducing the air pressure value of the process chamber when the vacuum valve is in an open state, and the air pressure value reduced by the process chamber is determined according to the air pressure value of the pre-pumping chamber, the volume of the pre-pumping chamber and the volume of the process chamber.
2. A vacuum flash system according to claim 1 wherein the volume of the pre-pumping chamber is N times the volume of the process chamber, and when the pre-pumping chamber has a gas pressure value below the first gas pressure threshold and the vacuum valve is in the open state, the gas pressure value of the process chamber decreases by K times, the difference between N and K being less than the predetermined threshold, N being a positive number and K being a positive number.
3. A vacuum flash system according to claim 2 wherein the number of pre-pumping chambers is M, the volume of the ith pre-pumping chamber being N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, the air pressure values of the M pre-pumping chambers are lower than a second air pressure threshold value, M is a positive integer greater than 1, and M is greater than or equal to i and greater than or equal to 2;
the pre-draw chamber is specifically configured to:
after the vacuum valves of the M pre-pumping chambers and the process chamber are opened for a preset time, the vacuum valves of the M pre-pumping chambers and the process chamber are closed, so that the air pressure value of the process chamber is reduced approximately
Figure 919030DEST_PATH_IMAGE002
And (4) doubling.
4. A vacuum flash system according to claim 2 wherein the number of pre-pumping chambers is M, the volume of the ith pre-pumping chamber being N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, and the air pressure value of the ith pre-pumping chamber is reduced by N compared with the air pressure value of the (i-1) th pre-pumping chamberiThe air pressure value of the 1 st pre-pumping chamber is reduced by N compared with the air pressure value of the process chamber1Multiplying, wherein M is a positive integer greater than 1, wherein M is more than or equal to i and more than or equal to 2;
the pre-draw chamber is specifically configured to:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for the preset time according to the sequence of reducing the air pressure values of the M pre-pumping chambers, and then the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
5. A vacuum flash system according to claim 2 wherein the number of pre-pumping chambers is M, the volume of the ith pre-pumping chamber being N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, the air pressure values of the M pre-pumping chambers are lower than a third air pressure threshold value, M is a positive integer greater than 1, and M is greater than or equal to i and greater than or equal to 2;
the pre-draw chamber is specifically configured to:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for a preset time according to a fixed sequence, and then the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 is more than or equal to j and is more than or equal to 1.
6. The vacuum flash system of any one of claims 2-5 wherein N isiAt least greater than 10.
7. The vacuum flash system of any one of claims 3 to 5 wherein M is 3 and N isiIs 100.
8. A vacuum flash evaporation method is characterized in that a substrate to be flashed is processed by utilizing a vacuum flash evaporation system, the vacuum flash evaporation system comprises a process chamber and at least one pre-pumping chamber, the process chamber and the pre-pumping chamber are connected with each other, a vacuum valve is arranged at a connecting port of the process chamber and the pre-pumping chamber, the air pressure value of the pre-pumping chamber is lower than that of the process chamber, and the volume of the pre-pumping chamber is larger than that of the process chamber;
the method comprises the following steps:
and opening a vacuum valve at a connecting port of the process chamber and the pre-pumping chamber to reduce the air pressure value of the process chamber.
9. The method of claim 8, wherein the pre-pump chamber has a volume N times that of the process chamber, N being a positive number, and the pre-pump chamber has a gas pressure value of a first gas pressure threshold;
the opening of the vacuum valve at the connection port of the process chamber and the pre-pumping chamber to reduce the pressure value of the process chamber comprises:
and opening vacuum valves at the connecting ports of the process chamber and the pre-pumping chamber, wherein the air pressure value of the process chamber is reduced by K times, the difference value between N and K is smaller than a preset threshold value, and K is a positive number.
10. The method of claim 9, wherein the number of pre-pumping chambers is M, and the volume of the ith pre-pumping chamber is N of the volume of the process chamberiEach pre-pumping chamber is connected with the process chamber, and the air pressure value of the ith pre-pumping chamber is reduced by N compared with the air pressure value of the (i-1) th pre-pumping chamberiThe air pressure value of the 1 st pre-pumping chamber is reduced by N compared with the air pressure value of the process chamber1Multiplying, wherein M is a positive integer greater than 1, wherein M is more than or equal to i and more than or equal to 2;
the opening of the vacuum valve at the connection port of the process chamber and the pre-pumping chamber to reduce the pressure value of the process chamber comprises:
after the jth pre-pumping chamber and the vacuum valve of the process chamber are opened for a preset time, the jth pre-pumping chamber and the vacuum valve of the process chamber are closed, the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are continuously opened for a preset time according to the sequence of reducing the air pressure values of the M pre-pumping chambers, and then the vacuum valve of the jth +1 pre-pumping chamber and the vacuum valve of the process chamber are closed, so that the air pressure value of the process chamber is gradually reduced by using the M pre-pumping chambers, wherein M-1 j is more than or equal to 1.
CN202111497140.0A 2021-12-09 2021-12-09 Vacuum flash evaporation system and vacuum flash evaporation method Pending CN113915971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111497140.0A CN113915971A (en) 2021-12-09 2021-12-09 Vacuum flash evaporation system and vacuum flash evaporation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111497140.0A CN113915971A (en) 2021-12-09 2021-12-09 Vacuum flash evaporation system and vacuum flash evaporation method

Publications (1)

Publication Number Publication Date
CN113915971A true CN113915971A (en) 2022-01-11

Family

ID=79248856

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111497140.0A Pending CN113915971A (en) 2021-12-09 2021-12-09 Vacuum flash evaporation system and vacuum flash evaporation method

Country Status (1)

Country Link
CN (1) CN113915971A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019212C1 (en) * 1990-06-15 1991-10-17 Maximilian 8000 Muenchen De Wohllaib Drying plant for slurries - has evaporation housing with pump fluid separator and differential pressure lock
US6640462B1 (en) * 2000-05-19 2003-11-04 Sun Tae Choi Method of drying wood and a system therefor
CN1538502A (en) * 2003-04-16 2004-10-20 ���������ƴ���ʽ���� Vacuum processing device and substrate delievering method
US20040237328A1 (en) * 2001-07-09 2004-12-02 Auer Ricardo Francisco Apparatus and process for freezing produce
CN105390412A (en) * 2014-08-25 2016-03-09 斯克林集团公司 Pressure-reducing drying device, substrate processing device and pressure-reducing drying method
CN109427624A (en) * 2017-08-31 2019-03-05 株式会社斯库林集团 Drying method for substrate and substrate board treatment
US20200006091A1 (en) * 2018-06-27 2020-01-02 VON ARDENNE Asset GmbH & Co. KG Vacuum arrangement and method
CN210722963U (en) * 2019-11-27 2020-06-09 上海芯元基半导体科技有限公司 Wafer wet processing device
JP2020176746A (en) * 2019-04-16 2020-10-29 東京エレクトロン株式会社 Vacuum dryer
JP2020190405A (en) * 2019-05-17 2020-11-26 東京エレクトロン株式会社 Vacuum drying device and method for manufacturing solvent collecting member

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019212C1 (en) * 1990-06-15 1991-10-17 Maximilian 8000 Muenchen De Wohllaib Drying plant for slurries - has evaporation housing with pump fluid separator and differential pressure lock
US6640462B1 (en) * 2000-05-19 2003-11-04 Sun Tae Choi Method of drying wood and a system therefor
US20040237328A1 (en) * 2001-07-09 2004-12-02 Auer Ricardo Francisco Apparatus and process for freezing produce
CN1538502A (en) * 2003-04-16 2004-10-20 ���������ƴ���ʽ���� Vacuum processing device and substrate delievering method
CN105390412A (en) * 2014-08-25 2016-03-09 斯克林集团公司 Pressure-reducing drying device, substrate processing device and pressure-reducing drying method
CN109427624A (en) * 2017-08-31 2019-03-05 株式会社斯库林集团 Drying method for substrate and substrate board treatment
US20200006091A1 (en) * 2018-06-27 2020-01-02 VON ARDENNE Asset GmbH & Co. KG Vacuum arrangement and method
JP2020176746A (en) * 2019-04-16 2020-10-29 東京エレクトロン株式会社 Vacuum dryer
JP2020190405A (en) * 2019-05-17 2020-11-26 東京エレクトロン株式会社 Vacuum drying device and method for manufacturing solvent collecting member
CN210722963U (en) * 2019-11-27 2020-06-09 上海芯元基半导体科技有限公司 Wafer wet processing device

Similar Documents

Publication Publication Date Title
KR101148295B1 (en) Evacuation of load lock enclosure
CN101236893B (en) Substrate processing method and substrate processing device
US10982662B2 (en) Pumping system
US9728432B2 (en) Method of degassing
CN113915971A (en) Vacuum flash evaporation system and vacuum flash evaporation method
JP5822213B2 (en) Vacuum pump transport system
CN106531658A (en) Pressure control method and device
JP2009026779A (en) Vacuum treatment apparatus
JP2012513111A (en) Method and associated apparatus for reducing the pressure in a charge-discharge lock
JP5956754B2 (en) Vacuum exhaust system
US20220080476A1 (en) Substrate processing apparatus, purge gas control method, and vacuum transfer chamber cleaning method
US20230400868A1 (en) Vacuum exhaust system
JP2006183152A (en) Vacuum system
KR101043775B1 (en) Loadlock chamber in a semi-conductor manufacturing system.
CN213878018U (en) Vacuum chamber and vacuum apparatus
WO2019119608A1 (en) Etching apparatus
KR102046162B1 (en) Method of processing the substrate
KR20200019751A (en) Vacuuming Device and Vacuuming Method
KR101626467B1 (en) Substrate tretment apparatus
KR200295233Y1 (en) Pumping system
KR101725243B1 (en) Depositing apparatus and method for leading-in and drawing out product with respect to depositing apparatus
WO2005061758A1 (en) Transfer system
CN115769038A (en) Vacuum drying apparatus and vacuum drying method for roll-to-roll electrodes
CN106548957B (en) Processing chamber and substrate processing system
EP3105455A1 (en) Pumping system and method for lowering the pressure in a load-lock chamber

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination